JPH07105288B2 - Resistive substrate manufacturing method - Google Patents
Resistive substrate manufacturing methodInfo
- Publication number
- JPH07105288B2 JPH07105288B2 JP62126245A JP12624587A JPH07105288B2 JP H07105288 B2 JPH07105288 B2 JP H07105288B2 JP 62126245 A JP62126245 A JP 62126245A JP 12624587 A JP12624587 A JP 12624587A JP H07105288 B2 JPH07105288 B2 JP H07105288B2
- Authority
- JP
- Japan
- Prior art keywords
- resistance
- hoop
- substrate
- shaped
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title claims description 19
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 238000000034 method Methods 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims 2
- 238000010168 coupling process Methods 0.000 claims 2
- 238000005859 coupling reaction Methods 0.000 claims 2
- 238000009413 insulation Methods 0.000 claims 1
- 238000009751 slip forming Methods 0.000 claims 1
- 239000010960 cold rolled steel Substances 0.000 description 4
- 238000010924 continuous production Methods 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
Landscapes
- Adjustable Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、テレビ受像機等の電子機器に使用される抵抗
基板の製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a resistance substrate used in electronic equipment such as a television receiver.
従来の技術 従来、基板の上に抵抗路、導電路等を形成する場合、基
板の上に抵抗、導電塗料を所望の回路上に印刷・焼成し
て生産していた。この場合、例えば可変抵抗器抵抗体に
おいては（１）フェノール樹脂積層板上にカーボン・レ
ンジ系抵抗材料を印刷・焼き付けるか、又は（２）ロー
ルフィルム上に印刷・焼き付けし、基板上にこのフィル
ムを貼り付ける方法が実施又は検討されてきた。2. Description of the Related Art Conventionally, when a resistance path, a conductive path, or the like is formed on a substrate, a resistor or conductive paint is printed and fired on a desired circuit to produce the circuit. In this case, for example, in the case of a variable resistor resistor, (1) a carbon range type resistance material is printed / baked on a phenol resin laminated plate, or (2) a carbon film is printed / baked on a roll film, and this film is printed on a substrate Have been implemented or studied.
発明が解決しようとする問題点 前述（１）の方法では、基板の長さに限界があるため連
続生産が困難であり、又（２）の方法では連続生産は可
能であるが、フィルムが焼成時にその熱により伸びる為
抵抗値が変動し、所定の抵抗値に設定する事が困難にな
るという生産性と性能面の問題があった。Problems to be Solved by the Invention In the method (1) described above, continuous production is difficult because the substrate length is limited, and in the method (2), continuous production is possible, but the film is baked. At times, there is a problem in productivity and performance that the resistance value fluctuates due to the heat and it becomes difficult to set a predetermined resistance value.
問題点を解決するための手段 上記問題点を解決するために本発明は、フープ状の金属
製薄板上にロール状の絶縁性フィルムを貼り付け、この
絶縁性フィルム上に抵抗路と導電路からなる抵抗体を所
定の間隔で複数個連続形成して後、この低抗体を形成し
た部分を連結体を介して隣接する対称形状の部分と共に
打ち抜き、さらに上記連結部を折り曲げることにより抵
抗基板を製造しようとするものである。Means for Solving the Problems In order to solve the above problems, the present invention attaches a roll-shaped insulating film on a hoop-shaped thin metal plate, and forms a resistance path and a conductive path on the insulating film. After continuously forming a plurality of resistors at a predetermined interval, the portion where the low antibody is formed is punched together with the adjacent symmetrical portion through the connecting body, and the connecting portion is further bent to manufacture a resistance substrate. Is what you are trying to do.
作用 上記のような製造方法にすることにより、フィルムの伸
びは金属製薄板の伸びに規制されるために抵抗値の設定
を容易にし、性能の安定化を図ることができ、しかもフ
ーム状で組み立てできるために連続生産が可能になり、
生産性を向上させる事が可能となる。By using the above manufacturing method, the elongation of the film is regulated by the elongation of the thin metal plate, so it is easy to set the resistance value and stabilize the performance. Because it is possible, continuous production is possible,
It is possible to improve productivity.
実施例 実施例を可変抵抗器の抵抗基板を例に第１図〜第４図に
基づいて説明する。１はフープ状の冷延鋼板で、２はロ
ール状の絶縁性フィルムで、両者は第１図に示す如く圧
延され、既知の方法で貼り付けられる。EXAMPLE An example will be described with reference to FIGS. 1 to 4 by taking a resistance substrate of a variable resistor as an example. Reference numeral 1 is a hoop-shaped cold-rolled steel sheet, 2 is a roll-shaped insulating film, both of which are rolled as shown in FIG. 1 and attached by a known method.
３は上記の如く冷延鋼板１上に絶縁性フィルム２を貼り
付けたフープ状基板で、第４図のごとく抵抗路４と導電
路５からなる抵抗体を所定の間隔で複数個連続して印
刷、焼成した後、第３図の如く上記抵抗体を形成した部
分を連結部７を介して隣接する対称形状の部分と共に打
ち抜き、フープ状抵抗基板６として可変抵抗器の組立工
程に供給される。このフープ状抵抗基板６は可変抵抗器
に組み込まれる前に、上記抵抗体を形成した部分と連結
部７を介して隣接する対称形状の部分のみに切断されて
後、連結部７を折り曲げて第４図に示す抵抗基板８とし
て完成させられる。Reference numeral 3 denotes a hoop-shaped substrate in which the insulating film 2 is attached on the cold-rolled steel sheet 1 as described above, and a plurality of resistors composed of the resistance paths 4 and the conductive paths 5 are continuously arranged at a predetermined interval as shown in FIG. After printing and firing, as shown in FIG. 3, the portion where the resistor is formed is punched out together with the adjacent symmetrical portion through the connecting portion 7 and is supplied to the variable resistor assembling process as the hoop-shaped resistor substrate 6. . Before the hoop-shaped resistance substrate 6 is assembled into the variable resistor, the hoop-shaped resistance substrate 6 is cut only into a symmetrical portion adjacent to the portion where the resistor is formed through the connecting portion 7, and then the connecting portion 7 is bent to The resistance substrate 8 shown in FIG. 4 is completed.
発明の効果 本発明は上述の如くの構成の製造方法である為、焼成時
のフィルムの伸びは金属製薄板の伸びに制限されるの
で、所定の抵抗値の設定が容易で、又、絶縁性フィルム
は既知の製造方法により厚みを安定的にコントロールで
きるので電気的に安定な高品質の抵抗基板を供給する事
が可能となる。また、フープ材を搬送しながら抵抗基板
を製造することができるために連続生産が可能になり、
生産性の向上を図ることができる。なお、上記実施例は
可変抵抗器の抵抗基板について述べたが、本発明の製造
方法は他の電子部品（例えば、固定抵抗器、厚膜IC）に
も適用できる。EFFECTS OF THE INVENTION Since the present invention is a manufacturing method having the structure as described above, the elongation of the film during firing is limited to the elongation of the metal thin plate, so that it is easy to set a predetermined resistance value, and the insulating property Since the thickness of the film can be stably controlled by a known manufacturing method, it is possible to supply an electrically stable high-quality resistive substrate. Also, since it is possible to manufacture the resistance substrate while conveying the hoop material, continuous production is possible,
Productivity can be improved. Although the above embodiment has described the resistance substrate of the variable resistor, the manufacturing method of the present invention can be applied to other electronic components (for example, fixed resistor and thick film IC).
第１図は金属製薄板上に絶縁性フィルムを貼り付ける概
略工程を示す図、第２図は抵抗器・導電路からなる抵抗
体を絶縁性フィルム上に印刷したフープ状の金属製薄板
を示す斜視図、第３図はフープ状に打ち抜いた抵抗基板
を示す斜視図、第４図は単品となった抵抗基板を示す斜
視図である。 １……フープ状の冷延鋼板、２……ロール状の絶縁製フ
ィルム、３……絶縁性フィルムを貼り付けたフープ状の
冷延鋼板、４……抵抗路、５……導電路、６……抵抗基
板（フープ状）、７……連結部、８……抵抗基板。FIG. 1 is a diagram showing a schematic process of attaching an insulating film on a metal thin plate, and FIG. 2 shows a hoop-shaped metal thin plate in which a resistor consisting of a resistor and a conductive path is printed on the insulating film. FIG. 3 is a perspective view showing a resistance substrate punched out in a hoop shape, and FIG. 4 is a perspective view showing a resistance substrate which is a single product. 1 ... Hoop-shaped cold rolled steel plate, 2 ... Roll-shaped insulating film, 3 ... Hoop-shaped cold rolled steel plate to which an insulating film is attached, 4 ... Resistance path, 5 ... Conductive path, 6 ...... Resistance board (hoop-shaped), 7 ... Connecting part, 8 ... Resistance board.
フロントページの続き (72)発明者 中谷 登 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (56)参考文献 特開 昭59−43562（ＪＰ，Ａ) 特開 昭49−3236（ＪＰ，Ａ)Front page continuation (72) Inventor Noboru Nakatani 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) Reference JP 59-43562 (JP, A) JP 49-3236 (JP, JP, 3236) A)
Claims (1)
性フィルムを貼り付け、この絶縁性フィルム上に抵抗路
と導電路からなる抵抗体を所定の間隔で複数個連続形成
して後、この低抗体を形成した部分を連結体を介して隣
接する対称形状の部分と共に打ち抜き、さらに上記連結
部を折り曲げて抵抗基板の組み立てを行う抵抗基板の製
造方法。1. A roll-shaped insulating film is attached to a hoop-shaped thin metal plate, and a plurality of resistors consisting of resistance paths and conductive paths are continuously formed on the insulation film at predetermined intervals. A method for manufacturing a resistance substrate, in which the portion where the low antibody is formed is punched together with the adjacent symmetrical portion via a coupling body, and the coupling portion is further bent to assemble the resistance substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62126245A JPH07105288B2 (en) | 1987-05-22 | 1987-05-22 | Resistive substrate manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62126245A JPH07105288B2 (en) | 1987-05-22 | 1987-05-22 | Resistive substrate manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63289904A JPS63289904A (en) | 1988-11-28 |
| JPH07105288B2 true JPH07105288B2 (en) | 1995-11-13 |
Family
ID=14930390
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62126245A Expired - Fee Related JPH07105288B2 (en) | 1987-05-22 | 1987-05-22 | Resistive substrate manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07105288B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2778157B2 (en) * | 1989-10-24 | 1998-07-23 | 松下電器産業株式会社 | Manufacturing method of resistor |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5741327B2 (en) * | 1972-04-21 | 1982-09-02 | ||
| JPS5943562A (en) * | 1982-09-06 | 1984-03-10 | Fujitsu Ltd | Manufacture of thick film hybrid ic |
-
1987
- 1987-05-22 JP JP62126245A patent/JPH07105288B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63289904A (en) | 1988-11-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |