JPH0738358B2 - Chip component and manufacturing method thereof - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip component mounted on a printed board and a method for manufacturing the same.

2. Description of the Related Art Chip components of this type include chip capacitors, chip coils, chip filters, and chip transformers.

There are two types of such chip components. One is that the element body is exposed and corresponds to a chip capacitor or a chip coil. The other one is called a mold part, and is shown in FIG.
As shown in (b), the exterior resin 30 is molded around the element body 1 to which the hoop terminals (electrodes) 7 are fixed, and the entire surface of the element body 1 is covered with the exterior resin 30.

DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention By the way, when the element body is exposed as described above, there is an advantage that it is structurally simple, inexpensive, and the reliability of chip parts is high, but structurally Mechanical strength is weak, especially when a brittle material such as ceramic or ferrite is used as a material, due to impact at the time of mounting (centering process by chip mount machine, handling process after assembled on printed circuit board),
May cause cracks and chips.

In addition, there is also a drawback that the finished dimensions vary from lot to lot due to individual differences in the thermal contraction rate when firing the material of the element body (green sheet), and variations in dimensional accuracy occur.

On the other hand, when the molded parts are used, the mechanical strength is strong due to the structure, and although there is an advantage that cracks and chips do not occur during the centering process and the handling process described above, the structure becomes complicated and the cost increases. There is a drawback that leads to.

Further, when the element body 1 is made of a material having poor strength, the element body 1 may be damaged by the injection pressure of the exterior resin 30, which may cause defective characteristics of the chip component.

Furthermore, when the hoop terminal 7 is used as the electrode, a bending process and a mounting process of the hoop terminal 7 are required during the manufacturing process of the chip component, so that the number of processes is large and there is a limit in improving the manufacturing efficiency. there were.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a chip component and a method for manufacturing the same that can solve the above-mentioned drawbacks of the prior art.

Means for Solving the Problems In a chip component according to the present invention, the element body and the electrode are exposed on the lower surface side of an element body on which electrodes are directly formed on both side surfaces, and the element body and the electrode are externally packaged on the upper surface side. It is characterized by being molded with resin.

Further, in this chip component manufacturing method, a corner portion for positioning the element body is provided on the hole bottom side of the cavity, liquid resin is filled in the cavity, and electrodes are directly formed on both side surfaces of the liquid resin in advance. It is characterized in that a chip component is obtained by immersing the element body with the upper surface side facing downward, drying and curing the liquid resin, and then taking it out from the cavity.

When it works, the corners provided at the bottom of the cavity accurately position the element immersed in the liquid resin, so that the subsequent molding process can be performed accurately and the external dimensions of the chip parts can be made uniform. Become.

Further, the strength of the upper portion of the chip component in which the exterior resin is molded can be improved against external pressure.

Furthermore, since the electrode is directly formed on the element body, the bending process and the attaching process of the electrode are not required, and the number of processes can be reduced.

Embodiment One embodiment of the present invention will be specifically described below with reference to the drawings. FIG. 1 is a process diagram showing a manufacturing process of a chip capacitor to which the method of the present invention is applied.

This manufacturing process is performed according to the following procedure. That is, as shown in FIG. 1 (a), an element body A with electrodes in which electrodes 2 and 2 are directly formed on the left and right side surfaces of a block-shaped element body 1 obtained by firing a ceramic is prepared. As shown in FIG. 1 (b), a cavity A filled with a liquid resin 3 is provided with the portion to be the upper surface side after manufacturing the chip capacitor B (see FIG. 1 (c)) as shown in FIG. 1 (b). Insert in 4.

The electrodes 2 and 2 are directly formed by baking an electrode material such as Ag,
It is performed by vapor deposition, sputtering or plating.

Around the hole bottom 40 of the cavity 4 filled with the liquid resin 3, a taper surface 41 which is inclined downward toward the center of the hole is formed.
Are formed by a length corresponding to the left and right and front and rear dimensions of the element body A. The taper surface 41 ... is an element body A immersed in the liquid resin 3.
Is formed to perform positioning of the. That is, when the element body A is inserted into the cavity 4 in which the tapered surface 41 is formed, the position of the element body A in the left-right direction, the front-rear direction, and the height direction is sequentially obtained by the guiding action of the tapered surface 41. It will be adjusted and all the element bodies A will be positioned in the same position. Therefore, the outer dimensions of all the chip capacitors B in the molded portion can be made uniform.

Instead of the tapered surfaces 41, other inclined guide surfaces such as rounded surfaces may be formed.

When the immersion step shown in FIG. 1 (b) is completed, the cavity 4 is heated in this state, and the liquid resin 3 is dried and cured. Then, when the liquid resin 3 is cured, as shown in FIG. 1C, the element body A is taken out from the mold, that is, the cavity 4, and is turned upside down.
Is exposed, and the chip capacitor B in which the element body 1 and the electrode 2 are molded with the exterior resin is obtained on the upper surface side.

The material of the cavity 4 may be metal, for example. However, the material of the cavity 4 is not limited to metal, and any other material may be used as long as it has a small dimensional change due to heat during resin curing. Further, in FIG. 1 (c), the vertical direction of the element body 1 is reversed from that in FIG. 1 (b), and the chip capacitor B is in the state shown in FIG. 1 (c).
Will be mounted on the printed circuit board.

As shown in FIG. 1 (c), the chip capacitor B of the present invention manufactured by such a manufacturing process has a very simple structure, and the portion of the exterior resin 30 corresponding to the tapered surface 41 ... The chamfered portions 31 ... Of the same size are formed.
The formation of such chamfered portions 31 is useful when the chip capacitor B is taken out from the embossed tape having the embossed hole in which the chip capacitor B is housed. That is, since the chamfered portions 31 and 31 are formed, the upper edge portion does not get caught.

FIG. 2 shows such a centering process of the chip capacitor B. The upper surface of the chip capacitor B, that is, the upper surface of the exterior resin 30 is adsorbed by the adsorption nozzle 5, and in this state, four side surfaces of the chip capacitor B toward the upper side are attached. The centering members 50 are pressed respectively to center the chip capacitors B.

In the centering step, since the chip capacitor B of the present invention has the constitution in which the exterior resin 30 is molded on the upper surface side of the element body A as described above, the side surface portion molded with the exterior resin is pressed by the centering member 50 ... Therefore, the conventional exposed type does not cause cracks or chips unlike chip parts.

Further, the external dimensions of the pressed portion are the same as those of the cavity 4
Since it is integrally formed with, it can be formed with high accuracy, the centering process can be performed with high accuracy, and the impact of the centering process can be mitigated by the mold forming part.
Similarly, in handling processing such as substrate transfer, cracking or chipping does not occur.

In the manufacturing process of this chip capacitor B, an embodiment may be adopted in which the element body A is immersed in the liquid resin 3 mixed with magnetic powder. In the case of adopting such an embodiment, the chip capacitor B after manufacturing has a magnetic shield effect, and there is an advantage that the application can be expanded.

FIG. 3 shows a manufacturing process of a chip coil to which the method of the present invention is applied.
The same procedure as in the manufacturing process of is performed. That is, as shown in FIG. 3 (a), the element body A in which the winding 61 is applied to the bobbin 6 is formed.
The electrodes 2 and 2 are directly formed on the left and right side surfaces of the lower end portion of the same as above, and the element A is shown on the electrode forming side as shown in FIG. 3 (b), that is, as shown in FIG. 3 (a). The state is turned upside down and inserted into the same cavity 4 as described above, and then the cavity 4 is heated to dry and cure the liquid resin 3.

Then, when the liquid resin 3 is cured, the element body A is taken out from the cavity 4 as shown in FIG. 3C, and the exterior resin 30 in which the liquid resin 3 is cured is molded on the upper surfaces of the electrodes 2 and 2. The chip coil C thus obtained is obtained. In this case, as shown in FIG.
The liquid resin 3 is also molded in a portion corresponding to the upper part of the cavity 4 by the swelling action due to the surface tension.
Prevents cracks and chips during the centering process.

Although the chip capacitor and the chip coil are exemplified as the chip component in the above-described embodiments, the present invention can be similarly applied to other chip components such as a chip filter and a chip truss.

EFFECTS OF THE INVENTION According to the chip component of claim 1, the element is directly formed on the electrode body, and the exterior resin is molded only on the upper portion that is easily subjected to impact force during mounting. In comparison, the structure is simple and the manufacturing cost can be significantly reduced. Further, as a matter of course, since the strength against external pressure can be protected as compared with the conventional exposed type chip component, it is possible to prevent the chip component from being damaged, but to prevent the electrical characteristics from being hindered. Can be improved.

Therefore, it is particularly effective when the brittle material ceramic or ferrite is used as the material of the element body.

Also, because the exterior resin is accurately molded in the upper part, it absorbs the dimensional variations of the element body due to the heat shrinkage rate when firing the material, and realizes chip parts with excellent dimensional accuracy. Therefore, the centering accuracy at the time of mounting can be improved. Therefore, it is convenient for improving the efficiency of the mounting process.

According to the method of the present invention as set forth in claim 2, since the cornering portion provided at the hole bottom of the cavity allows the subsequent molding step to be performed with high accuracy, it goes without saying that the manufacturing efficiency can be improved. Another advantage is that quality control can be performed quickly in the subsequent process.

Further, since the bending process and the attaching process for the electrodes, which are required in the conventional mold parts, are not necessary, the number of processes can be reduced, and the manufacturing efficiency can be reasonably improved accordingly.

[Brief description of drawings]

FIG. 1 is a process diagram showing a manufacturing process of a chip capacitor to which the method of the present invention is applied, and FIG. 2 is a perspective view showing a centering process in a chip mounting machine. FIG. 3 is a process diagram showing a manufacturing process of a chip coil to which the method of the present invention is applied. FIG. 4 is a sectional view showing a conventional mold part. 1 ... Element body, 2 ... Electrode, 3 ... Liquid resin, 30 ... Exterior resin, 4
… Cavity, 41… Tapered surface, B… Chip capacitor,
C ... Chip coil.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI Technical indication H01F 27/02 H01G 4/12 445 448 4/224 8123-5E H01F 15/02 L

Claims (2)

[Claims] 1. A chip characterized in that the element body and the electrodes are exposed on a lower surface side of an element body on which electrodes are directly formed on both side surfaces, and the element body and the electrodes are molded by an exterior resin on an upper surface side. parts. 2. A corner portion for positioning an element body is provided on the hole bottom side of the cavity, and the cavity is filled with a liquid resin,
It is possible to obtain a chip component by immersing the liquid resin in such a manner that the upper surface of the element body on which the electrodes are directly formed in advance is turned down, the liquid resin is dried and cured in this state, and then taken out from the cavity. A method for manufacturing a characteristic chip component.