JPH0715146B2 - Deposited film formation method - Google Patents

Description

The present invention relates to a deposited film forming method, and more particularly to a deposited film forming method capable of depositing a deposited film having a uniform film thickness and film quality on a columnar body.

[Prior art and its problems]

Conventionally, when a dielectric or metal deposition film is formed on the deposition surface of a semiconductor laser, semiconductor lasers and spacers connected in strips are alternately arranged, and a jig for pinching from the left and right is used to perform sputtering or the like. The deposition film has been formed on the surface to be deposited by the source of the deposition film coming from the.

However, in such a deposited film forming method, as shown in FIG. 6, in the deposited film forming apparatus in which the source of the deposited film is arranged below the deposition surface of the semiconductor laser, as in the vacuum vapor deposition apparatus, as shown in FIG. It is necessary to attach a screw or the like to the jig 16 that is sandwiched from the left and right sides to further strongly sandwich the semiconductor laser 14 and the spacer 15 and there is a problem in workability of attachment and detachment.

Further, when forming a deposited film on the back surface facing the deposition surface, the jig 16 is once taken out from a film forming apparatus such as a sputtering apparatus, and the strip-shaped semiconductor laser is turned upside down. After fixing to the jig 16 as before,
If the strip-shaped semiconductor laser 14 is turned over when the deposition is formed in the deposited film forming apparatus and the vacuum state of the film forming apparatus is broken, the strip-shaped semiconductor laser 14 is turned upside down and realigned. Since it has a complicated process of reworking, it has been a major obstacle in the work.

In addition, the surface of the jig 16 that is cleaved perpendicular to the deposition surface is in contact with the jig, and it is easy to damage the important surface of the structure of the semiconductor laser, which may deteriorate the device. there were.

Further, in a device such as a sputtering device in which the formed film is largely wrapped around, strip-shaped semiconductor lasers are laid down and film formation is performed in a lined state, but in this method, opposite surfaces have different reflectances. In order to form the deposited film, complicated steps such as resist coating are required, and there is a problem in workability.

In view of the above problems, an object of the present invention is to form a deposited film having a uniform film thickness and film quality on a deposition surface of a columnar body, improve its workability, and improve the workability of the surface of the columnar body and a jig. It is an object of the present invention to provide a method for forming a deposited film which can prevent scratches and the like by scraping the contact portion.

[Means for solving problems]

The deposited film forming method of the present invention is a method of forming a deposited film by causing deposited film forming particles to fly to a deposition surface of a columnar body,
A plurality of grooves into which the columnar bodies are inserted are placed side by side on the upper surface thereof, and a recess for exposing a part of the deposition surface of the columnar bodies inserted into the grooves is provided on the lower surface thereof. Using a plate-shaped holding member formed so that the bottom surface of the recess is located above the deposition surface, and the columnar bodies are inserted into the plurality of grooves of the holding member, the deposited film is formed from below. It is characterized in that formed particles are made to fly and a deposited film is formed on a part of the deposition surface exposed from the recess.

[Action]

According to the present invention, a plurality of grooves into which a columnar body is inserted with the deposition surface facing down are arranged in parallel on the upper surface thereof, and a recess for exposing a part of the deposition surface of the columnar body inserted into the groove is formed on the lower surface thereof. And using a plate-shaped holding member formed so that the bottom surface of the recess is located above the deposition surface, the columnar body is inserted into the plurality of grooves of the holding member, and Since the deposited film forming particles fly from the surface and form the deposited film on a part of the deposited surface exposed from the concave portion, the deposited film forming particles reach the deposited surface without being blocked by the holding member, It is possible to uniformly form a deposited film. Further, it is possible to reduce the contact area between the holding member and the columnar body and reduce defects due to mechanical breakage such as scratches.

After the deposited film is formed on the deposition surface by the above-described deposited film forming method, the holding member is further fitted with the second holding member and turned over, and the columnar body is held by the second holding member. If it is held in a state of being projected from the groove, the deposited film forming particles are made to fly through the through holes provided in the second holding member, and the deposited film is formed on the surface of the columnar body facing the deposition surface. It is possible to form a uniform deposited film on a plurality of deposition surfaces of the columnar body by changing the arrangement of the deposition surface of the columnar body with respect to the flying direction of the deposited film forming particles while maintaining the vacuum.

If the columnar body is held by holding both ends of the columnar body by the holding members, the contact area with the columnar body is further reduced and the possibility of mechanical damage such as scratches by the holding member is reduced.

Further, since the plurality of columnar bodies are respectively inserted into the plurality of grooves formed in the holding member, the holding member exists between the respective columnar bodies, and the deposition surface on the side surface of the deposition surface The portions other than the vicinity are covered with the holding member, and the deposited film is not formed on the side surface thereof. In addition, the holding member used in the present invention can be easily formed because it is only necessary to form a plurality of grooves into which the columnar bodies are inserted and the recesses for exposing the deposition surface on the plate-shaped member. .

〔Example〕

 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

The columnar body is a strip-shaped semiconductor laser as an example, but the columnar body is not limited to this. The shape is not limited to the quadrangular prism, but may be a triangular prism, a pentagonal prism, a cylinder, or the like.

FIGS. 1 (A) to 1 (C) are explanatory views showing a state of a semiconductor laser inserted into a holding means (which serves as a holding member).

FIG. 2 is a perspective view of the holding means.

As shown in FIG. 2, the holding means 1 is provided with grooves 2 in rows, and a recess 3 is provided on the back surface at a right angle to the grooves 2. As a material of the holding means 1, a sintered body of glass, a ceramic such as alumina, stainless steel, or the like is used.

The strip-shaped semiconductor laser 4 cleaved to a predetermined width is
2 is inserted into the groove 2 dug on the holding means 1 shown in FIG. 2 with the surface on which the film is to be formed facing down. FIGS. 1 (A), (B), and (C) are respectively the second
The figure shows the state seen from the A, B, and C directions. Only the both ends of the lower surface of the strip-shaped semiconductor laser 4 are in contact with the holding means 1, and unlike the conventional example in which the surface is placed on the flat plate downward, the cleaved surface It does not cause any inconvenience such as damaging the. Further, as shown in FIG. 1 (A), since the concave portion 3 is deeply dug so that the deposition surface of the semiconductor laser 4 protrudes, the concave portion 3 evaporates like an electron beam vapor deposition apparatus, for example. Even if an apparatus in which the flying material is less entangled is used, the holding means 1 does not form a shadow on the deposition surface, and a uniform deposition film is formed on the surface.

Since the semiconductor laser 4 is inserted into each of the plurality of grooves 2 formed in the holding means 1, the holding means 1 exists between the semiconductor lasers 4, and the side surface of the deposition surface is covered. The parts other than the vicinity of the deposition surface are covered with the holding member 1,
No deposited film is formed on the side surface. The holding means 1 can be easily formed because it is only necessary to form the plurality of grooves 2 into which the semiconductor laser 4 is inserted and the recesses 3 for exposing the deposition surface in a plate-shaped member.

As an example of the deposited film forming method using the above holding means,
The case of depositing a dielectric film using a normal electron beam evaporation apparatus will be described. The holding means 1 holding the semiconductor laser 4 as shown in FIG. 1 is set in the vapor deposition apparatus by the jig 5 as shown in FIG. Then 10
-Vacuum exhaust to ^-5 Torr or more, heat the temperature around the jig 5 to 200 ° C or more with a heater, and then deposit a dielectric forming material such as SiO ₂ or Al ₂ O ₃ with an electron beam emitted from the filament 7. The source 6 is heated and evaporated, and the shutter 8 controls the film thickness to perform vapor deposition.

Through the above steps, a predetermined dielectric film can be formed on one deposition surface of the semiconductor laser 4.

The dielectric film can be formed by repeating the above method even when the deposited film is formed on the back surface facing the deposition surface. In the above description, the deposited film to be formed is limited to the dielectric, but the film quality is not limited to the dielectric, and is also effective when forming a metal thin film on an insulating film, for example. The film formation method is not limited to electron beam evaporation, and the film source is located below the deposition surface of the strip-shaped semiconductor laser by a CVD (Chemical Vapor Deposition) method, a plasma CVD method, a sputtering method, or the like. Any material can be used to form the deposited film by the same method.

Next, another embodiment of the present invention will be described.

The deposited film forming method of the present embodiment is preferably used when the deposited films are formed on both surfaces facing each other, and the strip-shaped semiconductor laser holding means is provided with a rotating mechanism, and the strip-shaped semiconductor laser is provided during this rotation. By using a holding means having a structure in which the laser does not drop and the deposition surface projects below the bottom of the adjacent holding means both before and after the rotation, the once used in the method for forming a deposited film described above. The workability is improved by eliminating the work of breaking the vacuum of the vacuum device, taking out the jig, and turning the semiconductor laser upside down.

FIG. 4 and FIG. 5 are configuration diagrams showing the structure of the holding means of the semiconductor laser which performs the above-mentioned functions, (A) before rotation and (B) after 180 ° rotation, respectively. 4 is a configuration diagram showing the states of the holding means 9, and holding means 9 and holding means (which serves as a second holding member) 10.

As shown in FIGS. 4 and 5, the holding means 9 has substantially the same structure as the holding means 1 of the previous embodiment, but the holding means 9 is provided with a fitting claw 11. Similarly, the retaining means is also provided with a fitting claw 12.

The fitting claws 11 and 12 are provided so that the relative positions of the holding means 9 and the holding means 10 do not shift. A hole 13 is formed in the holding means 10 so as to correspond to a portion of the holding means 9 where the deposition surface of the semiconductor laser 4 is exposed, and when the whole holding means is rotated by 180 °, FIG. Like the semiconductor laser 4 around the hole 13
The semiconductor laser 4 does not drop downward due to the contact of the ends of the.

The method of forming a deposited film on the deposition surface of the semiconductor laser 4 using this holding means is the same as in the above-mentioned embodiment,
The deposition surface of the semiconductor laser 4 in the state before rotation shown in FIGS. 4 (A) and 4 (B) and the state after 180 ° rotation shown in FIGS. 4 (B) and 5 (B). A uniform deposited film can be formed on the deposition target surface without any obstacle in the vicinity to prevent the constituent substances of the deposited film from flying in.

The method of rotating the holding means 9 and the holding means 10 is
It is performed by a motor (not shown) provided inside or outside the vacuum device or manually.

〔The invention's effect〕

As described above in detail, according to the deposited film forming method of the present invention, a plurality of grooves into which the columnar body is inserted with the deposition surface facing down are arranged in parallel on the upper surface, and the grooves are formed on the lower surface. Using a plate-shaped holding member that is provided with a recess that exposes a part of the deposited surface of the inserted columnar body, and the bottom surface of the recess is located above the deposited surface, With the columnar bodies inserted in the plurality of grooves of the member, the deposited film forming particles are blown from below to form the deposited film on a part of the deposition surface exposed from the recess, so that the deposited film forming particles are retained by the holding member. As a result, it is possible to reach the surface to be deposited without being blocked and to form a deposited film uniformly on the surface to be deposited. Further, the contact area between the holding member and the columnar body can be reduced, and mechanical damage such as scratches can be reduced.

After forming the deposited film on the deposition surface, the second holding member was further fitted to the holding member and turned upside down, and the columnar body was projected from the groove of the holding member by the second holding member. In this state, the deposited film forming particles are made to fly through the through holes provided in the second holding member, and the deposited film is formed on the surface of the columnar body facing the deposition surface. After performing, the film on the other side can be continuously formed without breaking the vacuum, which is very effective in simplifying the process and saving labor, and the work of reversing the top and bottom of the columnar body and fixing it to the holding member is possible. Since it can be omitted, the deposition surface and the surface other than the deposition surface at this time are not scratched and contaminants are not attached.

If the columnar body is held by holding both ends of the columnar body by the holding members, the contact area with the columnar body is further reduced and the possibility of mechanical damage such as scratches by the holding member is reduced.

Further, since the plurality of columnar bodies are respectively inserted into the plurality of grooves formed in the holding member, the holding member exists between the respective columnar bodies, and the deposition surface on the side surface of the deposition surface The portions other than the vicinity are covered with the holding member, and the deposited film is not formed on the side surface thereof. In addition, the holding member used in the present invention can be easily formed because it is only necessary to form a plurality of grooves into which the columnar bodies are inserted and the recesses for exposing the deposition surface on the plate-shaped member. .

INDUSTRIAL APPLICABILITY The present invention is suitably used for a semiconductor laser or the like in which the damage of the columnar body greatly affects the characteristics, and can improve the performance and reliability thereof.

[Brief description of drawings]

1 (A) to 1 (C) are explanatory views showing the state of the semiconductor laser inserted in the holding means. FIG. 2 is a perspective view of the holding means. FIG. 3 is a schematic diagram showing the structure of an electron beam vapor deposition apparatus according to the present invention. FIG. 4 and FIG. 5 are configuration diagrams showing the structure of the holding means of the semiconductor laser which fulfills the above-mentioned functions. FIG. 6 is a schematic explanatory view showing a conventional deposited film forming method. 1,9,10 …… Holding means, 2 …… Groove, 3 …… Concave, 4 …… Semiconductor laser, 11,12 …… Mating claw, 13 …… Hole.

Claims (2)

[Claims] 1. A method of forming a deposited film by causing deposited film forming particles to fly to a deposition surface of a columnar body, wherein a plurality of grooves into which the columnar body is inserted with the deposition surface facing down are aligned. A plate provided on the lower surface thereof to expose a part of the deposition surface of the columnar body inserted in the groove, and the bottom surface of the recess is located above the deposition surface. Using a cylindrical holding member, with the columnar bodies inserted in the plurality of grooves of the holding member, the deposited film forming particles were blown from below to form a deposited film on a part of the deposition surface exposed from the recess. A method for forming a deposited film, comprising: 2. After forming a deposited film on a deposition surface, a second holding member is further fitted to the holding member and turned over, and the columnar body is removed from the groove of the holding member by the second holding member. A method of holding a projecting state, causing deposited film forming particles to fly through a through hole provided in the second holding member, and forming a deposited film on a surface of the columnar body facing a deposition surface. The method for forming a deposited film according to item 1.