JPH072269B2 - Solder dip processing device - Google Patents
Solder dip processing deviceInfo
- Publication number
- JPH072269B2 JPH072269B2 JP11846890A JP11846890A JPH072269B2 JP H072269 B2 JPH072269 B2 JP H072269B2 JP 11846890 A JP11846890 A JP 11846890A JP 11846890 A JP11846890 A JP 11846890A JP H072269 B2 JPH072269 B2 JP H072269B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- hole
- horizontal groove
- molten solder
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 title claims description 52
- 239000007788 liquid Substances 0.000 claims description 26
- 239000011248 coating agent Substances 0.000 claims description 14
- 238000000576 coating method Methods 0.000 claims description 14
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000006023 eutectic alloy Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 239000002341 toxic gas Substances 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Molten Solder (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、多数の電子部品を搭載したリードフレームに
半田被膜を選択的に形成するための半田ディプ処理装置
に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder dip processing device for selectively forming a solder coating on a lead frame on which a large number of electronic components are mounted.
従来の技術 多数の電子部品を搭載したリードフレームに半田被膜を
形成することが一般に行われており、前記半田被膜は通
常、ディプ（浸漬）処理により形成される。2. Description of the Related Art A solder coating is generally formed on a lead frame on which a large number of electronic components are mounted, and the solder coating is usually formed by a dip (immersion) process.
液槽内の溶融半田は常にヒータで加熱されており、半田
浴のためにキャリヤ等で液槽上に送り込まれた電子部品
は、リードフレームのリード領域を下側にして下降し溶
融半田に接触する。また、前記接触を良好ならしめると
ともに溶融半田の表面酸化を軽減させるために、液槽内
の溶融半田を噴流させることも行われている。The molten solder in the liquid tank is always heated by the heater, and the electronic parts sent to the liquid tank by the carrier etc. for the solder bath descend with the lead area of the lead frame facing down and come into contact with the molten solder. To do. Further, in order to improve the contact and reduce the surface oxidation of the molten solder, the molten solder in the liquid tank is jetted.
発明が解決しようとする課題 しかし、かかる従来の装置を用いてリードフレームに半
田被膜を形成すると、半田被膜を必要とするリード領域
のみならずフレーム領域にまで半田被膜が形成されてし
まい、それだけ半田を浪費するばかりでなく有害ガスの
発生量も多くなる。そのうえ、リードフレームから析出
した不純物が液槽内の溶融半田に混入し、その累積によ
って溶融半田の組成が経時変化するという課題もあっ
た。However, when a solder coating is formed on a lead frame by using such a conventional device, the solder coating is formed not only on the lead region that requires the solder coating but also on the frame region, and that much solder is used. Not only is this wasteful, but the amount of toxic gas generated also increases. In addition, there is also a problem that impurities precipitated from the lead frame are mixed in the molten solder in the liquid tank, and the composition of the molten solder changes with time due to the accumulation.
そこで本発明者らは、垂直溝およびその上部に連なる水
平溝を有する半田濡れのよいブロックを溶融半田ととも
に液槽内に設け、垂直溝を通じて水平溝内に導入される
溶融半田にリードフレームのリード領域を接触させる半
田ディプ処理装置を開発し提案してきた。この場合、水
平溝内にリードフレームのリード領域のみを通過させる
ことによって、同領域にのみ半田被膜を形成することが
できる。Therefore, the present inventors provided a block with good solder wettability having a vertical groove and a horizontal groove connected to the upper part thereof in a liquid tank together with the molten solder, and lead the lead frame to the molten solder introduced into the horizontal groove through the vertical groove. We have developed and proposed a solder dip processing device that contacts areas. In this case, by passing only the lead region of the lead frame into the horizontal groove, the solder coating can be formed only on the same region.
