JPH072854B2 - Prepreg and copper clad laminate - Google Patents
Prepreg and copper clad laminateInfo
- Publication number
- JPH072854B2 JPH072854B2 JP12551387A JP12551387A JPH072854B2 JP H072854 B2 JPH072854 B2 JP H072854B2 JP 12551387 A JP12551387 A JP 12551387A JP 12551387 A JP12551387 A JP 12551387A JP H072854 B2 JPH072854 B2 JP H072854B2
- Authority
- JP
- Japan
- Prior art keywords
- prepreg
- unsaturated
- unsaturated bisimide
- molar ratio
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 10
- 229910052802 copper Inorganic materials 0.000 title claims description 5
- 239000010949 copper Substances 0.000 title claims description 5
- 239000011521 glass Substances 0.000 claims description 27
- 239000004744 fabric Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 10
- 239000002966 varnish Substances 0.000 claims description 10
- 150000002430 hydrocarbons Chemical group 0.000 claims description 8
- 239000004215 Carbon black (E152) Substances 0.000 claims description 7
- 229930195733 hydrocarbon Natural products 0.000 claims description 7
- 150000004985 diamines Chemical class 0.000 claims description 6
- 239000005046 Chlorosilane Substances 0.000 claims description 5
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical compound Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 claims description 5
- 239000007822 coupling agent Substances 0.000 claims description 5
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 4
- 238000007747 plating Methods 0.000 description 20
- 229920005989 resin Polymers 0.000 description 15
- 239000011347 resin Substances 0.000 description 15
- 230000035515 penetration Effects 0.000 description 11
- 238000006243 chemical reaction Methods 0.000 description 8
- 238000009413 insulation Methods 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 4
- 238000005470 impregnation Methods 0.000 description 3
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- -1 methylene, ethylene, propylene Chemical group 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 125000004430 oxygen atom Chemical group O* 0.000 description 2
- 229920003192 poly(bis maleimide) Polymers 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Reinforced Plastic Materials (AREA)
Description
【発明の詳細な説明】 （技術分野） この発明は、プリプレグと銅張積層板とに関するもので
ある。さらに詳しくは、この発明は、メッキ液のしみ込
みによる絶縁性低下を防止した不飽和ビスイミド樹脂含
浸ガラス基材からなるプリプレグとそれを用いた銅張積
層板に関するものである。TECHNICAL FIELD The present invention relates to a prepreg and a copper clad laminate. More specifically, the present invention relates to a prepreg made of an unsaturated bisimide resin-impregnated glass base material that prevents deterioration of insulation due to penetration of a plating solution, and a copper clad laminate using the prepreg.
（背景技術） 近年、プリント配線板の高多層化、高密度化が進み、さ
らにその需要は高まってきている。(Background Art) In recent years, the number of printed wiring boards has increased and the density has increased, and the demand for them has further increased.
従来、プリント配線板に用いる銅張積層板としては、ガ
ラス布、紙などに樹脂ワニスを含浸させたプリプリグを
多数枚積層し、その表面に銅箔を配設したものが用いら
れてきている。この場合の樹脂ワニスとしては、絶縁
性、強度などの点において優れたエポキシ樹脂、フェノ
ール樹脂、ポリイミド樹脂、などのワニスが用いられて
きている。Conventionally, as a copper-clad laminate used for a printed wiring board, one in which a large number of prepregs impregnated with resin varnish on glass cloth, paper, etc. are laminated and a copper foil is arranged on the surface thereof has been used. As the resin varnish in this case, varnishes such as epoxy resin, phenol resin, and polyimide resin, which are excellent in terms of insulation and strength, have been used.
このうち、特に、ビスマレイミド、またはビスマレイミ
ドとトリアジンとの反応物からなる樹脂が耐熱性、誘電
特性、絶縁特性等において注目されてきている。Among them, in particular, resins made of bismaleimide or a reaction product of bismaleimide and triazine have been attracting attention in terms of heat resistance, dielectric properties, insulation properties and the like.
しかしながら、従来の樹脂含浸基材の積層体を用いた銅
張積層板においては、基材、たとえば樹脂含浸ガラス基
材層に沿って、スルーホール等のメッキ時にメッキ液が
しみ込むという欠点があった。このメッキ液のしみ込み
は、たとえば第１図に示したような多層プリンシ配線板
などにおいては重大な問題となる。However, the conventional copper-clad laminate using a laminate of resin-impregnated base materials has a drawback that the plating solution permeates along the base material, for example, the resin-impregnated glass base material layer when plating through holes and the like. . This impregnation of the plating solution becomes a serious problem in, for example, the multilayer principal wiring board as shown in FIG.
たとえば、樹脂含浸ガラス基材層（１）を積層し、その
表面に銅箔等から形成した導体層（２）と、内層として
の導体層（３）を有する多層・高密度プリント配線板に
おいては、スルーホール（４）のメッキ処理時にメッキ
液が基材層（１）に沿ってしみこみ、メッキ液の金属イ
オンが成長して導体層（２）（３）を導通させるメッキ
導通部（５）を生成し、絶縁特性を低下させてプリント
配線板の品質を劣化させる。For example, in a multilayer high-density printed wiring board having a resin-impregnated glass base material layer (1) laminated, a conductor layer (2) formed of copper foil or the like on the surface thereof, and a conductor layer (3) as an inner layer, , A plating conduction part (5) that allows the plating solution to soak along the base material layer (1) during the plating treatment of the through holes (4), so that the metal ions of the plating solution grow and conduct the conductor layers (2) and (3). And deteriorates the insulation characteristics and deteriorates the quality of the printed wiring board.
今後の高密度化、高多層化配線の動向を考慮すると、こ
のようなメッキ液のしみ込みによる絶縁性の低下は早急
に解決すべき問題になっている。Considering future trends in high-density and high-multilayer wiring, such a decrease in insulation due to the penetration of the plating solution has become an urgent issue to be solved.
（発明の目的） この発明は、以上の通りの事情を鑑みてなされたもので
あり、従来の樹脂含浸基材銅張積層板の欠点を改善し、
メッキ液のしみ込みを防止した、改良された樹脂含浸基
材からなるプリプレグとそれをを用いた銅張積層板を提
供することを目的としている。(Object of the Invention) The present invention has been made in view of the above circumstances, and improves the drawbacks of the conventional resin-impregnated base material copper-clad laminate,
An object of the present invention is to provide a prepreg made of an improved resin-impregnated base material that prevents penetration of a plating solution and a copper-clad laminate using the prepreg.
（発明の開示） この発明のプリプレグは、上記の目的を実現するため
に、次式 で示される不飽和ビスイミド（R1，R2，R4およびR5は、
H,CH3、C2H5または他の炭化水素基を示す）のうちの、R
1、R2、R4およびR5がＨの不飽和ビスイミド（A1）と、R
1、R2、R4およびR5のうちの１以上がCH3またはC2H5の不
飽和ビスイミド（A2）との配合比を、モル比A2／A1が０
〜0.50とし、該不飽和ビスイミド（A1＋A2）と次式 で示されるジアミン（R6は炭化水素基を示す）（Ｂ）と
を、モル比A1＋A2/Bが1.7〜3.0で反応させて得られたワ
ニスを、SiO265〜90％およびB2O3７〜30％を含有する低
誘電率ガラス布またはガラスマットにクロルシラン系、
またはエポキシシラン系のカップリング剤で処理したも
のに含浸してなることを特徴としている。DISCLOSURE OF THE INVENTION The prepreg of the present invention has the following formula to achieve the above object. Unsaturated bisimide represented by (R 1 , R 2 , R 4 and R 5 are
H, CH 3 , C 2 H 5 or other hydrocarbon radicals)
An unsaturated bisimide (A 1 ) in which 1 , R 2 , R 4 and R 5 are H;
When one or more of 1 , R 2 , R 4 and R 5 is CH 3 or C 2 H 5 and the unsaturated bisimide (A 2 ) is mixed, the molar ratio A 2 / A 1 is 0.
