JPH071528B2 - Magnetic head device - Google Patents
Magnetic head deviceInfo
- Publication number
- JPH071528B2 JPH071528B2 JP58247806A JP24780683A JPH071528B2 JP H071528 B2 JPH071528 B2 JP H071528B2 JP 58247806 A JP58247806 A JP 58247806A JP 24780683 A JP24780683 A JP 24780683A JP H071528 B2 JPH071528 B2 JP H071528B2
- Authority
- JP
- Japan
- Prior art keywords
- magnetic
- magnetic head
- mold body
- thin film
- conductive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/33—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only
- G11B5/39—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects
- G11B5/3903—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects using magnetic thin film layers or their effects, the films being part of integrated structures
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/10—Structure or manufacture of housings or shields for heads
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/17—Construction or disposition of windings
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Magnetic Heads (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は多チヤンネル磁気ヘツドを備える磁気ヘツド装
置に関する。Description: FIELD OF THE INVENTION The present invention relates to a magnetic head device with a multi-channel magnetic head.
背景技術とその問題点 先ず、第１図及び第２図を参照して、従来の磁気効果薄
膜（以下MR薄膜という）を用いた磁気ヘツド（MRヘツ
ド）の一例について説明する。Background Art and Problems Thereof First, an example of a magnetic head (MR head) using a conventional magnetic effect thin film (hereinafter referred to as MR thin film) will be described with reference to FIGS. 1 and 2.
このMRヘツドは、例えば第１図にその要部の拡大断面図
を示し、第２図にその拡大略線的平面図を示すように、
例えばNi−Zn系フエライトよりなる高抵抗の磁性基体
（１）の表面に凹溝（1a）が形成され、その凹溝（1a）
内にガラス等の絶縁性の非磁性充填部材（２）が充填さ
れる。磁性基体（１）及び充填部材（２）の各表面は同
一面とされる。This MR head, for example, as shown in FIG. 1 is an enlarged cross-sectional view of its main portion and FIG. 2 is an enlarged schematic plan view thereof,
For example, a groove (1a) is formed on the surface of a high-resistance magnetic substrate (1) made of Ni-Zn ferrite, and the groove (1a) is formed.
An insulating non-magnetic filling member (2) such as glass is filled therein. The surfaces of the magnetic substrate (1) and the filling member (2) are the same surface.
そして、充填部材（２）の表面及び磁性基体（１）の表
面に跨がる如く、例えばNi−Fe系合金、或いはNi−Co系
合金等よりなるMR薄膜（４）が被着形成され、このMR薄
膜（４）の両端から導出される金等の非磁性のリード導
電層（11），（12）が磁性基体（１）の表面上に被着形
成される。そして、このMR薄膜（４）の一端部の上に、
磁性基体（１）、リード導電層（11），（12）及びMR薄
膜（４）の各表面を覆う絶縁層（５）を介してNi−Fe系
合金等の磁性層よりなる磁気ヨーク（６）が、MR薄膜
（４）上を横切る方向に形成される。そして、磁気ヨー
ク（６）の内端部が絶縁層（５）を介してMR薄膜（４）
の一端と磁気的に連結される。磁気ヨーク（６）の外端
部は、非磁性層、即ち絶縁層（５）を介して磁性基体
（１）と対向し、この磁気ヨーク（６）と磁性基体
（１）との間に磁気ギヤツプｇが形成されるようになさ
れる。そして、MR薄膜（４）、磁気ヨーク（６）を覆つ
て非磁性絶縁性保護層（８）が被覆され、これの上に接
着剤層（９）によつて保護基体（10）が接着される。そ
して、両基体（１）及び（10）と磁気ヨーク（６）の前
端側が切削研磨されて磁気媒体との対接面（11）が形成
される。かくして、磁性基体（１）−磁気ギヤツプｇ−
磁気ヨーク（６）−MR薄膜（４）−磁性基体（１）によ
つて閉磁路が形成される。Then, an MR thin film (4) made of, for example, a Ni-Fe alloy or a Ni-Co alloy is adhered and formed so as to extend over the surface of the filling member (2) and the surface of the magnetic substrate (1), Non-magnetic lead conductive layers (11), (12) such as gold derived from both ends of the MR thin film (4) are deposited on the surface of the magnetic substrate (1). Then, on one end of this MR thin film (4),
A magnetic yoke (6) made of a magnetic layer of Ni-Fe alloy or the like via an insulating layer (5) covering the surfaces of the magnetic substrate (1), the lead conductive layers (11) and (12) and the MR thin film (4). ) Is formed across the MR thin film (4). Then, the inner end of the magnetic yoke (6) is separated by the MR thin film (4) through the insulating layer (5).
Is magnetically coupled to one end of. The outer end of the magnetic yoke (6) faces the magnetic substrate (1) via a non-magnetic layer, that is, an insulating layer (5), and a magnetic layer is provided between the magnetic yoke (6) and the magnetic substrate (1). The gear g is formed. Then, the MR thin film (4) and the magnetic yoke (6) are covered with a non-magnetic insulating protective layer (8), and the protective substrate (10) is adhered thereto by an adhesive layer (9). It Then, the front ends of the bases (1) and (10) and the magnetic yoke (6) are cut and polished to form a contact surface (11) with the magnetic medium. Thus, the magnetic substrate (1) -the magnetic gear g-
A closed magnetic circuit is formed by the magnetic yoke (6) -MR thin film (4) -magnetic substrate (1).
しかして、MR薄膜（４）に電流Ｉを流すことによつて、
その各磁気ギヤツプｇに対接ないしは対向する磁気記録
媒体よりの、これに記録された記録磁化による信号磁界
がMR薄膜（４）に与えられ、これによる抵抗変化に基ず
く電気的信号、即ち再生出力信号がMR薄膜（４）の両端
に得られ、リード導電層（11），（12）を通じて出力さ
れる。Then, by passing a current I through the MR thin film (4),
The MR thin film (4) is provided with a signal magnetic field due to the recording magnetization recorded on the magnetic recording medium which is in contact with or faces each of the magnetic gears g, and an electric signal based on the resistance change by the MR thin film (4), that is, reproduction. Output signals are obtained at both ends of the MR thin film (4) and output through the lead conductive layers (11) and (12).
そして、かかる磁気ヘツドが、磁性基体（１）、その凹
溝（1a）、非磁性充填部材（２）を共通として、多数形
成されることにより、PCM信号再生用のマルチチヤンネ
ルヘツドが構成される。尚、凹溝（1a）の底部に銅等の
バイアス導体を設けることができる。A large number of such magnetic heads are formed with the magnetic substrate (1), the concave groove (1a), and the non-magnetic filling member (2) being formed in common, thereby forming a multi-channel head for reproducing a PCM signal. . A bias conductor such as copper can be provided on the bottom of the groove (1a).
かかる磁気ヘツドは磁性基体（１）の表面に於いて、MR
薄膜（４）を対向する部分に凹溝（1a）が形成されてい
るため、MR薄膜（４）の中央付近から磁性基体（１）へ
漏洩する磁束が軽減されるので、磁気的効率が高いとい
う利点がある。Such a magnetic head is formed on the surface of the magnetic substrate (1) by MR
Since the concave groove (1a) is formed in the portion where the thin film (4) faces, the magnetic flux leaking from the vicinity of the center of the MR thin film (4) to the magnetic substrate (1) is reduced, resulting in high magnetic efficiency. There is an advantage.
上述の多チヤンネルのMRヘツドの各MR薄膜（４）から信
号を取出すには第３図のような回路構成を採る。即ち、
ｎ個のMR薄膜（４）を等価的にｎ個の可変抵抗器RM1〜R
Mnで示し、これらに夫夫直列接続される定電流用抵抗器
をR1〜Rnで示す。可変抵抗器RM1〜RMnの固定抵抗値は10
0Ω程度で、外部磁界による抵抗変化は約１％程度であ
る。これに対し、定電流抵抗器R1〜Rnは200〜300Ω程度
の抵抗値に選ばれる。In order to extract a signal from each MR thin film (4) of the above-mentioned multi-channel MR head, the circuit configuration as shown in FIG. 3 is adopted. That is,
Equivalent to n MR thin films (4) n variable resistors RM 1 to R
The resistors for constant current, which are denoted by M n and are connected in series with each other, are denoted by R 1 to R n . The fixed resistance value of the variable resistors RM 1 to RM n is 10
At about 0Ω, the resistance change due to the external magnetic field is about 1%. On the other hand, the constant current resistors R 1 to R n are selected to have a resistance value of about 200 to 300Ω.
抵抗器R1，RM1〜Rn，RMnの各直列回路は互いに並列接続
され、その並列回路の両端に直流電源E1が接続されるこ
とにより、各可変抵抗器RM1〜RMnには略一定の直流電流
が流される。Cs1は直流電源E1に並列接続された安定化
コンデンサである。The series circuits of the resistors R 1 , RM 1 to R n , and RM n are connected in parallel with each other, and the DC power source E 1 is connected to both ends of the parallel circuit, so that the variable resistors RM 1 to RM n are connected. Is supplied with a substantially constant direct current. C s1 is a stabilizing capacitor connected in parallel to the DC power supply E 1 .
抵抗器R1，RM1〜Rn，RMnの各直列回路の夫々の接続中点
より可変抵抗器RM1〜RMnの抵抗変化に基づく再生信号が
得られ、その各再生信号が夫々結合コンデンサC1〜Cnを
通じて前置増幅器A1〜Anに供給され、その各出力が並列
−直列変換器（13）に供給される。Resistors R 1, RM 1 ~R n, RM reproduction signal based on the resistance change of the variable resistor RM 1 ~RM n from the connection midpoint of each of the series circuits of n are obtained, each reproduction signal is respectively coupled It is supplied to the preamplifier a 1 to a n through capacitor C 1 -C n, that each output in parallel - is supplied to serial converter (13).
E2は全体としてIC化された増幅器A1〜An及び並列−直列
変換器（13）等に接続される直流電源で、ｔはその出力
端子であり、Cs2はこの直流電源E2に並列接続された安
定化コンデンサである。E 2 is as a whole an IC is an amplifier A 1 to A n and parallel - a DC power supply connected to serial converter (13) or the like, t is the output terminal, C s2 for the DC power source E 2 It is a stabilizing capacitor connected in parallel.
第４図にかかる磁気ヘツド装置の機械的構成を示し、
（15）はMRヘツド｛MR薄膜（４）（RM1〜RMn）及び抵抗
器R1〜Rnを含む｝、（16）は上述のコンデンサC1〜Cn、
Cs1，Cs2を含むコンデンサアレイ、（17）はその保持基
板、（18）は上述の前置増幅器A1〜An及び並列−直列変
換器（13）等を含むICチツプ、（19）はICチツプ（18）
に対するヒートシンク、（20）は信号取出しのための出
力導線の配線されたソリツドプリント配線基板である。FIG. 4 shows the mechanical structure of the magnetic head device according to FIG.
(15) is an MR head (including MR thin film (4) (RM 1 to RM n ) and resistors R 1 to R n ), (16) is the above-mentioned capacitors C 1 to C n ,
A capacitor array including C s1 and C s2 , (17) a holding substrate thereof, (18) an IC chip including the above preamplifiers A 1 to A n, a parallel-serial converter (13), etc. (19) IC chip (18)
The heatsink, (20) is a solid printed wiring board on which output conductors for signal extraction are wired.
