JPH07107911B2 - Semiconductor device inspection method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Object of the Invention (Field of Industrial Application) The present invention relates to a method for inspecting a semiconductor device.

(Prior Art) Generally, a semiconductor device is manufactured by the following steps.

That is, first, a large number of semiconductor chips are formed on a semiconductor wafer by a precision photo transfer technique or the like, and then cut into individual semiconductor chips. Then, this semiconductor chip is arranged on a substrate having leads, for example, a lead frame, and the electrode pads of the semiconductor chip and the leads of the lead frame are connected by, for example, wire bonding. Then, a semiconductor chip protector is formed by, for example, a mold to obtain a semiconductor device. For example, TAB (tape auto
There is also a semiconductor device in which a semiconductor chip is mounted on the substrate by mated bonding, etc.

In general, in the above-described semiconductor device manufacturing process, an inspection using a probe device in a semiconductor wafer state and an inspection of a completed semiconductor device using a handler or a substrate inspection device are performed.

Further, the inventors of the present invention have disclosed a method of arranging a finished semiconductor device on a tray and inspecting it, in Japanese Patent Application Nos. 61-299646 and 61-299646.
62-156924 and so on.

(Problems to be Solved by the Invention) As described above, conventionally, the state of the semiconductor wafer and the finished semiconductor device are inspected. Therefore, for example, a defect such as a defect in wire bonding that occurs after the inspection in the state of the semiconductor wafer cannot be detected until after the completion, and there is a problem that productivity is lowered.

In addition, in the inspection of the finished product, since the lead portion of the finished product is bent, the proportion of product defects due to the mold is small, but there is a problem in that the handler that continuously inspects the product has some production problems.

The present invention has been made in response to such conventional circumstances, and it is possible to efficiently inspect a semi-finished semiconductor device in a state where the electrode pads of the semiconductor chip and the leads of the base are connected, An object of the present invention is to provide a method for inspecting a semiconductor device, which can improve productivity in comparison.

[Structure of the Invention] (Means for Solving the Problems) That is, the present invention tests a semiconductor device including at least a semiconductor chip and a substrate having a lead to which an electrode pad of the semiconductor chip is electrically connected. On the occasion of
A plurality of semi-finished semiconductor devices in which the electrode pads of the semiconductor chip and the leads of the base are connected are arranged on a tray having a positioning mechanism, and then the trays are conveyed and positioned, and then the leads are mounted on the leads. The semi-finished semiconductor device is electrically inspected by bringing the probe into contact with the probe.

(Operation) In the method for inspecting a semiconductor device of the present invention having the above-described structure, a semi-finished semiconductor device in which the electrode pads of the semiconductor chip and the leads of the substrate are connected, for example, a semiconductor device in a lead frame state before molding is used. A plurality of trays having a positioning mechanism are arranged, the trays are transported and positioned, and the leads are brought into contact with the probe to electrically inspect the semi-finished semiconductor device.

Therefore, it is possible to detect a defect such as a defect in wire bonding which occurs after the inspection in the state of the semiconductor wafer before the molding, and it is possible to improve the productivity as compared with the conventional case. Further, since a plurality of semi-finished semiconductor devices are arranged on the tray, it is possible to efficiently perform the inspection using, for example, a large substrate probe device.

Further, it is possible to prevent the inspection from being stopped due to bending of the lead, and the productivity can be improved.

(Embodiment) An embodiment of a semiconductor device inspection method of the present invention will be described below with reference to the drawings.

For example, the tray 1 formed in the shape of a rectangular plate is made of an insulating material and has a predetermined size, for example, a size equivalent to a substrate that can be inspected by a probe device for a large substrate. Are lined up.

These recesses 2 are semi-finished semiconductor devices in which the electrode pads of the semiconductor chip and the leads of the base are connected, for example, the leads of the lead frame 3a and the electrode pads of the semiconductor chip 3b are bonded by the wires 3c. The semiconductor device 3 is a semi-finished product, and the semiconductor device 3 in the lead frame state can be positioned with a predetermined accuracy, for example, with a large substrate probe device so that the probe can be brought into contact with the lead. There is.

Then, the semi-finished semiconductor device 3 is placed in each recess 2 of the tray 1, and is transported and positioned by using, for example, a probe device for a large substrate, and as shown in FIG. The semi-finished semiconductor device 3 is electrically inspected by bringing the probe 4 into contact with.

Therefore, it is possible to detect a defect such as a defect in wire bonding which occurs after the inspection in the state of the semiconductor wafer before the molding, and it is possible to improve the productivity as compared with the conventional case. In addition, since a plurality of semi-finished semiconductor devices 3 are arranged on the tray 1 and the inspection is performed using the probe device for a large substrate, there is no need for a special inspection device.
It can be inspected efficiently.

In the above embodiment, the semi-finished semiconductor device 3 in which the leads of the lead frame 3a and the electrode pads of the semiconductor chip 3b are bonded by the wires 3c has been described, but other semi-finished semiconductor devices, for example, TAB
It is also possible to inspect in the same way for semi-finished semiconductor devices after bonding and cutting the tape, or semi-finished semiconductor devices of COB (chip on board) with semiconductor chips directly mounted on the substrate. it can. Also, CO
When the semi-finished semiconductor device B is inspected, it is possible to inspect it without using the tray 1 depending on the size of the substrate.

In addition, a finished product molded in the tray can be installed to perform a finished product inspection.

[Effects of the Invention] As described above, according to the semiconductor device inspection method of the present invention, a semi-finished semiconductor device in which the electrode pads of the semiconductor chip and the leads of the substrate are connected can be efficiently inspected. The productivity can be improved as compared with the conventional one.

[Brief description of drawings]

FIG. 1 is a plan view of a tray for explaining a semiconductor device inspection method according to an embodiment of the present invention, and FIG. 2 is a semi-finished semiconductor device arranged on the tray of FIG. It is a side view which shows the state which was made to contact. 1 ... Tray, 2 ... recessed part, 3 ... semi-finished semiconductor device.

Claims (1)

[Claims] 1. When inspecting a semiconductor device comprising at least a semiconductor chip and a base having leads to which electrode pads of the semiconductor chip are electrically connected, the electrode pads of the semiconductor chip and the leads of the base are provided. A plurality of semi-finished semiconductor devices connected to each other are arranged on a tray having a positioning mechanism, and then the trays are transported and positioned, and then a deep needle is brought into contact with the lead to complete the semi-finished semiconductor. A method of inspecting a semiconductor device, which comprises electrically inspecting the device.