リードフレームのリード領域は、リードフレームの長手
方向に間欠的に配列されているので、垂直溝上をリード
領域が通過し終わる都度、垂直溝を通じて水平溝内に溶
融半田が補填されていく。このため、リード領域の上下
両面に半田被膜を同時に形成することができる。また、
垂直溝を通じて上昇した溶融半田は逆流しないので、液
槽内溶融半田の純度を常に高く維持することができる。Since the lead regions of the lead frame are arranged intermittently in the longitudinal direction of the lead frame, the molten solder is filled in the horizontal grooves through the vertical grooves each time the lead regions finish passing over the vertical grooves. Therefore, the solder coating can be simultaneously formed on the upper and lower surfaces of the lead region. Also,
Since the molten solder that has risen through the vertical groove does not flow backward, the purity of the molten solder in the liquid tank can always be kept high.
しかし、リード領域の板厚や幅が比較的大きい品種に対
しては、水平溝内に導入された溶融半田がリード領域の
上面側に十分にまわり込まず、形成された半田被膜に厚
みむらを生じるという新たな課題があった。However, for products with a relatively large thickness or width of the lead area, the molten solder introduced into the horizontal groove does not sufficiently wrap around to the upper surface of the lead area, causing uneven thickness in the formed solder coating. There was a new issue that would arise.
課題を解決するための手段 本発明によると、多数の電子部品を搭載したリードフレ
ームのリード領域に半田被膜を形成すべく溶融半田とと
もに液槽内に設けられるブロックに、前記リード領域を
通過させるための水平溝を前記溶融半田の液面よりも高
い水平面内に有せしめるとともに、前記水平溝に連通し
て下方へ延び前記液面下に達する偏平な第１の通孔と、
前記水平溝に連通して上方へ若干延びたのち前記第１の
通孔を迂回して下方へ延び前記液面下に達する偏平な第
２の通孔とを有せしめる。Means for Solving the Problems According to the present invention, in order to pass the lead region to a block provided in a liquid tank together with molten solder to form a solder coating on the lead region of a lead frame on which a large number of electronic components are mounted, The horizontal groove of which is in a horizontal plane higher than the liquid surface of the molten solder, and a flat first through hole which communicates with the horizontal groove and extends downward to reach below the liquid surface,
A flat second through hole that communicates with the horizontal groove and extends slightly upward and then bypasses the first through hole and extends downward to reach below the liquid surface is provided.
作用 このように構成すると、液槽内の溶融半田はその表面張
力によって第１の通孔を通じ水平溝内に導入されるとと
もに、第２の通孔を通じても水平溝内に導入されること
になる。すなわち、水平溝内を通過するリード領域は上
下両方向から溶融半田の支給を受けることになり、各リ
ード領域の両面に半田被膜を厚みむらなく形成すること
ができ、しかも、処理能率を一段と高めることができ
る。また、第１および第２の通孔は溶融半田の液面下か
ら露出することなく上方へ延びるので、液面に浮遊する
酸化膜を混入させることなく液槽内の溶融半田を水平溝
内に導入させ得て、通孔内での半田詰まりを軽減させる
ことができる。Operation With this structure, the molten solder in the liquid tank is introduced into the horizontal groove through the first through hole due to its surface tension, and is also introduced into the horizontal groove through the second through hole. . That is, the lead region passing through the horizontal groove receives the supply of the molten solder from both the upper and lower directions, so that the solder coating can be formed on both sides of each lead region without the thickness unevenness, and the processing efficiency can be further improved. You can Further, since the first and second through holes extend upward from below the liquid surface of the molten solder without being exposed, the molten solder in the liquid tank can be placed in the horizontal groove without mixing an oxide film floating on the liquid surface. It can be introduced and solder clogging in the through hole can be reduced.
実施例 つぎに、本発明を図面に示した実施例とともに詳しく説
明する。EXAMPLES Next, the present invention will be described in detail with reference to the examples shown in the drawings.
第１図の示すように、溶融半田１を収容した液槽２内に
は、シーズヒータ３およびブロック４が設けられてお
り、ブロック４は鉛および亜鉛の共晶合金からなる溶融
半田１に対して濡れのよい鉄またはニッケル等の金属で
形成されている。第２図にも示すように、ブロック４は
第１垂直面５に第１および第２の通孔6,7を有し、上部
には水平溝８およびこれに隣接した貫通孔９を有してい
て、被処理電子部品Ａの本体部分ａが貫通孔９内を、そ
して、リードフレームｂのリード領域ｃが水平溝８内を
それぞれ通過する。ｄはフレーム領域を示す。As shown in FIG. 1, a sheathed heater 3 and a block 4 are provided in a liquid tank 2 containing the molten solder 1, and the block 4 is provided with respect to the molten solder 1 made of a eutectic alloy of lead and zinc. It is formed of a metal such as iron or nickel which has good wettability. As shown in FIG. 2, the block 4 has the first and second through holes 6 and 7 on the first vertical surface 5, and the horizontal groove 8 and the through hole 9 adjacent to the horizontal groove 8 at the upper portion. The main body portion a of the electronic component A to be processed passes through the through hole 9, and the lead region c of the lead frame b passes through the horizontal groove 8. d indicates a frame area.
水平溝８は溶融半田１の液面よりも高い水平面内に位置
し、貫通孔９もその大部分が前記液面よりも高い位置に
ある。第１の通孔６は水平溝８に連通して下方へ延び、
溶融半田１の液面下に達する偏平なものである。また、
第２の通孔７は水平溝８に連通して上方へ若干延びたの
ち第１の通孔６および貫通孔９を迂回して下方へ延び、
溶融半田１の液面下に達する偏平なもので、数字７に似
た平面形状を有している。The horizontal groove 8 is located in a horizontal plane higher than the liquid level of the molten solder 1, and most of the through holes 9 are also higher than the liquid level. The first through hole 6 communicates with the horizontal groove 8 and extends downward,
It is a flat one reaching below the liquid surface of the molten solder 1. Also,
The second through hole 7 communicates with the horizontal groove 8 and extends slightly upward, and then bypasses the first through hole 6 and the through hole 9 and extends downward.
It is a flat one reaching below the liquid surface of the molten solder 1, and has a planar shape similar to numeral 7.
第２垂直面10にも、第１垂直面５におけると同様の第１
および第２の通孔11,12が形成されている。また、第３
垂直面13にも前述と同様の第１および第２の通孔14,15
が形成されている。かかる通孔および水平溝８は、第２
図に示すようにブロック４を６つのブロック片16,17,1
8,19,20,21およびこれらを一体に結合する適数本のボル
トで構成することにより、比較的容易に得ることができ
る。また、蓋板としてのブロック片21をとり外して第１
および第２の通孔内や貫通孔内を清掃することができ
る。The second vertical plane 10 has the same first surface as that of the first vertical plane 5.
And the 2nd through-holes 11 and 12 are formed. Also, the third
The vertical surface 13 also has the same first and second through holes 14 and 15 as described above.
Are formed. The through hole and the horizontal groove 8 are the second
As shown in the figure, block 4 is divided into six block pieces 16,17,1
It can be relatively easily obtained by configuring the device with 8,19,20,21 and an appropriate number of bolts that connect these together. Also, the block piece 21 as the lid plate is removed to remove the first
Also, the inside of the second through hole and the inside of the through hole can be cleaned.
前述の実施例では、第１および第２の通孔を第１ないし
第３垂直面に設けて３連構成となしたが、この連数は任
意に選択できる。また、被処理電子部品Ａの本体部分ａ
の通過路を水平溝８の外側に設定してもよく、この場合
は貫通孔９を要しない。In the above-described embodiment, the first and second through holes are provided in the first to third vertical surfaces to form a triple structure, but the number of the continuous holes can be arbitrarily selected. In addition, the main body portion a of the electronic component A to be processed
The passage may be set outside the horizontal groove 8. In this case, the through hole 9 is not required.
