JPH0826473B2 - Electrodeposition method of amorphous iron-molybdenum-tungsten alloy coating. - Google Patents
Electrodeposition method of amorphous iron-molybdenum-tungsten alloy coating.Info
- Publication number
- JPH0826473B2 JPH0826473B2 JP7806989A JP7806989A JPH0826473B2 JP H0826473 B2 JPH0826473 B2 JP H0826473B2 JP 7806989 A JP7806989 A JP 7806989A JP 7806989 A JP7806989 A JP 7806989A JP H0826473 B2 JPH0826473 B2 JP H0826473B2
- Authority
- JP
- Japan
- Prior art keywords
- molybdenum
- plating
- water
- iron
- tungsten
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、非晶質鉄−モリブデン−タングステン合金
めっき皮膜の電析方法に関する。TECHNICAL FIELD The present invention relates to a method for electrodepositing an amorphous iron-molybdenum-tungsten alloy plating film.
モリブデンやタングステンは、水溶液中から単独では
電析し得ないが、鉄族金属と共析することができる誘起
共析型金属であることが知られており、このため従来か
ら種々の鉄−モリブデン合金めっき方法や鉄−タングス
テン合金めっき方法が提案されている。Although molybdenum and tungsten cannot be electrodeposited alone from an aqueous solution, they are known to be induced eutectoid metals that can be co-deposited with iron group metals. Alloy plating methods and iron-tungsten alloy plating methods have been proposed.
しかし、従来の鉄−モリブデン合金めっき方法や鉄−
タングステン合金めっき方法により得られるめっき皮膜
は結晶構造のものが多く、耐食性等の面から非晶質皮膜
が望まれるが、従来、かかる非晶質皮膜を確実に得るこ
とについての提案は少なく、特に非晶質の鉄−モリブデ
ン−タングステン三元合金めっきを得る方法は提案がな
い。However, the conventional iron-molybdenum alloy plating method and iron-
Many of the plating films obtained by the tungsten alloy plating method have a crystalline structure, and an amorphous film is desired from the viewpoint of corrosion resistance and the like, but conventionally, there are few proposals for reliably obtaining such an amorphous film, There is no proposal for a method for obtaining an amorphous iron-molybdenum-tungsten ternary alloy plating.
本発明は上記事情に鑑みなされたもので、非晶質鉄−
モリブデン−タングステン三元合金皮膜を確実にしかも
工業的有利に電析する方法を提案することを目的とす
る。The present invention has been made in view of the above circumstances.
It is an object of the present invention to propose a method for reliably and industrially electrodepositing a molybdenum-tungsten ternary alloy film.
本発明者らは、上記目的を達成するため種々検討を行
なった結果、水溶性第1鉄塩と錯化剤として水溶性モリ
ブデン酸塩と水溶性タングステン酸塩と水溶性酒石酸塩
とを含有するpH3〜6のめっき浴を使用し、被めっき物
を50℃以下の温度において陰極電流密度2〜20A/dm2で
電気めっきして、鉄量が60重量%以下で残部がモリブデ
ンとタングステン、又は鉄量が75重量%以下でモリブデ
ン量が15重量%以上かつ残部がタングステンからなる鉄
−モリブデン−タングステン合金めっき皮膜を得ること
により、非晶質化が達成されると共に、かかる非晶質鉄
−モリブデン−タングステン合金めっき皮膜が高い耐食
性を有し、また上記方法はめっき温度を低温とすること
ができるので、コスト的にメリットが大きく、実用性の
高いものであることを知見したものである。As a result of various investigations to achieve the above-mentioned object, the present inventors contain a water-soluble ferrous salt, a water-soluble molybdate, a water-soluble tungstate and a water-soluble tartrate as complexing agents. Using a plating bath having a pH of 3 to 6 and electroplating an object to be plated at a cathode current density of 2 to 20 A / dm 2 at a temperature of 50 ° C. or less, an iron content of 60% by weight or less and the balance of molybdenum and tungsten, or Amorphization is achieved by obtaining an iron-molybdenum-tungsten alloy plating film in which the amount of iron is 75% by weight or less, the amount of molybdenum is 15% by weight or more, and the balance is tungsten. It has been found that the molybdenum-tungsten alloy plating film has high corrosion resistance, and the above method can reduce the plating temperature, so that it has great cost advantages and is highly practical. It is a thing.
以下、本発明につき更に詳述する。 Hereinafter, the present invention will be described in more detail.
本発明方法において使用するめっき浴は、上述したよ
うに水溶性第1鉄塩と水溶性モリブデン酸塩と水溶性タ
ングステン酸塩と水溶性酒石酸塩とを含有するpH3〜6
のものである。The plating bath used in the method of the present invention contains the water-soluble ferrous salt, the water-soluble molybdate, the water-soluble tungstate, and the water-soluble tartrate as described above, and has a pH of 3 to 6.
belongs to.
ここで、水溶性第1鉄塩としては、従来から鉄−タン
グステン合金めっきに用いられる硫酸第1鉄が使用さ
れ、水溶性モリブデン酸塩としては、モリブデン酸ナト
リウム等のモリブデン酸アルカリ金属塩が使用され、水
溶性タングステン酸塩としては、タングステン酸ナトリ
ウム等のタングステン酸アルカリ金属塩が使用され、水
溶性酒石酸塩としては、酒石酸アンモニウム、酒石酸ナ
トリウム、酒石酸カリウム、酒石酸ナトリウムカリウム
が使用される。Here, as the water-soluble ferrous iron salt, ferrous sulfate conventionally used for iron-tungsten alloy plating is used, and as the water-soluble molybdate salt, an alkali metal molybdate salt such as sodium molybdate is used. As the water-soluble tungstate, an alkali metal tungstate such as sodium tungstate is used, and as the water-soluble tartrate, ammonium tartrate, sodium tartrate, potassium tartrate, potassium sodium tartrate is used.
上記成分の濃度は、目的とするめっき皮膜組成に応じ
て選定され、この場合めっき浴中のモリブデン、タング
ステン量が多くなる程、めっき皮膜中のモリブデン、タ
ングステン量が多くなるものであるが、本発明において
は、非晶質化の点からめっき皮膜中の鉄量が60重量%以
下、残部がモリブデンとタングステン、又は鉄量が75%
重量以下、モリブデン量が15重量%以上、残部がタング
ステンとなるようにめっき浴組成を選定する。従って、
かかる点から水溶性第1鉄塩は2〜36g/l、水溶性モリ
ブデン酸塩は1〜31.5g/l、水溶性タングステン酸塩は
2〜43g/lとすることが好ましい。また、水溶性酒石酸
塩は、第1鉄塩、モリブデン酸塩、タングステン酸塩の
合計モル量に対し等価になるように使用することが好ま
しく、通常72g/l以下とされる。The concentrations of the above components are selected according to the intended plating film composition.In this case, the more molybdenum and tungsten in the plating bath, the more molybdenum and tungsten in the plating film. In the invention, the amount of iron in the plating film is 60% by weight or less from the viewpoint of amorphization, the balance is molybdenum and tungsten, or the amount of iron is 75%.
The plating bath composition is selected so that the weight is less than or equal to the weight, the amount of molybdenum is more than 15% by weight, and the balance is tungsten. Therefore,
From this point of view, the water-soluble ferrous salt is preferably 2-36 g / l, the water-soluble molybdate is 1-31.5 g / l, and the water-soluble tungstate is preferably 2-43 g / l. The water-soluble tartrate salt is preferably used so as to be equivalent to the total molar amount of ferrous salt, molybdate salt, and tungstate salt, and is usually 72 g / l or less.
また、本発明のめっき浴は、pH3〜6に調整される。 Further, the plating bath of the present invention is adjusted to pH 3-6.
上記めっき浴を用いて適宜な被めっき物に電気めっき
を行なう場合、めっき温度は50℃以下、より好ましくは
40℃以下とするものであり、本発明においては30℃以下
の室温でも十分めっきが可能である。また、陰極電流密
度は2〜20A/dm2とすることができる。When electroplating an appropriate object to be plated using the plating bath, the plating temperature is 50 ° C or lower, and more preferably
The temperature is 40 ° C. or lower, and in the present invention, plating can be sufficiently performed even at room temperature of 30 ° C. or lower. Further, the cathode current density can be set to 2 to 20 A / dm 2 .
なお、撹拌は無撹拌でもよいが、スターラー等を用い
て撹拌することが好ましく、また、陽極は通常白金めっ
きチタン網等の不溶性陽極が用いられるが、鉄陽極を用
いることも可能である。The stirring may be unstirred, but it is preferable to use a stirrer or the like, and an insoluble anode such as a platinum-plated titanium mesh is usually used as the anode, but an iron anode can also be used.
次に実施例により本発明を更に具体的に説明する。 Next, the present invention will be described more specifically by way of examples.
めっき浴としてFeSO4・7H2O,Na2MoO4・2H2O,Na2WO4・2
H2O,(NH4)2C4H4O6を下記濃度で使用し、pH3〜8,めっき
温度28〜80℃、陰極電流密度2〜20A/dm2でめっきを行
なった。FeSO 4・ 7H 2 O, Na 2 MoO 4・ 2H 2 O, Na 2 WO 4・ 2 as plating bath
Using H 2 O and (NH 4 ) 2 C 4 H 4 O 6 at the following concentrations, plating was performed at pH 3 to 8, plating temperature of 28 to 80 ° C., and cathode current density of 2 to 20 A / dm 2 .
なお、電解槽としては500mlのガラス製円筒容器を用
い、陽極は白金めっきチタン網(95×65mm)とし、陰極
(被めっき物)は円形銅板(6cm2×0.3t)を脱脂、酸
洗して用いた。In addition, a 500 ml glass cylindrical container was used as the electrolytic cell, a platinum plated titanium mesh (95 x 65 mm) was used as the anode, and a circular copper plate (6 cm 2 x 0.3 t ) was degreased and pickled as the cathode (plating object). Used.
なおまた、非晶質構造の判定にはX線回折法を用い、
電着膜中のFe,Mo及びWはプラズマ発光分析法と蛍光X
線法を併用した。皮膜構造はAESを用いて構成成分の分
布状態を求めた。電析膜の電気化学的挙動は北斗電工製
自動分極測定装置を用いた。Furthermore, the X-ray diffraction method is used to determine the amorphous structure,
Fe, Mo and W in the electrodeposited film were analyzed by plasma emission spectrometry and fluorescence X
The linear method was used together. For the film structure, the distribution of constituents was determined using AES. For the electrochemical behavior of the electrodeposited film, an automatic polarization measuring device manufactured by Hokuto Denko was used.
(1)Fe−Mo−W合金皮膜の非晶質化に及ぼすめっき皮
膜組成の影響 FeSO4・7H2O,Na2MoO4・2H2O,Na2WO4・2H2Oを種々の濃
度と、(NH4)2C4H4O6を72g/lの濃度で含むpH4のめっき浴
を使用し、めっき温度30±2℃、陰極電流密度6.0A/dm2
でめっきを行ない、得られためっき皮膜の組成を分析す
ると共に、それが非晶質であるか否かを評価した。結果
を第1図に示す。(1) Fe-Mo-W various concentrations influence FeSO 4 · 7H 2 O of plating film composition, Na 2 MoO 4 · 2H 2 O, the Na 2 WO 4 · 2H 2 O on the amorphous alloy film And a pH4 plating bath containing (NH 4 ) 2 C 4 H 4 O 6 at a concentration of 72 g / l, plating temperature 30 ± 2 ℃, cathode current density 6.0 A / dm 2
The composition of the obtained plating film was analyzed, and it was evaluated whether it was amorphous or not. The results are shown in Fig. 1.
第1図の結果より、Fe−Mo−W合金皮膜中のFe量が60
%以下、Mo量が20%以上、W量が残部である場合、非晶
質皮膜が得られることが認められた。From the results shown in Fig. 1, the amount of Fe in the Fe-Mo-W alloy film was 60.
It was confirmed that an amorphous film can be obtained when the content of Mo is 20% or less, the amount of Mo is 20% or more, and the amount of W is the balance.
(2)Fe−Mo−W合金皮膜の非晶質化に及ぼすpHの影響 下記組成 FeSO4・7H2O 36g/l Na2MoO4・2H2O 31.5〃 Na2WO4・2H2O 43〃 (NH4)2C4H4O6 72〃 のめっき浴を使用い、pHを変化させて、めっき温度30±
2℃において種々の陰極電流密度でめっきを行ない、得
られためっき皮膜が非晶質であるか否かを評価した。結
果を第2図に示す。(2) Fe-Mo-W Effect of pH on the amorphous alloy film following composition FeSO 4 · 7H 2 O 36g / l Na 2 MoO 4 · 2H 2 O 31.5〃 Na 2 WO 4 · 2H 2 O 43 Use a plating bath of 〃 (NH 4 ) 2 C 4 H 4 O 6 72 〃 and change the pH to a plating temperature of 30 ±
Plating was carried out at various cathode current densities at 2 ° C., and it was evaluated whether or not the obtained plated film was amorphous. Results are shown in FIG.
第2図の結果から、めっき浴が酸性である場合にめっ
きが可能で、しかも非晶質皮膜が得られることが認めら
れた。From the results shown in FIG. 2, it was confirmed that when the plating bath was acidic, plating was possible and an amorphous film was obtained.
(3)Fe−Mo−W合金皮膜の耐食性 Fe−12%Mo−8%W及びFe−6%Mo−43%Wのめっき
皮膜を1規定塩酸溶液中に30℃において浸漬し、アノー
ド分極曲線を求めた。結果を第3図に示す。(3) Corrosion resistance of Fe-Mo-W alloy coating Fe-12% Mo-8% W and Fe-6% Mo-43% W plated coatings are immersed in 1N hydrochloric acid solution at 30 ° C, and anode polarization curve I asked. Results are shown in FIG.
第3図の結果より、非晶質のFe−6%Mo−43%W合金
めっき皮膜が良好な耐食性を有していることが認められ
た。From the results shown in FIG. 3, it was confirmed that the amorphous Fe-6% Mo-43% W alloy plating film had good corrosion resistance.
本発明によれば、非晶質で耐食性に優れた鉄−モリブ
デン−タングステン三元合金めっき皮膜を確実にかつ工
業的有利に電析することができる。According to the present invention, an iron-molybdenum-tungsten ternary alloy plating film which is amorphous and has excellent corrosion resistance can be electrodeposited reliably and industrially.
【図面の簡単な説明】 第1図はFe−Mo−W合金皮膜組成と非晶質化の関係を示
すグラフ、第2図はめっき浴のpHとFe−Mo−W合金皮膜
の非晶質化の関係を示すグラフ、第3図は各種Fe−Mo−
W合金めっき皮膜の1規定塩酸中でのアノード分極曲線
を示す。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a graph showing the relationship between the composition of the Fe—Mo—W alloy coating and amorphization, and FIG. 2 is the pH of the plating bath and the amorphousness of the Fe—Mo—W alloy coating. Fig. 3 shows various Fe-Mo-
The anodic polarization curve of a W alloy plating film in 1N hydrochloric acid is shown.
Claims (1)
水溶性タングステン酸塩と水溶性酒石酸塩とを含有する
pH3〜6のめっき浴を使用し、被めっき物を50℃以下の
温度において陰極電流密度2〜20A/dm2で電気めっきし
て、鉄量が60重量%以下で残部がモリブデンとタングス
テン、又は鉄量が75重量%以下でモリブデン量が15重量
%以上かつ残部がタングステンからなる鉄−モリブデン
−タングステン合金めっき皮膜を得ることを特徴とする
非晶質鉄−モリブデン−タングステン合金皮膜の電析方
法。1. A water-soluble ferrous salt, a water-soluble molybdate, a water-soluble tungstate, and a water-soluble tartrate.
Using a plating bath having a pH of 3 to 6 and electroplating an object to be plated at a cathode current density of 2 to 20 A / dm 2 at a temperature of 50 ° C. or less, an iron content of 60% by weight or less and the balance of molybdenum and tungsten, or A method for electrodepositing an amorphous iron-molybdenum-tungsten alloy coating, characterized in that an iron-molybdenum-tungsten alloy coating is obtained which has an iron content of 75% by weight or less, a molybdenum content of 15% by weight or more, and the balance being tungsten. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7806989A JPH0826473B2 (en) | 1989-03-31 | 1989-03-31 | Electrodeposition method of amorphous iron-molybdenum-tungsten alloy coating. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7806989A JPH0826473B2 (en) | 1989-03-31 | 1989-03-31 | Electrodeposition method of amorphous iron-molybdenum-tungsten alloy coating. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02259094A JPH02259094A (en) | 1990-10-19 |
| JPH0826473B2 true JPH0826473B2 (en) | 1996-03-13 |
Family
ID=13651559
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7806989A Expired - Lifetime JPH0826473B2 (en) | 1989-03-31 | 1989-03-31 | Electrodeposition method of amorphous iron-molybdenum-tungsten alloy coating. |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0826473B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105945565A (en) * | 2016-04-29 | 2016-09-21 | 中冶天工集团天津有限公司 | Kiln shell assembly adjusting device and applying method thereof |
-
1989
- 1989-03-31 JP JP7806989A patent/JPH0826473B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105945565A (en) * | 2016-04-29 | 2016-09-21 | 中冶天工集团天津有限公司 | Kiln shell assembly adjusting device and applying method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02259094A (en) | 1990-10-19 |
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