To 0.50 and the unsaturated bisimide (A 1 + A 2 ) and the following formula A varnish obtained by reacting a diamine represented by (R 6 represents a hydrocarbon group) (B) at a molar ratio of A 1 + A 2 / B of 1.7 to 3.0, SiO 2 65 to 90% and B 2 O 3 low dielectric constant glass cloth or chlorosilane based on glass mat containing 7 to 30%
Alternatively, it is characterized by being impregnated with a material treated with an epoxysilane coupling agent.
また、この発明の銅張積層版は、上記の樹脂ワニスを含
浸させたガラス布またはガラスマットからなるプリプレ
グを積層し、その表面に銅箔を配設してなることを特徴
としている。The copper clad laminate of the present invention is characterized in that a prepreg made of a glass cloth or a glass mat impregnated with the above resin varnish is laminated, and a copper foil is provided on the surface thereof.
この発明に用いる不飽和ビスイミドについては、上記式
中のR1、R2、R4およびR5は、Ｈ、CH3、C2H5または他の
炭化水素基を示し、メチル基、エチル基以外にも、プロ
ピル、ブチルなどのアルキル基の適宜なものとすること
ができる。また、フェニル環を連結するR3についても、
メチレン、エチレン、プロピレン、イソプロピレン、ブ
チレン、イソブチレン等の適宜なアルキレン基、あるい
はまた、炭素鎖に酸素原子を結合するアルキレン−オキ
シ−アルキレン基や、フェニル基などを結合するその他
の適宜な炭化水素基とすることができる。Regarding the unsaturated bisimide used in the present invention, R 1 , R 2 , R 4 and R 5 in the above formula represent H, CH 3 , C 2 H 5 or another hydrocarbon group, a methyl group or an ethyl group. Besides, it may be an appropriate alkyl group such as propyl or butyl. Also, for R 3 that connects the phenyl rings,
Suitable alkylene group such as methylene, ethylene, propylene, isopropylene, butylene, isobutylene, or alkylene-oxy-alkylene group for bonding oxygen atom to carbon chain, or other suitable hydrocarbon for bonding phenyl group, etc. Can be the basis.
この発明においては、R1、R2、R4およびR5がＨの不飽和
ビスイミド（A1）と、R1、R2、R4およびR5のうちの１以
上がCH3またはC2H5の不飽和ビスイミド（A2）とを、モ
ル比（A2／A1）が０〜0.50の範囲で混合するが、好まし
くは、モル比A2／A1＝0.02〜0.50とする。不飽和ビスイ
ミド（A2）の混合によって、可橈性を付与し、メッキ液
のしみ込みを抑制することができる。次いでこの不飽和
ビスイミド（A1＋2）をジアミン（Ｂ）と反応させる
が、上記式中のジアミンのフェニル環を連結するR6につ
いても、メチレン、エチレン、プロビレン、イソプロピ
レン、さらには炭素鎖に酸素原子を結合するものや、フ
ェニル基などを結合するものなどの適宜な炭化水素基と
することができ、また、この不飽和ビスイミド（A1＋
A2）とジアミン（Ｂ）との反応は、モル比（A1＋A2/B）
が1.17〜3.0の範囲において、有機溶媒中で反応させる
ことができる。In the present invention, unsaturated bisimide (A 1 ) in which R 1 , R 2 , R 4 and R 5 are H and one or more of R 1 , R 2 , R 4 and R 5 is CH 3 or C 2 The unsaturated bisimide (A 2 ) of H 5 is mixed in a molar ratio (A 2 / A 1 ) of 0 to 0.50, preferably a molar ratio of A 2 / A 1 = 0.02 to 0.50. By mixing the unsaturated bisimide (A 2 ), flexibility can be imparted and penetration of the plating solution can be suppressed. Next, this unsaturated bisimide (A 1 + 2 ) is reacted with a diamine (B). R 6 which connects the phenyl ring of the diamine in the above formula also has methylene, ethylene, propylene, isopropylene, and further a carbon chain. It may be an appropriate hydrocarbon group such as one having an oxygen atom bonded to or a phenyl group bonded to the unsaturated bisimide (A 1 +
The reaction between A 2 ) and diamine (B) has a molar ratio (A 1 + A 2 / B)
In the range of 1.17 to 3.0, the reaction can be carried out in an organic solvent.
その際に、反応には、マレイミドのホモポリマー化抑制
溶剤、たとえば、ジオキサン、MC等を含む溶剤を用いる
とが好ましい。反応は、50〜150℃、１〜４時間程度で
行なうことができる。この反応において得られる樹脂
は、好ましくは、分子量15,000以上のものが５％以下と
する。これ以上の場合には、ガラス基材に含浸させる樹
脂ワニスとしては、粘度が大きすぎる等の理由によって
あまり好ましくない。At that time, it is preferable to use a solvent for suppressing homopolymerization of maleimide, for example, a solvent containing dioxane, MC or the like in the reaction. The reaction can be carried out at 50 to 150 ° C. for about 1 to 4 hours. The resin obtained in this reaction preferably has a molecular weight of 15,000 or more and 5% or less. In the case of more than this, the resin varnish with which the glass substrate is impregnated is not so preferable because the viscosity is too large.
次いで、得られた樹脂をガラス布またはガラスマットに
含浸させてプリプリグを形成するが、この含浸において
は、上記反応によって得られた樹脂を、40〜60重量％含
有するようにすることが好ましい。Then, the obtained resin is impregnated into a glass cloth or a glass mat to form a prepreg. In this impregnation, it is preferable to contain 40 to 60% by weight of the resin obtained by the above reaction.
ガラス布またはガラスマットとしては、Si265〜90％お
よびB2O3７〜30％を含有する低誘電率（高周波特性に優
れた）ガラス布またはガラスマットを、クロルシラン系
またはエポキシシラン系のカップリング剤で処理したも
のを用いる。約0.05〜1mm程度の厚さのものを用い、樹
脂含浸させたプリプレグとして所要の枚数を重ね合わせ
て積層板とする。この積層板の片面または両面に配設す
る銅箔としては、たとえば、0.018〜0.07mm程度の厚さ
とすることができる。As the glass cloth or glass mat, a low dielectric constant (excellent high frequency characteristic) glass cloth or glass mat containing Si 2 65 to 90% and B 2 O 3 7 to 30% is used as a chlorosilane-based or epoxysilane-based glass cloth or glass mat. The one treated with a coupling agent is used. Using a thickness of about 0.05 to 1 mm, a required number of resin-impregnated prepregs are stacked to form a laminated plate. The thickness of the copper foil provided on one side or both sides of this laminate can be, for example, about 0.018 to 0.07 mm.
以上の通りのプリプレグおよびこのプリプレグを用いた
銅張積層版においては、スルーホール等のメッキ処理に
おいてメッキ液のしみ込みを効果的に防止することがで
きる。さらに低誘電率のガラス布またはガラスマットを
用いることから、樹脂との界面密着性、耐熱性、および
プリント配線板の信号処理速度を向上させることができ
る。In the prepreg as described above and the copper-clad laminate using this prepreg, the penetration of the plating solution can be effectively prevented during the plating treatment of the through holes and the like. Further, since the glass cloth or the glass mat having a low dielectric constant is used, it is possible to improve the interface adhesion with the resin, the heat resistance, and the signal processing speed of the printed wiring board.
次に実施例を示し、さらに詳しくこの発明について説明
する。もちろん、この発明は、以下の実施例によって限
定されるものではない。Next, the present invention will be described in more detail with reference to examples. Of course, the present invention is not limited to the following examples.
実施例１ 次の配合および、反応の条件において、樹脂ワニスを製
造した。Example 1 A resin varnish was produced under the following formulation and reaction conditions.
（ｉ） 配合 （ii） 反応条件 80℃（温度） ３時間（反応時間） この樹脂ワニスを、SiO273％およびB2O321％、その他６
％の組成からなる低誘電率ガラスで、フィラメント径７
μｍ、集束板200x200本、厚さ0.10mmガラス布をクロル
シランカップリング剤で処理したものに含浸させて、樹
脂の含有量が50重量％、流れ性が30％のプリプレグを得
た。硬化時間は、170℃の温度において400秒であった。(I) Blend (Ii) Reaction conditions 80 ° C. (temperature) 3 hours (reaction time) This resin varnish was treated with 73% SiO 2 and 21% B 2 O 3 and others 6
% Low-dielectric-constant glass with a filament diameter of 7
A prepreg having a resin content of 50% by weight and a flowability of 30% was obtained by impregnating a glass cloth having a diameter of 100 μm, a focusing plate of 200 × 200 pieces, and a thickness of 0.10 mm with a chlorosilane coupling agent. The cure time was 400 seconds at a temperature of 170 ° C.
得られたプリプレグを60枚積層し、圧縮成形して厚板を
作製した。この厚板に0.35φのドリルを用いて穴あけ加
工し、無電解メッキを行って、メッキ液のしみ込み性に
ついて評価した。Sixty prepregs thus obtained were laminated and compression molded to produce a thick plate. This thick plate was drilled using a 0.35φ drill and electroless plated to evaluate the penetration of the plating solution.
その結果を従来のものと比較してすると、従来のもの
（ケルイミド樹脂）は、しみ込み量が30μｍであった
が、この例のもののしみ込み量は80μｍにしかすぎなか
った。メッキ液のしみ込み量は著しく低減している。ま
た耐熱性も、Ｅ−0.5/300℃からＥ−0.5/310℃にまで向
上している。Comparing the results with the conventional one, the conventional one (kelimide resin) had a soaking amount of 30 μm, but the soaking amount of this example was only 80 μm. The penetration amount of the plating solution is significantly reduced. The heat resistance is also improved from E-0.5 / 300 ° C to E-0.5 / 310 ° C.
実施例２〜３ 実施例１と同様にして、次の表に配合からなる条件で樹
脂ワニスを製造した。同様にガラス布に含浸して、樹脂
量50％、流れ性30％、硬化時間（170℃）400秒のプリプ
レグを得た。実施例１と同様にしてメッキ液のしみ込み
性について評価した。その結果も表−１に示した。Examples 2 to 3 In the same manner as in Example 1, resin varnishes were produced under the conditions shown in the following table. Similarly, a glass cloth was impregnated to obtain a prepreg having a resin content of 50%, a flowability of 30%, and a curing time (170 ° C.) of 400 seconds. The penetration of the plating solution was evaluated in the same manner as in Example 1. The results are also shown in Table 1.
メッキ液のしみ込みは従来のものに比べて、はるかに低
減している。The penetration of the plating solution is much reduced compared to the conventional one.
（発明の効果） この発明により、以上詳しく説明した通り、メッキ液の
しみ込みとそれによるプリント配線板用積層板の絶縁性
の低下を効果的に防止することができる。また、耐熱性
の向上した低誘電率積層板が得られる。プリント配線板
の品質の信頼性は大幅に向上する。 (Effects of the Invention) According to the present invention, as described in detail above, it is possible to effectively prevent the impregnation of the plating liquid and the deterioration of the insulating property of the laminate for a printed wiring board due to the penetration. In addition, a low dielectric constant laminate having improved heat resistance can be obtained. The reliability of the quality of the printed wiring board is greatly improved.
第１図は、積層板へのメッキ液のしみ込みを模式的に示
した断面図である。 １……ガラス基材層、2,3……導体層、４……スルーホ
ール、５……メッキ導通部。FIG. 1 is a sectional view schematically showing penetration of a plating solution into a laminated plate. 1 ... Glass substrate layer, 2,3 ... conductor layer, 4 ... through hole, 5 ... plating conductive part.
Claims (2)
H,CH3、C2H5または他の炭化水素基を示す）のうちの、R
1、R2、R4およびR5がＨの不飽和ビスイミド（A1）と、R
1、R2、R4およびR5のうちの１以上がCH3またはC2H5の不
飽和ビスイミド（A2）との配合比を、モル比A2／A1が０
〜0.50とし、該不飽和ビスイミド（A1＋A2）と次式 で示されるジアミン（R6は炭化水素基を示す）（Ｂ）と
をモル比A1＋A2/Bが1.7〜3.0で反応させて得られたワニ
スを、SiO265〜90％およびB2O3７〜30％を含有する低誘
電率ガラス布またはガラスマットにクロルシラン系、ま
たはエポキシシラン系のカップリング剤で処理したもの
に含浸させてなることを特徴とするプリプレグ。1. The following equation Unsaturated bisimide represented by (R 1 , R 2 , R 4 and R 5 are
H, CH 3 , C 2 H 5 or other hydrocarbon radicals)
An unsaturated bisimide (A 1 ) in which 1 , R 2 , R 4 and R 5 are H;
When one or more of 1 , R 2 , R 4 and R 5 is CH 3 or C 2 H 5 and the unsaturated bisimide (A 2 ) is mixed, the molar ratio A 2 / A 1 is 0.
To 0.50 and the unsaturated bisimide (A 1 + A 2 ) and the following formula A varnish obtained by reacting a diamine represented by (R 6 represents a hydrocarbon group) (B) at a molar ratio A 1 + A 2 / B of 1.7 to 3.0, SiO 2 65 to 90% and B 2 A prepreg obtained by impregnating a low-dielectric-constant glass cloth or glass mat containing 7 to 30% O 3 with a chlorosilane-based or epoxysilane-based coupling agent.
H,CH3，C2H5または他の炭化水素基を示し、R3は、炭化
水素基を示す）のうちの、R1，R2，R4およびR5がＨの不
飽和ビスイミド（A1）と、R1，R2，R4およびR5のうちの
１以上がCH3またはC2H5の不飽和ビスイミド（A2）との
配合比、モル比A2／A1が０〜0.50とし、該不飽和ビスイ
ミド（A1＋A2）と次式 で示されるジアミン（R6は炭化水素基を示す）（Ｂ）と
を、モル比A1＋A1/Bが1.7〜3.0で反応させて得られたワ
ニスを、SiO265〜90およびB2O3７〜30％を含有する低誘
電率ガラス布またはガラスマットにクロルシラン系、ま
たはエポキシシラン系のカップリング剤で処理したもの
に含浸させ、得られたプリプレグを積層して表面に銅箔
を配設してなることを特徴とする銅張積層板。2. The following equation Unsaturated bisimide represented by (R 1 , R 2 , R 4 and R 5 are
H, CH 3 , C 2 H 5 or another hydrocarbon group, and R 3 represents a hydrocarbon group), R 1 , R 2 , R 4 and R 5 are unsaturated bisimides (H). A 1 ) and one or more of R 1 , R 2 , R 4 and R 5 is CH 3 or C 2 H 5 unsaturated bisimide (A 2 ), and the molar ratio A 2 / A 1 is 0 to 0.50, the unsaturated bisimide (A 1 + A 2 ) and the following formula With a diamine represented by (R 6 represents a hydrocarbon group) (B) at a molar ratio of A 1 + A 1 / B of 1.7 to 3.0, SiO 2 65 to 90 and B 2 A low dielectric constant glass cloth or glass mat containing 7 to 30% of O 3 is impregnated with a material treated with a chlorosilane-based or epoxysilane-based coupling agent, and the obtained prepreg is laminated to form a copper foil on the surface. A copper clad laminate characterized by being arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12551387A JPH072854B2 (en) | 1987-05-22 | 1987-05-22 | Prepreg and copper clad laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12551387A JPH072854B2 (en) | 1987-05-22 | 1987-05-22 | Prepreg and copper clad laminate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63289036A JPS63289036A (en) | 1988-11-25 |
| JPH072854B2 true JPH072854B2 (en) | 1995-01-18 |
Family
ID=14911998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12551387A Expired - Lifetime JPH072854B2 (en) | 1987-05-22 | 1987-05-22 | Prepreg and copper clad laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH072854B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0611802B2 (en) * | 1989-08-25 | 1994-02-16 | 新日鐵化学株式会社 | Prepreg manufacturing method |
-
1987
- 1987-05-22 JP JP12551387A patent/JPH072854B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63289036A (en) | 1988-11-25 |
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