発明の効果 以上のように本発明によると、リードフレームの板厚や
形状に関係なく、同フレームのリード領域の全面に半田
被膜を厚みむらなく形成できるのみならず処理能率を高
め得、しかも、液槽内溶融半田の純度を常に高く維持す
ることができる。また、液面に浮遊する酸化膜を混入さ
せることなく溶融半田を水平溝内に導入できるので、良
質の半田被膜を形成できるのみならず、通孔内での半田
詰まりを軽減させることができる。As described above, according to the present invention, regardless of the thickness and shape of the lead frame, not only the solder coating can be uniformly formed on the entire lead region of the frame but also the processing efficiency can be improved, and The purity of the molten solder in the liquid tank can always be kept high. Further, since the molten solder can be introduced into the horizontal groove without mixing the oxide film floating on the liquid surface, not only a good quality solder coating can be formed, but also the clogging of the solder in the through hole can be reduced.
第１図は本発明を実施した半田ディプ処理装置の要部の
斜視図、第２図は同装置のブロックの分解斜視図であ
る。 １……溶融半田、２……液槽、４……ブロック、6,11…
…第１の通孔、7,12……第２の通孔、８……水平溝、９
……貫通孔。FIG. 1 is a perspective view of a main part of a solder dip processing apparatus according to the present invention, and FIG. 2 is an exploded perspective view of a block of the apparatus. 1 ... Molten solder, 2 ... Liquid tank, 4 ... Block, 6,11 ...
… First through hole, 7,12 …… Second through hole, 8 …… Horizontal groove, 9
…… Through hole.
Claims (2)
のリード領域に半田被膜を形成すべく溶融半田とともに
液槽内に設けられたブロックが、前記リード領域を通過
させるための水平溝を前記溶融半田の液面よりも高い水
平面内に有するとともに、前記水平溝に連通して下方へ
延び前記液面下に達する偏平な第１の通孔と、前記水平
溝に連通して上方へ若干延びたのち前記第１の通孔を迂
回して下方へ延び前記液面下に達する偏平な第２の通孔
とを有していることを特徴とする半田ディプ処理装置。1. A block provided in a liquid tank together with molten solder for forming a solder coating on a lead region of a lead frame on which a large number of electronic components are mounted has a horizontal groove for passing the lead region. A flat first through hole, which is located in a horizontal plane higher than the liquid surface of the solder, communicates with the horizontal groove and extends downward to reach below the liquid surface, and communicates with the horizontal groove and extends slightly upward. And a flat second through hole that extends downward to bypass the first through hole and reaches below the liquid surface.
内に位置し、前記ブロックが水平および垂直方向へそれ
ぞれ分離可能に複数のブロック片で組み立てられている
ことを特徴とする請求項１記載の半田ディプ処理装置。2. The first and second through holes are located in a common vertical plane, and the blocks are assembled by a plurality of block pieces that are separable in the horizontal and vertical directions, respectively. The solder dip processing device according to claim 1.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11846890A JPH072269B2 (en) | 1990-05-08 | 1990-05-08 | Solder dip processing device |
| US07/696,833 US5199990A (en) | 1990-05-08 | 1991-05-07 | Apparatus for solder-plating a lead-frame carrying electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11846890A JPH072269B2 (en) | 1990-05-08 | 1990-05-08 | Solder dip processing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0437470A JPH0437470A (en) | 1992-02-07 |
| JPH072269B2 true JPH072269B2 (en) | 1995-01-18 |
Family
ID=14737419
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11846890A Expired - Lifetime JPH072269B2 (en) | 1990-05-08 | 1990-05-08 | Solder dip processing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH072269B2 (en) |
-
1990
- 1990-05-08 JP JP11846890A patent/JPH072269B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0437470A (en) | 1992-02-07 |
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