JPH0722221B2 - Method for manufacturing ceramic circuit board - Google Patents
Method for manufacturing ceramic circuit boardInfo
- Publication number
- JPH0722221B2 JPH0722221B2 JP61227035A JP22703586A JPH0722221B2 JP H0722221 B2 JPH0722221 B2 JP H0722221B2 JP 61227035 A JP61227035 A JP 61227035A JP 22703586 A JP22703586 A JP 22703586A JP H0722221 B2 JPH0722221 B2 JP H0722221B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- brazing material
- circuit board
- manufacturing
- ceramic circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は、セラミックス回路基板の製造方法の改良に関
する。The present invention relates to an improvement in a method for manufacturing a ceramic circuit board.
（従来の技術とその問題点） 従来、セラミックス回路基板を製造するには、第３図に
示す如くAl2O3基板１に、無電界銅めっき等により回路
２を形成して、セラミックス回路基板３を得ていた。(Prior Art and Its Problems) Conventionally, in order to manufacture a ceramic circuit board, a circuit 2 is formed on an Al 2 O 3 substrate 1 by electroless copper plating as shown in FIG. I was getting 3.
然ら乍ら、この方法ではめっきの密着不良、ふくれ等が
生じ、信頼性のある回路２が得にくいという問題があっ
た。However, this method has a problem that adhesion failure of plating, swelling, etc. occur and it is difficult to obtain a reliable circuit 2.
そこで本発明は、セラミックス基板との密着不良、ふく
れ等の無い回路を有するセラミックス回路基板を製造す
ることのできる方法を提供しようとするものである。Therefore, the present invention is intended to provide a method capable of manufacturing a ceramics circuit board having a circuit free from poor adhesion to the ceramics board and swelling.
（問題点を解決するための手段） 上記問題点を解決するための本発明のセラミックス回路
基板の製造方法は、Al2O3系セラミックス基板に、Ti、Z
r又はHfのいずれかの活性金属を含むAgCu系ペーストろ
う材をスクリーン印刷してパターンを形成し、次に加熱
してろう材を溶融接着させ、回路形成することを特徴と
するものである。(Means for Solving Problems) A method for manufacturing a ceramics circuit board according to the present invention for solving the above problems is an Al 2 O 3 -based ceramics substrate containing Ti, Z
An AgCu-based paste brazing material containing an active metal of either r or Hf is screen-printed to form a pattern, and then heated to melt-bond the brazing material to form a circuit.
また本発明のセラミックス回路基板上の製造方法は、Al
2O3系セラミックス基板に、Ti、Zr又はHfのいずれかの
活性金属を含むAgCu系ペーストろう材をスクリーン印刷
してパターンを形成し、次に加熱してろう材を溶融接着
させ、回路を形成し、以後絶縁体を印刷、焼成し、その
上に前記と同じAgCu系ペーストろう材をスクリーン印刷
してパターンを形成し加熱してろう材を溶融接着させ、
回路を形成することを少なくとも１回行って複層の回路
を形成することを特徴とするものである。In addition, the manufacturing method on the ceramic circuit board of the present invention is
The 2 O 3 based ceramic substrate, Ti, and screen printing the AgCu based paste brazing material containing either of the active metal of Zr or Hf to form a pattern, the brazing material is melted adhesive and then heated, the circuit After forming, printing and firing the insulator, screen printing the same AgCu-based paste brazing material as above on it to form a pattern and heat to fuse and bond the brazing material,
It is characterized in that a circuit is formed at least once to form a multilayer circuit.
（作用） 上記のように本発明のセラミックス回路基板の製造方法
は、活性金属を含むAgCuペーストろう材でパターンを形
成し、加熱して溶融接着し、回路を形成するので、ろう
材はセラミックス基板に対して良く濡れた状態となり、
しかもろう材は耐熱強度があるので、加熱溶融時セラミ
ックス基板との熱膨張差の充分対応できて、接着面にク
ラックが入ることが無い。従って、長期間使用しても回
路がふくれて剥離することが無く、接着強度が極めて高
いものである。(Operation) As described above, in the method for manufacturing a ceramics circuit board of the present invention, a pattern is formed by using an AgCu paste brazing material containing an active metal, and heating and melting and bonding are performed to form a circuit. It gets wet well against
In addition, since the brazing material has heat resistance strength, the difference in thermal expansion between the brazing material and the ceramic substrate during heating and melting can be sufficiently dealt with, and cracks do not occur on the bonding surface. Therefore, the circuit does not swell and peel off even after long-term use, and the adhesive strength is extremely high.
