JPH0719962B2 - Multilayer wiring board - Google Patents
Multilayer wiring boardInfo
- Publication number
- JPH0719962B2 JPH0719962B2 JP6635686A JP6635686A JPH0719962B2 JP H0719962 B2 JPH0719962 B2 JP H0719962B2 JP 6635686 A JP6635686 A JP 6635686A JP 6635686 A JP6635686 A JP 6635686A JP H0719962 B2 JPH0719962 B2 JP H0719962B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- copper foil
- wiring layer
- substrate
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 31
- 239000011347 resin Substances 0.000 claims description 31
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 20
- 239000011889 copper foil Substances 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 17
- 239000004744 fabric Substances 0.000 claims description 12
- 239000003822 epoxy resin Substances 0.000 claims description 11
- 229920000647 polyepoxide Polymers 0.000 claims description 11
- 241000531908 Aramides Species 0.000 claims description 3
- 229920003235 aromatic polyamide Polymers 0.000 claims description 3
- 239000000835 fiber Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 21
- 239000003365 glass fiber Substances 0.000 description 6
- 239000003973 paint Substances 0.000 description 6
- 238000001723 curing Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 150000008065 acid anhydrides Chemical class 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000004640 Melamine resin Substances 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- 229920006231 aramid fiber Polymers 0.000 description 2
- 150000004982 aromatic amines Chemical class 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、電子機器の回路構成に用いる多層配線板に関
するものである。TECHNICAL FIELD The present invention relates to a multilayer wiring board used for a circuit configuration of electronic equipment.
従来の技術 従来、多層配線板として、両面に銅箔で形成された配線
層を固着した基板上に、酸無水物硬化剤系エポキシ樹脂
あるいは燐酸塩硬化形メラミン樹脂からなる樹脂を印刷
し、この上に導電ペイントを所定のパターンに印刷され
たもの、あるいは、ガラス繊維布基材に酸無水物硬化エ
ポキシ樹脂を含浸させＢステージにし、この片面に銅箔
を付けＣステージにして銅箔を固着させた後、銅箔を所
定のパターンにエッチングし配線層を形成した樹脂シー
トと、銅箔を所定のパターンに形成した配線層を固着し
た基板との間に、ガラス繊維布基材に酸無水物硬化剤系
エポキシ樹脂あるいはポリイミド樹脂を含浸させたＢス
テージの予備含浸シート（プリプレグシート）を接着剤
として挟さみ、加熱加圧処理を施して一体化されたもの
がある。2. Description of the Related Art Conventionally, as a multilayer wiring board, a resin composed of an acid anhydride curing agent type epoxy resin or a phosphate curing melamine resin is printed on a substrate on which wiring layers formed of copper foil are fixed on both sides. Conductive paint printed in a predetermined pattern on the top, or glass fiber cloth base material impregnated with acid anhydride cured epoxy resin to make B stage, and copper foil is attached to one side of this to make C stage to fix copper foil After that, the copper foil is etched into a predetermined pattern to form a wiring layer between the resin sheet and the substrate on which the wiring layer having the copper foil formed in a predetermined pattern is fixed, and the glass fiber cloth base material is acid-anhydrous. In some cases, a B-stage pre-impregnated sheet (prepreg sheet) impregnated with a hardener epoxy resin or a polyimide resin is sandwiched as an adhesive and subjected to heat and pressure treatment to be integrated. .
発明が解決しようとする問題点 前者の多層配線板では、表層部の配線層が導電ペイント
で形成されているため電子部品をはんだ付けできない不
都合、あるいは、酸無水物硬化剤系エポキシ樹脂あるい
は燐酸塩硬化形メラミン樹脂からなる印刷用の樹脂は、
印刷によるピンホールや不純物の含有量の関係で耐電圧
特性が劣化する不都合があった。Problems to be Solved by the Invention In the former multilayer wiring board, the wiring layer of the surface layer is formed of conductive paint, so that electronic parts cannot be soldered, or an acid anhydride curing agent epoxy resin or phosphate is used. Resin for printing consisting of curable melamine resin,
There is a disadvantage that the withstand voltage characteristics are deteriorated due to the content of pinholes and impurities due to printing.
