JPH0735577B2 - Continuous strip vacuum deposition equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial field of application) The present invention relates to a metal strip or other strip-shaped surface which is subjected to a physical vapor deposition method such as ion plating in a vacuum.
The present invention relates to a belt-shaped continuous vacuum deposition apparatus for continuously coating ceramics and other thin films.

(Prior Art) Conventionally, A is applied to one or both sides of a strip-shaped material such as a metal strip.
As a continuous vacuum deposition apparatus for continuously depositing l, Ti, etc., a type as shown in FIG. 7 is known.
The continuous vacuum vapor deposition processing apparatus of the type shown in the drawing includes a vacuum vapor deposition chamber 1 which is maintained at a high vacuum for performing vacuum vapor deposition processing,
The vacuum vapor deposition chamber 1 is provided with inlet side and outlet side air locks 2 and 3 which communicate with an inlet 1a and an outlet 1b, respectively, and these air locks 2 and 3 are adjusted to a higher vacuum degree as they are closer to the vacuum vapor deposition chamber 1. And a strip-shaped material 4 such as a metal strip which is continuously made to pass through the inlet 1a and the outlet 1b into the vacuum vapor deposition chamber 1 during the vapor deposition process. It is configured to ensure a vacuum seal for maintaining a high vacuum in the chamber 1.

In the vacuum vapor deposition chamber 1, an evaporation source 5 such as a vapor deposition pot for holding a metal or the like to be vapor deposited in a molten state is provided.

Inlet side airlock 2 and outlet side airlock 3
The coil rewinder 6 and the winder 7 are respectively provided on the outlet side of the
By this, the strip 4 unwound from the coil by the rewinding machine 6 passes from the inlet opening 8 of the inlet side air lock 2 to the outlet opening 9 of the outlet side air lock 3 via the vacuum deposition chamber 1.
Through the vacuum evaporation chamber 1 to vapor-deposit the metal vapor evaporated from the evaporation source 5 on the surface of the strip, and the strip 4 coming out from the outlet opening 9 of the outlet air lock 3 is coiled by the winder 7. It is configured to be wound into a shape.

The internal pressures of the plurality of differential pressure chambers of the inlet side air lock 2 are sequentially different from those of the inlet side end close to the atmospheric pressure so as to maintain the degree of vacuum in the vacuum deposition chamber 1 at a predetermined value. The degree of vacuum inside the chamber is increased, while the internal pressures of the plurality of differential pressure chambers of the air lock 3 on the outlet side are gradually lowered from a predetermined degree of vacuum in the vacuum deposition chamber 1 toward the outlet side end. The differential pressure chamber at the side end is close to atmospheric pressure.

(Problems to be Solved by the Invention) In such a continuous vacuum vapor deposition treatment apparatus, it is necessary to frequently replace the evaporation source installed in the vacuum vapor deposition chamber 1 and replenish the vaporized material. Vapors such as metal evaporated from the evaporation source 5 adhere to vapor deposition equipment and the like installed in the vacuum vapor deposition chamber, and as a result these equipment do not operate normally, so it is necessary to enter the vacuum vapor deposition chamber for cleaning. In addition, maintenance work such as repair of the above-mentioned equipment in the vacuum deposition chamber is required.

However, in the conventional continuous vacuum vapor deposition processing apparatus having the above-mentioned configuration, the high vacuum vacuum vapor deposition chamber is opened to the atmospheric atmosphere in order to perform the above-mentioned maintenance work. Things do not become products,
There is a problem that the product yield decreases, and it takes a long time to return the room to the original vacuum level after completing various maintenance work.
As a result, there is a problem that the operating rate of the equipment is reduced.

SUMMARY OF THE INVENTION The present invention is intended to solve the above problems and provide a continuous vacuum vapor deposition processing apparatus which is improved so as to eliminate a decrease in product yield and a reduction in equipment operating rate caused by performing the various maintenance operations described above.

(Means for Solving Problems) According to the present invention, as shown in FIG. 1, a vacuum chamber 10 that is evacuated to a high vacuum degree and a vacuum deposition process while maintaining a high vacuum in the vacuum chamber are performed. An air lock 2, which is continuously provided on the inlet side and the outlet side of the vacuum chamber 10 so that the power strip 4 can be introduced into the vacuum chamber from the inlet air atmosphere and can be led out from the vacuum chamber into the outlet air atmosphere, 3, and a vacuum chamber 10 which is constantly maintained at a high degree of vacuum through these inlet and outlet air locks 2 and 3 and which is passed through the vacuum chamber 4.
A vapor deposition unit 11 having two elongated vapor deposition chambers 14 and 15 provided in the width direction via a partition wall 13 is provided in the vacuum chamber 10 so as to be movable in the width direction. The front and rear walls 11a and 11b of the unit 11 and the partition wall 13 are provided with openings 16, 17 and 18 which are opened so that the strips do not interfere with each other when the vapor deposition unit 11 moves in the width direction.
One of the deposition chambers 14 and 15 is configured to be switched to the vacuum processing work position A, and the other deposition chamber in the maintenance position with respect to the vacuum chamber 10 and one deposition chamber 14 in the vacuum deposition processing work position A. Sealing device 1 that shuts off 15 airtightly
9,20,21,22,23,24 are provided for the openings 16,17,18, and the inspection door 37 with a sealed door can be directly put in and out of the other vapor deposition chamber 15 at the maintenance position B. 38 is provided.

(Operation) According to the apparatus of the present invention having the above-described configuration, as shown in the figure, one vapor deposition chamber 14 of the vapor deposition unit 11 is positioned at the vacuum vapor deposition operation position A and the vacuum vapor deposition operation is continuously performed. In the meantime, the other vapor deposition chamber 15 is hermetically shut off from the vacuum chamber 10 and the vapor deposition chamber 14 by the sealing devices 20, 22, 23 and 24.
To the atmosphere through the inspection ports 37 and 38 to perform maintenance work inside the vapor deposition chamber 15.After the maintenance work is completed, the inspection ports 37 and 38 are sealed and an appropriate vacuum device is installed inside the vapor deposition chamber 15. It can be used to evacuate to a predetermined high vacuum level.

Therefore, when the maintenance work of the vapor deposition chamber 14 becomes necessary, the sealing devices 20, 22, 23 and 24 are released, the vapor deposition unit 11 is moved in the vacuum chamber 10 in the width direction of the strip 4,
Position the other vapor deposition chamber 15 at the vacuum vapor deposition processing work position A,
This allows the vacuum deposition process operation to be performed substantially continuously.

Then, the evaporation chamber 14 moved to the maintenance position B can be maintained in the same manner as described above for the evaporation chamber 15.

As described above, according to the present invention, the belt-like material is always held in the high vacuum atmosphere, so that the generation of defective products due to the maintenance work can be completely eliminated, and the down time of the device due to the maintenance work can be eliminated. Can be almost eliminated, and the operating rate of equipment can be improved.

(Embodiment) FIGS. 1 to 6 show an embodiment of the present invention.

In the illustrated example, as shown in FIG. 1, a vacuum chamber 10 that is evacuated to a high vacuum and a strip 4 to be vacuum-deposited while maintaining a high vacuum in the vacuum chamber are vacuumed from the inlet side atmospheric atmosphere. The vacuum chamber 10 is equipped with air locks 2 and 3 that are continuously provided on the inlet side and the outlet side of the vacuum chamber 10 so that the vacuum chamber 10 can be introduced into the chamber and discharged from the vacuum chamber into the atmosphere on the outlet side. As shown in FIG. 7, for example, the width of the strip 4 is elongated to the left and right to be about three times the width of the conventional vacuum deposition chamber 1 shown in FIG. A vapor deposition unit 11 having a width about twice that of the chamber 1 is provided so as to be movable in the width direction of the strip 4 by appropriate driving means and wheels 12, and the interior of the vapor deposition unit is, as shown in FIG.
Two vapor deposition chambers 14 and 1 partitioned by the partition wall 13 in the width direction
5 are provided side by side in the width direction, whereby the vapor deposition unit 1
1 is moved in the vacuum chamber 10 in the width direction of the strip 4 to move the vapor deposition chamber 14,
Set the position of one of the 15 deposition chambers to the vacuum deposition work position A.
From the maintenance position B to the vacuum deposition work position A at the same time as switching from the maintenance position B to the maintenance position B.
It is configured to be switched to. Evaporation sources and other vapor deposition equipment (not shown) are provided inside the vapor deposition chambers 14 and 15, respectively.

The front and rear walls 11a and 11b and the partition wall 13 of the vapor deposition unit 11 include
When the vapor deposition unit 11 is moved in the vacuum chamber 10 in the width direction of the strip 4 and the positions of the vapor deposition chambers 14 and 15 are exchanged, openings 16, 17 and 18 are provided so as not to interfere with the strip 4. When one of the vapor deposition chambers 14 and 15 is located at the vacuum vapor deposition work position A, the other vapor deposition chamber located at the maintenance position B is airtightly shielded from the vacuum chamber 10 and the one vapor deposition chamber. Vapor deposition chambers 1 with openings 16 and 17 in 11a and 11b
A partition wall 1 between the sealing devices 19, 20 and 21, 22 and the vapor deposition chambers 14, 15 capable of separately sealing the opening portions to the respective 4, 15
3, a sealing device 23 capable of sealing the opening 18 of 3, and the openings 16 and 17 and the opening.
A corner sealing device 24 capable of sealing a portion where the ends of 18 intersect with each other is provided. The sealing devices 19 to 22 have the same structure. For example, as shown in FIGS. 4 and 5, the sealing device 19 has an elevating door 25 that opens and closes an opening 16a that opens to the vapor deposition chamber 14 from above and below. The vapor deposition unit 11 is guided by a guide member (not shown) fixed to the outer wall of the vapor deposition chamber 14 to be slidable up and down along the outer wall of the vapor deposition chamber and fixed to the outer wall of the vapor deposition chamber. Upper and lower cylinder devices 27 and 28 are connected to operate the upper and lower doors 25 and 26, respectively.

As shown in FIG. 6, the sealing device 23 has an elevating door 30 capable of closing the opening 18 provided in the partition wall 13.
The cylinder device 31 is configured to be slidable up and down along the surface of the partition wall to open and close the opening 18, and the corner sealing device is provided at both ends of the lift door 30 of the partition wall opening sealing device 23.
24 corner sealing block pieces 32 are provided to be opened and closed by a cylinder device 33.

As shown in FIG. 3, in order to release the inside of the vapor deposition chamber 15 in the maintenance position in the vacuum chamber 10 to the atmosphere so that the vapor deposition chamber 15 can be moved in and out from the outside of the vacuum chamber 10, Fitting portions 35 are provided at both ends, fitting portions 36 capable of airtightly fitting with the fitting portions 35 are provided at both ends of the vacuum chamber 10, and inspection ports 37 and 37 are provided on both end walls of the vacuum chamber 10 and the vapor deposition unit 11, respectively. 38 are provided, and these inspection ports 37 and 38 are closed doors.
It is closed by 39 and 40 so that it can be opened and closed.

With the above configuration, for example, when one of the vapor deposition chambers 14 of the vapor deposition unit 11 is positioned at the vacuum vapor deposition work position as shown in the figure, an opening that opens to the other vapor deposition chamber 15 by an automatic control button operation or the like. Sealing device for parts 16 and 17 2
The vapor deposition chamber 15 is airtightly shut off from the vacuum chamber 10 and the vapor deposition chamber 14 by closing the sealing device 23 and the corner sealing device 24 of the opening 18 of the partition wall 13 at 0, 22, and therefore the vapor deposition chamber 14 is closed.
While performing the vacuum deposition process of the strip 4 using
It is possible to perform maintenance work inside the vapor deposition chamber 15 by opening the vapor deposition chamber 15 to the atmosphere via the inspection ports 37 and 38.

(Effects of the Invention) According to the present invention, the belt-like material during the vacuum vapor deposition process is always kept in a high vacuum atmosphere, and therefore it is possible to completely eliminate the occurrence of defective products due to the maintenance work, and to perform the maintenance work. The downtime of the device can be substantially eliminated, and the operating rate of the equipment can be improved.

[Brief description of drawings]

FIG. 1 is a diagrammatic longitudinal sectional view of the whole processing apparatus according to the present invention, FIG. 2 is a partial transverse sectional view shown as a section on the line II-II in FIG. 1, and FIG. 3 is III- in FIG. FIG. 4 is a front view of the vapor deposition unit, FIG. 5 is an end view of the vapor deposition unit as seen from the line VV of FIG. 4, and FIG. 6 is VI of FIG. FIG. 7 is a diagrammatic vertical sectional view of the entire conventional processing apparatus. 2 ... Inlet air lock, 3 ... Outlet air lock 4 ... Band, 10 ... Vacuum chamber 11 ... Deposition unit, 12 ... Wheels 13 ... Partition wall, 14, 15 ... Deposition chamber 16, 17, 18 ... Opening, 19 , 20,21,22,23,24 ... Sealing device

Claims (1)

[Claims] 1. A vacuum chamber that is evacuated to a high vacuum, and a strip to be vacuum-deposited while introducing a high vacuum inside the vacuum chamber is introduced into the vacuum chamber from the inlet side atmospheric atmosphere, and in the outlet side atmospheric atmosphere. In a continuous vacuum deposition apparatus for belt-shaped material, which comprises an air lock continuously provided on the inlet side and the outlet side of the vacuum chamber so that it can be led out from the vacuum chamber, a high pressure is constantly applied via the inlet and outlet air locks. A vacuum chamber maintained at a vacuum degree is formed elongated in the width direction of a strip passing through the vacuum chamber, and a vapor deposition unit in which two vapor deposition chambers are provided in the width direction via partition walls is provided in the width direction. Movably provided in the vacuum chamber, the front and rear walls of the vapor deposition unit and the partition wall are provided with openings so as not to interfere with the band-shaped object when the vapor deposition unit moves in the width direction, whereby the vapor deposition chamber Noizu A sealing device configured to switch one of them to a vacuum processing work position and to hermetically shut off one of the vacuum chamber and the other deposition chamber in the maintenance position from the other one in the vacuum deposition work position. Is provided for the opening, and an inspection port with a closed door is provided in the other vapor deposition chamber at the maintenance position so that the inspection port can be directly put in and out from the outside.