（実施例） 本発明のセラミックス回路基板の製造方法の一実施例を
第１図によって説明すると、厚さ4mmの93％Al2O3基板１
上に、Ag−Cu28wt％−Ti2wt％より成るペースト状ろう
材を厚さ0.03mmにスクリーン印刷してパターン形成し、
次に830℃で加熱してろう材を基板１上に溶融接着さ
せ、回路２′を形成して、セラミックス回路基板３′を
得た。(Example) An example of a method for manufacturing a ceramics circuit board according to the present invention will be described with reference to FIG. 1. A 93% Al 2 O 3 substrate 1 having a thickness of 4 mm
On top, a paste-like brazing material composed of Ag-Cu 28 wt% -Ti2 wt% is screen-printed to a thickness of 0.03 mm to form a pattern,
Next, the brazing material is melted and adhered onto the substrate 1 by heating at 830 ° C. to form a circuit 2 ', and a ceramic circuit substrate 3'is obtained.
次に他の実施例を第２図によって説明すると、厚さ4.5m
mの93％Al2O3基板１上に、Ag−Cu28wt％−Zr2wt％より
成るペースト状ろう材を厚さ0.03mmにスクリーン印刷し
てパターン形成し、次に880℃で加熱してろう材を基板
１上に溶融接着させ、回路２′を形成して、次いで絶縁
体を厚さ0.1mmにスクリーン印刷し、次いで600℃で焼成
して絶縁層４を形成し、次にその上にAg−Cu28wt％−Ti
2wt％より成るペースト状ろう材を厚さ0.035mmにスクリ
ーン印刷してパターン形成し、次いで830℃で加熱して
ろう材を絶縁層４に溶着接着させ且つ前記回路２′に接
続して回路５を形成して、２層の回路を有するセラミッ
クス回路基板３″を得た。Next, another embodiment will be described with reference to FIG.
On a 93% Al 2 O 3 substrate 1 of m, a paste-like brazing material composed of Ag-Cu 28wt% -Zr 2wt% is screen-printed to a thickness of 0.03mm to form a pattern, and then heated at 880 ° C to perform brazing. Is melt-bonded onto the substrate 1 to form a circuit 2 ', then the insulator is screen-printed to a thickness of 0.1 mm, and then baked at 600 ° C to form an insulating layer 4, and then Ag is formed thereon. -Cu28wt% -Ti
A paste-like brazing material consisting of 2 wt% is screen-printed to a thickness of 0.035 mm to form a pattern, and then heated at 830 ° C. so that the brazing material is welded and adhered to the insulating layer 4 and connected to the circuit 2'and the circuit 5 is formed. Was formed to obtain a ceramic circuit board 3 ″ having a two-layer circuit.
こうして作られた実施例１、２のセラミックス回路基板
３′、３″と、従来例のセラミックス回路基板３とを各
１万個について品質検査し、且つセラミックス基板１上
に対する回路２、２の密着強度を測定した処、下記の表
に示すような結果を得た。The quality of each of the ceramic circuit boards 3'and 3 "of Examples 1 and 2 thus produced and the ceramic circuit board 3 of the conventional example is inspected, and the circuits 2 and 2 are closely attached to the ceramic board 1. When the strength was measured, the results shown in the table below were obtained.
上記の表で明らかなように実施例１、２のセラミックス
回路基板は、従来例のセラミックス回路基板に比し回路
のふくれが桁違いに少ないことが判る。また実施例１、
２のセラミックス回路基板は従来例のセラミックス回路
基板に比し、回路の密着強度が著しく安定していること
が判る。 As can be seen from the above table, the ceramic circuit boards of Examples 1 and 2 have orders of magnitude less swelling of the circuit than the conventional ceramic circuit boards. Example 1,
It can be seen that the ceramic circuit board of No. 2 has significantly more stable circuit adhesion strength than the conventional ceramic circuit board.
尚、第２図に示す実施例のセラミックス回路基板は、２
層に回路を形成した場合でもあるが、３層以上何層でも
良いものである。The ceramic circuit board of the embodiment shown in FIG.
Although the circuit may be formed in layers, the number of layers may be three or more.
（発明の効果） 以上詳記した通り本発明のセラミックス回路基板の製造
方法によれば、セラミックス基板に対する回路の密着強
度が著しく安定していて、しかも回路のふくれが極めて
少ないセラミックス回路基板を容易に得ることができ
る。(Effects of the Invention) As described above in detail, according to the method for manufacturing a ceramics circuit board of the present invention, the adhesion strength of the circuit to the ceramics board is remarkably stable, and the circuitization of the circuit is extremely small. Obtainable.
第１図は本発明のセラミックス回路基板の製造方法の一
実施例を示す図、第２図は本発明のセラミックス回路基
板の製造方法の他の実施例を示す図、第３図は従来のセ
ラミックス回路基板の製造方法を示す図である。FIG. 1 is a diagram showing an embodiment of a method for manufacturing a ceramic circuit board of the present invention, FIG. 2 is a diagram showing another embodiment of a method of manufacturing a ceramic circuit board of the present invention, and FIG. 3 is a conventional ceramics. It is a figure which shows the manufacturing method of a circuit board.
Claims (2)
fのいずれかの活性金属を含むAgCu系ペーストろう材を
スクリーン印刷してパターンを形成し、次に加熱してろ
う材を溶融接着させ、回路を形成することを特徴とする
セラミックス回路基板の製造方法。1. An Al 2 O 3 -based ceramic substrate, Ti, Zr or H
Manufacturing of a ceramic circuit board characterized by screen-printing an AgCu-based paste brazing material containing any of the active metals of f to form a pattern, and then heating to melt-bond the brazing material to form a circuit. Method.
fのいずれかの活性金属を含むAgCu系ペーストろう材を
スクリーン印刷してパターンを形成し、次に加熱してろ
う材を溶融接着させ、回路を形成し、以後絶縁体を印
刷、焼成し、その上に前記と同じAgCu系ペーストろう材
をスクリーン印刷してパターンを形成し加熱してろう材
を溶融接着させ、回路を形成することを少なくとも１回
行って複層の回路を形成することを特徴とするセラミッ
クス回路基板の製造方法。2. An Al 2 O 3 -based ceramic substrate with Ti, Zr or H
The AgCu-based paste brazing material containing any of the active metals of f is screen-printed to form a pattern, then heated to melt-bond the brazing material to form a circuit, after which an insulator is printed and fired, The same AgCu-based paste brazing material as described above is screen-printed on it to form a pattern, which is then heated to melt and bond the brazing material and form a circuit at least once to form a multi-layer circuit. A method for manufacturing a characteristic ceramics circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61227035A JPH0722221B2 (en) | 1986-09-25 | 1986-09-25 | Method for manufacturing ceramic circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61227035A JPH0722221B2 (en) | 1986-09-25 | 1986-09-25 | Method for manufacturing ceramic circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6381894A JPS6381894A (en) | 1988-04-12 |
| JPH0722221B2 true JPH0722221B2 (en) | 1995-03-08 |
Family
ID=16854505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61227035A Expired - Lifetime JPH0722221B2 (en) | 1986-09-25 | 1986-09-25 | Method for manufacturing ceramic circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0722221B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2765000B2 (en) * | 1989-02-14 | 1998-06-11 | 株式会社ワールドメタル | Ceramic wiring board |
| JP3223199B2 (en) * | 1991-10-25 | 2001-10-29 | ティーディーケイ株式会社 | Method of manufacturing multilayer ceramic component and multilayer ceramic component |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5453267A (en) * | 1977-10-05 | 1979-04-26 | Hitachi Ltd | Method of manufacturing thick film multilayer wiring board |
| JPS6011479A (en) * | 1983-06-30 | 1985-01-21 | Showa Denko Kk | Thiazolylcarbamate compound and agricultural and horticultural fungicide |
| JPS6185705A (en) * | 1984-10-04 | 1986-05-01 | 昭和電工株式会社 | Conductive paste |
-
1986
- 1986-09-25 JP JP61227035A patent/JPH0722221B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6381894A (en) | 1988-04-12 |
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