また、後者の多層配線板では、表層部の配線が銅箔で形
成でき電子部品をはんだ付けできるものの、ガラス繊維
布に樹脂を含浸した樹脂板がＢステージの状態で銅箔に
所定のパターンのエッチングを施すならば、Ｂステージ
の樹脂板がエッチング液にさらされ耐久性がなくなる欠
点があるため、樹脂板をＣステージにして銅箔を固着さ
せなければならない。したがって、樹脂含浸シートと基
板を接着するのに別個Ｂステージの予備含浸シートを接
着剤として用意しなければならない複雑な構造となる。
また、樹脂はガラス繊維布と相溶性がないためミーズリ
ングを起こす原因となっていた。Also, in the latter multilayer wiring board, the wiring of the surface layer portion can be formed of copper foil and electronic components can be soldered, but the resin board impregnated with glass fiber cloth resin has a predetermined pattern on the copper foil in the B stage state. If etching is performed, the resin plate of the B stage is exposed to the etching solution and loses its durability. Therefore, it is necessary to fix the copper foil to the C plate of the resin plate. Therefore, in order to bond the resin-impregnated sheet and the substrate, a separate B-stage pre-impregnated sheet must be prepared as an adhesive, which is a complicated structure.
Further, the resin is not compatible with the glass fiber cloth, which causes measling.
問題点を解決するための手段 本発明は、１層目の銅箔配線層が両面に形成された樹脂
基板の両面に、２層目の銅箔配線層が形成された樹脂板
を重ね合わせて、加圧加熱処理により接着された多層配
線板であって、前記樹脂板が、エポキシ樹脂が含浸され
たアーラミド繊維布からなることを特徴とするものであ
る。Means for Solving the Problems The present invention relates to a resin substrate having a first copper foil wiring layer formed on both sides thereof and a resin plate having a second copper foil wiring layer formed thereon, which is superposed on both sides of the resin substrate. A multilayer wiring board adhered by pressure and heat treatment, wherein the resin plate is made of an aramide fiber cloth impregnated with an epoxy resin.
作用 本発明の多層配線板は、アーラミド繊維布に芳香族アミ
ン硬化剤添加のエポキシ樹脂を含浸した樹脂板を使用す
るためＣステージ後の接着にすぐれＣステージの状態で
基板に接着することができる。このため、樹脂板と基板
とを接着するのに両者の間に接着剤を必要としない。Effect The multilayer wiring board of the present invention uses a resin plate in which an aramid fiber cloth is impregnated with an epoxy resin containing an aromatic amine curing agent, and therefore has excellent adhesion after the C stage and can be adhered to the substrate in the C stage state. . Therefore, no adhesive is required between the resin plate and the substrate to bond them.
実施例 本発明の多層配線板は、第５図に示す構造を特徴とし、
第１図〜第５図にその製造方法を示す。以下、第１図〜
第５図に示す工程断面図を参照して説明する。EXAMPLE A multilayer wiring board of the present invention is characterized by the structure shown in FIG.
1 to 5 show the manufacturing method thereof. Below, FIG.
This will be described with reference to the process sectional view shown in FIG.
まず、紙基材フェノール樹脂積層板、紙基材エポキシ樹
脂積層板、ガラス布基材エポキシ樹脂積層板あるいはガ
ラス布基材ポリイミド樹脂積層板等のいずれかでできた
基板１の両面に銅箔を固着し、銅箔を所定のパターンに
エッチングして上面配線層２と下面配線層３を形成する
［第１図］。次に、厚さが0.05〜0.2mmのアーラミド繊
維布に芳香族アミン硬化剤を添加したエポキシ樹脂を含
浸し、Ｂステージの状態にした樹脂板４の片面に銅箔を
付け樹脂を熱硬化させてＣステージにし、樹脂板４に銅
箔を固着する。この銅箔を所定のパターンにエッチング
して配線層５を形成する。このときスルーホールを形成
する領域の銅箔もエッチング除去して開口６を設ける
［第２図］。First, a copper foil is provided on both sides of a substrate 1 made of a paper-based phenol resin laminate, a paper-based epoxy resin laminate, a glass cloth-based epoxy resin laminate, a glass cloth-based polyimide resin laminate, or the like. After being fixed, the copper foil is etched into a predetermined pattern to form the upper surface wiring layer 2 and the lower surface wiring layer 3 [FIG. 1]. Next, an aramid fiber cloth having a thickness of 0.05 to 0.2 mm is impregnated with an epoxy resin containing an aromatic amine curing agent, and a copper foil is attached to one surface of the resin plate 4 in the B stage to heat cure the resin. C stage to fix the copper foil to the resin plate 4. This copper foil is etched into a predetermined pattern to form the wiring layer 5. At this time, the copper foil in the region where the through hole is formed is also removed by etching to form the opening 6 [FIG. 2].
次に、上記の樹脂板４を２枚用意し、基板１面に対して
樹脂板４の配線層５を外側に向けて基板１の両面より樹
脂板４を重ね合わせ、20〜50kg/cm2の圧力と150〜170℃
の温度で30〜60分間にわたり加圧加熱処理を行い基板１
と樹脂板４を接着し一体化する［第３図］。Next, prepare two of the above resin plates 4, and stack the resin plates 4 on both sides of the substrate 1 with the wiring layer 5 of the resin plate 4 facing outward on the surface of the substrate 1, and 20 to 50 kg / cm 2 Pressure and 150 ~ 170 ℃
Substrate 1 is heated at a temperature of 30 to 60 minutes under pressure.
And the resin plate 4 are bonded and integrated [FIG. 3].
次に、樹脂板４の表面に形成された配線層５中のスルー
ホール用の開口６よりレーザ加工を施し、樹脂板４を貫
通した開口７を設け、基板１の上面配線層２と下面配線
層３を露出させる［第４図］。この開口７に銀粉−樹脂
系の導電ペイントを印刷して開口７に導電ペイント８を
充填し、145℃の温度で30分間の加熱処理により導電ペ
イント８を硬化させる。Next, laser processing is performed from the through hole opening 6 in the wiring layer 5 formed on the surface of the resin plate 4 to form an opening 7 penetrating the resin plate 4, and the upper surface wiring layer 2 and the lower surface wiring of the substrate 1 are provided. Expose layer 3 [Fig. 4]. A conductive paint of silver powder-resin system is printed on the opening 7, the conductive paint 8 is filled in the opening 7, and the conductive paint 8 is cured by heat treatment at a temperature of 145 ° C. for 30 minutes.
このようにして、基板１の１層目の配線層２、３と樹脂
板の２層目の配線層５とが基板の両面に形成された多層
配線層が形成される［第５図］。In this way, a multilayer wiring layer is formed in which the first wiring layers 2 and 3 of the substrate 1 and the second wiring layer 5 of the resin plate are formed on both sides of the substrate [FIG. 5].
発明の効果 本発明の多層配線板は、２層目に位置する配線層が銅箔
で形成することができるため電子部品をはんだ付けで強
固に固定することができる。EFFECTS OF THE INVENTION In the multilayer wiring board of the present invention, since the wiring layer located in the second layer can be formed of copper foil, electronic components can be firmly fixed by soldering.
また、基板と樹脂板を接着するにあたり、Ｃステージの
樹脂板を用いることができ、接着剤が不要で構造が簡素
化される効果が奏される。Further, in adhering the substrate and the resin plate, the resin plate of the C stage can be used, and the effect that the structure is simplified without the need for an adhesive agent.
さらに、アーラミド繊維布は、ガラス繊維布より安価で
あるため経済性の面で富み、かつ、エポキシ樹脂に対し
て相溶性があるため接着性、耐電圧特性に優れている。Further, the aramide fiber cloth is cheaper than the glass fiber cloth, and is therefore economically advantageous, and because it is compatible with the epoxy resin, it has excellent adhesiveness and withstand voltage characteristics.
また、レーザで開口部を形成するとき炭化やガラス繊維
の残存もなく加工性にも優れている。Moreover, when forming the opening with a laser, there is no carbonization or glass fiber remaining, and the workability is excellent.
第１図〜第５図は本発明の多層配線板を製造する方法を
示す工程断面図である。 １……基板、２……上面配線層、３……下面配線層、４
……樹脂板、５……配線層、6,7……開口、８……導電
ペイント。1 to 5 are process cross-sectional views showing a method for manufacturing a multilayer wiring board according to the present invention. 1 ... Substrate, 2 ... Top wiring layer, 3 ... Bottom wiring layer, 4
…… Resin plate, 5 …… Wiring layer, 6,7 …… Opening, 8 …… Conductive paint.
Claims (1)
脂基板の両面に、２層目の銅箔配線層が形成された樹脂
板を前記各銅箔配線層が外側になるように重ね合わせ
て、加圧加熱処理により接着された多層配線板であっ
て、前記樹脂板が、エポキシ樹脂が含浸されたアーラミ
ド繊維布からなることを特徴とする多層配線板。1. A resin board having a second copper foil wiring layer formed on both sides of a resin substrate having a first copper foil wiring layer formed on both sides, and each copper foil wiring layer being on the outside. A multilayer wiring board which is laminated and adhered by pressure and heat treatment as described above, wherein the resin plate is made of an aramide fiber cloth impregnated with an epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6635686A JPH0719962B2 (en) | 1986-03-25 | 1986-03-25 | Multilayer wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6635686A JPH0719962B2 (en) | 1986-03-25 | 1986-03-25 | Multilayer wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62222697A JPS62222697A (en) | 1987-09-30 |
| JPH0719962B2 true JPH0719962B2 (en) | 1995-03-06 |
Family
ID=13313488
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6635686A Expired - Lifetime JPH0719962B2 (en) | 1986-03-25 | 1986-03-25 | Multilayer wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0719962B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0834348B2 (en) * | 1990-01-24 | 1996-03-29 | 新神戸電機株式会社 | Manufacturing method of multilayer printed wiring board |
-
1986
- 1986-03-25 JP JP6635686A patent/JPH0719962B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62222697A (en) | 1987-09-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |