JPH07119268B2 - Method for producing novolac type phenolic resin - Google Patents
Method for producing novolac type phenolic resinInfo
- Publication number
- JPH07119268B2 JPH07119268B2 JP62252732A JP25273287A JPH07119268B2 JP H07119268 B2 JPH07119268 B2 JP H07119268B2 JP 62252732 A JP62252732 A JP 62252732A JP 25273287 A JP25273287 A JP 25273287A JP H07119268 B2 JPH07119268 B2 JP H07119268B2
- Authority
- JP
- Japan
- Prior art keywords
- phenolic resin
- resin
- type phenolic
- novolac type
- molar ratio
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000010680 novolac-type phenolic resin Substances 0.000 title description 9
- 238000006243 chemical reaction Methods 0.000 claims description 16
- 229920003986 novolac Polymers 0.000 claims description 16
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 10
- 238000005259 measurement Methods 0.000 claims description 10
- 239000005011 phenolic resin Substances 0.000 claims description 10
- 239000003054 catalyst Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 150000002989 phenols Chemical class 0.000 claims description 8
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 7
- 150000001299 aldehydes Chemical class 0.000 claims description 6
- 230000002378 acidificating effect Effects 0.000 claims description 4
- 229920001568 phenolic resin Polymers 0.000 claims description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 3
- 230000002194 synthesizing effect Effects 0.000 claims description 3
- 229920005989 resin Polymers 0.000 description 11
- 239000011347 resin Substances 0.000 description 11
- 229920000642 polymer Polymers 0.000 description 8
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000010992 reflux Methods 0.000 description 3
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000018044 dehydration Effects 0.000 description 2
- 238000006297 dehydration reaction Methods 0.000 description 2
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 description 2
- 235000006408 oxalic acid Nutrition 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- BGJSXRVXTHVRSN-UHFFFAOYSA-N 1,3,5-trioxane Chemical compound C1OCOCO1 BGJSXRVXTHVRSN-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- QHPQWRBYOIRBIT-UHFFFAOYSA-N 4-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C=C1 QHPQWRBYOIRBIT-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003377 acid catalyst Substances 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 150000001413 amino acids Chemical class 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- LLEMOWNGBBNAJR-UHFFFAOYSA-N biphenyl-2-ol Chemical compound OC1=CC=CC=C1C1=CC=CC=C1 LLEMOWNGBBNAJR-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004587 chromatography analysis Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 150000001923 cyclic compounds Chemical class 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 235000019256 formaldehyde Nutrition 0.000 description 1
- 239000002783 friction material Substances 0.000 description 1
- 229940015043 glyoxal Drugs 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 150000004492 retinoid derivatives Chemical class 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- -1 sodium and potassium Chemical class 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
Landscapes
- Phenolic Resins Or Amino Resins (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、分子構造が単分散であるノボラック型フェノ
ール樹脂の製造方法に関するものであり、本発明により
得られた樹脂は成形品用、積層品用、シェルモールド法
結合剤用、レチノイド砥石結合剤用摩擦材結合剤用、封
止材用エポキシ原料、同エポキシ樹脂硬化剤用等の公知
のフェノール樹脂の用途に使用可能である。TECHNICAL FIELD The present invention relates to a method for producing a novolac type phenolic resin having a monodisperse molecular structure, and the resin obtained by the present invention is used for molded articles and laminated. It can be used for known phenolic resins such as products, shell mold binders, retinoid grindstone binders friction material binders, epoxy raw materials for sealants, and epoxy resin curing agents.
通常、ノボラック型フェノール樹脂は、フェノール類と
アルデヒド類を酸性触媒存在下で反応させて得られる
が、2核体量は最初の仕込みモル比(フェノール類に対
するアルデヒド類の割合、以下モル比と略す)である程
度決定されてしまい、どんなに反応を進行させても、一
定以下には減少しない。Usually, the novolac type phenol resin is obtained by reacting phenols and aldehydes in the presence of an acidic catalyst, but the binuclear amount is the initial charge molar ratio (ratio of aldehydes to phenols, hereinafter abbreviated as molar ratio). However, no matter how much the reaction proceeds, it does not decrease below a certain level.
モル比を高くすれば、2核体量は減少するが、逆に高分
子領域が増大してしまい、軟化点が高くなって、例えば
コンパウンドの流動性が悪くなる等の欠点がある。一方
モル比を低くすれば、高分子領域は減少して、軟化点は
低くなり、コンパウンドの流動性は良くなるが、2核体
量が多く、例えば成型品の耐熱性は低下する等の欠点が
ある。When the molar ratio is increased, the binuclear amount is decreased, but on the contrary, the polymer region is increased, the softening point is increased, and there is a drawback that the fluidity of the compound is deteriorated. On the other hand, when the molar ratio is lowered, the polymer region is reduced, the softening point is lowered, and the fluidity of the compound is improved, but the amount of binuclear is large, and for example, the heat resistance of the molded product is lowered. There is.
以上のように公知のノボラックレヂンの反応方法では、
2核体量及び高分子領域の両方が少ない、いわゆる分子
構造が単分散であるノボラック型フェノール樹脂を得る
ことは不可能であった。As described above, in the known reaction method of novolac resin,
It has been impossible to obtain a novolac type phenolic resin having a small amount of both binuclear amount and high molecular weight region, that is, a so-called molecular structure is monodisperse.
P−アルキルフェノールの特定の環状体の製造法として
特公昭60-33124、特公昭60-33125、特公昭60-33126など
が公知であるが、これらは何れもP−アルキルフェノー
ルに限定したものであり、且つ工程が煩雑で工業的でな
い。As a method for producing a specific cyclic compound of P-alkylphenol, Japanese Patent Publication No. 60-33124, Japanese Patent Publication No. 60-33125, Japanese Patent Publication No. 60-33126 and the like are known, but all of them are limited to P-alkylphenol. Moreover, the process is complicated and not industrial.
又、2核体を減少させる方法としては通常のノボラック
反応処法により合成した樹脂を、例えば、メタノールと
水の混合溶媒等の特定溶媒で溶解度の差を利用して、洗
浄、分別する方法もあるが、工程が煩雑であり、収量も
悪く、コストアップとなるので実用的ではない。Further, as a method for reducing the binuclear body, there is also a method of washing and fractionating a resin synthesized by a usual novolak reaction method using a difference in solubility with a specific solvent such as a mixed solvent of methanol and water. However, it is not practical because the process is complicated, the yield is poor, and the cost is increased.
以上のような背景から流動性が良く、耐熱性を発揮する
単分散のノボラック型フェノール樹脂の開発が望まれて
いたわけである。即ち、高分子領域も少なく、又2核体
量も少なく、分子量分布の幅の狭い、いわゆる分子構造
が単分散のノボラック型フェノール樹脂である。本発明
者らは鋭意研究の結果、従来製造することが出来なかっ
た高分子領域及び2核体量を共に減少させて流動性、耐
熱性に優れた単分散のノボラック型フェノール樹脂の製
造方法について発明したものである。From the above background, it has been desired to develop a monodisperse novolac type phenolic resin having good fluidity and exhibiting heat resistance. That is, it is a novolac type phenolic resin having a monodispersed molecular structure, which has a small polymer region, a small binuclear amount, and a narrow molecular weight distribution. As a result of earnest studies, the present inventors have found a method for producing a monodispersed novolac-type phenolic resin having excellent fluidity and heat resistance by reducing both the polymer region and the amount of binuclear body, which could not be produced conventionally. It was invented.
本発明は従来製造することが出来なかった分子構造が単
分散であるノボラック型フェノール樹脂の製造方法に関
するものであり、鋭意研究の結果、先ずレゾール化反応
を行い、次いでノボラック化反応を行なうことにより、
分子構造が単分散であるノボラック型フェノール樹脂の
製造方法を発明したものである。The present invention relates to a method for producing a novolac type phenolic resin having a monodisperse molecular structure which could not be produced conventionally, and as a result of earnest research, by first performing a resolization reaction and then performing a novolak reaction. ,
It is an invention of a method for producing a novolac type phenolic resin having a monodisperse molecular structure.
本発明は、先ずフェノール類とアルデヒド類を塩基性触
媒を用いて合成し、次いでフェノール類及び酸性触媒を
加えてノボラック型フェノール樹脂を合成する方法にお
いて、ノボラック型フェノール樹脂の軟化点が50〜120
℃であり、且つGPC(Gell Permeation Chromatography
東洋曹達工業(株)製、以下GPCと略す)測定におい
て、7核体のピーク高さに対する2核体のピーク高さの
比が1.6〜0.3であることを特徴とする分子構造が単分散
であるフェノール樹脂の製造方法。The present invention is a method of synthesizing a phenol and an aldehyde using a basic catalyst, and then synthesizing a novolak type phenol resin by adding a phenol and an acid catalyst, wherein the softening point of the novolak type phenol resin is 50 to 120.
℃ and GPC (Gell Permeation Chromatography
In the measurement by Toyo Soda Kogyo Co., Ltd., abbreviated as GPC hereinafter), the ratio of the peak height of the binuclear body to the peak height of the 7-nuclear body is 1.6 to 0.3, and the molecular structure is monodisperse. A method for producing a phenolic resin.
本発明によるフェノール類としては、フェノールあるい
はクレゾール、キシレノール、レゾルシノール、カテコ
ール、パラターシャリーブチルフェノール、オクチルフ
ェノール、フェニルフェノールのようなアルキルフェノ
ール類やその混合物、又、ビスフェノールA、ビスフェ
ノールF、ビスフェノールSのようなビスフェノール類
やその混合物であり、アルデヒド類とは、ホルマリン、
パラホルムアルデヒド、グリオキザール、トリオキサ
ン、ポリオキサン等やその混合物や重合体でも良い。Examples of the phenols according to the present invention include phenol or alkylphenols such as cresol, xylenol, resorcinol, catechol, paratertiary butylphenol, octylphenol and phenylphenol, and mixtures thereof, and bisphenols such as bisphenol A, bisphenol F and bisphenol S. Aldehydes are formalin,
Paraformaldehyde, glyoxal, trioxane, polyoxane, etc., or a mixture or polymer thereof may be used.
塩基性触媒としては、ナトリウム、カリウムのようなア
ルカリ金属、及びマグネシウム、カルシウム、バリウム
のようなアルカリ土類金属の酸化物や水酸化物、及び、
トリエチルアミンやトリエタノールアミン等のアミノ類
が使用可能である。As the basic catalyst, oxides and hydroxides of alkali metals such as sodium and potassium, and alkaline earth metals such as magnesium, calcium, and barium, and
Amino acids such as triethylamine and triethanolamine can be used.
酸性触媒としては、塩酸、硫酸のような無機酸、及び、
シュウ酸、アジビン酸のような有機酸が使用可能であ
る。As the acidic catalyst, inorganic acids such as hydrochloric acid and sulfuric acid, and
Organic acids such as oxalic acid and adibic acid can be used.
本発明におけるレゾール化反応のモル比(ホルムアルデ
ヒド類/フェノール類)は0.5〜3.0であり更に好ましく
は1.0〜2.0である。モル比が0.5未満の場合は2核体量
が多くなり過ぎ、モル比が3.0を越える場合は高分子領
域が増大する。The molar ratio (formaldehydes / phenols) of the resolization reaction in the present invention is 0.5 to 3.0, more preferably 1.0 to 2.0. If the molar ratio is less than 0.5, the binuclear amount becomes too large, and if the molar ratio exceeds 3.0, the polymer region increases.
又、ノボラック化反応のモル比は0.3〜0.9であり、更に
好ましくは0.55〜0.75である。モル比が0.3未満の場合
は、2核体量が多くなり過ぎ、0.9を越える場合は、高
分子領域が増大する。The molar ratio of the novolak reaction is 0.3 to 0.9, more preferably 0.55 to 0.75. If the molar ratio is less than 0.3, the binuclear amount becomes too large, and if it exceeds 0.9, the polymer region increases.
本発明によるノボラック型フェノール樹脂とは、先ず前
記フェノール類とアルデヒド類を前記のレゾール化反応
のモル比範囲内で塩基性触媒存在下でレゾール化反応さ
せた後、フェノール類を加えて前記のノボラック化反応
のモル比範囲内とし、酸性触媒を加えてノボラック化反
応をせしめて合成されるもののうち、軟化点が50〜120
℃であり、更に好ましくは80〜105℃である。軟化点か5
0℃未満の場合は製品がブロッ化しにくくて作業性が悪
く、120℃を越える場合は、粘度が高すぎて製造工程に
適合しにくくなる。The novolak type phenol resin according to the present invention means that the phenols and the aldehydes are first subjected to the resolization reaction in the presence of a basic catalyst within the molar ratio range of the resolization reaction, and then the phenols are added to the novolak resin. The softening point is 50 to 120 among those synthesized by adding an acidic catalyst to cause a novolak reaction to be carried out within the molar ratio range of the reaction.
C., more preferably 80 to 105.degree. Softening point or 5
If the temperature is lower than 0 ° C, the product is hard to block and the workability is poor. If the temperature is higher than 120 ° C, the viscosity is too high and it is difficult to adapt to the manufacturing process.
本発明におけるノボラック型フェノール樹脂のGPC測定
における7核体のピーク高さに対する2核体のピーク高
さの比は1.6〜0.3である。1.6を越える場合は、2核体
量が多すぎて軟化点が低下し、成形品の耐熱性が低下す
る等の欠点がある。0.3未満の場合は高分子領域が増大
して軟化点が高くなり、成形品の流動性が悪くなり、作
業効率が低下する。The ratio of the peak height of the binuclear body to the peak height of the 7 nucleus body in the GPC measurement of the novolac type phenol resin in the present invention is 1.6 to 0.3. If it exceeds 1.6, there is a drawback that the amount of binuclear bodies is too large, the softening point is lowered, and the heat resistance of the molded article is lowered. If it is less than 0.3, the polymer region increases, the softening point increases, the fluidity of the molded product deteriorates, and the work efficiency decreases.
GPCの測定条件 機種:東洋曹達工業(株)製 HLC-802UR カラム配列:G3000HLX+G2000HLX×2 流量:0.8ml/min オーブン槽温度:40℃ 試料濃度:150〜200mg/THF10ml 検出方法:RI(示差屈折計) 〔発明の効果〕 本発明により耐熱性、流動性に優れた単分散のノボラッ
ク型フェノール樹脂を安定して製造でき広く種々の分野
に供給することができる。GPC measurement conditions Model: HLC-802UR manufactured by Toyo Soda Kogyo Co., Ltd. Column array: G3000HLX + G2000HLX x 2 Flow rate: 0.8 ml / min Oven bath temperature: 40 ° C Sample concentration: 150-200 mg / THF10 ml Detection method: RI (differential refractometer [Advantages of the Invention] According to the present invention, a monodisperse novolac type phenolic resin having excellent heat resistance and fluidity can be stably produced and can be widely supplied to various fields.
以下、本発明を実施例により詳細に説明するが、本発明
は実施例に限定されるものではない。ここに記載する
「%」は全て「重量」を示す。Hereinafter, the present invention will be described in detail with reference to examples, but the present invention is not limited to the examples. All "%" described here indicate "weight".
実施例1. フェノール470g(5モル)、50%ホルマリン450g(7.5
モル)、水酸ナトリウム10gを温度計、還流冷却器、撹
拌装置及び脱水装置を備えた反応装置に入れ徐々に昇温
させ75℃に保持して2時間レゾール化反応を行なう。30
℃以下まで冷却した後フェノール611g(6.5モル)と10
%塩酸91gを加え、95〜100℃とし撹拌還流下にて3時間
反応させノボラック化せしめる。直ちに真空度680mmHg
にて内温が200℃になるまで昇温させその温度に2時間
保持して脱水、脱モノマーを行ない、冷却バットに取り
出して目的の樹脂を得た。この樹脂の特性は軟化点が95
℃、GPC測定における2核体のピーク高さ/7核体のピー
ク高さが1.39であった。Example 1. Phenol 470 g (5 mol), 50% formalin 450 g (7.5
Mol) and 10 g of sodium hydroxide are placed in a reaction apparatus equipped with a thermometer, a reflux condenser, a stirrer and a dehydrator, and the temperature is gradually raised to 75 ° C. and the resolization reaction is carried out for 2 hours. 30
After cooling to below ℃, 611 g (6.5 mol) of phenol and 10
Add 91 g of% hydrochloric acid, bring the mixture to 95 to 100 ° C., and stir under reflux for 3 hours to cause novolak reaction. Immediately vacuum degree 680mmHg
The internal temperature was raised to 200 ° C., and the temperature was maintained for 2 hours for dehydration and demonomerization, and the product was taken out in a cooling vat to obtain the target resin. The softening point of this resin is 95.
The peak height of the binuclear body / the peak height of the 7-nuclear body in GPC measurement at 1.degree.
この樹脂のGPC測定を図−2に示す。The GPC measurement of this resin is shown in Figure 2.
実施例2. フェノール470g(5モル)に50%ホルマリン210g(3.5
モル)、シュウ酸30gを実施例1と同様な装置を用いて9
5〜100℃の撹拌還流下ノボラック化反応せしめ、その後
脱水、脱モノマーを行なって、樹脂を得た。この樹脂の
特性は、軟化点が95℃、GPC測定における2核体のピー
ク高さ/7核体のピーク高さの高さ比が1.74であった。Example 2. Phenol 470 g (5 mol) and 50% formalin 210 g (3.5
Mol) and 30 g of oxalic acid using the same apparatus as in Example 1.
A novolak reaction was carried out under stirring and reflux at 5 to 100 ° C., followed by dehydration and demonomerization to obtain a resin. As for the characteristics of this resin, the softening point was 95 ° C., and the height ratio of the peak height of the binuclear body / the peak height of the binuclear body in GPC measurement was 1.74.
この樹脂のGPC測定を図−1に示す。The GPC measurement of this resin is shown in Figure 1.
図−2は本発明の樹脂のGPC測定結果。 図−1は本発明以外の樹脂のGPC測定結果を示す。 Figure 2 shows the GPC measurement results of the resin of the present invention. FIG. 1 shows the GPC measurement results of resins other than the present invention.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 岡本 邦夫 群馬県高崎市大八木町622 群栄化学工業 株式会社内 (72)発明者 羽鳥 正彦 群馬県高崎市大八木町622 群栄化学工業 株式会社内 (56)参考文献 特開 昭62−212410(JP,A) 特公 昭47−13974(JP,B1) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Kunio Okamoto, 622, Oyagi-cho, Takasaki-shi, Gunma Gunei Chemical Industry Co., Ltd. (72) Masahiko Hatori, 622, Oyagi-machi, Takasaki-shi, Gunma Gunei Chemical Industry Co., Ltd. ( 56) References JP-A-62-212410 (JP, A) JP-B-47-13974 (JP, B1)
Claims (1)
ルムアルデヒド/フェノール)0.5〜3.0で塩基性触媒を
用いてレゾール化反応し、次いで、フェノール類を加え
て、モル比を0.3〜0.9とし更に酸性触媒を加えてノボラ
ック化せしめ、ノボラック型フェノール樹脂を合成する
方法において、ノボラック型フェノール樹脂の軟化点が
50〜120℃、且つGPC測定において、7核体のピーク高さ
に対する2核体のピーク高さの比が1.6〜0.3であること
を特徴とするノボラック型フェノール樹脂の製造方法。1. Phenols and aldehydes are subjected to a resolization reaction with a basic catalyst at a molar ratio (formaldehyde / phenol) of 0.5 to 3.0, and then phenols are added to make the molar ratio of 0.3 to 0.9 and further acidic. In the method of synthesizing a novolak type phenolic resin by adding a catalyst to make it a novolak type, the softening point of the novolak type phenolic resin is
A method for producing a novolak-type phenol resin, wherein the ratio of the peak height of the binuclear body to the peak height of the 7-nuclear body in GPC measurement at 50 to 120 ° C. is 1.6 to 0.3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62252732A JPH07119268B2 (en) | 1987-10-07 | 1987-10-07 | Method for producing novolac type phenolic resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62252732A JPH07119268B2 (en) | 1987-10-07 | 1987-10-07 | Method for producing novolac type phenolic resin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0195118A JPH0195118A (en) | 1989-04-13 |
| JPH07119268B2 true JPH07119268B2 (en) | 1995-12-20 |
Family
ID=17241492
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62252732A Expired - Lifetime JPH07119268B2 (en) | 1987-10-07 | 1987-10-07 | Method for producing novolac type phenolic resin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07119268B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015152037A1 (en) * | 2014-03-31 | 2015-10-08 | 明和化成株式会社 | Phenolic resin, epoxy resin composition containing said phenolic resin, cured product of said epoxy resin composition, and semiconductor device equipped with said cured product |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7005181B2 (en) | 2000-04-06 | 2006-02-28 | American Aerogel Corporation | Organic, open cell foam materials, their carbonized derivatives, and methods for producing same |
| KR100995678B1 (en) * | 2008-09-01 | 2010-11-22 | 주식회사 코오롱 | Phenolic novolac resin, phenol novolac epoxy resin and epoxy resin composition |
| TW201302837A (en) * | 2011-04-11 | 2013-01-16 | Gun Ei Chemical Industry Co Ltd | Curing agent composition for epoxy resin and thermosetting molding compound |
| CN116693783B (en) * | 2023-07-19 | 2026-02-17 | 濮阳市恩赢高分子材料有限公司 | A method for synthesizing a low softening point, fast-curing phenolic resin |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0662731B2 (en) * | 1986-03-14 | 1994-08-17 | 旭チバ株式会社 | Production method of novolac resin |
-
1987
- 1987-10-07 JP JP62252732A patent/JPH07119268B2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015152037A1 (en) * | 2014-03-31 | 2015-10-08 | 明和化成株式会社 | Phenolic resin, epoxy resin composition containing said phenolic resin, cured product of said epoxy resin composition, and semiconductor device equipped with said cured product |
| CN106133017A (en) * | 2014-03-31 | 2016-11-16 | 明和化成株式会社 | Phenolic resin, epoxy resin composition containing the same, cured product of the epoxy resin composition, and semiconductor device having the cured product |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0195118A (en) | 1989-04-13 |
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