JPH0736762B2 - Injection molding method for conductive shoes - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an injection molding method for conductive shoes.

[0002]

2. Description of the Related Art Conventionally, in the injection molding method of conductive shoes,
What uses conductive woven cloth woven with conductive thread as the insole, or multiple small holes are provided in the insole, and the shoe sole molding material is injected into these small holes by injection pressure during shoe sole injection molding. It is known that a part of the shoe sole is introduced and exposed inside the shoe.

However, the cost of using a conductive woven fabric as the insole is high, and those having a small hole in the insole must be punched to make a small hole. The strength decreases, and the insole is stretched and deformed excessively when suspended, and the insole cannot be held in close contact with the bottom of the shoe mold. It is irregularly exuded and exposed on the upper surface of the insole,
There is a defect that the appearance is deteriorated or the shape of the shoe is deformed due to the deformation of the insole after the shoe sole is molded.

[0004]

SUMMARY OF THE INVENTION The present invention is intended to provide a conductive shoe having a good appearance by an injection molding method at a low cost.

[0005]

The present invention will be described below with reference to the drawings showing an embodiment of the present invention. In the present invention, a cover 1 having a cover 11 and an insole 12 sewn in a bag is hung in a shoe mold 2 and a conventional method is used. In the method of injection-molding the electrically conductive shoe sole 3 on the scabbard part 1, the basis weight of the insole 12 is 45 to 220 g / m ² , the air flow rate is 30 to 300 cc / cm ² / sec, and the tensile strength is 5 kg.
/ 5 cm or more, a long-fiber non-woven fabric having a lower surface partially thermocompression-bonded to form irregularities on the lower surface is used, and a shoe sole molding material is formed on the lower surface of the midsole 12 by injection pressure during molding of the shoe sole 3. The subject matter of the present invention is an injection molding method of a conductive shoe, which is characterized in that it is made to intrude into unevenness, and at the same time, is extruded to the upper surface of the insole 12 through the tissue gap of the nonwoven fabric forming the insole 12. .

In the present invention, the cover 11 is made of a commonly used material such as cloth, synthetic resin leather, leather, etc., and the non-woven fabric forming the insole 12 is polyamide, polyester, polyacrylic or polyolefin. Or a combination of two or more kinds of thermoplastic long fibers such as polyvinyl series, or these thermoplastic fibers, natural fibers such as cotton, suf, hemp, artificial fibers such as viscose rayon and cupra, polyurethane Thermoplastic fibers are partially heat-melted so that air permeability is maintained in the mixture of system fibers, and the fibers are partially heat-welded, or the fibers are partially bonded using an adhesive as a binder. The one that is adhesively bonded is used.

In the present invention, the weight of the insole 12 is set to 45.
The reason for limiting to 220 g / m ² is that if the basis weight is less than that, the shoe sole molding material forms a film layer that exudes during shoe sole injection molding, and the hygroscopicity and foot contact of the insole 12 are lost. This is because, when the sole weight is more than that, the shoe sole molding material cannot be sufficiently permeated into the upper surface of the insole when the shoe sole is molded, and there is a drawback that conductivity is lowered.
Further, in the present invention, the ventilation amount of the insole 12 is 30 to 300 cc /
The reason for limiting to cm ² / sec is that if the ventilation amount is less than that, the shoe sole molding material cannot be sufficiently permeated into the upper surface of the insole 12 at the time of molding the shoe sole, the conductivity is lowered, and the ventilation amount is reduced. On the contrary, when the shoe sole molding is more than that, there is a drawback that the shoe sole molding material penetrates the insole 12 at the time of molding the sole and a film layer is formed on the upper surface of the insole 12, and the hygroscopicity and foot contact property of the insole 12 are lost. Because there is. Further, the tensile strength of the insole 12 is limited to 5 kg / 5 cm or more, because when the tensile strength is less than that, the insole 12 is excessively stretched and deformed when the hem part 1 is suspended in a shoe mold. The bottom 12 cannot be adhered to the bottom surface of the shoe mold, and when molding the shoe sole, the midsole 1
This is because wrinkles are formed on the upper surface of the shoe 2, the sole molding material is unevenly permeated into the upper surface of the insole 12, and the appearance is deteriorated and the shoe is deformed after the sole is molded.

In the present invention, the cover 11 and the insole 12 are sewn in a bag shape by a conventional method to prepare the cover 1,
The skirt 1 thus prepared is hung in the shoe mold 2 in a conventional method in the shoe molding process, and the shoe sole molding material is injected onto the surface of the skirt to mold the shoe sole 3.

As the shoe sole molding material, vinyl chloride resin, thermoplastic rubber, polyurethane, etc. are usually used for injection molding of shoe soles, and the electric insulation resistance value after molding the shoe sole is 1.0 ×. What is set so that 10 ⁵ Ω <R <1.0 × 10 ⁸ Ω is used.

[0010]

[Examples] As a cover 11, a laminated cloth of a front cloth made of a rayon and French rack cloth woven from a mixed yarn of rayon and cotton and a back cloth made of a cotton lekotte cloth is used. Using a spunbonded non-woven fabric made of thermoplastic type polyester filament manufactured by Toray Industries, Inc. of Example 1.2 shown in a separate table as the bottom 12, the bag-shaped scabbard part 1 is formed by sewing, and this is sewn. Suspend in the shoe mold 2 and use a conventional shoe sole molding material containing conductive vinyl chloride as the main component.
A shoe sole 3 was welded and formed on the lower surface of the sulcus 1, and this was used as Comparative Example 1.
The insole 12 shown in FIG. 2 was used to measure the electric resistance value based on the test method of JIS T8103 safety work shoes for static electricity prevention, as compared with a shoe having a shoe sole formed in the same manner as in the example. The separate table is shown in the right column, and at the same time, the appearances are compared and shown in the right column of the separate table.

[0011]

[Table 1]

[0012]

Since the present invention is constructed as described above, the outer appearance can be obtained by a method similar to the molding of a normal injection-molded shoe by simply selecting the insole 12 as can be seen from the right column of the attached table. Excellent conductivity without lowering, and insole 1
Since unevenness is formed on the lower surface of the shoe 2, the shoe sole 3 is formed so as not to be uneven when the shoe sole 3 is molded, and a shoe having excellent joint strength between the scapular part 1 and the shoe sole 3 can be provided at low cost. .

[Brief description of drawings]

FIG. 1 is a sectional view of an essential part showing an injection-molded state of a conductive shoe according to the present invention.

[Explanation of symbols]

 1.胛 部 11 ... 蛛 cover 12 ... insole 2. Shoe shape 3. Shoe sole

Continuation of the front page (51) Int.Cl. ⁶ Identification number Office reference number FI technical display location A43D 86/00 B29C 45/14 8823-4F B29D 31/50 // B29L 31:50

Claims (1)

[Claims] 1. A hem part 1 in which a garment cover 11 and a midsole 12 are sewn in a bag.
In the method of suspending the shoe sole 2 in the shoe mold 2 and injection-molding the conductive shoe sole 3 on the crease part 1 by a conventional method, the basis weight 4 is set as the insole 12.
5 to 220 g / m ² , ventilation amount 30 to 300 cc / cm ²
/ S, tensile strength of 5 kg / 5 cm or more, using a long-fiber non-woven fabric with the lower surface partially thermocompressed to form irregularities on the lower surface, and the sole material is molded by injection pressure when molding the sole 3. An injection molding method for a conductive shoe, characterized in that unevenness formed on the lower surface of the sole 12 is embedded therein and, at the same time, it is exuded to the upper surface of the insole 12 through the tissue gap of the nonwoven fabric forming the insole 12.