JPH0736612B2 - Mounting structure for solid-state image sensor - Google Patents

Description

TECHNICAL FIELD The present invention relates to a mounting structure for a solid-state imaging device.

[Prior art]

Conventional attachment structures of this type include, for example, the one shown in FIG. 1 and the one shown in FIG.

In FIG. 1, reference numeral 1 is a solid-state image sensor fixed to a base plate 2,
Reference numeral 3 is a circuit board, which is fixed to the base plate 2 via an insulating plate 10. The pin 1a of the solid-state imaging device 1 is electrically connected to the circuit board 3 and is in a state of being driven. The base plate 2 is fixed to the holding member 5 with screws 6, whereby the image pickup surface of the solid-state image pickup device 1 is fixed. 4 is a circuit board 3
It is a drive IC attached to.

In FIG. 2, as in FIG. 1, the solid-state image pickup device 1 has a base plate 2
The base plate 2 is fixed to the holding member 5 by means of screws 6 at a plurality of positions via springs 7. Since the spring 7 is interposed in a compressed state, the base plate 2 is spring-biased in the longitudinal direction of the screw 6 and is elastically fixed to the holding member 5. Then, the amount of compression of the spring 7 can be varied by tightening or loosening the screw 6 to adjust the tilt of the solid-state imaging device 1. Other configurations are the same as those in FIG.

By the way, in general, when the solid-state image pickup device 1 is driven at a high temperature, a dark current increases, which becomes noise and appears on the screen, which is very unsightly. Further, the drive IC 4 for driving the solid-state image pickup device 1 becomes extremely high in temperature when a current is applied, but the heat generated at this time is transmitted from the circuit board 3 to the solid-state image pickup device 1 via the pin 1a. As a result, the temperature of the solid-state imaging device 1 becomes high, which causes deterioration of image quality. Therefore, it is necessary to take some heat dissipation measures for the solid-state imaging device 1.

From this point of view, looking at the mounting structure of FIGS. 1 and 2, in FIG. 1, the heat transmitted to the solid-state image sensor 1 is
The structure is such that it is transmitted to the holding member 5 via the base plate 2 that is in contact therewith. Also, to make it easier to transfer heat,
A metal material having good thermal conductivity is used for the base plate 2 and the holding member 5. In FIG. 2, the heat of the solid-state image sensor 1 is similarly transferred to the base plate 2, but the contact area between the base plate 2 and the screws 6 and the springs 7 is small from the base plate 2 to the holding member 5. I can only get it. As a result, the heat from the solid-state image sensor 1 is mostly contained in the base plate 2.

Therefore, in FIG. 1, the heat is surely escaped easily, but since metal is selected as the material of the parts, it is necessary to add fins or the like to increase the surface area in consideration of more effective heat dissipation. However, adding fins causes a large amount of wasted space, resulting in a large product. This becomes a big problem in the miniaturization of products. Of course, a large surface area can be obtained even with a structure in which a metal part is used to radiate heat without attaching fins. However, with this method, it is possible to reduce the size, but the weight is heavy and it is difficult to use, and the cost is high and the product is disadvantageous in price. Further, since the base plate 2 to which the solid-state image pickup device 1 is attached is directly fixed to the holding member 5, the tilt adjustment of the device 1 cannot be performed and the focus cannot be accurately obtained.

On the other hand, in FIG. 2, although the tilt adjustment of the solid-state image pickup device 1 can be performed, as described above, heat is accumulated in the base plate 2 and heat is not effectively radiated from here. That is, the heat of the solid-state imaging device 1 is transferred to the base plate 2, but is transferred only slightly from the base plate 2 to the holding member 5 because the contact area between the base plate 2 and the screws 6 and the springs 7 is small. As a result, the temperature of the solid-state image sensor 1 will rise.

Further, as can be said in both FIG. 1 and FIG. 2, both have a structure in which heat is radiated from the solid-state imaging device 1 itself. In this structure, heat is transferred to the solid-state image sensor 1 through the pin 1a, the solid-state image sensor 1, and the ground plane 2 in this order, so that it is a preferable structure from the viewpoint of heat dissipation of the solid-state image sensor 1 itself. Absent.

In short, in the mounting structure shown in FIG. 1, heat dissipation of the solid-state image sensor 1 is relatively easy, but if the effect is further enhanced, the weight becomes heavy and it becomes difficult to use, resulting in high cost. The tilt adjustment of 1 cannot be performed. on the other hand,
In the mounting structure shown in FIG. 2, tilting adjustment of the solid-state image pickup device 1 can be performed, but sufficient heat dissipation cannot be performed for the reason described above. In addition, both of the drawbacks are common to both structures, but neither of them is very effective as a heat dissipation structure.

As a means for solving such a problem, a mounting structure as shown in FIG. 3 can be considered.

In FIG. 3, 1 is a solid-state image sensor, 2 is a base plate to which the solid-state image sensor 1 is fixed, 3 is a circuit board on which the solid-state image sensor 1 is attached by pins 1a, and 4 is a drive IC for driving the solid-state image sensor 1. It is attached to the substrate 3. Reference numeral 5 is a holding member for holding the base plate 2, and the base plate 2 is attached to the holding member 5 with screws 6. Reference numeral 7 denotes a spring fitted into the screw 6 and interposed between the base plate 2 and the holding member 5 by compression, whereby the base plate 2 is elastically fixed to the holding member 5. If the compression amount of the spring 7 is changed by tightening or loosening the screw 6, the tilt of the solid-state image pickup device 1 can be adjusted.

Reference numeral 8 is a heat radiating plate, and 9 is a spacer interposed between the circuit board 3, the heat radiating plate 8 and the ground plane 2. The spacer 9 is made of a heat insulating material having a low heat conductivity, which makes it difficult to transfer heat between the substrate 3 and the heat radiating plate 8 and between the heat radiating plate 8 and the base plate 2.

The pin 1a of the solid-state image sensor 1 is inserted into a hole 8b of a heat dissipation plate 8 described later and attached to the circuit board 3. This heat dissipation plate 8 uses a substrate having a high thermal conductivity and good insulation such as a ceramic substrate or an enamel substrate. The circuit board 3 has a structure as shown in FIG. 4 as shown in FIG. The pattern 8a has a hole 8b through which the pin 1a of the solid-state image sensor 1 is inserted. The holes 8b are formed so that the pins 1a are electrically insulated from each other. Further, the pin 1a inserted into the hole 8b is soldered to enhance the adhesion with the heat dissipation plate 8 and facilitate heat transfer.

However, in such a mounting structure, since an insulating substrate is used as the heat dissipation plate, the thermal conductivity is lower than that of a conductive metal, and effective heat dissipation may not be possible.

〔Purpose〕

The present invention has been made to solve such conventional problems, and an object of the present invention is to provide a mounting structure for a solid-state image sensor capable of effectively and surely dissipating heat and suppressing temperature rise of the solid-state image sensor. It is what

〔Example〕

FIG. 5 shows an embodiment of the present invention. FIG. 5 (a) is a view as seen from a direction perpendicular to the optical axis, and FIG. 5 (b) is a direction as seen from the optical axis direction. It is a sectional view between 12b and 12c.

In the figure, 1 is a solid-state image sensor, 2 is a base plate to which the solid-state image sensor 1 is fixed, 3 is a circuit board on which the solid-state image sensor 1 is attached by pins 1a, and 4 is a drive IC for driving the solid-state image sensor 1.
It is attached to the circuit board 3. Reference numeral 5 is a holding member for holding the base plate 2, and the base plate 2 is attached to the holding member 5 with screws 6. Reference numeral 7 denotes a spring fitted into the screw 6 and interposed between the base plate 2 and the holding member 5 by compression, whereby the base plate 2 is elastically fixed to the holding member 5. By tightening or loosening the screw 6, the spring 7
The tilt of the solid-state image sensor 1 can be adjusted by changing the amount of compression.

In this embodiment, a heat conductive heat dissipation sheet 11 having an insulating property,
For example, the heat from the circuit board 3 is made to pass through the pin 1a by using "Electronized boron nitride" (product name) manufactured by Denki Kagaku Kogyo and "Electrical heat dissipation sheet" (product name) made of silicon rubber. The heat dissipation plates 12a, 12b, 12c are guided to and radiated from the heat dissipation plates 12a, 12b, 12c, and the heat transfer to the solid-state imaging device 1 is suppressed.

That is, the pin 1a is sandwiched by the heat dissipation sheet 11, the heat dissipation sheet 11 is further sandwiched by the heat dissipation plates 12a, 12b, 12c, and tightened with the screws 13, so that the pin 1a and the heat dissipation sheet 11 and the heat dissipation sheet 11 and the heat dissipation plates 12a, 12b. , 12c to increase the contact area to improve heat transfer from the circuit board 3 to the heat sinks 12a, 12b, 12c, and to dissipate heat from there, and to suppress heat transfer to the solid-state image sensor 1. It was done. As for the heat sink, if the surface of the heat sink is made uneven to increase the surface area like the heat sink 13 of FIG. 6, the heat dissipation effect can be further enhanced.

〔effect〕

As described above, according to the present invention, the drive IC which is transmitted to the solid-state imaging device via the pin and the circuit board.
Most of the heat from the heat dissipation plate is transferred to and dissipated from this heat dissipation plate, but it is also a structure that is in contact with the terminals and the heat dissipation plate and that has a member with insulation and high thermal conductivity. By doing so, a metal plate or the like having a high thermal conductivity can be used as the heat dissipation plate, so that effective heat dissipation and temperature rise suppression of the solid-state imaging device can be achieved.

[Brief description of drawings]

1 and 2 are side views of a conventional solid-state image sensor mounting structure, FIG. 3 is a side view of a solid-state image sensor mounting structure for explaining the background of the present invention, and FIG. 4 is heat dissipation in FIG. 5 is a front view of the plate, FIG. 5 shows an embodiment of the present invention, FIG. 5 (a) is a plan view, FIG. 5 (b) is a front view of the main part of FIG. 6 (a), and FIG. 6 is FIG. 2A and 2B show another embodiment of the heat radiating plate, in which FIG. 1A is a front view and FIG. 2B is a side view. Reference numeral 1 is a solid-state image sensor, 2 is a base plate, 3 is a circuit board, 5 is a holding member, 11 is a heat dissipation sheet, and 12a, 12b, 12c and 13 are heat dissipation plates.

Claims (1)

[Claims] 1. A solid-state image sensor for picking up an image of a subject, a mounting member for mounting the solid-state image sensor, angle adjusting means for adjusting a relative angle between the mounting member and incident light, and driving the solid-state image sensor. In a mounting structure of a solid-state imaging device having a driving unit for driving the solid-state imaging device and a terminal for connecting the solid-state imaging device and the driving unit, a heat dissipation plate provided between the solid-state imaging device and the driving unit and having high thermal conductivity. And a mounting member which is in contact with the terminal and the heat dissipation plate and has an insulating property and a high thermal conductivity.