JPH07107955B2 - Dicing method and device - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a dicing technique, and more particularly to a technique effectively applied to improving reliability in a dicing process of a ceramic substrate or a semiconductor wafer.

[Conventional technology]

Japanese Patent Application Laid-Open No. 61-44597 discloses an example of a knife-type dicing device for cutting a ceramic substrate.

The present inventor examined improvement of dicing accuracy in a dicing apparatus used for dividing a plate-like object such as such a ceramic substrate. The following is a technology which has not been publicly known but has been studied by the present inventor, and the outline thereof is as follows.

In other words, for the ceramic substrate for hybrid modules used in large-scale electronic computers, etc., in order to realize simultaneous acquisition of multiple green sheets and improve manufacturing efficiency, after performing multi-layer simultaneous sintering of green sheets, plating processing is performed, and then each circuit is further processed. A technique of manufacturing by a process of dividing and cutting each region is known.

When dividing such a ceramic substrate, a dicing technique similar to that used for dividing a semiconductor wafer is used.

That is, in the dicing device that performs the above process,
Prior to dicing, an object to be cut such as a ceramic substrate is positioned on a stage, and then a dicing blade in a high-speed rotating state is scanned in a contact state along a boundary area on the ceramic substrate to divide each substrate unit. Is.

By the way, when aligning the ceramic substrate on a stage, first, a dicing blade in a high-speed rotating state is scanned to form a dummy linear reference line, and this linear reference line is used as a reference on an image on a TV screen or the like. It is known that the cursor position is determined by deciding the cursor line and the position of the stage is adjusted by the deviation between the cursor line and the monitor line previously printed on the surface of the ceramic substrate.

To detect the deviation, usually, two arbitrary points are designated, and the deviation amounts of the cursor line and the monitor line in the visual fields of these two points are averaged in the mutual visual fields to determine the cutting scanning locus of the dicing blade. The decision is made and dicing is performed.

[Problems to be solved by the invention]

However, it has been clarified by the present inventor that the following inconveniences may occur when the alignment is performed by the two-point visual field.

That is, in the case of a ceramic substrate or the like that is multilayer co-sintered as described above, since the degree of partial shrinkage during sintering is high, the monitor line that should be originally a straight line formed on the surface of the substrate However, it often becomes curved after sintering. Therefore, when positioning is performed by the two-point visual field method as described above during dicing, the actual cutting locus of the dicing blade and the circuit boundary area on the ceramic substrate are largely displaced depending on the setting position of the two-point visual field. There is a high possibility that dicing failure may occur such as the internal circuit pattern of the ceramic substrate being cut.

The present invention has been made focusing on the above problems,
An object of the present invention is to provide a technique capable of highly accurate dicing division even when a material such as a ceramic substrate whose material is easily deformed is used as the object to be cut.

The above and other objects and novel features of the present invention will be apparent from the description of the present specification and the accompanying drawings.

[Means for solving problems]

The outline of a typical invention among the inventions disclosed in the present application will be briefly described as follows.

That is, it is a dicing method for cutting a plate-like object whose surface is divided into a plurality of regions in the thickness direction or cutting by a certain amount, and a monitor line and a straight reference line which are previously formed on the surface of the plate-like object. After monitoring the deviation of the dicing blade at at least three points, the scanning loci of the dicing blades are aligned in parallel by the average value of the deviation amounts of the respective monitor lines and the straight reference line at these three points.

[Action]

According to the above-described means, the deviation amount between the monitor line and the straight reference line is monitored at at least three points, and the scanning loci of the dicing blades are aligned in parallel by the average value thereof, so that more accurate dicing of the plate-like object is performed. It becomes possible to divide.

〔Example〕

FIG. 1 is a schematic explanatory view showing the constitution of a dicing apparatus which is an embodiment of the present invention, FIG. 2 (a) is a plan view showing a ceramic substrate which is an object to be cut of this embodiment, and FIG. Partial enlarged views thereof, FIGS. 3 (a) and 3 (b) are explanatory views showing the method of adjusting the cursor gauge in the present embodiment, FIGS. 4 (a), 4 (b) and 5 (a), (B) is an explanatory view showing a parallel alignment method at the time of dicing according to this embodiment, FIGS. 6 (a), (b), (c) and FIGS. 7 (a), (b), (c). 8A and 8B are explanatory views showing a width matching method.

In FIG. 1, reference numeral 1 denotes a ceramic substrate as an example of a plate-like object which is an object to be cut, and the ceramic substrate 1 is attached to a glass plate 2 with an adhesive agent (not shown) or the like on the surface of a stage 3. It has been placed. The stage 3 is provided with a vacuum suction port 4, and the vacuum suction action from the vacuum suction port 4 fixes the ceramic substrate 1 together with the glass plate 2 on the stage 3.

Television cameras 6a, 6b, 6c as detection units 6 are provided at three locations above the stage 3 at predetermined intervals, and each image from these television cameras 6a, 6b, 6c is displayed on a monitor screen 7. Is divided into three parts in the vertical direction and displayed on divided screens 8a, 8b, 8c. In addition, in FIG.
A pair of lines 9a and 9b indicated by a two-dot chain line appearing in the central horizontal direction of the divided screens 8a, 8b and 8c are cursor gauges, and the adjustment knobs 19a and 19b provided on the outside of the screen cause the monitor screen 7 to move. It is movable vertically.

A dicing blade 10 that is movable in the horizontal direction integrally with the detection unit 6 is rotatably provided on the side of the detection unit 6 while being sandwiched by a spindle 11. The spindle 11 is connected to a motor (not shown) which is a rotary drive source, and is movable in the front direction, that is, the Y direction and the Z direction in FIG.

The stage is movable in the left-right direction, that is, the X direction in FIG.
Rotation of 0 degrees is possible.

The dicing blade 10 sandwiched between the spindles 11 is formed of, for example, a corrosion-resistant metal in the shape of a hollow disk with a thickness of about 50 μm, and nickel particles or the like is used as a binder on the circumference to fix diamond particles. Can be obtained by Such a die sig blade 10 is driven by a rotary drive source such as a motor (not shown) with reference to the vertical plane.
It is possible to rotate at a high speed of about 00 to 4000 rpm, and by contacting the rotating peripheral end of the dicing blade 10 with the object to be cut, it becomes possible to form a deep groove for the object to be cut or to separate the cutting. ing.

The movement of the ceramic substrate 1 in the Z-axis direction is relatively performed by the dicing blade 10 whose movement is controlled in the Z-axis direction by the control unit 12 as described above, and the cutting depth in the dicing is the Z-axis direction. It is determined by the amount of displacement to. Here, when the ceramic substrate 1 is completely cut and separated by dicing, the ceramic substrate 1
It is necessary to set the amount of displacement in the Z-axis direction by the control unit 12 to such an extent that even the glass plate 2 on which is attached is cut.

The detection unit 6 has a structure capable of focusing by vertical movement, for example, and by an illumination system (not shown), at predetermined three points on the surface of the ceramic substrate 1 shown in FIGS. 2 (a) and 2 (b). The structure is such that the field of view can be photographed. This photographing signal is sent from the detector 6 to the monitor screen 7
And is displayed on each divided screen 8a, 8b, 8c. At this time, in order to use it as a reference for alignment during dicing, it is desirable that the enlargement magnification on the monitor screen 7 is about 10 to 200 times.

Here, the ceramic substrate 1 as an object to be cut used in the present embodiment will be described. In this ceramic substrate 1, a large number of green sheets on which wirings and electrodes are formed by printing a conductive metal material or the like are laminated and simultaneously fired. A large number of internal regions 13 are formed in a matrix form on the surface thereof as shown by the diagonal lines in FIGS. 2 (a) and 2 (b). Monitor lines 14 are formed on the outer peripheries of the internal regions 13 by printing or the like.

Next, a dicing method using the dicing apparatus of this embodiment will be sequentially described.

First, in the control unit 12, the spindle as the cutting condition
Initial conditions such as the number of rotations of 11, the Y-direction movement amount, the setting of the cutting width, the Z-axis direction displacement amount, and the X-direction movement amount of the stage 3 are set.

Furthermore, the following parallel alignment is further performed after replacement of the dicing blade 10 or when necessary.

That is, first, the dummy dicing is performed by moving the stage 3 in the X direction while rotating the spindle 11 at an arbitrary position in the outermost peripheral region on the ceramic substrate 1. The purpose of this dummy dicing is to form a cutting trace by the dicing blade 10 on the surface thereof, and the cutting trace may be a groove having a depth that can be visually recognized. The cutting trace formed in this way is 15 in FIG. 2 (b).
It becomes a straight reference line as shown by.

The stage 3 is appropriately moved so that the straight line reference line 15 is directly below the detection unit 6, and the straight line reference line 15 is displayed on the monitor screen 7. The monitor screen 7 at this time is in the state shown in FIG. That is, the hatched portion in FIG. 3 (a) is the straight reference line 15 formed by the dummy dicing, and the width of the dicing blade 10 in the thickness direction on the monitor screen 7 can be detected by this. You can Next, on the monitor screen 7, the adjustment knobs 19a and 19b are adjusted so that the edge lines on both sides of the straight reference line 15 in the width direction and the cursor gauges 9a and 9b coincide with each other (Fig. 3 (b)). ). In this state, the cursor gauges 9a, 9
b matches the dicing line when the actual dicing is performed on the ceramic substrate 1.

Next, the cursor gauges 9a and 9b set as described above and the monitor line 14 previously formed on the ceramic substrate 1 are aligned in parallel.

As described above, the monitor line 14 is formed by means of printing or the like on the green sheets before laminating and sintering the green sheets which are the constituent materials of the ceramic substrate 1.

In parallel alignment of the cursor gauges 9a and 9b with the monitor line 14, first, the stage 3 and the spindle 11 are appropriately moved in the XY directions so that the monitor line 14 is directly below the detection unit 6.

Here, if the monitor line 14 is a substantially straight line on the ceramic substrate 1, the monitor screen 7
A linear monitor line 14 penetrating in the horizontal direction of the monitor screen 7 as shown in FIG. 3 should be projected, but as described above, in the case of the ceramic substrate 1, the sintering process is performed. Influenced by heat shrinkage, etc., Fig. 4 (b)
Often appears as a curved line as shown in. As described above, the cursor line 9 including the monitor line 14 and the pair of cursor gauges 9a and 9b.
When the positional relationship with and is in the state as shown in FIG. 4 (b), an image as shown in FIG. 4 (a) appears on the monitor screen.

In such a state, the conventional two-point visual field, that is, the fourth
When the alignment is performed only within the range shown by the visual fields 6a and 6c in FIG. 6B, the curvature of the monitor line 14 may cause the internal region 13 to be cut during dicing as described above.

Regarding this point, in the present embodiment, parallel alignment is performed by the following three-point visual field.

First, the monitor line 14 is moved by moving the stage 3.
The total amount of displacement between the cursor line 9 and the cursor line 9 is 3 fields of view 6a, 6
Adjust while watching the monitor screen 7 so as to average in b and 6c. The setting state thus obtained is shown in FIGS. 5 (a) and 5 (b).

After the parallel alignment is completed as described above, the width alignment is performed. 6 (a) to (c) and FIG. 7 (a).
(C) shows the method of performing the width matching according to the present embodiment, respectively.

That is, when the parallel alignment is performed on the monitor line 14A side at the lower end of the inner area 13 as shown in FIG. 6 (b), if the monitor line 14B at the upper end of the inner area 13 is displaced. There is. The reason for this is that the actual width dimension l ₁ of the internal region 13 shown in FIG. 2A, that is, the width dimension from the monitor line 14A at the lower end to the monitor line 14B at the upper end in FIG. This is because the shrinkage of the ceramic material during sintering makes it smaller than the set dimension l ₂ . If this deviation is large, no matter how accurately the parallel alignment is performed, the monitor line at the upper end where the deviation occurs
On the side of 14B, there is a possibility that a part of the internal region 13 will be cut during dicing.

In such a case, as shown in FIGS. 7 (a) to (c), a position that is an average of the parallel alignment position of the monitor line 14A at the lower end and the parallel alignment position of the monitor line 14B at the upper end. The width is adjusted by setting the cursor line 9 to, and the Y-direction of the spindle 11 is adjusted, and then the actual cutting work step is started.

In the cutting work step, the cutting by the dicing blade 10 is performed based on the X-direction trajectory set as described above.
This is done for each line in the direction. After the cutting of all the X-direction lines shown in FIG. 2B is completed, the stage 3 is rotated 90 degrees and the cutting of the Y-direction line is performed. Where Y
When cutting the directional lines, the stage 3 may be simply rotated by 90 degrees as described above and then dicing may be performed immediately, but the parallel alignment and the width alignment described above may be performed again.

As described above, according to this embodiment, the cursor line 9 based on the straight line reference line 15 and the monitor line 14 are aligned by visual field recognition at three locations, so that highly accurate parallel alignment and width alignment can be performed. Therefore, even when the object to be cut, which is likely to cause a dimensional error, is used, it is possible to prevent erroneous cutting of the inner region and realize highly accurate dicing.

Further, as described above, since the ceramic substrate 1 can be cut and separated with high accuracy after sintering, it is possible to improve the manufacturing efficiency and reduce the cost of the hybrid module substrate used in a large-scale computer.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the embodiments and various modifications can be made without departing from the scope of the invention. Nor. For example, as the position recognition in the parallel alignment and the width alignment, the case of using the three-point visual field has been described, but the position recognition may be performed based on the three or more visual fields.

In the above description, the invention mainly made by the present inventor has been described in the case of being applied to a so-called ceramic substrate cutting and separating technique, which is the field of use thereof, but the present invention is not limited to this and, for example, in manufacturing a semiconductor device. It can also be applied to semiconductor wafer dicing technology and the like.

〔The invention's effect〕

The following is a brief description of an effect obtained by the representative one of the inventions disclosed in the present application.

That is, after the deviation between the monitor line and the linear reference line which are formed in advance on the surface of the plate-like object is monitored at at least three points, the deviation amount between each monitor line and the linear reference line at at least these three points is monitored. By performing parallel alignment of the scanning loci of the dicing blades with the average amount, it is possible to perform more accurate dicing division in the plate-shaped object.

[Brief description of drawings]

FIG. 1 is a schematic explanatory view showing a configuration of a dicing apparatus which is an embodiment of the present invention, FIG. 2 (a) is a plan view showing a ceramic substrate which is an object to be cut of the embodiment, and FIG. 2 (b). ) Is a partially enlarged view thereof, FIGS. 3 (a) and (b) are explanatory views showing a method of adjusting the cursor gauge in the embodiment, and FIGS. 4 (a), (b) and 5 (a). , (B) is
FIGS. 6 (a), 6 (b) and 6 (c) and FIG. 7 (a), which are explanatory views showing a parallel alignment method in dicing according to the embodiment, respectively.
(B), (c) is explanatory drawing which shows the method of width alignment, respectively. 1 ... Ceramic substrate (plate-like object), 2 ... Glass plate,
3 ... Stage, 4 ... Vacuum suction port, 6 ... Detection unit, 6
a, 6b, 6c …… TV camera (recognition field of view), 7 …… monitor screen, 8a, 8b, 8c …… split screen, 9 …… cursor line, 9a, 9b …… cursor gauge, 10 …… dicing blade, 11 …… Spindle, 12 …… Control part, 13 …… Internal area, 14 …… Monitor line, 14A …… Bottom monitor line, 14B …… Top monitor line, 15 …… Linear reference line, 19a, 19b …… Adjustment Knob.

Claims (3)

[Claims] 1. A dicing method for cutting a plate-shaped object whose surface is divided into a plurality of regions in the thickness direction or a predetermined amount, and a monitor line formed in advance on the surface of the plate-shaped object. After monitoring the deviation from the straight reference line that becomes the dicing scanning locus at at least three points,
A dicing method characterized in that the scanning loci of the dicing blades are aligned in parallel by the average value of the amounts of deviation between the respective monitor lines and the straight reference line at at least these three locations. 2. The plate-shaped object is a ceramic substrate obtained by multi-layer sintering of green sheets, and the monitor line is formed by printing on the green sheets before sintering,
The dicing method according to claim 1, wherein the straight reference line is formed by dummy scanning of a dicing blade on the surface of the substrate after sintering. 3. A dicing device for cutting a plate-shaped object whose surface is divided into a plurality of regions in the thickness direction or for cutting the plate-shaped object by a fixed amount, and a stage for fixing the plate-shaped object and a plate-shaped object on the stage. Recognition means for monitoring the monitor lines formed on the surface of the object at at least three points, and a control section for determining the scanning locus of the dicing blade corresponding to the deviation amount of the monitor lines at the at least three points obtained from the recognition means. And a dicing device.