JPH0719853B2 - Semiconductor device - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly, to a bonding structure between a case body and a case lid which are integrated to form a case for housing electronic components.

[Conventional technology]

Conventionally, as this type of semiconductor device, a semiconductor device configured as shown in FIGS. 4 and 5 (a) and (b) is known. The semiconductor device 1 includes a case body 4 that serves as a case for accommodating electronic components 3 such as a circuit board and a power transistor, and a heat sink 5 as a case lid, which are adhered to each other via an adhesive agent 2. . Then, mounting holes 4a and 5a penetrating the integrated bonding surfaces of the case body 4 and the heat sink 5 are formed at positions corresponding to each other. A hollow cylindrical bush 6 is fitted in the hole 4a. Therefore, the completed semiconductor device 1 has the bush 6 arranged in the case body 4.
Also, a screw part (not shown) inserted through the mounting hole 5a of the heat sink 5 can be mounted on a chassis, a panel or the like constituting a required device. Reference numeral 7 in the drawing is a connecting lead terminal that penetrates a side portion of the case body 4 and projects to the outside.

[Problems to be Solved by the Invention]

In order to assemble the semiconductor device 1 having the conventional structure, the electronic component 3 is mounted on the heat sink 5 in advance by bonding or soldering, and then the heat sink 5 is pressed against the case body 4 coated with the adhesive 2 to bond it. By doing so, an integrated case is constructed. Therefore, the applied adhesive 2 will spread evenly on the bonding surfaces of the case body 4 and the heat sink 5.
A part 2a of the spread adhesive 2 will stick out from the bonding surface, and the sticking-out adhesive 2a will be inside the bush 6 and the mounting hole 5a as shown in the enlarged cross-sectional view of the main part of FIG. It will harden while flowing into. If the adhesive 2a adheres to the inner peripheral surfaces of the bush 6 and the mounting hole 5a and is hardened, it becomes difficult to insert a screw part for attaching the completed semiconductor device to a required part. .

The present invention was devised to eliminate such inconvenience, and effectively prevents the adhesive applied to bond the case body and the case lid from flowing into the mounting hole. It is an object of the present invention to provide a semiconductor device that can be manufactured.

[Means for Solving the Problems]

The present invention relates to a semiconductor device comprising a case body and a case lid which are bonded to each other to form an electronic component storage case, and mounting holes are formed in the integrated bonding surfaces of the both, respectively. A relief groove is formed in a side portion of the mounting hole formed in the case body so that the adhesive that flows out at the time of bonding can flow therein.

[Action]

According to the above configuration, when the case lid is pressed against the case body to which the adhesive has been applied, a part of the adhesive applied to the case body will stick out from the bonding surface. Will flow into the escape groove formed at the side of the mounting hole. Therefore, the protruding adhesive does not flow into the inside of the mounting holes formed in the case body and the case lid to be cured unlike the conventional example.

〔Example〕

 Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a partially cutaway perspective view showing the configuration of a semiconductor device according to the present invention, FIG. 2 (a) is an enlarged plan view of its essential part, and FIG. 2 (b) is a line bb in FIG. 2 (a). 2 is a cross-sectional view taken along line 10, and reference numeral 10 in these drawings denotes a semiconductor device. Since the basic overall structure of the semiconductor device 10 is the same as that of the conventional example, it is not shown in the fourth example in FIGS. 1 and 2A and 2B.
Parts and portions which are the same as or correspond to those in FIGS. 5A and 5B are designated by the same reference numerals, and detailed description thereof will be omitted here.

The semiconductor device 10 includes a case body 4 made of a resin such as PBT or PET, which is a case of the electronic component 3 when adhered via an adhesive 2 such as an epoxy resin, and a metal plate as a case lid. The heat sink 5 is provided. Needless to say, the case lid is not necessarily the heat sink 5 and may be a simple lid made of resin or the like.

Then, mounting holes 4a and 5a penetrating the integrated bonding surfaces of the case body 4 and the heat sink 5 are formed at positions corresponding to each other. A hollow cylindrical bush 6 made of metal is fitted into the hole 4a. In addition, in FIG. 1, these mounting holes 4a and 5a are illustrated as being formed at four places, but the present invention is not limited to this, and if they are formed at least at two places facing each other. It's good. Further, a clearance groove 11 having a predetermined size and an arc shape in plan view is formed at an inner position along a side portion of the mounting hole 4a formed in the case body 4.

By the way, in order to assemble the semiconductor device 10, the electronic component 3 is mounted on the heat sink 5 in advance by adhesion or soldering, and then the heat sink 5 is pressed and adhered to the case body 4 to which the adhesive 2 is applied. Will form an integrated case. At this time, the applied adhesive 2 spreads evenly on the bonding surfaces of the case body 4 and the heat sink 5, and the part 2a of the spread adhesive 2 is shown in the enlarged cross-sectional view of the main part of FIG. As described above, the resin enters the inside of the escape groove 11 formed on the side portion of the mounting hole 4a of the case body 4 and then hardens.

〔The invention's effect〕

As described above, according to the present invention, since the escape groove into which the adhesive can flow is formed in the side portion of the mounting hole formed in the case body that is adhered to the case lid, the adhesive is applied. When the case lid is pressed against the removed case body, a part of the adhesive that protrudes from the adhesive surface flows into the escape groove and is cured. Therefore, it is possible to effectively prevent the protruding adhesive from flowing into the inside of the mounting holes formed in the case body and the case lid as in the conventional example. Therefore, when the completed semiconductor device is attached to the required equipment, it is possible to avoid the inconvenience that it is difficult to insert the screw component into the attachment hole.

[Brief description of drawings]

1 to 3 relate to the present invention, FIG. 1 is a partially cutaway perspective view showing a structure of a semiconductor device, FIG. 2 (a) is an enlarged plan view of a main portion thereof, and FIG. 2 (b) is 2 is a sectional view taken along line bb of FIG. 2 (a), and FIG. 3 is an enlarged sectional view of an essential part showing a bonded state. 4 to 6 relate to a conventional example, and FIG. 4 is a partially cutaway perspective view showing the structure of a semiconductor device,
FIG. 5 (a) is an enlarged plan view of an essential part thereof, FIG. 5 (b) is a sectional view taken along line bb of FIG. 5 (a), and FIG. 6 is an enlarged sectional view of an essential part showing a bonded state. Is. In the figure, reference numerals 2 and 2a are adhesives, 3 is an electronic component, 4 is a case body, 4a is a mounting hole for the heat sink, 5 is a heat sink (case lid), 5a is a mounting hole for the bush, 6 is a bush, 10 is a semiconductor device, 11 is an escape groove. In addition, the same reference numerals in the drawings indicate the same or corresponding parts and portions.

Claims (1)

[Claims] 1. A semiconductor device comprising a case body and a case lid which are adhered to each other to be a case for accommodating an electronic component, and mounting holes are formed in the integrated bonding surfaces of the both, respectively. 2. The semiconductor device according to claim 1, wherein a side surface of the mounting hole formed in the case body is formed with an escape groove into which the adhesive that flows out at the time of bonding can flow.