そして、MRヘツド（15）、コンデンサアレイ（16）、IC
チツプ（18）及びプリント配線基板（20）の各間が夫夫
金等のワイアW1〜W3により順次電気的に接続（ボンデイ
ング）されている。And MR head (15), capacitor array (16), IC
The chip (18) and the printed wiring board (20) are sequentially electrically connected (bonded) by wires W 1 to W 3 such as husband and wife.
（21），（22）は上下のモールド体で、上記各部品を一
体にモールドしている。(21) and (22) are upper and lower mold bodies that integrally mold the above-mentioned components.
しかして、このワイヤW1〜W3の本数は、夫夫チヤンネル
数×２本＋出力端子用８本＋電源ライン用数本で、合計
すると60本近くになり、ワイヤボンデイングの作業が煩
雑である。However, the number of wires W 1 to W 3 is the number of husband and wife channels × 2 + 8 for output terminals + several for power supply lines, totaling close to 60, and the wire bonding work is complicated. is there.
又、コンデンサアレイ（16）の保持基板（17）は、下面
にコンデンサを半田付けし、上面にボンデイングパツド
を設けたスルーホールソリツド基板であり、構成が複雑
且つ細かくなる。Further, the holding substrate (17) of the capacitor array (16) is a through-hole solid substrate having a lower surface to which a capacitor is soldered and a bonding pad provided on the upper surface, and the structure is complicated and fine.
発明の目的 かかる点に鑑み、本発明は構成簡単、製造容易なこの種
磁気ヘツド装置を提案しようとするものである。SUMMARY OF THE INVENTION In view of the above points, the present invention is intended to propose a magnetic head device of this type that has a simple structure and is easy to manufacture.
発明の概要 本発明による磁気ヘツド装置は、ヒートシンク（19）が
埋込まれ、凹溝が形成されると共に、先端に磁気ヘッド
（15）が取り付けられた下モールド体（21）と、所定パ
ターンの配線導電層及び磁気ヘッド（15）用のリード導
電層（23a）が形成されると共にコンデンサアレイ（1
6）及びICチップ（18）を所定の配線導電層に接続載置
して成るプリント基板（23）を有し、プリント基板（2
3）上に載置したICチップ（18）を下モールド体（21）
に埋込んだヒートシンク（18）に対向配置させ、コンデ
ンサアレイ（16）を下モールド体（21）に形成した凹溝
内に収容させると共にプリント基板（23）に設けられた
リード導電層（23a）に磁気ヘッド（15）の端子を接続
させた後にプリント基板（23）と磁気ヘッド（15）の一
部を上モールド体（22）で一体化して成ることを特徴と
するものである。かかる本発明によれば、構成簡単、製
造容易なこの種磁気ヘツド装置を得ることができる。SUMMARY OF THE INVENTION In a magnetic head device according to the present invention, a heat sink (19) is embedded, a groove is formed, a lower mold body (21) having a magnetic head (15) attached to the tip, and a predetermined pattern. A wiring conductive layer and a lead conductive layer (23a) for the magnetic head (15) are formed and a capacitor array (1
6) and an IC chip (18) are connected and mounted on a predetermined wiring conductive layer, and a printed circuit board (23) is provided.
3) Lower the IC chip (18) placed on the lower mold body (21)
Is placed opposite to the heat sink (18) embedded in the capacitor, the capacitor array (16) is housed in the groove formed in the lower mold body (21), and the lead conductive layer (23a) is provided on the printed board (23). After connecting the terminals of the magnetic head (15) to the, the printed circuit board (23) and a part of the magnetic head (15) are integrated by the upper mold body (22). According to the present invention, it is possible to obtain this kind of magnetic head device having a simple structure and easy manufacture.
実施例 以下、第５図及び第６図を参照して、本発明の一実施例
を説明する。（23）はプリント配線基板、特にフレキシ
ブルプリント配線基板（フイルムキヤリア）で、ポリイ
ミド等の基材から成り、その上に所定パターンの銅等の
配線導電層が被着形成されている。そして、始めに、図
６の様にこの基板（23）の例えば同一面の所定導電層上
にコンデンサアレイ（16）の電極を半田付けすると共
に、ICチツプ（18）をワイアボンド（又は半田バンプに
よる接続も可）によつて他の所定導電層上に接続する。
そして、かかま基板（23）へのICチップ（18）の取付工
程とは別に作成された、取付けめねじ（19a′）の形成
されたヒートリンク（19）が埋め込まれ、凹溝が形成さ
れ、且つ多チャンネルMRヘッド（15）の取り付けられた
モールド体（21）が用意される。このモールド（21）上
にコンデンサアレイ（16）とICチップ（18）を取付けた
基板（23）を載置し、図６に示す基板（23）のリード導
電層（23a）をモールド（21）上の多チャンネル磁気ヘ
ッド（15）の各端子に半田付けする。その上をポツテイ
ングレジン（22′）でモールドして、全体を一体化す
る。かくして、磁気ヘツド装置の信頼性及び強度が確保
できる。Embodiment An embodiment of the present invention will be described below with reference to FIGS. 5 and 6. Reference numeral (23) is a printed wiring board, particularly a flexible printed wiring board (film carrier), which is made of a base material such as polyimide, on which a wiring conductive layer of copper or the like having a predetermined pattern is adhered. Then, first, as shown in FIG. 6, the electrodes of the capacitor array (16) are soldered on a predetermined conductive layer on the same surface of the substrate (23), and the IC chip (18) is wire-bonded (or solder-bumped). Connection is also possible) to connect to another predetermined conductive layer.
Then, the heat link (19) having the mounting female screw (19a ') formed therein, which is prepared separately from the step of mounting the IC chip (18) on the rotary hook substrate (23), is embedded to form the groove. A mold body (21) to which the multi-channel MR head (15) is attached is prepared. A substrate (23) having a capacitor array (16) and an IC chip (18) attached is placed on this mold (21), and a lead conductive layer (23a) of the substrate (23) shown in FIG. 6 is molded (21). Solder to each terminal of the upper multi-channel magnetic head (15). Mold it with Pottain resin (22 ') and integrate the whole. Thus, the reliability and strength of the magnetic head device can be ensured.
かくして、ICチツプ（18）はヒートシンク（19′）上に
接触し、コンデンサアレイ（16）がモールド体（21）の
凹溝内に配され、MRヘツド（19）がモールド体（21）の
端部に配される。尚、モールド体（21），（22′）にて
ハウジングが構成される。Thus, the IC chip (18) contacts the heat sink (19 '), the capacitor array (16) is arranged in the groove of the mold body (21), and the MR head (19) is located at the end of the mold body (21). Be assigned to the department. The mold body (21), (22 ') constitutes a housing.
次に、第７図及び第８図を参照して、本発明の他の実施
例を説明するも、第７図及び第８図に於いて、第５図及
び第６図と対応する部分には同一符号を付して重複説明
を省略する。本実施例に於いては、プリント配線基板
（23）の上面にICチツプ（18）を取付け、下面に２列に
コンデンサアレイ（夫夫13枚のコンデンサから成る）
（16），（16）を取付けた場合である。尚、ヒートシン
クは、上側のモールド（22′）上に配することができ
る。Next, another embodiment of the present invention will be described with reference to FIGS. 7 and 8. In FIGS. 7 and 8, parts corresponding to those of FIGS. 5 and 6 will be described. Are denoted by the same reference numerals and redundant description will be omitted. In this embodiment, the IC chip (18) is mounted on the upper surface of the printed wiring board (23) and the capacitor array is composed of two rows on the lower surface (consisting of 13 capacitors each).
This is the case when (16) and (16) are attached. The heat sink can be arranged on the upper mold (22 ').
尚、上述の各実施例に於いて、多チヤンネルMRヘツドの
代りに、多チヤンネル電磁誘導型薄膜ヘツド等の多チヤ
ンネルヘツドを用いても良い。In each of the above embodiments, a multi-channel head such as a multi-channel electromagnetic induction type thin film head may be used instead of the multi-channel MR head.
上述せる本発明によれば、プリント配線基板に多チャン
ネル磁気ヘッド（15）に関連したICチップ（18）やコン
デンサアレイ（16）を取付けた後、多チャンネル磁気ヘ
ッド（15）を配設したモールド体（21）上にプリント配
線基板（23）を載置して多チャンネル磁気ヘッド（15）
とプリント配線基板（23）の導電層（23a）とを半田付
けした後にハウジング内に一体に収納したので、構造簡
単、製造容易な多チャンネル磁気ヘッドを備えた磁気ヘ
ッド装置を得ることが出来る。特にプリント配線基板上
に予めICチップ等の部品を取り付けたフィルムキャリア
を、予め磁気ヘッドを取付けたモールド（21）上に載置
して、フィルムキャリアを磁気ヘッドに半田付けする様
にしたので、フィルムキャリア上でICチップの接続状態
の確認が出来、且つワイヤボンデング数が従来に比べて
大幅に減少するだけでなく、組立工程が簡略化されて歩
留りが向上し、更に複雑なコンデンサアレイの保持板も
不要と成る。According to the present invention described above, a mold in which a multi-channel magnetic head (15) is arranged after mounting an IC chip (18) and a capacitor array (16) related to the multi-channel magnetic head (15) on a printed wiring board. A printed wiring board (23) is placed on the body (21) to form a multi-channel magnetic head (15).
Since the conductive layer (23a) of the printed wiring board (23) and the printed wiring board (23) are soldered and then housed integrally in the housing, a magnetic head device having a multi-channel magnetic head with a simple structure and easy manufacture can be obtained. In particular, since the film carrier on which parts such as IC chips are previously mounted on the printed wiring board is placed on the mold (21) to which the magnetic head is mounted in advance, and the film carrier is soldered to the magnetic head, Not only can the connection state of the IC chip be confirmed on the film carrier, and the number of wire bondings can be greatly reduced compared to the conventional method, but the assembly process can be simplified and yield can be improved. The holding plate is also unnecessary.
発明の効果 上述せる本発明によれば、多チヤンネル磁気ヘツドを備
えた構成簡単、製造容易な磁気ヘツド装置を得ることが
できる。又、製造が容易なことから、装置の歩留りが向
上する。EFFECTS OF THE INVENTION According to the present invention described above, it is possible to obtain a magnetic head device having a multi-channel magnetic head and having a simple structure and easy manufacturing. In addition, since the manufacturing is easy, the yield of the device is improved.
第１図及び第２図は夫々従来のMRヘツドを示す断面図及
びその一部の平面図、第３図はMRヘツドを備える従来の
磁気ヘツド装置の回路系を示す回路図、第４図は従来の
磁気ヘツド装置を示す断面図、第５図及び第６図は夫々
本発明の一実施例の断面図及びその部分の斜視図、第７
図及び第８図は夫々本発明の他の実施例の上部モールド
を除去した状態の平面図及び全体の断面図である。 （15）は磁気ヘツド、（16）はコンデンサアレイ、（1
8）はICチツプ、（19′）はヒートシンク、（23）はプ
リント基板、（21），（22′）はモールド体である。1 and 2 are a sectional view and a plan view of a part thereof showing a conventional MR head, respectively. FIG. 3 is a circuit diagram showing a circuit system of a conventional magnetic head device having an MR head, and FIG. A sectional view showing a conventional magnetic head device, FIGS. 5 and 6 are a sectional view of an embodiment of the present invention and a perspective view of a portion thereof, respectively.
FIG. 8 and FIG. 8 are a plan view and a sectional view of the whole of the other embodiment of the present invention with the upper mold removed. (15) is a magnetic head, (16) is a capacitor array, (1
8) is an IC chip, (19 ') is a heat sink, (23) is a printed circuit board, and (21) and (22') are molded bodies.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 南 俊彦 東京都品川区北品川６丁目７番35号 ソニ ー株式会社内 (72)発明者 関谷 哲夫 東京都品川区北品川６丁目７番35号 ソニ ー株式会社内 (72)発明者 内田 裕之 東京都品川区北品川６丁目７番35号 ソニ ー株式会社内 (56)参考文献 特開 昭58−50621（ＪＰ，Ａ) 実開 昭58−7221（ＪＰ，Ｕ) 実開 昭57−195625（ＪＰ，Ｕ) 特公 昭56−10682（ＪＰ，Ｂ１) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Toshihiko Minami 6-735 Kita-Shinagawa, Shinagawa-ku, Tokyo Sony Corporation (72) Inventor Tetsuo Sekiya 6-35 Kita-Shinagawa, Shinagawa-ku, Tokyo Sony Corporation (72) Inventor Hiroyuki Uchida 6-735 Kita-Shinagawa, Shinagawa-ku, Tokyo Sony Corporation (56) References JP 58-50621 (JP, A) Actual development Sho 58- 7221 (JP, U) Actually open Sho 57-195625 (JP, U) Japanese Patent Sho 56-10682 (JP, B1)
Claims (1)
ると共に、先端に磁気ヘッドが取り付けられた下モール
ド体と、 所定パターンの配線導電層及び上記磁気ヘッド用のリー
ド導電層が形成されると共にコンデンサアレイ及びICチ
ップを所定の配線導電層に接続載置して成るプリント基
板とを有し、 上記プリント基板上に載置した上記ICチップを上記下モ
ールド体に埋込んだヒートシンクに対向配置させ、上記
コンデンサアレイを上記下モールド体に形成した凹溝内
に収容させると共に上記プリント基板に設けられたリー
ド導電層に上記磁気ヘッドの端子を接続させた後に上記
プリント基板と上記磁気ヘッドの一部を上モールド体で
一体化して成ることを特徴とする磁気ヘッド装置。1. A lower mold body having a heat sink buried therein, a groove formed therein, a magnetic head attached to the tip, a wiring conductive layer having a predetermined pattern, and a lead conductive layer for the magnetic head. And a printed circuit board formed by connecting and mounting a capacitor array and an IC chip on a predetermined wiring conductive layer. The IC chip mounted on the printed circuit board faces a heat sink embedded in the lower mold body. Of the magnetic head, the capacitor array is housed in a groove formed in the lower mold body, and terminals of the magnetic head are connected to lead conductive layers provided on the printed board. A magnetic head device characterized in that a part is integrally formed by an upper mold body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58247806A JPH071528B2 (en) | 1983-12-29 | 1983-12-29 | Magnetic head device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58247806A JPH071528B2 (en) | 1983-12-29 | 1983-12-29 | Magnetic head device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60143417A JPS60143417A (en) | 1985-07-29 |
| JPH071528B2 true JPH071528B2 (en) | 1995-01-11 |
Family
ID=17168932
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58247806A Expired - Lifetime JPH071528B2 (en) | 1983-12-29 | 1983-12-29 | Magnetic head device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH071528B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62139101A (en) * | 1985-12-12 | 1987-06-22 | Mitsubishi Electric Corp | Rotating head type magnetic recording and reproducing device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6015866B2 (en) * | 1980-02-23 | 1985-04-22 | 共和真空技術株式会社 | vacuum dryer |
| JPS57195625U (en) * | 1981-06-09 | 1982-12-11 | ||
| JPS587221U (en) * | 1981-07-03 | 1983-01-18 | アルプス電気株式会社 | magnetic head |
| JPS5850621A (en) * | 1981-09-18 | 1983-03-25 | Canon Electronics Inc | Thin film magnetic head |
| JPS58224430A (en) * | 1982-06-23 | 1983-12-26 | Canon Inc | Hybrid thin film integration head |
-
1983
- 1983-12-29 JP JP58247806A patent/JPH071528B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60143417A (en) | 1985-07-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |