JPH0723267B2 - Metallizing composition - Google Patents

Description

TECHNICAL FIELD The present invention relates to a metallizing composition for forming a metallized metal layer on a ceramic body, and more specifically, a non-magnetic material such as aluminum (Al) is brazed. And a metallizing composition used for forming a metallized metal layer.

(Prior Art) Conventionally, ceramics have been widely used for electronic components such as IC packages that house semiconductor elements and circuit boards that have circuit wiring because they have excellent properties such as electrical insulation, chemical stability, and mechanical strength. On the surface of the ceramic body, a metallized metal layer to which external lead terminals and the like are brazed is adhered and formed. The metallized metal layer on the surface of the ceramic body is usually made of alumina which is made into a paste by adding an organic binder and an organic solvent to a refractory metal powder such as molybdenum-manganese (Mo-Mn) or tungsten (W). The raw or sintered ceramic body is adhered to the surface by screen printing, and then the ceramic body is fired in a reducing atmosphere to sinter and integrate the refractory metal and the ceramic body.

(Problems to be solved by the invention) However, the conventional metallized metal layer using molybdenum-manganese or the like is iron (Fe), kovar (Fe-Ni-
Co) has a good wettability with a silver brazing material, and iron etc. can be brazed firmly, but aluminum (Al), which is a non-magnetic material, has a poor wettability with an aluminum brazing material. As a result, there is a drawback that aluminum, which is a non-magnetic material, cannot be directly brazed onto a conventional metallized metal layer using molybdenum-manganese or the like. Therefore, in electronic parts where electrons, magnetism, etc. act, if you want to braze terminals, etc. made of non-magnetic material that do not adversely affect the action of the electrons, magnetism, the requirement is not satisfied, and the characteristics of electronic parts Was poor and unreliable.

(Object of the invention) The present inventors have conducted various experiments in view of the above-mentioned drawbacks, and as a result, a eutectic of titanium or a hydride thereof and aluminum or an alloy thereof has an activity of 5 kg / mm ^{2 with} respect to ceramics.
It has been found that the aluminum brazing material, which is firmly bonded with the above strength and which is brazed with aluminum, has excellent wettability.

It is an object of the present invention to provide a metallizing composition capable of forming a metallized metal layer capable of strongly brazing aluminum, which is a non-magnetic material, based on the above findings.

INDUSTRIAL APPLICABILITY The metallizing composition of the present invention is suitably used for forming a metallized metal layer for brazing an electronic component on which electrons and magnetism act, specifically, a terminal or the like made of aluminum, which is a nonmagnetic material, to an acceleration tube or the like. .

(Means for Solving Problems) The metallizing composition of the present invention is characterized by comprising 2 to 50% by weight of titanium or its hydride and 50 to 98% by weight of aluminum or its alloy. .

In the composition for metallization of the present invention, when the amount of titanium or its hydride is 2% by weight or less and the amount of aluminum or its alloy is 98% by weight or more, titanium or its hydride and aluminum or its alloy are formed. The absolute amount of the eutectic compound is insufficient, and the bonding strength between the metallized metal layer and the ceramic is reduced.

In addition, the amount of titanium or its hydride is 50% by weight or more,
When the amount of aluminum or its alloy is 50% by weight or less, the melting temperature of the metallizing composition becomes extremely high,
The metallized metal layer cannot be firmly bonded to the ceramic at a general firing temperature (700 to 800 ° C).

Therefore, in the metallizing composition of the present invention, titanium or its hydride is specified in the range of 2 to 50% by weight, and aluminum or its alloy is specified in the range of 50 to 98% by weight.

The metallizing composition of the present invention is prepared by mixing powder of titanium or its hydride and powder of aluminum or its alloy to form a mixed powder, or by forming a foil of titanium or its hydride and a foil of aluminum or its alloy. It is used as a metallizing composition by forming a laminated two-layer structure, by combining powdery titanium or its hydride and foil-like aluminum or its alloy, or vice versa.

(Example) Next, this invention is demonstrated based on an Example.

First, titanium (Ti) or its hydride (TiH ₂ ) and aluminum (Al) or its alloys (eg Al-Si)
The powder and foil of above were prepared, and these were combined as shown in the table below to obtain a metallizing sample with a thickness. Next, this was attached in a circular shape with a diameter of 5 mm to the surface of a ceramic body made of alumina (Al ₂ O ₃ ), silicon carbide (SiC), and silicon nitride (Si ₃ N ₄ ) and at a temperature of about 700 ° C in a vacuum furnace. It is fired at a temperature to deposit a metallized metal layer on the surface of the ceramic body. Then, a columnar body made of aluminum (Al) having a diameter of 5 mm and a length of 20 mm was brazed through an aluminum brazing material, and then the aluminum columnar body was pulled vertically to examine the bonding strength per unit area. .

When the titanium or its hydride and aluminum or its alloy are used in powder form, the particle size is adjusted to 1 to 5 μm, an organic binder and a solvent are added thereto, and the mixture is kneaded for 10 hours with a kneader. Then, it was made into a paste and attached to the surface of the ceramic body.

Sample Nos. 24 to 26 are comparative samples for comparison with the products of the present invention, which are conventionally used metallizing compositions of molybdenum-manganese (Mo-Mn).

The above results are shown in the table below.

(Effect of the invention) As can be seen from the above experimental results, the metallized metal layer using the conventional metallizing composition (Mo-Mn) is adhered to alumina (Al ₂ O ₃ ), but silicon carbide (SiC) , Silicon nitride (Si ₃ N ₄ ) was not deposited at all, and alumina (Al ₂
While non-magnetic material aluminum (Al) cannot be brazed on the metallized metal layer deposited on O ₃ ),
The metallized metal layer using the metallizing composition of the present invention has a bonding strength of 5 kg / m on any ceramic body of alumina (Al ₂ O ₃ ), silicon carbide (SiC), and silicon nitride (Si ₃ N ₄ ).
It can be applied with a strength of m ² or more, and can also braze aluminum (Al), which is a non-magnetic material, directly and firmly. Especially titanium or its hydride 3 to 35
Wt%, aluminum or its alloys 65 to 97 wt%
The metallized metal layer using the metallized composition consisting of is extremely strong in bonding strength of 10 kg / mm ² or more, and is suitable as a metallized composition for forming a metallized metal layer by brazing aluminum, which is a non-magnetic material. .

Therefore, the metallizing composition of the present invention is extremely useful for forming a metallized metal layer to which a terminal or the like made of a non-magnetic material is brazed in an electronic component where electrons or magnetism acts.

Claims (1)

[Claims] 1. A metallized metal layer of 5 kg / mm ^{2 on} ceramic.
A metallizing composition capable of being bonded with the above bonding strength, comprising 2 to 50% by weight of titanium hydride,
A metallizing composition comprising 50 to 98% by weight of aluminum or its alloy.