JPH07120617B2 - Capacitor manufacturing method - Google Patents
Capacitor manufacturing methodInfo
- Publication number
- JPH07120617B2 JPH07120617B2 JP62031383A JP3138387A JPH07120617B2 JP H07120617 B2 JPH07120617 B2 JP H07120617B2 JP 62031383 A JP62031383 A JP 62031383A JP 3138387 A JP3138387 A JP 3138387A JP H07120617 B2 JPH07120617 B2 JP H07120617B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive tape
- capacitor
- capacitor element
- pressing
- solidified
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003990 capacitor Substances 0.000 title claims description 32
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000002390 adhesive tape Substances 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 20
- 238000003825 pressing Methods 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 238000005507 spraying Methods 0.000 claims description 5
- 239000007921 spray Substances 0.000 claims description 3
- 238000004804 winding Methods 0.000 description 7
- 230000000873 masking effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
- 238000007751 thermal spraying Methods 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/32—Wound capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、巻回型のフィルムコンデンサ素子の製造方法
に関するものである。The present invention relates to a method for manufacturing a wound film capacitor element.
一般に、この種のコンデンサの製造方法は、金属の蒸着
膜を形成した誘電体フィルムを巻芯に巻回してその巻芯
を抜き取った後、プレス装置により扁平状に成形固形化
するほか、このように成形固形化したコンデンサ素子の
両端面にメタリコン電極を金属溶射により形成し、かつ
そのメタリコン電極部に引出端子を取着するようにして
おり、しかしてその巻回後のプレス工程については、受
板に一定数のコンデンサ素子を整列載置した後、プレス
装置にセットして成形固形化し、次に成形固形化後の素
子を受板から取り出して別に用意した保持枠に隔壁板の
介装のもとに素子端面が露出するように並列させたまま
多重積に締め付けて枠組みし、この枠組み後の素子群の
端面に溶融金属をスプレーしてメタリコン電極を形成す
るようにしており、また扁平状に成形固形化後の素子を
接着テープに連続的に並列状態に貼付した後にメタリコ
ン電極を形成するようにした技術が、特開昭50−58556
号公報および特開昭58−143518号公報に記載されてい
る。Generally, this type of capacitor manufacturing method involves winding a dielectric film on which a metal vapor-deposited film has been formed around a core, removing the core, and then forming and solidifying the core into a flat shape by a press machine. The metallicon electrodes are formed by metal spraying on both end faces of the molded and solidified capacitor element, and the lead-out terminals are attached to the metallicon electrode parts.However, regarding the pressing step after winding, After a certain number of capacitor elements are aligned and placed on the plate, they are set in a press machine to be molded and solidified, and then the molded and solidified elements are taken out from the receiving plate and the partition plate is inserted into a separately prepared holding frame. Originally, it is arranged so that the end faces of the elements are exposed side by side and tightened in a multiple product to form a frame, and molten metal is sprayed onto the end faces of the element group after this frame to form a metallikon electrode. The technique to form the metallikon electrode element after molding solidified into a flat shape after stuck continuously parallel state to the adhesive tape, JP 50-58556
JP-A-58-143518.
上記方法によれば、プレス工程については、受板に一定
数のコンデンサ素子を整列載置した後、プレス装置にセ
ットして成形固形化し、次に成形固形化後の素子を受板
から取り出す等の煩雑な作業が必要であり、非能率的で
ある。According to the above method, in the pressing step, after a certain number of capacitor elements are aligned and mounted on the receiving plate, they are set in a pressing device to be molded and solidified, and then the molded and solidified elements are taken out from the receiving plate. It requires complicated work and is inefficient.
本発明の目的は、上記従来方法の欠点に鑑み、コンデン
サ素子の扁平化に当り、受板に多数のコンデンサ素子を
整列載置した後、プレス装置にセットして成形固形化す
ると共に、成形固形化後の素子を受板から取り出す等の
煩雑な作業を省略し、テープへの貼着から巻き重ねに至
る一連の作業過程に組み入れる簡易な手段のもとに高能
率かつ安価にコンデンサを製造する方法を提供すること
にある。In view of the drawbacks of the above conventional method, the object of the present invention is to flatten a capacitor element, and after placing a large number of capacitor elements in a line on a receiving plate, set it in a pressing device to solidify and mold it. By omitting the complicated work such as taking out the element after conversion from the receiving plate, and manufacturing the capacitor efficiently and inexpensively by a simple means to be incorporated into a series of work processes from sticking to tape to winding. To provide a method.
本発明は、上記目的を達成するため、粘着テープに巻回
後のコンデンサ素子を互いに近接した一定ピッチのもと
に並列状態に貼付するようにすると共に、必要に応じ貼
付された状態のまま１〜３個ずつプレス加工し、かつこ
のように貼付された素子を貼着テープと共にドラムに巻
き重ねるようにし、次にこの円板状の素子に対して溶融
金属をスプレーして素子端面にメタリコン電極を形成す
るようにしたことを特徴とするものである。In order to achieve the above-mentioned object, the present invention is configured such that the capacitor elements after being wound on the adhesive tape are attached in a parallel state at a constant pitch close to each other, and the attached state is kept as necessary. Approximately 3 pieces each are pressed, and the element thus attached is wound around a drum together with an adhesive tape, and then a molten metal is sprayed onto the disk-shaped element to form a metallikon electrode on the end surface of the element. Is formed.
以下、本発明方法を図面に示す製造装置について詳細に
説明する。The method of the present invention will be described in detail below with reference to a manufacturing apparatus shown in the drawings.
第１図は、コンデンサ素子を貼着テープに貼付する工程
から巻き取り工程までの状態を例示するものであって、
片面に粘着膜がある粘着テープ１をリール２から解きほ
どきつつ粘着面が下向き状態のもとに駆動ローラ３によ
り一定寸法ずつ間欠的に駆送すると共に、粘着テープ１
の前端方はこれをドラム４に止着したまま前記駆動ロー
ラ３による送り出しに対応する速度のもとに巻き取るよ
うにするほか、駆動ローラ３からドラム４に至る走行過
程にコンデンサ素子Ｃの貼付装置５とプレス手段あるい
は熱プレス手段としてのプレス装置６とを順次配設する
のであって、貼付装置５においてはパーツフィーダによ
り繰り出されるコンデンサ素子Ｃの中間素材を適宜の貼
付手段により粘着テープ１に押し付けて一定ピッチのも
とに並列状態に貼付するようにし、かつプレス装置６に
おいては粘着テープ１に貼付されて移送されるコンデン
サ素子Ｃの下方に下型７を固設すると共に、この下型７
の上方にはコンデンサ素子Ｃの間欠的な移送に対応して
その停止期間に下降する上型８を設けてコンデンサ素子
Ｃを１個ずつもしくは２〜３個ずつ常温または熱を加え
つつ扁平状に成形固形化するようにし、なお必要に応じ
各所にガイドローラ9,10,11,12,13を設けると共に、適
宜位置に粘着テープ１の緊緩を調節吸収するためのテン
ションローラ14を設け、以って粘着テープ１を間欠的走
行により一定寸法ずつ移送しつつ前端方において巻き取
るようにしてなり、これにより移送される過程の粘着テ
ープにコンデンサ素子Ｃを一定ピッチのもとに貼付する
と共にプレス装置６により扁平状に成形固形化した後、
渦巻状に巻き重ねて円板状の重畳素子群Ｇを構成するよ
うにする。FIG. 1 illustrates the state from the step of attaching the capacitor element to the adhesive tape to the winding step,
While the adhesive tape 1 having an adhesive film on one surface is unwound from the reel 2, the drive roller 3 intermittently ejects the adhesive tape 1 with a certain size while the adhesive surface faces downward.
The front end of the roller is wound on the drum 4 at a speed corresponding to the feeding by the driving roller 3 while being fixed to the drum 4, and the capacitor element C is attached in the traveling process from the driving roller 3 to the drum 4. The device 5 and the pressing device 6 as a pressing unit or a hot pressing unit are sequentially arranged. In the pasting device 5, the intermediate material of the capacitor element C fed by the parts feeder is attached to the adhesive tape 1 by an appropriate pasting device. The lower mold 7 is fixed below the capacitor element C, which is pressed and pushed in parallel at a constant pitch and is transferred to the adhesive tape 1 in the pressing device 6, and the lower mold 7 is fixed. 7
An upper die 8 which descends during the suspension period corresponding to intermittent transfer of the capacitor element C is provided above the capacitor element C, and the capacitor elements C are flattened at room temperature or by applying heat at room temperature or 2 to 3 capacitors at a time. It is molded and solidified, and if necessary, guide rollers 9, 10, 11, 12, 13 are provided at various places, and a tension roller 14 for adjusting and absorbing the tightness of the adhesive tape 1 is provided at an appropriate position. Thus, the adhesive tape 1 is wound at the front end while being transferred by a constant size by intermittent running, and the capacitor element C is attached to the adhesive tape in the process of being transferred at a constant pitch and pressed. After being molded and solidified into a flat shape by the device 6,
The disc-shaped superposition element group G is formed by spirally winding.
上記のように円板状に構成した素子群Ｇの両端面には、
第２図のように金属溶射ガン15により、亜鉛，半田等の
金属を溶融吹き付けして各コンデンサ素子Ｃの端面にメ
タリコン電極Ｍを形成し、なおメタリコン電極Ｍの形成
後は、粘着テープ１を解きほどきつつコンデンサ素子Ｃ
を粘着テープ１から剥離する簡単な作業により分解する
ことができるから、機械化が容易であり、分解後は必要
に応じ余剰付着金属粒子を除去し、次に両端面のメタリ
コン電極Ｍ部に引出端子を各別に取着した後、適宜の外
装を施して完成コンデンサ素子を得ることができるので
ある。On both end faces of the element group G configured as a disc as described above,
As shown in FIG. 2, a metal spray gun 15 melts and sprays a metal such as zinc or solder to form a metallikon electrode M on the end face of each capacitor element C. After the metallikon electrode M is formed, the adhesive tape 1 is applied. While unraveling, capacitor element C
Since it can be disassembled by a simple operation of peeling the adhesive tape 1 from the adhesive tape 1, it is easy to mechanize, and after disassembly, excess adhered metal particles are removed as needed, and then the lead-out terminals are provided on the metallikon electrodes M on both end surfaces. It is possible to obtain a completed capacitor element by attaching each of them separately and then applying an appropriate exterior.
上記メタリコン電極Ｍの溶射工程時にコンデンサ素子Ｃ
の周側面に余剰金属粒子が付着し易いから、必要に応じ
粘着テープ１に貼付する以前にコンデンサＣにマスキン
グテープを施し、あるいはマスキング塗装を施して溶射
後にそのマスクを除去するようにしてもよく、あるいは
粘着テープ１に貼付した後にその外方から他のマスキン
グテープを施して粘着テープと相俟って汚損防止用のマ
スキングテープとするようにする等の方法を講じてもよ
いのである。Capacitor element C during the spraying process of the metallikon electrode M
Since excess metal particles are likely to adhere to the peripheral side surface of the capacitor C, a masking tape may be applied to the capacitor C before attaching it to the adhesive tape 1 if necessary, or masking may be applied to remove the mask after thermal spraying. Alternatively, it is also possible to take a method such as applying it to the adhesive tape 1 and then applying another masking tape from the outside to make it a stain-proofing masking tape together with the adhesive tape.
以上説明したように、本発明方法によれば、粘着テープ
にコンデンサ素子を並列状態に貼付したまま巻き重ねて
円板状の重畳素子群とした後、金属溶射によりメタリコ
ン電極を形成するようにしたから、これによりメタリコ
ン電極を形成の前工程としての枠組み作業および枠組み
のための補助治具を省略することができ、しかも溶射後
の分解についても粘着テープを解きほどくと共に剥離す
る等の著しく簡易な操作で足るから、能率を向上して製
品の多量生産並びに低廉化を実現することができる効果
があり、かつ特に貼付工程後にプレス装置による成形工
程を付加し、その後に引き続き巻き重ねるようにしたこ
とにより、貼付から巻き重ねまでの工程を連続的な一貫
作業のもとに高能率に行なうことができるのであって、
しかも多数の素子を同時に押圧する従来のプレス方法と
は異なる１〜３個の少数毎に押圧するプレス方法を採択
する関係上、各素子に対する圧力が均斉となり均一製品
を容易に得ることができるのである。As described above, according to the method of the present invention, after the capacitor elements are stuck on the adhesive tape in a parallel state and stacked to form a disk-shaped superimposed element group, the metallikon electrode is formed by metal spraying. From this, it is possible to omit the framework work as a pre-process of forming the metallikon electrode and the auxiliary jig for the framework, and it is also extremely easy to disassemble and peel off the adhesive tape after the thermal spraying. Since the operation is sufficient, there is an effect that efficiency can be improved and mass production of products and cost reduction can be realized, and in particular, a forming process by a press device is added after the pasting process, and then the film is continuously wound. By doing so, the process from pasting to winding can be performed efficiently under continuous continuous work,
Moreover, since a pressing method for pressing a small number of 1 to 3 different from the conventional pressing method for pressing a large number of elements at the same time is adopted, the pressure on each element becomes uniform, and a uniform product can be easily obtained. is there.
図面において、第１図は本発明方法を実施するための貼
付から巻き取りまでの装置を例示する側面図、第２図は
金属溶射工程を示す側面図、また第３図はメタリコン電
極形成後のコンデンサ素子の斜視図である。 １……粘着テープ ６……プレス装置 Ｃ……コンデンサ素子 Ｇ……コンデンサ素子群 Ｍ……メタリコン電極In the drawings, FIG. 1 is a side view illustrating an apparatus from sticking to winding for carrying out the method of the present invention, FIG. 2 is a side view showing a metal spraying process, and FIG. 3 is a view after forming a metallikon electrode. It is a perspective view of a capacitor element. 1 ... Adhesive tape 6 ... Pressing device C ... Capacitor element G ... Capacitor element group M ... Metallicon electrode
Claims (1)
の移送過程において巻回後のコンデンサ素子を一定ピッ
チのもとに並列状態に貼付すると共に、このコンデンサ
素子を粘着テープに貼付した状態のまま、粘着テープに
対する間欠的移送過程においてプレス装置による押圧扁
平化により１〜３個ずつ成形固形化した後、粘着テープ
と共に渦巻状に巻き重ねて円板状の重畳素子群を構成
し、かつ円板状の素子群の両端面に金属溶射によりメタ
リコン溶射を形成するようにしたことを特徴とするコン
デンサの製造方法。Claim: What is claimed is: 1. While the adhesive tape is being transferred by a constant size, the wound capacitor elements are stuck in parallel at a fixed pitch in the transfer process, and the capacitor elements are stuck to the adhesive tape. As it is, in the intermittent transfer process to the adhesive tape, 1 to 3 pieces are molded and solidified by pressing and flattening by the press device, and then wound together with the adhesive tape in a spiral shape to form a disk-shaped overlapping element group, and A method for manufacturing a capacitor, characterized in that metallikon spray is formed on both end faces of a plate-shaped element group by metal spraying.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62031383A JPH07120617B2 (en) | 1987-02-16 | 1987-02-16 | Capacitor manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62031383A JPH07120617B2 (en) | 1987-02-16 | 1987-02-16 | Capacitor manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63199409A JPS63199409A (en) | 1988-08-17 |
| JPH07120617B2 true JPH07120617B2 (en) | 1995-12-20 |
Family
ID=12329731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62031383A Expired - Fee Related JPH07120617B2 (en) | 1987-02-16 | 1987-02-16 | Capacitor manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07120617B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005093761A (en) * | 2003-09-18 | 2005-04-07 | Matsushita Electric Ind Co Ltd | Film capacitor |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5058556A (en) * | 1973-09-25 | 1975-05-21 | ||
| JPS58143518A (en) * | 1982-02-22 | 1983-08-26 | 日立コンデンサ株式会社 | Taping device for condenser element |
-
1987
- 1987-02-16 JP JP62031383A patent/JPH07120617B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63199409A (en) | 1988-08-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |