JPH0737149B2 - IC mounting structure for thermal printing head - Google Patents
IC mounting structure for thermal printing headInfo
- Publication number
- JPH0737149B2 JPH0737149B2 JP21464286A JP21464286A JPH0737149B2 JP H0737149 B2 JPH0737149 B2 JP H0737149B2 JP 21464286 A JP21464286 A JP 21464286A JP 21464286 A JP21464286 A JP 21464286A JP H0737149 B2 JPH0737149 B2 JP H0737149B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- wiring pattern
- external connection
- signal cable
- cable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007651 thermal printing Methods 0.000 title description 2
- 239000000758 substrate Substances 0.000 claims description 28
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 description 8
- 230000001681 protective effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Landscapes
- Electronic Switches (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は、熱転写型プリンタや感熱紙型プリンタに用い
る熱印字ヘッドのIC取付け構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC mounting structure of a thermal print head used in a thermal transfer printer or a thermal paper printer.
（従来の技術） この種の熱印字ヘッドの一例を第３図に示した。この図
において、熱印字ヘッドはシリアル型であって、絶縁性
の基板20上には、発熱抵抗体21が列設されると共に、こ
の発熱抵抗体21の駆動回路を構成するIC22が取り付けら
れている。発熱抵抗体21の各印字ドット単位は、基板20
上の配線パターン23を介して、IC22の出力側電極22aに
導かれている。また、IC22の入力側の電極22bには、基
板20上の他方の配線パターン24を介して、外部接続用信
号ケーブルであるフレキシブルケーブル25の配線パター
ン26が接続されている。ここで、IC22の電極22a,22bと
各配線パターン23、24との間は、ボンディングワイヤ2
7、28により接続され、かつ、フレキシブルケーブル25
は基板20の端部に熱圧着されている。さらに、IC22の表
面部と、ケーブル端部25aとは、各別に保護樹脂コート2
9,30によりそれぞれ覆われている。(Prior Art) An example of this type of thermal print head is shown in FIG. In this figure, the thermal print head is a serial type, and a heating resistor 21 is arranged in a row on an insulating substrate 20, and an IC 22 that constitutes a drive circuit of this heating resistor 21 is attached. There is. Each print dot unit of the heating resistor 21 is the substrate 20
It is led to the output side electrode 22a of the IC 22 through the upper wiring pattern 23. A wiring pattern 26 of a flexible cable 25, which is a signal cable for external connection, is connected to the input side electrode 22b of the IC 22 via the other wiring pattern 24 on the substrate 20. Here, the bonding wire 2 is provided between the electrodes 22a and 22b of the IC 22 and the wiring patterns 23 and 24.
Flexible cable 25 connected by 7, 28
Is thermocompression bonded to the end of the substrate 20. Furthermore, the surface of the IC 22 and the cable end 25a are separately protected by a protective resin coat 2
Covered by 9,30 respectively.
（発明が解決しようとする問題点） 従来の構成では、IC22のダイボンディング工程、ワイヤ
ボンディング工程、そしてIC22部分および基板20端部で
の保護樹脂コート29、30の形成工程、というように工程
数が多く、したがってコストアップを招来した。(Problems to be Solved by the Invention) In the conventional configuration, the number of steps is the die-bonding step of the IC22, the wire-bonding step, and the step of forming the protective resin coats 29 and 30 at the IC22 part and the end of the substrate 20. However, the cost was increased.
また、ケーブル端部25aがIC22から離れた位置で基板20
に取付けられるため、基板サイズが大きくなる問題点も
あった。In addition, when the cable end 25a is away from the IC 22, the board 20
There is also a problem that the size of the board becomes large because it is attached to the.
本発明はこのような問題点に鑑みて、コストダウンを図
り、また基板サイズを縮小できる熱印字ヘッドのIC取付
け構造を提供することを目的としている。In view of such problems, an object of the present invention is to provide an IC mounting structure for a thermal print head which can reduce the cost and can reduce the substrate size.
（問題点を解決するための手段） 前記問題点を解決するため、本発明は、基板上にICの一
部の電極に対応する配線パターンを、また外部接続用信
号ケーブルに前記ICの他の電極に対応する配線パターン
をそれぞれ形成し、前記基板上に前記外部接続用信号ケ
ーブルを重合し、かつ前記の基板および外部接続用信号
ケーブルにまたがってバンプを有するICを配置すると共
に、このICの各バンプを基板および外部接続用信号ケー
ブルの各配線パターンに熱圧着し、該IC上に基板と外部
接続用信号ケーブルとにまたがる樹脂コートを施した。(Means for Solving Problems) In order to solve the above problems, the present invention provides a wiring pattern corresponding to a part of electrodes of the IC on a substrate and a signal cable for external connection of the other ICs. Wiring patterns corresponding to the electrodes are respectively formed, the external connection signal cable is superposed on the substrate, and an IC having a bump is arranged across the substrate and the external connection signal cable, and the IC Each bump was thermocompression bonded to each wiring pattern of the substrate and the external connection signal cable, and a resin coat was applied on the IC so as to extend over the substrate and the external connection signal cable.
（作用） 上記構成によれば、ICの各バンプが基板上の配線パター
ンと外部接続用信号ケーブルの配線パターンとにそれぞ
れ接続された状態で、ICと基板と外部接続用信号ケーブ
ルの三者が樹脂コートにより相互に結合される。(Operation) According to the above configuration, the IC, the board, and the external connection signal cable are connected to each other in a state where the bumps of the IC are connected to the wiring pattern on the board and the wiring pattern of the external connection signal cable, respectively. They are bonded to each other by a resin coat.
（実施例） 以下、本発明を図面に示す実施例に基づいて詳細に説明
する。(Example) Hereinafter, the present invention will be described in detail based on an example shown in the drawings.
第１図は、この実施例に係るシリアル型熱印字ヘッドの
側面図であり、また、第２図はその正面図である。FIG. 1 is a side view of a serial type thermal print head according to this embodiment, and FIG. 2 is a front view thereof.
これらの図において、熱印字ヘッドはセラミックやアル
ミナ等からなる絶縁性基板１を備える。この基板１は短
形状平板で、その表面には、印字ドット部2aを一列に連
続させてなる発熱抵抗体２と、この発熱抵抗体２の各印
字ドット部単位に接続される配線パターン３とが形成さ
れている。外部接続用信号ケーブルであるフレキシブル
ケーブル５の一端部は、その配線パターン４を基板１と
は反対側に向けて基板１の一端部に重合されている。IC
6は、フレキシブルケーブル５側から入力される制御信
号にもとづいて発熱抵抗体１を駆動するもので、一面部
に基板１側の配線パターン３に対応するバンプ7aと、フ
レキシブルケーブル５側の配線パターン４に対応するバ
ンプ7bとを備えている。そして、このIC6は、基板１と
フレキシブルケーブル５の両者にまたがって、片側列の
バンプ7aにより基板１側配線パターン３に、また他の片
側列のバンプ7bによりフレキシブルケーブル５側配線パ
ターン４にそれぞれ熱圧着されている。また、ケーブル
端部5aはIC6と共に同一の保護樹脂コート８により被わ
れている。９は基板１の裏面に設けられた放熱板であ
る。In these figures, the thermal print head comprises an insulating substrate 1 made of ceramic, alumina or the like. The substrate 1 is a short flat plate, on the surface of which a heating resistor 2 in which printing dot portions 2a are continuous in a row, and a wiring pattern 3 connected to each printing dot portion of the heating resistor 2 are formed. Are formed. One end of the flexible cable 5, which is a signal cable for external connection, is overlapped with one end of the substrate 1 with the wiring pattern 4 facing the side opposite to the substrate 1. I c
6 is for driving the heating resistor 1 based on a control signal input from the flexible cable 5 side, and bumps 7a corresponding to the wiring pattern 3 on the substrate 1 side on one surface and a wiring pattern on the flexible cable 5 side. And bumps 7b corresponding to No. 4 are provided. The IC 6 extends over both the substrate 1 and the flexible cable 5 to the wiring pattern 3 on the substrate 1 side by the bumps 7a on one side row, and on the wiring pattern 4 on the flexible cable 5 side by the bumps 7b on the other side row. It is thermocompression bonded. The cable end portion 5a is covered with the same protective resin coat 8 together with the IC 6. Reference numeral 9 is a heat dissipation plate provided on the back surface of the substrate 1.
上記構成では、バンプ7a、7bと配線パターン３、４間の
接続は、IC6に対する１回の熱圧着工程により一度に行
うことができる。また、IC6を基板１とフレキシブルケ
ーブル５間にまたがって配置するので、つまりケーブル
端部5aをIC6下部まで引込んだ状態とするので、IC6の発
熱抵抗体２からの離間距離が定まっている場合、基板１
の長さは従来例のものより短くなり、基板サイズは縮小
される。In the above configuration, the connection between the bumps 7a and 7b and the wiring patterns 3 and 4 can be made at once by one thermocompression bonding process for the IC6. In addition, since the IC 6 is arranged so as to straddle between the substrate 1 and the flexible cable 5, that is, the cable end 5a is pulled down to the lower part of the IC 6, so that the separation distance of the IC 6 from the heating resistor 2 is fixed. , Substrate 1
Is shorter than that of the conventional example, and the substrate size is reduced.
（効果） 以上のように、本発明の熱印字ヘッドのIC取付け構造に
よれば、バンプ付きICを採用して、そのICと基板および
外部接続用信号ケーブルの配線パターン間を１回の熱圧
着工程により一度に接続でき、かつ前記ICを基板と外部
接続用信号ケーブルにわたって配置して、ICとケーブル
端部を同一の保護樹脂コートにより被覆できる構成とし
たことにより、工程数が少なくて、コストダウンが可能
である。(Effect) As described above, according to the IC mounting structure of the thermal printing head of the present invention, the bumped IC is adopted, and the IC and the wiring pattern of the board and the signal cable for external connection are subjected to thermocompression once. The number of steps is small and the cost can be reduced by making it possible to connect at a time by the process, and by arranging the IC across the board and the signal cable for external connection and covering the IC and the cable end with the same protective resin coat. Down is possible.
さらに、前記のようにICを基板と外部接続用信号ケーブ
ルにわたって配置、つまりケーブル端部をIC下部まで引
込む状態とすることにより、基板サイズを縮小できる効
果も得られる。Further, by arranging the IC over the substrate and the signal cable for external connection as described above, that is, by bringing the end of the cable into the lower part of the IC, the effect of reducing the substrate size can be obtained.
第１図は、本発明の一実施例にかかる熱印字ヘッドの、
側面図、第２図は、その正面図、第３図は、従来例の平
面図である。 １……基板、２……発熱抵抗体、 ３、４……配線パターン、 ５……フレキシブルケーブル（外部接続用信号ケーブ
ル）、 ６……IC、7a、7b……バンプ ８……保護樹脂コート。FIG. 1 shows a thermal print head according to an embodiment of the present invention.
A side view, FIG. 2 is a front view thereof, and FIG. 3 is a plan view of a conventional example. 1 ... Substrate, 2 ... Heating resistor, 3, 4 ... Wiring pattern, 5 ... Flexible cable (signal cable for external connection), 6 ... IC, 7a, 7b ... Bump 8 ... Protective resin coat .
Claims (1)
ターンを、また外部接続用信号ケーブルに前記ICの他の
電極に対応する配線パターンをそれぞれ形成し、前記基
板上に前記外部接続用信号ケーブルを重合し、かつ前記
の基板および外部接続用信号ケーブルにまたがってバン
プを有するICを配置すると共に、このICの各バンプを基
板および外部接続用信号ケーブルの各配線パターンに熱
圧着し、該IC上に基板と外部接続用信号ケーブルとにま
たがる樹脂コートを施したことを特徴とする熱印字ヘッ
ドのIC取付け構造。1. A wiring pattern corresponding to a part of electrodes of an IC is formed on a substrate, and a wiring pattern corresponding to other electrodes of the IC is formed on a signal cable for external connection, and the external pattern is formed on the substrate. An IC having bumps is arranged by overlapping the connection signal cable and straddling the board and the external connection signal cable, and each bump of this IC is thermocompression bonded to each wiring pattern of the board and the external connection signal cable. An IC mounting structure for a thermal print head, characterized in that a resin coat is provided on the IC to cover the substrate and the signal cable for external connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21464286A JPH0737149B2 (en) | 1986-09-11 | 1986-09-11 | IC mounting structure for thermal printing head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21464286A JPH0737149B2 (en) | 1986-09-11 | 1986-09-11 | IC mounting structure for thermal printing head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6369662A JPS6369662A (en) | 1988-03-29 |
| JPH0737149B2 true JPH0737149B2 (en) | 1995-04-26 |
Family
ID=16659131
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21464286A Expired - Fee Related JPH0737149B2 (en) | 1986-09-11 | 1986-09-11 | IC mounting structure for thermal printing head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0737149B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2527361Y2 (en) * | 1991-03-08 | 1997-02-26 | グラフテック株式会社 | Conductor connection structure of thermal head array |
-
1986
- 1986-09-11 JP JP21464286A patent/JPH0737149B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6369662A (en) | 1988-03-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |