JPH072855B2 - Prepreg and copper clad laminate - Google Patents
Prepreg and copper clad laminateInfo
- Publication number
- JPH072855B2 JPH072855B2 JP12551487A JP12551487A JPH072855B2 JP H072855 B2 JPH072855 B2 JP H072855B2 JP 12551487 A JP12551487 A JP 12551487A JP 12551487 A JP12551487 A JP 12551487A JP H072855 B2 JPH072855 B2 JP H072855B2
- Authority
- JP
- Japan
- Prior art keywords
- prepreg
- unsaturated bisimide
- unsaturated
- clad laminate
- bisimide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Description
【発明の詳細な説明】 （技術分野） この発明は、プリプレグと銅張積層板とに関するもので
ある。さらに詳しくは、この発明は、メッキ液のしみ込
みによる絶縁性低下を防止した不飽和ビスイミド樹脂含
浸ガラス基材からなるプリプレグとそれを用いた銅張積
層板に関するものである。TECHNICAL FIELD The present invention relates to a prepreg and a copper clad laminate. More specifically, the present invention relates to a prepreg made of an unsaturated bisimide resin-impregnated glass base material that prevents deterioration of insulation due to penetration of a plating solution, and a copper clad laminate using the prepreg.
（背景技術） 近年、プリント配線板の高多層化、高密度化が進み、さ
らにその需要は高まっている。(Background Art) In recent years, the number of printed wiring boards has increased and the density has increased, and the demand for them has further increased.
従来、プリント配線板に用いる銅張積層板としては、ガ
ラス布、紙などに樹脂ワニスを含浸させたプリプリグを
多数枚積層し、その表面に銅箔を配設したものが用いら
れてきている。この場合の樹脂ワニスとしては、絶縁
性、強度などの点において優れたエポキシ樹脂、フェノ
ール樹脂、ポリイミド樹脂、などのワニスが用いられて
きている。Conventionally, as a copper-clad laminate used for a printed wiring board, one in which a large number of prepregs impregnated with resin varnish on glass cloth, paper, etc. are laminated and a copper foil is arranged on the surface thereof has been used. As the resin varnish in this case, varnishes such as epoxy resin, phenol resin, and polyimide resin, which are excellent in terms of insulation and strength, have been used.
このうち、特に、ビスマレイミド、またはビスマレイミ
ドとトリアジンとの反応物からなる樹脂が耐熱性、誘電
特性、絶縁特性等において注目されてきている。Among them, in particular, resins made of bismaleimide or a reaction product of bismaleimide and triazine have been attracting attention in terms of heat resistance, dielectric properties, insulation properties and the like.
しかしながら、従来の樹脂含浸基材の積層体を用いた銅
張積層板においては、基材、たとえば樹脂含浸ガラス基
材層に沿って、スルーホーン等のメッキ時にメッキ液が
しみ込むという欠点があった。このメッキ液のしみ込み
は、たとえば第１図に示したような多層プリンシ配線板
などにおいては重大な問題となる。However, the conventional copper-clad laminate using the laminate of the resin-impregnated base material has a drawback that the plating solution permeates along the base material, for example, the resin-impregnated glass base material layer during plating of a through horn or the like. . This impregnation of the plating solution becomes a serious problem in, for example, the multilayer principal wiring board as shown in FIG.
たとえば、樹脂含浸ガラス基材層（１）を積層し、その
表面に銅箔等から形成した導体層（２）と内層としての
導体層（３）を有する多層・高密度プリント配線板にお
いては、スルーホール（４）のメッキ処理時にメッキ液
が基材層（１）に沿ってしみこみ、メッキ液の金属イオ
ンが成長して導体層（２）（３）を導通させてメッキ導
通部（５）を生成し、絶縁特性を低下させてプリント配
線板の品質を劣化させる。For example, in a multi-layer high-density printed wiring board having a resin-impregnated glass base material layer (1) laminated, a conductor layer (2) formed of copper foil or the like on the surface thereof and a conductor layer (3) as an inner layer, During the plating treatment of the through holes (4), the plating solution permeates along the base material layer (1), and the metal ions of the plating solution grow to make the conductor layers (2) and (3) conductive and the plating conduction part (5). And deteriorates the insulation characteristics and deteriorates the quality of the printed wiring board.
今後の高密度化、高多層化配線の動向を考慮すると、こ
のようなメッキ液のしみ込みによる絶縁性の低下は早急
に解決すべき問題になっている。Considering future trends in high-density and high-multilayer wiring, such a decrease in insulation due to the penetration of the plating solution has become an urgent issue to be solved.
（発明の目的） この発明は、以上の通りの事情を鑑みてなされたもので
あり、従来の樹脂含浸基材銅張積層板の欠点を改善し、
メッキ液のしみ込みを防止した、改良された樹脂含浸基
材からなるプリプレグとそれをを用いた銅張積層板を提
供することを目的としている。(Object of the Invention) The present invention has been made in view of the above circumstances, and improves the drawbacks of the conventional resin-impregnated base material copper-clad laminate,
An object of the present invention is to provide a prepreg made of an improved resin-impregnated base material that prevents penetration of a plating solution and a copper-clad laminate using the prepreg.
（発明の開示） この発明のプリプレグは、上記の目的を実現するため
に、次式 で示される不飽和ビスイミド（R1、R2、R4およびR5は、
H,CH3、C2H5または他の炭化水素基を示す）のうちの、R
1、R2、R4およびR5がＨの不飽和ビスイミド（A1）と、R
1、R2、R4およびR5のうちの１以上がCH3またはC2H5の不
飽和ビスイミド（A2）とを、モル比A2／A1が0.02〜0.50
において混合し、さらに、該不飽和ビスイミド（A1＋
A2）と次式 で示されるジアミン（R6は炭化水素基を示す）（Ｂ）と
を、モル比A1＋A2/Bが1.7〜3.0で反応させて得られたワ
ニスをガラス布またはガラスマットに含浸させてなるこ
とを特徴としている。DISCLOSURE OF THE INVENTION The prepreg of the present invention has the following formula to achieve the above object. The unsaturated bisimide (R 1 , R 2 , R 4 and R 5 are
H, CH 3 , C 2 H 5 or other hydrocarbon radicals)
An unsaturated bisimide (A 1 ) in which 1 , R 2 , R 4 and R 5 are H;
One or more of 1 , R 2 , R 4 and R 5 is an unsaturated bisimide (A 2 ) having CH 3 or C 2 H 5 and a molar ratio A 2 / A 1 of 0.02 to 0.50.
In the unsaturated bisimide (A 1 +
A 2 ) and the following formula The glass cloth or glass mat is impregnated with a varnish obtained by reacting a diamine represented by (R 6 represents a hydrocarbon group) (B) with a molar ratio A 1 + A 2 / B of 1.7 to 3.0. It is characterized by becoming.
また、この発明のガラス基材銅張積層版は、上記の樹脂
ワニスを含浸させたガラス布またはガラスマットからな
るプリプレグを積層し、その表面に銅箔を配設したこと
を特徴としている。Further, the glass-based copper-clad laminate of the present invention is characterized in that a prepreg made of a glass cloth or a glass mat impregnated with the above resin varnish is laminated and a copper foil is provided on the surface thereof.
この発明に用いる不飽和ビスイミドについては、R1、
R2、R4およびR5は、Ｈ、CH3、C2H5または他の炭化水素
基を示し、メチル基、エチル基以外にも、プロピル、ブ
チルなどのアルキル基の適宜なものとすることができ
る。また、フェニル環を連結するR3についても、メチレ
ン、エチレン、プロピレン、イソプロピレン、ブチレ
ン、イソブチレン等の適宜なアルキレン基、あるいはま
た、炭素鎖に酸素原子を結合するものや、フェニル基な
どを結合するその他の適宜な炭化水素基とすることがで
きる。For the unsaturated bisimide used in the present invention, R 1 ,
R 2 , R 4 and R 5 represent H, CH 3 , C 2 H 5 or another hydrocarbon group, which is an alkyl group such as propyl or butyl in addition to a methyl group or an ethyl group. be able to. Further, as for R 3 which connects the phenyl ring, a suitable alkylene group such as methylene, ethylene, propylene, isopropylene, butylene, and isobutylene, or a compound that bonds an oxygen atom to the carbon chain, or a phenyl group is bonded. And other suitable hydrocarbon groups.
R1、R2、R4およびR5がＨの不飽和ビスイミド（A1）と、
R1、R2、R4およびR5のうちの１以上がCH3またはC2H5の
不飽和ビスイミド（A2）とを、モル比（A2／A1）が0.02
〜0.50の範囲で混合し、次いでこの不飽和ビスイミド
（A1＋2）をジアミン（Ｂ）と反応させるが、この場合
のジアミンのフェニル環を連結するR6についても、メチ
レン、エチレン、プロビレン、イソプロピレン、さらに
は炭素鎖に酸素原子を結合するものや、フェニル基など
を結合するものなどの適宜な炭化水素基とすることがで
き、また、この不飽和ビスイミド（A1＋A2）とジアミン
（Ｂ）との反応は、モル比（A1＋A2/B）が1.7〜3.0の範
囲にいおいて、DMAC、DMF、DMAA、DMSO,などの有機溶媒
中で反応させることができる。An unsaturated bisimide (A 1 ) in which R 1 , R 2 , R 4 and R 5 are H;
One or more of R 1 , R 2 , R 4 and R 5 is CH 3 or C 2 H 5 unsaturated bisimide (A 2 ) with a molar ratio (A 2 / A 1 ) of 0.02.
Mixed in the range of 0.50, and then the unsaturated bisimide (A 1 + 2 ) is reacted with a diamine (B). In this case, R 6 which connects the phenyl ring of the diamine also includes methylene, ethylene, propylene, It may be an appropriate hydrocarbon group such as isopropylene, or one having an oxygen atom bonded to the carbon chain, or one having a phenyl group bonded thereto, and the unsaturated bisimide (A 1 + A 2 ) and diamine. The reaction with (B) can be carried out in an organic solvent such as DMAC, DMF, DMAA or DMSO with the molar ratio (A 1 + A 2 / B) being in the range of 1.7 to 3.0.
不飽和ビスイミド（A2）を混合することにより、可橈性
を付与し、メッキ液のしみ込みを抑制することができ
る。不飽和ビスイミド（A1＋A2）とジアミンとの反応
は、50〜150℃、１〜４時間程度で行なうことができ
る。By mixing the unsaturated bisimide (A 2 ), flexibility can be imparted and penetration of the plating solution can be suppressed. The reaction between the unsaturated bisimide (A 1 + A 2 ) and the diamine can be performed at 50 to 150 ° C. for about 1 to 4 hours.
次いで、得られた樹脂をガラス布またはガラスマットに
含浸させてプリプレグを形成するが、この含浸において
は、上記反応によって得られた樹脂を、40〜60重量％含
有するようにすることが好ましい。Next, a glass cloth or a glass mat is impregnated with the obtained resin to form a prepreg. In this impregnation, it is preferable that the resin obtained by the above reaction is contained in an amount of 40 to 60% by weight.
ガラス布またはガラスマットとしては、約0.05〜1mm程
度の厚さのものを用い、樹脂含浸させたプリプレグとし
て所要の枚数を重ね合わせて積層板とする。この積層板
の片面または両面に配設する銅箔としては、たとえば、
0.018〜0.07mm程度の厚さとすることができる。A glass cloth or a glass mat having a thickness of about 0.05 to 1 mm is used, and a required number of resin-impregnated prepregs are stacked to form a laminated plate. As the copper foil to be arranged on one side or both sides of this laminated plate, for example,
The thickness can be about 0.018 to 0.07 mm.
以上の通りのプリプレグおよびこのプリプレグを用いた
銅張積層版においては、スルーホール等のメッキ処理に
おいてメッキ液のしみ込みと、それによる絶縁性の低下
を防止することができる。In the prepreg as described above and the copper-clad laminate using this prepreg, it is possible to prevent the plating solution from soaking in the plating treatment of through holes and the like, and to prevent the deterioration of the insulating property.
次に実施例を示し、さらに詳しくこの発明について説明
する。もちろん、この発明は、以下の実施例によって限
定されるものではない。Next, the present invention will be described in more detail with reference to examples. Of course, the present invention is not limited to the following examples.
実施例 次の配合および、反応の条件において、樹脂ワニスを製
造した。Example A resin varnish was produced under the following formulation and reaction conditions.
（ｉ） 配合 （ii） 反応条件 80℃（温度） ３時間（反応時間） この樹脂ワニスをガラス布に含浸させて、樹脂の含有量
が50重量％、流れ性が30％のプレプレグを得た。硬化時
間は、170℃の温度において400秒であった。(I) Blend (Ii) Reaction conditions 80 ° C. (temperature) 3 hours (reaction time) A glass cloth was impregnated with this resin varnish to obtain a prepreg having a resin content of 50% by weight and a flowability of 30%. The cure time was 400 seconds at a temperature of 170 ° C.
得られたプレプリグを60枚積層し、圧縮成形して厚板を
作製した。この厚板に0.35φのドリルを用いて穴あけ加
工し、無電解メッキを行って、メッキ液のしみ込み性に
ついて評価した。60 sheets of the obtained prepreg were laminated and compression molded to prepare a thick plate. This thick plate was drilled using a 0.35φ drill and electroless plated to evaluate the penetration of the plating solution.
その結果を従来のものと比較して示したものが表−１で
ある。メッキ液のしみ込み量が約40％低減し、プリント
配線板の信頼性が大幅に向上した。Table 1 shows the result in comparison with the conventional one. The permeation amount of the plating solution has been reduced by about 40%, greatly improving the reliability of the printed wiring board.
（発明の効果） この発明により、以上詳しく説明した通り、メッキ液の
しみ込みとそれによるプリント配線板の絶縁性の低下を
効果的に防止することができる。プリント配線板の品質
の信頼性は大幅に向上する。 (Effects of the Invention) According to the present invention, as described in detail above, it is possible to effectively prevent the impregnation of the plating solution and the deterioration of the insulating property of the printed wiring board due to the penetration. The reliability of the quality of the printed wiring board is greatly improved.
第１図は、積層板へのメッキ液のしみ込みを模式的に示
した断面図である。 １……ガラス基材層、2,3……導体層、４……スルーホ
ール、５……メッキ導通部。FIG. 1 is a sectional view schematically showing penetration of a plating solution into a laminated plate. 1 ... Glass substrate layer, 2,3 ... conductor layer, 4 ... through hole, 5 ... plating conductive part.
Claims (2)
H,CH3、C2H5または他の炭化水素基を示す）のうちの、R
1、R2、R4およびR5がＨの不飽和ビスイミド（A1）と、R
1、R2、R4およびR5のうちの１以上がCH3またはC2H5の不
飽和ビスイミド（A2）とを、モル比、A2／A1が0.02〜0.
50において混合し、さらに、 該不飽和ビスイミド（A1＋A2）と次式 で示されるジアミン（R6は炭化水素基を示す）（Ｂ）と
を、モル比、A1＋A2/Bが1.7〜3.0で反応させて得られた
ワニスをガラス布またはガラスマットに含浸させてなる
ことを特徴とするプリプレグ。1. The following equation Unsaturated bisimide represented by (R 1 , R 2 , R 4 and R 5 are
H, CH 3 , C 2 H 5 or other hydrocarbon radicals)
An unsaturated bisimide (A 1 ) in which 1 , R 2 , R 4 and R 5 are H;
One or more of 1 , R 2 , R 4 and R 5 is an unsaturated bisimide (A 2 ) having CH 3 or C 2 H 5 and a molar ratio of A 2 / A 1 of 0.02 to 0.
At 50 and mixed with the unsaturated bisimide (A 1 + A 2 ) The glass cloth or glass mat is impregnated with a varnish obtained by reacting a diamine represented by (R 6 represents a hydrocarbon group) (B) with a molar ratio of A 1 + A 2 / B of 1.7 to 3.0. A prepreg characterized by:
H,CH3，C2H5または他の炭化水素基を示し、R3は、炭化
水素基を示す）のうちの、R1，R2，R4およびR5がＨの不
飽和ビスイミド（A1）と、R1，R2，R4およびR5のうちの
１以上がCH3またはC2H5の不飽和ビスイミド（A2）と
を、モル比、A2／A1が0.02〜0.50おいて混合し、さら
に、 該不飽和ビスイミド（A1＋A2）と次式 で示されるジアミン（R6は炭化水素基を示す）（Ｂ）と
を、モル比、A1＋A1/Bが1.7〜3.0で反応させて得られた
ワニスをガラス布またはガラスマットに含浸させ、得ら
れたプリプレグを積層して表面に銅箔を配設してなるこ
とを特徴とする銅張積層板。2. The following equation Unsaturated bisimide represented by (R 1 , R 2 , R 4 and R 5 are
H, CH 3 , C 2 H 5 or another hydrocarbon group, and R 3 represents a hydrocarbon group), R 1 , R 2 , R 4 and R 5 are unsaturated bisimides (H). A 1 ) and an unsaturated bisimide (A 2 ) in which at least one of R 1 , R 2 , R 4 and R 5 is CH 3 or C 2 H 5 , a molar ratio of A 2 / A 1 is 0.02. To 0.50 and mixed with the unsaturated bisimide (A 1 + A 2 ) With a diamine represented by (R 6 represents a hydrocarbon group) (B) at a molar ratio of A 1 + A 1 / B of 1.7 to 3.0 to impregnate a glass cloth or a glass mat with a varnish. A copper clad laminate characterized in that the obtained prepreg is laminated and a copper foil is provided on the surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12551487A JPH072855B2 (en) | 1987-05-22 | 1987-05-22 | Prepreg and copper clad laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12551487A JPH072855B2 (en) | 1987-05-22 | 1987-05-22 | Prepreg and copper clad laminate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63289037A JPS63289037A (en) | 1988-11-25 |
| JPH072855B2 true JPH072855B2 (en) | 1995-01-18 |
Family
ID=14912024
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12551487A Expired - Lifetime JPH072855B2 (en) | 1987-05-22 | 1987-05-22 | Prepreg and copper clad laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH072855B2 (en) |
-
1987
- 1987-05-22 JP JP12551487A patent/JPH072855B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63289037A (en) | 1988-11-25 |
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