JPH07115440B2 - Ceramic-metal bonded structure and method for manufacturing the same - Google Patents
Ceramic-metal bonded structure and method for manufacturing the sameInfo
- Publication number
- JPH07115440B2 JPH07115440B2 JP62010046A JP1004687A JPH07115440B2 JP H07115440 B2 JPH07115440 B2 JP H07115440B2 JP 62010046 A JP62010046 A JP 62010046A JP 1004687 A JP1004687 A JP 1004687A JP H07115440 B2 JPH07115440 B2 JP H07115440B2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- layer
- base material
- thin plate
- bonded structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910052751 metal Inorganic materials 0.000 title claims description 196
- 239000002184 metal Substances 0.000 title claims description 196
- 238000000034 method Methods 0.000 title description 11
- 238000004519 manufacturing process Methods 0.000 title description 5
- 239000000463 material Substances 0.000 claims description 80
- 239000000919 ceramic Substances 0.000 claims description 59
- 238000005219 brazing Methods 0.000 claims description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 17
- 229910052802 copper Inorganic materials 0.000 claims description 17
- 239000010949 copper Substances 0.000 claims description 17
- 229910045601 alloy Inorganic materials 0.000 claims description 15
- 239000000956 alloy Substances 0.000 claims description 15
- 239000000945 filler Substances 0.000 claims description 8
- 150000002739 metals Chemical class 0.000 claims description 6
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 5
- 229910052750 molybdenum Inorganic materials 0.000 claims description 5
- 239000011733 molybdenum Substances 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 229910000531 Co alloy Inorganic materials 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 2
- 229910052721 tungsten Inorganic materials 0.000 claims description 2
- 239000010937 tungsten Substances 0.000 claims description 2
- 230000035939 shock Effects 0.000 description 16
- 230000008646 thermal stress Effects 0.000 description 14
- 229910000975 Carbon steel Inorganic materials 0.000 description 8
- 239000010962 carbon steel Substances 0.000 description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- 229910001374 Invar Inorganic materials 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- 230000035882 stress Effects 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229910000833 kovar Inorganic materials 0.000 description 3
- 239000011812 mixed powder Substances 0.000 description 3
- LFYJSSARVMHQJB-QIXNEVBVSA-N bakuchiol Chemical compound CC(C)=CCC[C@@](C)(C=C)\C=C\C1=CC=C(O)C=C1 LFYJSSARVMHQJB-QIXNEVBVSA-N 0.000 description 2
- 239000010953 base metal Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229910001182 Mo alloy Inorganic materials 0.000 description 1
- 229910017709 Ni Co Inorganic materials 0.000 description 1
- 229910003267 Ni-Co Inorganic materials 0.000 description 1
- 229910003262 Ni‐Co Inorganic materials 0.000 description 1
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 1
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- MGRWKWACZDFZJT-UHFFFAOYSA-N molybdenum tungsten Chemical compound [Mo].[W] MGRWKWACZDFZJT-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Ceramic Products (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明はセラミックス母材と金属母材とが金属中間層を
介して接合されるセラミックスと金属の接合構造体およ
びその製造方法に関する。Description: TECHNICAL FIELD The present invention relates to a ceramic-metal bonded structure in which a ceramic base material and a metal base material are bonded via a metal intermediate layer, and a method for manufacturing the same.
最近、激しい摩耗や高熱を受ける金属部品・部材の一部
に、いわゆるファインセラミックスの部品を組合せるこ
とで、部品全体の耐摩耗性や耐熱性を向上させる手段が
採られている。このような組合せによるセラミックスと
金属の接合構造体は、セラミックス母材と金属母材とを
金属中間層を介して一体的に接合するもので、セラミッ
クス母材と金属母材との熱膨張係数の大きな差を金属中
間層で吸収し、セラミックス母材と金属母材とを電気炉
中で加熱接合した後、常温下で冷却する過程で発生する
熱応力や熱歪が緩和されるようになっており、これによ
って接合面での剥離が防止されることになる。Recently, a means for improving the wear resistance and heat resistance of the entire component has been adopted by combining a so-called fine ceramic component with a part of a metal component or member that is subjected to severe wear or high heat. The ceramic-metal joint structure by such a combination integrally joins the ceramic base material and the metal base material via the metal intermediate layer, and has a coefficient of thermal expansion of the ceramic base material and the metal base material. A large difference is absorbed by the metal intermediate layer, and after the ceramic base material and the metal base material are heated and joined in an electric furnace, the thermal stress and thermal strain generated in the process of cooling at room temperature are alleviated. This prevents peeling at the joint surface.
従来から行なわれている接合方法としては、例えば、セ
ラミックス母材の表面にメタライズ層を形成し、次いで
その上に金属中間層をろう付けし、更にこの金属中間層
の上に金属母材をろう付けしていくものや、上記セラミ
ックス母材に金属中間層および金属母材を一段で同時接
合する方法などが知られている。セラミックス母材およ
び金属母材には多種類のものが使われているが、金属中
間層には銅、アルミニウム、銀などの高展延性金属、又
はこれらいずれかの金属を含む合金、あるいは鉄−ニッ
ケル−コバルト合金〔例えば、コバール、スーパーイン
バー（商品名）〕やタングステン−モリブテン合金など
のような低熱膨張金属が用いられている。前者の高展延
性金属による熱応力の緩和機構は、セラミックス母材と
金属母材の熱膨張係数の差を金属中間層の塑性変形によ
って吸収し金属母材側からの熱応力等を緩和するもので
あり、後者の低熱膨張金属による熱応力の緩和機構は、
金属母材側で発生する熱応力を金属中間層で食い止めセ
ラミックス母材側に伝播しないようにしたものである。As a conventional joining method, for example, a metallized layer is formed on the surface of a ceramic base material, a metal intermediate layer is then brazed thereon, and a metal base material is brazed on the metal intermediate layer. Known methods include a method of simultaneously attaching the metal intermediate layer and the metal base material to the ceramic base material in a single step. Although many types of ceramic base materials and metal base materials are used, highly ductile metals such as copper, aluminum and silver, alloys containing any of these metals, or iron- Low thermal expansion metals such as nickel-cobalt alloys [e.g., Kovar, Super Invar (trade name)] and tungsten-molybdenum alloys are used. In the former, the mechanism of thermal stress relaxation by highly malleable metal absorbs the difference in thermal expansion coefficient between the ceramic base material and the metal base material by plastic deformation of the metal intermediate layer, and relaxes the thermal stress from the metal base material side. And the latter relaxation mechanism of thermal stress by low thermal expansion metal is
The thermal stress generated on the side of the metal base material is prevented by the metal intermediate layer so as not to propagate to the side of the ceramic base material.
ところで、セラミックスと金属の接合構造体は、加熱−
冷却サイクルを受ける機械部品として使用されることが
多いため、上述のように高展延性金属や低膨張金属を金
属中間層として用い、熱応力等の緩和を図るようにして
あっても、金属中間層自体が熱伸縮によって熱歪を発生
しその影響をセラミックス母材側で受けてしまうといっ
た問題があった。By the way, the bonded structure of ceramics and metal is heated by
Since it is often used as a machine part that undergoes a cooling cycle, even if a high-expansion metal or low-expansion metal is used as the metal intermediate layer as described above to reduce thermal stress, etc. There has been a problem that the layer itself causes thermal strain due to thermal expansion and contraction, and the effect is received on the ceramic base material side.
金属中間層による熱歪の影響は、該金属中間層の厚さを
薄くすることによって減少するものであるが（特願昭61
-58830号に開示）、従来の金属中間層は１層で形成して
あるためにその効果にも限界があった。The influence of thermal strain due to the metal intermediate layer is reduced by reducing the thickness of the metal intermediate layer (Japanese Patent Application No. 61-61).
No. 58830), the conventional metal intermediate layer is limited in its effect because it is formed of one layer.
そこで本発明の技術的課題は、金属母材からの熱応力の
影響や金属中間層自身の熱歪による影響をセラミックス
母材側で受けないようにし、加熱−冷却サイクルの激し
い苛酷な環境下でもセラミックスと金属の接合構造体を
有効に使用でき得るようにする点にある。Therefore, the technical problem of the present invention is to prevent the ceramic base material side from being affected by the thermal stress from the metal base material and the thermal strain of the metal intermediate layer itself, even under a severe environment of a heating-cooling cycle. The point is to make it possible to effectively use the bonded structure of ceramics and metal.
本発明は上記技術的課題の解決のために、セラミックス
母材と金属母材とが金属中間層とろう材層を介して接合
されるセラミックスと金属の接合構造体において、ろう
材層を含まない上記金属中間層はセラミックス母材側か
ら高展延性金属もしくは該金属を含む合金の金属薄板層
Ａ、低線膨張率かつ高剛性の金属層Ｂ、および高展延性
金属もしくは該金属を含む合金の金属層Ｃの３層構造を
形成してなることを特徴とするセラミックスと金属の接
合構造体と、セラミックス母材上にメタライズ層を形成
すると共に、該メタライズ層上に高展延性金属もしくは
該金属を含む合金の金属薄板層Ａを設け、その上に低線
膨張率かつ高剛性の金属層Ｂを設け、更にその上に前記
金属薄板層Ａと同様の高展延性金属もしくは該金属を含
む合金の金属層Ｃを設け、最後にこの上に金属母材を重
ねると共に、前記メタライズ層を除く各層間および金属
層Ｃと金属母材との間に金属ろう材を介装し、加熱によ
って一体化したことを特徴とするセラミックスと金属の
接合構造体の製造方法を手段としている。In order to solve the above technical problems, the present invention does not include a brazing filler metal layer in a ceramic-metal joint structure in which a ceramic base metal and a metal base metal are joined via a metal intermediate layer and a brazing filler metal layer. The metal intermediate layer comprises a metal thin plate layer A of a highly malleable metal or an alloy containing the metal, a metal layer B having a low linear expansion coefficient and high rigidity, and a highly malleable metal or an alloy containing the metal from the ceramic base material side. A joined structure of ceramics and metal, which is formed by forming a three-layer structure of a metal layer C, and a metallized layer is formed on the ceramic base material, and a highly malleable metal or the metal is formed on the metallized layer. A metal thin plate layer A containing an alloy is provided, a metal layer B having a low linear expansion coefficient and high rigidity is provided on the metal thin plate layer A, and a highly ductile metal similar to the metal thin plate layer A or an alloy containing the metal is further provided thereon. Metal layer C The metal base material is provided, and finally, a metal base material is laid on the metal base material, and a metal brazing material is interposed between each layer except the metallized layer and between the metal layer C and the metal base material and integrated by heating. The method for producing a bonded structure of ceramics and metal is used as a means.
添付図面の第１図は、本発明に係るセラミックスと金属
の接合構造体の原理図を示したものであり、セラミック
ス母材と金属母材との間に３層構造をなすろう材を含ま
ない金属中間層を介している。FIG. 1 of the accompanying drawings shows a principle diagram of a bonded structure of ceramics and metal according to the present invention, which does not include a brazing material having a three-layer structure between the ceramic base material and the metal base material. Via the metal intermediate layer.
このろう材を含まない金属中間層の内、金属薄板層Ａお
よび金属層Ｃを構成する金属には銅、アルミニウム、銀
などの高展延性金属、又はこれらいずれかの金属を含む
高展延性の合金が用いられる。また、上記金属薄板層Ａ
および金属層Ｃに挟まれた金属層Ｂを構成する金属に
は、モリブデンやタングステン又は鉄−ニッケル−コバ
ルト系合金〔例えば、コバールやスーパーインバー等
（商品名）〕など低線膨張率でかつ高い剛性を有する金
属が用いられる。因にこれら金属の線膨張率は６×10-6
／℃以下であり、また弾性率は３×10-12dyn/cm2以上で
ある。Among the metal intermediate layers not including the brazing material, the metal constituting the metal thin plate layer A and the metal layer C is a highly malleable metal such as copper, aluminum, or silver, or a highly malleable metal containing any of these metals. Alloys are used. In addition, the metal thin plate layer A
The metal constituting the metal layer B sandwiched between the metal layer C and molybdenum, tungsten, or an iron-nickel-cobalt-based alloy [for example, Kovar, Super Invar, etc. (trade name)] has a low linear expansion coefficient and a high coefficient. A rigid metal is used. The linear expansion coefficient of these metals is 6 × 10 -6
/ ° C. or less, and the elastic modulus is 3 × 10 −12 dyn / cm 2 or more.
このように、金属薄板層Ａおよび金属層Ｃに高展延性金
属を用い、金属層Ｂに低線膨張率かつ高剛性を用いるの
は、例えば接合構造体に熱的衝撃が加えられた時に、金
属母材側から発生する大きな熱応力を金属層Ｃによって
吸収すると同時に、この金属層Ｃ自身に発生する熱歪が
セラミックス母材側に伝播しないように金属層Ｂによっ
て抑制するからである。また、金属層Ｂの構成金属とセ
ラミックス母材の線膨張係数は比較的近いが、全く同一
ではないから、両者の間に発生する熱応力を金属薄板層
Ａによって吸収し、全体として金属母材とセラミックス
母材との大きな線膨張係数差による熱応力を緩和できる
構成としている。As described above, the use of a highly malleable metal for the metal thin plate layer A and the metal layer C and a low linear expansion coefficient and a high rigidity for the metal layer B means that, for example, when a thermal shock is applied to the bonded structure, This is because the large thermal stress generated from the metal base material side is absorbed by the metal layer C, and at the same time, the thermal strain generated in the metal layer C itself is suppressed by the metal layer B so as not to propagate to the ceramic base material side. The linear expansion coefficients of the constituent metal of the metal layer B and the ceramic base material are relatively close to each other, but they are not exactly the same. Therefore, the thermal stress generated between them is absorbed by the metal thin plate layer A, and the metal base material as a whole is absorbed. The thermal stress due to a large difference in linear expansion coefficient between the ceramic base material and the ceramic base material can be relaxed.
また、上記金属薄板層Ａの層厚は0.1〜1.0mm、金属層Ｂ
の層厚は0.1〜1.5mm、金属層Ｃの層厚は0.5〜3.0mmの範
囲が望ましい。上述したように金属薄板層Ａは、金属層
Ｂとセラミックス母材との間に発生する熱応力を緩和す
る機能をもつものである。そして金属層Ｂは線膨張係数
が小さくセラミックス母材に近似しているから熱応力も
小さいものであり、上記範囲の層厚で十分に機能する。
反対に層厚を増すと、金属薄板層Ａ自身に発生する熱歪
を無視し得なくなり、これがセラミックス母材に影響を
及ぼしてしまうから、1.0mmまでの厚さが好ましい。The thickness of the metal thin plate layer A is 0.1 to 1.0 mm, and the metal layer B is
It is desirable that the layer thickness is 0.1 to 1.5 mm, and the metal layer C is 0.5 to 3.0 mm. As described above, the metal thin plate layer A has a function of relaxing the thermal stress generated between the metal layer B and the ceramic base material. Since the metal layer B has a small coefficient of linear expansion and is close to that of a ceramic base material, it also has a small thermal stress, and a layer thickness within the above range sufficiently functions.
On the other hand, if the layer thickness is increased, the thermal strain generated in the metal thin plate layer A itself cannot be ignored, and this will affect the ceramic base material, so a thickness of up to 1.0 mm is preferable.
金属層Ｂは、金属層Ｃ自身に発生する熱歪をセラミック
ス母材側に伝播するのを食い止めるものであるから、最
低限食い止め機能を持つ厚さがあればよく、また、余り
厚くなると内部歪を無視し得なくなるから、上限は1.5m
mである。Since the metal layer B is to prevent the thermal strain generated in the metal layer C itself from propagating to the ceramic base material side, it is sufficient if it has a thickness having a minimum hold-down function. Can not be ignored, so the upper limit is 1.5m
m.
金属層Ｃは、金属母材側からの大きな熱応力を吸収する
と共に、第１図に示すような外力Ｆを受けた時に、その
機械的衝撃による応力歪を金属層Ｃの塑性変形によって
吸収するものであるから、前記金属薄板層Ａおよび金属
層Ｂの層厚に比べて厚く形成される。尚、金属層Ｃは層
が厚いことから、その歪による影響を少なくするため
に、金属層Ｃの接合面積を他の金属中間層A,Bおよびセ
ラミックス母材、金属母材のいずれよりも小さくした
り、また円柱体や角部が円形の曲率をもった多角形柱状
体に形成することが望ましい。The metal layer C absorbs a large thermal stress from the side of the metal base material, and when it receives an external force F as shown in FIG. 1, absorbs the stress strain due to its mechanical impact by the plastic deformation of the metal layer C. Therefore, it is formed thicker than the layer thickness of the metal thin plate layer A and the metal layer B. Since the metal layer C is thick, the bonding area of the metal layer C is made smaller than that of the other metal intermediate layers A and B, the ceramic base material, and the metal base material in order to reduce the influence of the strain. Moreover, it is desirable to form a columnar body or a polygonal columnar body whose corners have a circular curvature.
本発明に適用されるセラミックス母材は、酸化アルミニ
ウムや酸化ジルコニウム等の酸化物系セラミックスおよ
び窒化珪素や炭化珪素等の非酸化物系セラミックスのい
ずれをも含む。また、本発明に適用される金属母材は、
炭素鋼（S45C）およびその他使用される機械部品の用途
に応じて広く含まれる。The ceramic base material applied to the present invention includes both oxide-based ceramics such as aluminum oxide and zirconium oxide and non-oxide-based ceramics such as silicon nitride and silicon carbide. Further, the metal base material applied to the present invention,
Widely included depending on the application of carbon steel (S45C) and other mechanical parts used.
上記セラミックスと金属の接合構造体の製造方法では、
まずセラミックス母材の表面にメタライズ層を形成する
と共に、その上に金属薄板層Ａを重ね、更に金属層Ｂ、
金属層Ｃ、金属母材をろう材を介して順次重ねた後、加
熱によって一体的に接合できるものである。In the method for manufacturing the bonded structure of ceramics and metal,
First, a metallized layer is formed on the surface of the ceramic base material, a metal thin plate layer A is overlaid thereon, and a metal layer B,
After the metal layer C and the metal base material are sequentially stacked via the brazing material, they can be integrally joined by heating.
上述の手段によれば、セラミックス母材と金属母材とを
性質および層厚の異なる３層のろう材を含まない金属中
間層を介して接合したから、熱的および機械的応力やそ
れに伴う歪が金属中間層によって吸収されることにな
り、セラミックス母材と金属母材との間の大きな熱膨張
の差による影響およびろう材を含まない金属中間層自身
の熱歪の影響を無視し得ることになる。According to the above-mentioned means, since the ceramic base material and the metal base material are joined via the metal intermediate layer which does not contain the brazing filler metal of three layers having different properties and layer thicknesses, the thermal and mechanical stress and the resulting strain Will be absorbed by the metal intermediate layer, and the effect of the large difference in thermal expansion between the ceramic base material and the metal base material and the effect of thermal strain of the metal intermediate layer itself containing no brazing material can be ignored. become.
