JPH0729269B2 - Electronic component mounting device - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus that sucks electronic components and mounts them on a printed circuit board.

(Prior Art) In recent years, an electronic component mounting apparatus that sucks an electronic component and mounts it on a printed circuit board has made remarkable progress.

The conventional electronic component mounting device is equipped with a suction nozzle that is always kept at a negative pressure. The suction nozzle sucks electronic components and checks the pressure inside the suction nozzle to print the suction nozzle while checking the suction state. Move it to the board,
It was to mount electronic parts.

The order of mounting electronic components using the conventional electronic component mounting apparatus will be described below.

First, paste-like solder with high adhesiveness is applied on the printed circuit board, and the suction nozzle that sucks the electronic components moves there, causing the electronic components to adhere to the solder, and then the solder is heated to melt the electronic components. To fix.

(Problems to be solved by the invention) However, in the above-described conventional configuration, the suction nozzle may suck the solder on the printed circuit board when mounting the electronic component, but since the conventional suction nozzle has a small inner diameter of 1 mm, Solder gradually adheres to the nozzle, the pipe line resistance inside the suction nozzle increases, and the pressure inside the nozzle always drops.However, conventionally, the pressure inside the suction nozzle decreased to confirm the suction of electronic components. As a result, this confirmation operation cannot be performed, and even if electronic parts are not picked up, the mounting operation continues as it is and defective products are produced. And
There is a problem that suction can not be performed, and since the machine has to be stopped and the inside of the suction nozzle has to be cleaned to remove the solder in the suction nozzle, productivity is reduced. Was there.

(Means for Solving the Problems) According to the present invention, a suction nozzle for sucking an electronic component, a first path from a suction position for sucking an electronic component to a mounting position on a substrate for mounting the electronic component, and a mounting position are provided. At least the moving means for moving the suction nozzle along the second path to the suction position, the first passage communicating with the negative pressure generating means, the second passage communicating with the positive pressure generating means, and the suction nozzle are provided. When on the first path, the inside of the suction nozzle communicates with the first passage, and when the suction nozzle is at a predetermined position on the second path, the suction nozzle and the second passage are connected. It is configured to include switching means for communicating.

(Operation) With the above configuration, when the electronic component is mounted on the surface of the substrate or the like by using the solder, the suction nozzle mounts the electronic component,
Until the next electronic component is sucked, a positive pressure flow path is connected to the suction nozzle, and the solder adhering to the inside of the suction nozzle is blown away by the positive pressure air flow to clean the inside of the suction nozzle.

(Embodiment) FIG. 1 is a side view of an essential part of an electronic component mounting apparatus according to an embodiment of the present invention. 3 is a suction head for sucking and holding an electronic component at the tip of the suction nozzle 3a, and 13 is a suction nozzle 3a. The tube 12 connected to has a push rod 12a, which connects the tube 13 and the tube 15 when the push rod 12a is not pushed, and connects the tube 13 and the tube 14 when the push rod 12a is pushed. Switching valve, 10 is an air cylinder having a rod 10a for pushing the push rod 12a, 20 has a flange 20a provided with a flow path 20b,
It is a supporting member that holds six suction heads and the same number of switching valves 12 as the suction heads (the arrangement is shown in FIG. 2), and a tube 14 is connected to the flow path 20b. Reference numeral 6 denotes a shaft that serves as a central axis of rotation of the support member 20, has a channel 6a at the center of the inside thereof, and is provided with an overhang 6c having a channel 6b at a part of the inside thereof. Air is sucked out by a pressure generator (vacuum pump) 21 and kept at a negative pressure. A tube 18 is connected to the flow path 6b. The tube 18 is supplied with air by a positive pressure generator (compressor) 22 so that the inside of the tube 18 has a positive pressure. Reference numeral 8 is a bearing for rotatably supporting the support member 20 on the shaft 6, and 16 is a rotary joint for connecting the flow path 6a and the tube 15.

In FIG. 2, reference numeral 1 is a component rack for supplying electronic components to the suction head, and 5 is paste solder already applied,
Printed substrates 4 to which electronic components are attached are substrate positioning devices for moving the mounting position of the electronic components on the printed circuit board below the suction head 3.

The operation of the electronic component mounting apparatus of the present embodiment configured as described above will be described below.

In the first state, the suction nozzle 3a includes a tube 13, a switching valve 12, a tube 15, a rotary joint 16, and a flow path.
It is connected to the vacuum pump 21 via 6a, and the suction nozzle
3a is breathing in air. Here, the switching valve 12, the tube 15, the rotary joint 16, and the flow path 6a constitute a first passage. In this state, the suction head 3 is attached to the parts rack 1
The electronic component is supplied from the electronic component, and the electronic component at the suction position is sucked to the tip of the suction nozzle 3a. Next, the supporting member 20 is rotated in the direction of arrow A by the driving means (not shown), and the suction head 3 moves onto the printed circuit board 5. Flow path in the middle
By checking the pressure of 6a, the suction state of the electronic component is confirmed, and if there is no electronic component, it is not mounted. When the suction head 3 moves onto the printed circuit board 5, the board positioning device 4 moves the mounting position on the printed circuit board 5 below the suction head 3 to mount electronic components. The movement path of the electronic component up to this point is referred to as a first path.

Next, when the support member 20 further rotates and the suction head 3 moves below the air cylinder 10, the shaft 6 projects.
The channel 6b in 6c and the channel 20b in the flange 20a are connected.
Here, the switching valve 12, the tube 14, the flow passage 20b, and the flow passage 18 form a second passage. In this state, the rod 10a of the air cylinder 10 pushes the rod 12a in the direction of arrow B.
, The tube 13 and the tube 14 are connected, air is blown from the adsorption nozzle 3, the solder is blown away, and the inside of the nozzle is cleaned.

After that, the support member further rotates, and the suction nozzle returns to the original suction position. The movement path of the electronic component from the mounting position to the suction position is referred to as a second path.

(Advantages of the Invention) The present invention provides a suction nozzle for sucking an electronic component, a first path from the suction position for sucking the electronic component to the mounting position on the board for mounting the electronic component, and the mounting position to the suction position. A moving means for moving the suction nozzle along the second path, a first passage communicating with the negative pressure generating means, a second passage communicating with the positive pressure generating means, and at least the first suction nozzle.
When the suction nozzle is at a specific position on the second path, the suction nozzle and the second passage are communicated with each other. A switching means is provided, and while the suction head moves from the position on the printed circuit board to the suction position of the electronic component, the switching valve switches the flow path to blow out positive pressure air from the suction nozzle, and the solder in the suction nozzle is provided. Since the suction nozzle is cleaned every cycle, the suction nozzle is not clogged, electronic components can be reliably mounted, and the risk of creating defective products is reduced. Since the time spent cleaning the suction nozzle until now is eliminated, the maintainability is improved and the productivity is improved accordingly.

[Brief description of drawings]

FIG. 1 is a sectional view of an essential part of an electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 2 is a sectional view of an essential part of an electronic component mounting apparatus according to an embodiment of the present invention. 3 …… Suction head 3a …… Suction nozzle 6 …… Shaft 6a …… Flow path 12 …… Switching valve 13,14,15,18 …… Tube 16 …… Rotary joint 20 …… Supporting member 20b …… Flow path 21 …… Negative pressure generator (vacuum pump) 22 …… Positive pressure generator (compressor)

Claims (1)

[Claims] 1. A suction nozzle for sucking an electronic component, a first path from a suction position for sucking an electronic component to a mounting position on a board for mounting an electronic component, and a second route from the mounting position to the suction position. The moving means for moving the suction nozzle along the path, the first passage communicating with the negative pressure generating means, the second passage communicating with the positive pressure generating means, and the suction nozzle having at least the first passage. When the suction nozzle is in a predetermined position on the second path, the suction nozzle and the second passage are communicated with each other. An electronic component mounting device, comprising: a switching unit that communicates with the passage of the electronic component mounting device.