JPH0738518B2 - Parts mounting device - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus for mounting an electronic component on an electronic circuit board (hereinafter simply referred to as a board).

2. Description of the Related Art The applicant of the present application has previously disclosed in JP-A-55-15270 that a plurality of substrates are supported on an XY table while being held at predetermined relative positions, and a fixing substance for fixing components is applied to the substrates. Disposing the dispenser and the mounting device that mounts the component on the substrate are arranged with the same positional relationship as the relative positional relationship between the substrates,
Alternatively, the plurality of substrates are supported on a fixed table, the dispenser and the mounting device are installed on an XY table, and one positioning operation of the XY table applies a fixing substance to one substrate and other substrates. The components are simultaneously mounted on the substrate, and then the substrate is moved from the position corresponding to the dispenser to the position corresponding to the mounting device so that application of the fixing substance to the substrate and mounting of the components can be sequentially performed in the same device. We proposed a component mounting method that eliminates the step of applying a fixing substance to the substrate before the component mounting step.

DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention By the way, in the conventional mounting device in the component mounting device, the position regulation for the suction nozzle of the component sucked in the component supply section is performed by the position regulating claw provided in the mounting head. However, the positioning accuracy is deteriorated due to wear of the position adjusting claws, etc., and the provision of the position adjusting claws increases the weight of the mounting head, making it difficult to mount at high speed. there were.

On the other hand, in recent years, the displacement of the suction component with respect to the axis of the suction nozzle is detected by a recognition device such as a recognition camera, and when the component mounting position of the board and the suction nozzle are aligned, the displacement of the suction component is corrected. A mounting apparatus has been proposed in which the components are aligned and mounted to mount components.

However, when such a mounting device is applied to the component mounting device in which dispensers are arranged in parallel, as shown in FIG. 5, one XY table 51 corresponds to the substrate 52 corresponding to the dispenser and the mounting device. Since the substrate 53 to be fixed is fixed, as shown in FIG.
If the component P is eccentrically y-adsorbed with respect to the axis of 54, the XY table 51 is corrected and positioned by the eccentricity y, and as a result, the substrate 52 corresponding to the dispenser 52. Is also eccentric from the predetermined position by y, and as a result, the fixing substance F is applied to the position eccentric by y by the dispenser. When the component P is mounted on this substrate, the fixing substance F is applied. There is a problem that the component P may not be surely fixed due to the positional deviation from the fixed substance F that has been fixed.

Furthermore, in the component mounting apparatus, the board 52 at the position corresponding to the dispenser and the board at the position corresponding to the mounting apparatus
It is premised that the positional relationship of 53 perfectly matches the positional relationship between the coating position by the dispenser and the mounting position by the suction head, but in reality such a positional relationship is accurately secured. This is rare, and there is also a problem that it is difficult to mount with high precision.

In view of the above-mentioned conventional problems, the present invention is a component mounting apparatus in which application of a fixing substance and component mounting are performed almost simultaneously on a substrate positioned corresponding to a dispenser and a mounting apparatus, respectively. A recognition device for recognizing the position is provided to correct the relative position with respect to the substrate to mount the component, and the deviation of the coating position by the dispenser can be eliminated, and the position of the substrate with respect to the arrangement position of the dispenser and the mounting device can be eliminated. An object of the present invention is to provide a component mounting apparatus capable of correcting a mismatch in correspondence between fixed positions.

Means for Solving the Problems In order to achieve the above object, the present invention provides a table for supporting a plurality of substrates on which components are to be mounted while maintaining a predetermined relative position, and one table supported on the table is provided. A dispenser for applying a fixing substance for fixing the component to the substrate and a mounting device for mounting the component at the same timing as the coating by the dispenser are provided at the position where the fixing substance is coated on another substrate, and The mounting device and the dispenser are installed on a common support, and a moving means for relatively moving the table and the support in two directions orthogonal to each other on one plane parallel to the substrate is provided. A recognition device for recognizing the suction position of the component sucked by the supply unit is provided, and the dispenser is attached to the mounting device based on the recognition result by the recognition device. Position correction means for correcting the relative position of the dispenser and the substrate by relatively moving or the relative position of the plurality of substrates by correcting the relative position of the dispenser or the mounting device and the substrate is provided. Is characterized by.

Effect Since the present invention has the above-described configuration, when there is a displacement in the suction position of the component sucked by the component supply unit, the recognition device detects it and makes the component mounting position of the board correspond to the mounting device. When the table and the support are moved relative to each other, the amount of positional deviation can be corrected, or the relative position between the mounting device and the substrate can be corrected by the position correcting means, so that the component can be mounted at an appropriate position. Further, when the mounting position is corrected by the relative movement of the table and the support, the position correction means corrects the relative position of the dispenser and the substrate so that the application position of the fixing substance by the dispenser can be set to an appropriate position. it can. Even when the correspondence between the position of the dispenser and the board on the mounting device is not appropriate, the positional correction means corrects the relative position of the dispenser or the mounting device and the corresponding board to shift the correspondence. It can be corrected and optimized.

Embodiment An embodiment of the present invention will be described below with reference to FIGS. 1 to 3. In FIG. 1, reference numeral 1 is a base, and an XY table 2 which is movable in two horizontal directions orthogonal to each other is arranged at the center of the front part. The two substrates 3a and 3b on which the component P is to be mounted can be fixed to the XY table 2 in a predetermined arrangement relationship. Reference numeral 4 is a supporter that supports a dispenser 5 for applying a fixing substance such as an adhesive or cream solder for fixing the component to the substrate, and a mounting device 6 for mounting the component P on the substrate 3b. The base 1
It is erected on the top. The dispenser 5 and the mounting device 6 are arranged at the same positions on the substrates 3a and 3b, respectively, so as to apply a fixing substance and mount components.
Reference numerals 7a and 7b are conveyors for sequentially supplying the board 3 to the XY table 2 and discharging the board 3 on which component mounting is completed. Reference numeral 8 denotes a component supply unit, in which a large number of component supply units 8a are arranged in parallel and an arbitrary component supply unit 8a is configured to be movable in the X direction along a rail 9 so as to be positioned corresponding to the mounting device 6. .

The dispenser 5 is provided with a pair of coating heads 5a arranged at appropriate intervals, and these coating heads 5a are positioned in the X and Y directions by a position correcting means 10 having the same structure as the XY table 2. It is supported so that it can be corrected.

Next, a detailed configuration of the mounting device 6 will be described with reference to FIG. A plurality of mounting heads 12 are rotatably held on the outer periphery of a support body 11 which is intermittently rotated about the vertical axis about the vertical axis at a pitch corresponding to the intermittent rotation pitch.
In addition, a plurality of types of suction nozzles are provided on the outer periphery of each mounting head 12.
13 are held so that they can rotate. The component supply unit 8 is disposed at the component receiving position S1 corresponding to the rear stop position in the circulation movement path of each mounting head 12 by the support 11. The XY table 2 is located at the component mounting position S5 corresponding to the front stop position.

Corresponding to the stop positions S2 to S4 of the mounting head 12 from the component receiving position S1 to the component mounting position S5 in the rotation direction of the support 11, the Y direction position regulation for the component P sucked and transferred by the suction nozzle 13 is performed. Means 17, a recognition device 18 for detecting the position of the component P in the XY directions, and a suction nozzle rotating means 19 for angular position correction are provided.

The Y-direction position regulating means 17 includes a pair of clamp claws 17a, 1a.
The component P is clamped at 7b to align with the suction nozzle 13 in the Y direction. Further, the recognition device 18 detects the position in the XY direction and the angular position of the component P sucked by the suction nozzle 13, and the component P with respect to the CCD recognition camera 21 arranged at the side position. A pair of reflecting mirrors 22a and 2a disposed directly below the suction nozzle 13 and the CCD recognition camera 21 in order to project the image of
It has 2b. Further, the suction nozzle rotating means 19 includes a rotating shaft 25 which is driven to rotate by a motor 23 on an elevator (not shown).
Is provided, the elevating table is lowered, the transmission section 26 provided at the lower end thereof is pressed against the passive section 27 at the upper end of the suction nozzle 13 to frictionally transmit, and the suction nozzle 13 can be rotated at an arbitrary angle. ing.

Corresponding to S6 and S7 among the stop positions S6 to S8 of each mounting head 12 between the component mounting position S5 and the component receiving position S1 in the rotation direction of the support 11, the defective component receiver 28 and the motor 29a.
Nozzle selecting means 29 provided with a pinion 29b which can be driven by and can be moved into and out of engagement with the mounting head 12 is provided.

As shown in FIG. 3, the XY table 2, the dispenser 5, the mounting device 6, and the position correcting means 10 are controlled by a control signal from the CPU 30 to perform the operations described later, and the CPU 30 is configured to sequentially mount the components to be mounted. The type and mounting position are input by the input device 31, and the recognition data from the recognition device 18 is input.

Next, the operation will be described. The substrate 3a before applying the fixing substance is provided on the XY table 2 at a position corresponding to the dispenser 5, and the substrate 3a to which the fixing substance is applied at a position corresponding to the mounting device 6. 3b is fixed. On the other hand, the mounting device 6
At the component receiving position S1, the component is previously sucked from the component supply unit 8, the recognition device 18 recognizes the suction position of the component P with respect to the suction nozzle 13, and the suction nozzle rotating means 19 detects the posture of the component P. After being corrected, it is moved to the component mounting position S5. At the same time, the XY table 2 is moved so that the arbitrary component mounting positions on the substrates 3a and 3b correspond to the central positions of the coating head 5a and the suction nozzle 13. At that time, the position shift amount of the component P with respect to the center of the suction nozzle 13 recognized by the recognition device 18 is corrected, and the XY table 2 is moved. Further, the position correcting means 10 corrects the position of the coating head 5a of the dispenser 5 in accordance with the position correction amount of the XY table 2. In this state, the dispenser 5 and the mounting head 12 are operated to apply the fixing substance and mount the components on the predetermined positions of the substrates 3a and 3b, respectively. With the above operation, the application of the fixing substance to the substrate 3a is completed,
This is repeated until the mounting of the component on the board 3b is completed.

After that, the substrate on which the components are mounted is discharged by the conveyor 7b, the substrate on which the fixing substance is applied is positioned corresponding to the mounting device 6, and the substrate supplied from the conveyor 7a is the dispenser 5
It is fixed at the position corresponding to.

In the above embodiment, the correction of the position of the coating head 5a of the dispenser 5 is illustrated, but the correction amount is usually about 0.5 mm, and as shown in FIG. 4, a portion corresponding to the dispenser 5 of the XY table 2. The correction table 42 may be arranged in the above, and the correction table 42 may be moved and adjusted in the X direction and the Y direction. In FIG. 4, 43 is a Y table, 43a is a Y-direction driving means, 44 is an X table, and 44a is an X-direction driving means, which constitute the XY table 2. or,
Reference numeral 45 is an X-direction driving means for the correction table 42, and 46 is a Y-direction driving means.

Further, a similar correction table may be arranged in a portion corresponding to the mounting device 5 on the XY table 2.

The present invention is not limited to the above-mentioned embodiment, and for example, in the above-mentioned embodiment, the table for fixing the substrate is moved by the moving means as the XY table and the support is fixed, but the support is reversed. May be moved in the X and Y directions by the moving means to fix the table, or both may be moved in the X and Y directions by the respective moving means. Further, the mounting device 6 may be a linear movement type instead of the rotation type.

EFFECTS OF THE INVENTION According to the component mounting apparatus of the present invention, when there is a deviation in the suction position of the components sucked by the component supply unit as described above,
This is detected by the recognition device and the amount of positional deviation is corrected when the table and the support are moved relative to each other, or the relative position of the mounting device and the substrate is corrected by the position correction means so that the component is placed at an appropriate position. It can be mounted, and when it is corrected by the relative movement of the table and the support, the application position of the fixing substance by the dispenser can be set to an appropriate position by correcting the relative position of the dispenser and the substrate by the position correcting means. You can Further, even when the correspondence relationship between the disposition position of the dispenser and the mounting device and the fixed position of the substrate is not appropriate, the correction can be made appropriate by the correction by the position correcting means, which brings about a great effect.

[Brief description of drawings]

1 to 3 show an embodiment of the present invention, FIG. 1 is an overall perspective view, FIG. 2 is a perspective view showing the configuration of a mounting device, and FIG.
FIG. 4 is a control block diagram, FIG. 4 is a perspective view of an XY table of another embodiment, and FIGS. 5 and 6 are explanatory views of problems of the conventional example. 2 ... XY table 3a, 3b ... Substrate 4 ... Support 5 ... Dispenser 6 ... Mounting device 8 ... Parts supply unit 10 ... Position correction means 18 ... Recognition device.

Claims (1)

[Claims] 1. A table for supporting a plurality of substrates on which components are to be mounted while maintaining a predetermined relative position, and a fixing substance for fixing the components to one substrate supported on the table is provided. A dispenser for coating and a mounting device for mounting components at the same timing as the coating by the dispenser are provided at positions where the fixing substance is coated on another substrate, and the mounting device and the dispenser are installed on a common support. Recognition for recognizing the suction position of the component sucked by the component supply unit is provided in the mounting device by providing moving means for relatively moving the table and the support in two directions orthogonal to each other on one plane parallel to the substrate. A device is provided, and the dispenser is moved by moving the dispenser relative to the mounting device based on the recognition result by the recognition device. The relative position of the plate, or, the component mounting apparatus characterized in that a position correction means for correcting the relative position of the dispenser or mounting device and the substrate by changing the relative positions of the plurality of substrates.