〔実施例−１〕 （試料の作製） 第２図に基づいて説明すると、まず平板状のアルミナセ
ラミック板１（15×30×5mm）を超音波洗浄したのち乾
燥し、セラミックス母材とした。次にスクリーンオイル
の添加によりペースト化した68Ag-26Cu-5Ti組成の金属
混合粉末を上記セラミックス母材の表面に塗布し、約50
μｍ厚のメタライズ層２を形成した後、150℃で真空乾
燥してスクリーンオイル中の発散成分を除去した。更
に、このメタライズ層２の上面に銅薄板３（15×30×0.
5mm）を載せ置き、真空電気炉中にて870℃で10分間加熱
してセラミックス母材上にメタライズ層２を形成すると
同時に銅薄板３からなる金属薄板層Ａを接合した。更に
この金属薄板層Ａの上面に金属層Ｂを形成するFe-31Ni-
5Co合金板（スーパーインバー）４（15×30×0.5mm）お
よび金属層Ｃを形成する円柱状の２枚の銅板5a,5b（10
φ×2mm）を積層し、最後に金属母材としての炭素鋼板
（S45c）６を重ね置いた。なお、銅薄板３とスーパーイ
ンバー４との間、スーパーインバー４と円柱状銅板5a,5
bとの間、および円柱状銅板5a,5bと炭素鋼板６との間に
は、それぞれBAg-8ろう材7a,7b,7c（15×30×0.05mm）
を介装しておき、真空炉中にて870℃で10分間加熱し、
ろう付けを行なった。[Example-1] (Preparation of sample) To explain with reference to Fig. 2, first, a flat alumina ceramic plate 1 (15 x 30 x 5 mm) was ultrasonically cleaned and then dried to obtain a ceramic base material. Next, a metal mixed powder having a composition of 68Ag-26Cu-5Ti, which is made into a paste by adding screen oil, is applied to the surface of the ceramic base material,
After forming the metallized layer 2 having a thickness of μm, it was vacuum dried at 150 ° C. to remove the volatile components in the screen oil. Further, a copper thin plate 3 (15 × 30 × 0.
5 mm) was placed and heated in a vacuum electric furnace at 870 ° C. for 10 minutes to form the metallized layer 2 on the ceramic base material and at the same time, the metal thin plate layer A made of the copper thin plate 3 was joined. Further, Fe-31Ni- forming a metal layer B on the upper surface of the metal thin plate layer A
5Co alloy plate (Super Invar) 4 (15 × 30 × 0.5 mm) and two cylindrical copper plates 5a, 5b (10
(φ × 2 mm), and finally, a carbon steel plate (S45c) 6 as a metal base material was placed on top of it. In addition, between the copper thin plate 3 and the super invar 4, the super invar 4 and the cylindrical copper plate 5a, 5
BAg-8 brazing filler metal 7a, 7b, 7c (15 × 30 × 0.05 mm) between b and the cylindrical copper plates 5a, 5b and carbon steel plate 6, respectively.
, And heat it in a vacuum furnace at 870 ° C for 10 minutes,
I brazed.
（熱衝撃試験） 上述の方法にて作製した試料、即ちセラミックスと金属
の接合構造体に、大気中において350℃と室温との間で
熱衝撃を繰返し加えた。第３図は熱衝撃を500回繰返し
て加えた後の常温圧縮剪断強度試験の結果を示したもの
である。この結果によれば、熱衝撃回数の増加にかかわ
らず圧縮剪断強度は低下せず、極めて高い接合強度を維
持することがわかった。(Thermal Shock Test) A thermal shock was repeatedly applied to the sample manufactured by the above method, that is, the bonded structure of ceramics and metal, between 350 ° C. and room temperature in the atmosphere. FIG. 3 shows the results of the cold compression shear strength test after the thermal shock was repeatedly applied 500 times. According to this result, it was found that the compressive shear strength did not decrease regardless of the increase in the number of thermal shocks, and the extremely high bonding strength was maintained.
〔実施例−２〕 （試料の作製） 洗浄、乾燥した平板状のアルミナセラミック板（30×30
×5mm）の上面に68Ag-26Cu-5Ti組成の金属混合粉末を約
40μｍ厚にスクリーン印刷し、150℃で真空乾燥させ
た。次にこの上面に銅薄板（29×29×0.2mm）、Fe-29Ni
-17Co合金板（コバール）（29×29×0.5mm）および円柱
状の５枚の銅板（10φ×2mm）の金属中間層を順次重ね
たあと、炭素鋼板（S45C）を最後に重ね置き、真空炉中
にて870℃で10分間加熱し、一体的に接合した。なお、B
Ag-8ろう材（30×30×0.05mm）は上記実施例−１と同
様、各部材間に介装されている。[Example-2] (Preparation of sample) Washed and dried flat alumina ceramic plate (30 x 30)
Approximately 5 mm) on the upper surface of the mixed metal powder of 68Ag-26Cu-5Ti composition
It was screen printed to a thickness of 40 μm and vacuum dried at 150 ° C. Next, on this upper surface, a thin copper plate (29 × 29 × 0.2 mm), Fe-29Ni
-17Co alloy plate (Kovar) (29 × 29 × 0.5mm) and five cylindrical copper plates (10φ × 2mm) are laminated one by one on the metal intermediate layer, and then the carbon steel plate (S45C) is placed at the end and vacuum is applied. It was heated in a furnace at 870 ° C. for 10 minutes and integrally joined. In addition, B
The Ag-8 brazing filler metal (30 × 30 × 0.05 mm) is interposed between the respective members as in the case of Example-1.
（熱衝撃試験） 上述の手段により作製した試料を実施例−１と同様の方
法により試験した。また、本実施例では、500℃室温
の100回繰返し試験も併せて行なった。常温での圧縮剪
断強度の結果を第４図に示す。(Thermal shock test) The sample produced by the above-mentioned means was tested by the same method as in Example-1. In addition, in this example, a 100-time repeated test at 500 ° C. and room temperature was also performed. The results of compressive shear strength at room temperature are shown in FIG.
この結果によれば、実施例−１と同様、熱衝撃回数の増
加にかかわらず圧縮剪断強度は低下せず、実施例−１よ
りむしろ高い強度を示す。また、500℃における熱衝撃
試験では高い圧縮剪断強度を示した。According to this result, as in Example-1, the compressive shear strength does not decrease regardless of the increase in the number of thermal shocks, and the strength is higher than that in Example-1. In the thermal shock test at 500 ℃, it showed high compressive shear strength.
〔実施例−３〕 （試料の作製） 洗浄、乾燥した窒化珪素セラミックス（15×30×5mm）
の上面に65Ag-25Cu-10Ti組成の金属混合粉末を約40μｍ
厚にスクリーン印刷したのち150℃で真空乾燥させた。
次にこの上面に銀薄板（15×30×0.15mm）、モリブデン
板（15×30×1.0mm）および円柱状の２枚の銅板（12φ
×3mm）の金属中間層を順次重ねたあと、炭素鋼板（S45
C）を最後に重ね置き、真空中にて950℃で10分間加熱し
接合した。なお、銀薄板とモリブデン板の間、およびモ
リブデン板と銅板の間には65Ag-25Cu-10Ti組成の金属混
合粉末（15×30×0.05mm）を、また銅板と炭素鋼板との
間にはBAg-8ろう材（15×30×0.05mm）をそれぞれ介装
して接合した。[Example-3] (Preparation of sample) Washed and dried silicon nitride ceramics (15 x 30 x 5 mm)
Approximately 40μm of metal mixed powder of 65Ag-25Cu-10Ti composition on the upper surface of
After thick screen printing, it was vacuum dried at 150 ° C.
Next, a silver thin plate (15 × 30 × 0.15 mm), a molybdenum plate (15 × 30 × 1.0 mm) and two cylindrical copper plates (12φ)
× 3 mm) metal layers are sequentially stacked, and then carbon steel plate (S45
Finally, (C) was overlaid and heated in vacuum at 950 ° C. for 10 minutes to bond. In addition, between the thin silver plate and the molybdenum plate, and between the molybdenum plate and the copper plate, a mixed metal powder of 65Ag-25Cu-10Ti composition (15 × 30 × 0.05 mm) was used, and between the copper plate and the carbon steel plate, BAg-8. A brazing material (15 × 30 × 0.05 mm) was interposed and joined.
（熱衝撃試験） 上述の方法により作製した試料を大気中において、350
℃室温の100回繰返し試験を行なった。試験前の圧縮
剪断強度と試験後のそれとを比較した結果を表−１に示
す。(Thermal shock test) The sample prepared by the above method was subjected to 350
The test was repeated 100 times at room temperature. The results of comparison between the compressive shear strength before the test and that after the test are shown in Table-1.
本実施例はセラミックス母材の材質および金属中間層の
材質を変えたものであるが、この結果によれば、上記実
施例と同様、試験前に比べて試験後の圧縮剪断強度はほ
とんど低下していないことがわかった。 In this example, the material of the ceramic base material and the material of the metal intermediate layer were changed.According to the results, similar to the above-mentioned example, the compressive shear strength after the test was almost decreased as compared with that before the test. Turned out not.
（試料の作製） 洗浄、乾燥したアルミナセラミック（15×30×5mm）お
よび窒化珪素セラミックス（15×30×5mm）の各上面に6
8Ag-26Cu-6Ti組成の金属混合粉末を約50μ厚にスクリー
ン印刷したのち、150℃で真空乾燥させた。次にこの上
面に金属中間層を構成する銅板（15×30×2.5mm）を載
せ置いたのち、BAg-8ろう材（15×30×0.05mm）を介し
て炭素鋼板（S45C）を載せ、真空炉中にて850℃で15分
間加熱接合し、アルミナセラミックを母材とする試料−
Ｉと窒化珪素セラミックスを母材とする試料−IIを得
た。(Preparation of sample) 6 on each surface of cleaned and dried alumina ceramics (15 × 30 × 5mm) and silicon nitride ceramics (15 × 30 × 5mm)
A metal mixed powder having a composition of 8Ag-26Cu-6Ti was screen-printed to a thickness of about 50 μm, and then vacuum dried at 150 ° C. Next, after placing a copper plate (15 × 30 × 2.5 mm) that constitutes the metal intermediate layer on this upper surface, place a carbon steel plate (S45C) via BAg-8 brazing filler metal (15 × 30 × 0.05 mm), A sample that is heat-bonded at 850 ° C for 15 minutes in a vacuum furnace and uses alumina ceramic as the base material −
A sample-II containing I and silicon nitride ceramics as base materials was obtained.
（熱衝撃試験） 上述のようにして得た試料−Ｉと試料−IIのそれぞれに
つき、大気中にて350℃室温の間を40回繰返して熱衝
撃を加えたのち、常温での圧縮剪断強度を調べた。第５
図はその結果を示したものであるが、これによると試料
−Ｉおよび試料−IIとも熱衝撃後の圧縮剪断強度は大幅
に低下している。(Thermal shock test) Each of Sample-I and Sample-II obtained as described above was subjected to thermal shock by repeating 40 times at room temperature at 350 ° C. in room temperature, and then subjected to compressive shear strength at room temperature. I checked. Fifth
The figure shows the results, which show that the compressive shear strength after thermal shock is significantly reduced in both Sample-I and Sample-II.
以上説明したように、本発明に係るセラミックスと金属
の接合構造体およびその製造方法によれば、セラミック
スと金属との間の大きな線膨張係数差によって発生する
接合面での熱的応力や機械的応力およびそれに伴うろう
材を含まない金属中間層自身の熱歪などの伝播を効果的
に防止し得るので、熱衝撃サイクルなどに対する接合強
度が大幅に向上し、苛酷な環境下での使用に十分耐えら
れるものとなった。As described above, according to the bonded structure of ceramics and metal and the method for manufacturing the same according to the present invention, thermal stress and mechanical stress at the bonding surface caused by a large difference in linear expansion coefficient between ceramics and metal. Since it can effectively prevent the propagation of stress and thermal strain of the metal intermediate layer itself that does not contain brazing filler metal, it greatly improves the bonding strength against thermal shock cycles and is sufficient for use in harsh environments. It was tolerable.
第１図は本発明に係るセラミックスと金属の接合構造体
の原理図、第２図は本発明の一実施例に係る接合構造体
を示す図、第３図は実施例−１における熱衝撃試験の結
果を示す図、第４図は実施例−２における熱衝撃試験の
結果を示す図、第５図は比較例における熱衝撃試験の結
果を示す図である。 １……アルミナセラミック板（セラミックス母材） ２……メタライズ層 ３……銅薄板（金属薄板層Ａ） ４……Fe-Ni-Co合金板（金属層Ｂ） 5a,5b……円柱状銅板（金属層Ｃ） ６……炭素鋼板（金属母材） 7a,7b,7c……ろう材（BAg-8）FIG. 1 is a principle view of a bonded structure of ceramics and metal according to the present invention, FIG. 2 is a view showing a bonded structure according to an embodiment of the present invention, and FIG. 3 is a thermal shock test in Embodiment-1. FIG. 4 is a diagram showing the results of the thermal shock test in Example-2, and FIG. 5 is a diagram showing the results of the thermal shock test in Comparative Example. 1 ... Alumina ceramic plate (ceramic base material) 2 ... Metallized layer 3 ... Copper thin plate (metal thin plate layer A) 4 ... Fe-Ni-Co alloy plate (metal layer B) 5a, 5b ... Cylindrical copper plate (Metal layer C) 6 ... Carbon steel plate (metal base material) 7a, 7b, 7c ... Brazing material (BAg-8)
───────────────────────────────────────────────────── フロントページの続き (72)発明者 鈴木 英二 千葉県船橋市本中山３−19−２ (72)発明者 杉山 弘記 千葉県習志野市津田沼３−７−１ (56)参考文献 特開 昭60−239372（ＪＰ，Ａ) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Eiji Suzuki 3-19-2 Motonakayama, Funabashi City, Chiba Prefecture (72) Inventor Hiroki Sugiyama 3-7-1 Tsudanuma, Narashino City, Chiba Prefecture (56) References 60-239372 (JP, A)
Claims (6)
属中間層とろう材層を介装して接合されてなるセラミッ
クスと金属との接合構造体において、 ろう材層を含まない上記金属中間層はセラミックス母材
側から高展性金属もしくは該金属を含む合金の金属薄板
層Ａ、低線膨張率かつ高剛性の金属層Ｂ、および高展延
性金属もしくは該金属を含む合金の金属層Ｃの３層構造
を形成してなる ことを特徴とするセラミックスと金属の接合構造体。1. A bonded structure of ceramics and metal, which is bonded between a ceramic base material and a metal base material with an intermediate metal layer and a brazing material layer interposed therebetween, wherein the brazing material layer is not included. The metal intermediate layer includes, from the ceramic base material side, a metal thin plate layer A of a highly malleable metal or an alloy containing the metal, a metal layer B having a low linear expansion coefficient and high rigidity, and a metal of the highly malleable metal or an alloy containing the metal. A joined structure of ceramics and metal, which is formed by forming a three-layer structure of layer C.
成する高展延性金属もしくは該金属を含む合金は、銅、
アルミニウム、銀、又はこれら各金属を含む合金のいず
れかであり、金属層Ｂを構成する低線膨張率かつ高剛性
の金属は、モリブデン、タングステン、鉄−ニッケル−
コバルト系合金のいずれかであることを特徴とする特許
請求の範囲第１項記載のセラミックスと金属の接合構造
体。2. A highly ductile metal or an alloy containing the metal, which composes the metal thin plate layer A and the metal layer C, is copper,
The metal having a low linear expansion coefficient and high rigidity, which is one of aluminum, silver, and an alloy containing each of these metals, and which has a low linear expansion coefficient and high rigidity, is molybdenum, tungsten, or iron-nickel-
The ceramic-metal bonded structure according to claim 1, wherein the bonded structure is a cobalt-based alloy.
記金属層Ｂの層厚は0.1〜1.5mm、上記金属層Ｃの層厚は
0.5〜3.0mmの範囲であることを特徴とする特許請求の範
囲第１項または第２項記載のセラミックスと金属の接合
構造体。3. The metal thin plate layer A has a layer thickness of 0.1 to 1.0 mm, the metal layer B has a layer thickness of 0.1 to 1.5 mm, and the metal layer C has a layer thickness of 0.1 to 1.5 mm.
The bonded structure of ceramics and metal according to claim 1 or 2, wherein the bonded structure has a range of 0.5 to 3.0 mm.
層A,Bおよびセラミックス母材、金属母材のいずれより
も小さいことを特徴とする特許請求の範囲第１項乃至第
３項いずれか記載のセラミックスと金属の接合構造体。4. The bonding area of the metal layer C is smaller than that of any of the other metal intermediate layers A and B, the ceramic base material, and the metal base material. Item 10. A joined structure of ceramics and a metal according to any one of items.
は各角部が円形の曲率をもった多角形柱状体であること
を特徴とする特許請求の範囲第１項乃至第４項いずれか
記載のセラミックスと金属の接合構造体。5. The metal layer C is one or more columnar bodies or polygonal columnar bodies each of which has a circular curvature at each corner. A bonded structure of any one of the ceramics and metal.
すると共に、該メタライズ層上に高展延性金属もしくは
該金属を含む合金の金属薄板層Ａを設け、その上に金属
ろう材を介して低線膨張率かつ高剛性の金属層Ｂを設
け、更にその上に金属ろう材を介して上記金属薄板層Ａ
と同様の高展延性金属もしくは該金属を含む合金の金属
層Ｃを設け、最後にこの上に金属ろう材を介して金属母
材を重ね、加熱によって一体化した ことを特徴とするセラミックスと金属の接合構造体の製
造方法。6. A metallized layer is formed on a ceramic base material, a metal thin plate layer A of a highly malleable metal or an alloy containing the metal is provided on the metallized layer, and a metal brazing material is placed on the metal thin plate layer A to form a metal thin layer. A metal layer B having a linear expansion coefficient and high rigidity is provided, and the metal thin plate layer A is further provided on the metal layer B via a metal brazing material.
A metal layer C made of a highly malleable metal or an alloy containing the same metal as described above is provided, and finally, a metal base material is overlaid with a metal brazing filler metal, and integrated by heating. Of the bonded structure of the above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62010046A JPH07115440B2 (en) | 1987-01-21 | 1987-01-21 | Ceramic-metal bonded structure and method for manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62010046A JPH07115440B2 (en) | 1987-01-21 | 1987-01-21 | Ceramic-metal bonded structure and method for manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63179733A JPS63179733A (en) | 1988-07-23 |
| JPH07115440B2 true JPH07115440B2 (en) | 1995-12-13 |
Family
ID=11739454
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62010046A Expired - Fee Related JPH07115440B2 (en) | 1987-01-21 | 1987-01-21 | Ceramic-metal bonded structure and method for manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07115440B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63248780A (en) * | 1987-04-02 | 1988-10-17 | 株式会社東芝 | Ceramic structure |
| JP2738840B2 (en) * | 1988-07-22 | 1998-04-08 | 三菱電機株式会社 | Ceramic-metal composite substrate |
| JP2525873B2 (en) * | 1988-07-26 | 1996-08-21 | 住友電気工業株式会社 | Connection structure between semiconductor device parts |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60239372A (en) * | 1984-05-14 | 1985-11-28 | 日本特殊陶業株式会社 | Method of bonding ceramic and magnetic material |
-
1987
- 1987-01-21 JP JP62010046A patent/JPH07115440B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63179733A (en) | 1988-07-23 |
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