JPH0740360B2 - Method for manufacturing magnetic disk substrate - Google Patents
Method for manufacturing magnetic disk substrateInfo
- Publication number
- JPH0740360B2 JPH0740360B2 JP12514986A JP12514986A JPH0740360B2 JP H0740360 B2 JPH0740360 B2 JP H0740360B2 JP 12514986 A JP12514986 A JP 12514986A JP 12514986 A JP12514986 A JP 12514986A JP H0740360 B2 JPH0740360 B2 JP H0740360B2
- Authority
- JP
- Japan
- Prior art keywords
- plating layer
- resin
- disk substrate
- disk
- nickel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C37/0025—Applying surface layers, e.g. coatings, decorative layers, printed layers, to articles during shaping, e.g. in-mould printing
- B29C37/0028—In-mould coating, e.g. by introducing the coating material into the mould after forming the article
- B29C37/0032—In-mould coating, e.g. by introducing the coating material into the mould after forming the article the coating being applied upon the mould surface before introducing the moulding compound, e.g. applying a gelcoat
Landscapes
- Manufacturing Of Magnetic Record Carriers (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Description
【発明の詳細な説明】 (産業上の利用分野) 本発明は、表面が平滑で平坦な磁気デイスク基板の製造
方法に関する。Description: TECHNICAL FIELD The present invention relates to a method for manufacturing a magnetic disk substrate having a smooth surface and a flat surface.
(従来技術) 近年、高密度記録可能な磁気デイスクとして、磁性層を
めっきやスパッタ、蒸着等により形成したものが実用化
されている。(Prior Art) In recent years, as a magnetic disk capable of high density recording, a magnetic disk having a magnetic layer formed by plating, sputtering, vapor deposition or the like has been put into practical use.
この磁気デイスクは、非磁性金属基板、通常はアルミニ
ウム合金基板上にニッケル−リン合金等の非磁性下地層
を形成し、その上に磁性層をめっきやスパッタ等により
形成し、必要に応じさらに保護層を設けたものである。This magnetic disk is formed by forming a non-magnetic underlayer such as nickel-phosphorus alloy on a non-magnetic metal substrate, usually an aluminum alloy substrate, and forming a magnetic layer on it by plating, sputtering, etc., and further protecting it if necessary. It is provided with layers.
ところが、このタイプの磁気デイスク基板には高度の平
滑性、平坦性が要求されるので、アルミニウム基板を高
度の平滑面に研磨する必要があるが、アルミニウムは柔
かいため所定の平滑度を得るのが困難で生産性が悪いと
いう問題があった。However, since this type of magnetic disk substrate is required to have high smoothness and flatness, it is necessary to polish the aluminum substrate to have a highly smooth surface. However, since aluminum is soft, it is difficult to obtain a predetermined smoothness. There was a problem of difficulty and poor productivity.
この問題を解決するために、アルミニウム基板上に薄い
合成樹脂層を塗布形成して表面平滑性を得る方法や、デ
イスク全体を合成樹脂により製造する試みが知られてい
る。In order to solve this problem, a method of applying a thin synthetic resin layer on an aluminum substrate to obtain surface smoothness and an attempt to manufacture the entire disk with a synthetic resin are known.
(発明が解決しようとする問題点) ところが各種の方法によりアルミニウム基板表面を平
滑、平坦にしても、その上にニッケル−リンめっき層を
形成すると、めっき液に接触するめっき層表面にピンホ
ール等の構造欠陥が生じたり、めっき層の厚さが不均一
になって表面に凹凸(うねり)が生じたりするため、ニ
ッケル−リンめっき層を再度研磨しているのが実情であ
る。(Problems to be Solved by the Invention) However, even if the surface of the aluminum substrate is smoothed or flattened by various methods, if a nickel-phosphorus plating layer is formed on it, pinholes, etc. are formed on the surface of the plating layer in contact with the plating solution. Since the structural defect of 1) occurs, or the thickness of the plating layer becomes non-uniform and unevenness (waviness) occurs on the surface, the fact is that the nickel-phosphorus plating layer is polished again.
(問題点を解決するための手段) 本発明は、特に研磨を行うことなく表面の平滑性、平坦
性が優れたニッケル−リンめっき層を有する磁気デイス
ク基板を得ることができる方法であって、その特徴は、
デイスク状キャビテイを有し内面平滑な成形金型の内面
に、非磁性ニッケル−リンめっき層を形成し、その金型
内に合成樹脂を供給するか、あるいはその金型内に非磁
性金属芯板を挿入するとともにめっき層と芯板との間に
合成樹脂を供給して、加熱下に合成樹脂とメッキ層とを
一体化することにより表面にニッケル−リンめっき層を
有する磁気デイスク基板を製造する点にある。(Means for Solving the Problems) The present invention is a method for obtaining a magnetic disk substrate having a nickel-phosphorus plated layer having excellent surface smoothness and flatness without polishing, The feature is
A non-magnetic nickel-phosphorus plating layer is formed on the inner surface of a molding die having disk-shaped cavities and a smooth inner surface, and synthetic resin is supplied into the die, or a non-magnetic metal core plate is placed in the die. And a synthetic resin is supplied between the plating layer and the core plate, and the synthetic resin and the plating layer are integrated under heating to manufacture a magnetic disk substrate having a nickel-phosphorus plating layer on the surface. In point.
これにより、金型内面を平滑にしておけば、めっき層の
金型に接していた面がデイスク基板表面にくることにな
って、デイスク基板を個々に研磨しなくても極めて平滑
性、平坦性のよいめっき層が得られる。As a result, if the inner surface of the mold is made smooth, the surface of the plating layer that was in contact with the mold will come to the surface of the disk substrate, and it will be extremely smooth and flat without polishing the disk substrate individually. It is possible to obtain a plating layer with good quality.
以下本発明を図面を参照して具体的に説明する。The present invention will be specifically described below with reference to the drawings.
第1図は本発明方法の一例の第1工程(めっき層の形
成)を示す断面図、第2図は、その第2工程(合成樹脂
の供給)を示す断面図である。FIG. 1 is a sectional view showing a first step (formation of a plating layer) of an example of the method of the present invention, and FIG. 2 is a sectional view showing the second step (supply of synthetic resin).
成形金型1は例えば雄型11と雌型12とからなり、両者の
間にデイスク状のキャビテイを形成するようになってい
る。両型11、12の上下内面111、121は平坦で互いに平行
になっており、各々中心線平均粗さRa(JIS BO601)が
0.02μm以下となるように研磨された鏡面になってい
る。The molding die 1 includes, for example, a male die 11 and a female die 12, and a disc-shaped cavity is formed between the two. The upper and lower inner surfaces 111 and 121 of both molds 11 and 12 are flat and parallel to each other, and the center line average roughness Ra (JIS BO601) is
It has a mirror surface that is polished to 0.02 μm or less.
金型1の上下内面111、121は、ステンレス304やクロム
めっきした金属を用いると、めっき液に対する耐食性が
良好でまたニッケル−リンめっき層の剥離が容易になり
好ましい。It is preferable to use stainless steel 304 or a metal plated with chrome for the upper and lower inner surfaces 111 and 121 of the mold 1 because the corrosion resistance to the plating solution is good and the nickel-phosphorus plating layer can be easily peeled off.
この金型1の周面にマスキング9を施して、上下面11
1、121にニッケル−リン合金層2を電気めっきまたは無
電解めっきにより形成する。Masking 9 is applied to the peripheral surface of the mold 1 to form the upper and lower surfaces 11
The nickel-phosphorus alloy layer 2 is formed on the layers 1 and 121 by electroplating or electroless plating.
ニッケル−リン合金としては、非磁性とするためにリン
を6〜20重量%含有したものが好ましい。As the nickel-phosphorus alloy, one containing 6 to 20% by weight of phosphorus is preferable in order to make it non-magnetic.
めっき層2の厚さは通常30〜50μm程度である。The thickness of the plating layer 2 is usually about 30 to 50 μm.
層2の形成方法としては、析出速度の大きい電気メッキ
法が実用的である。As a method for forming the layer 2, an electroplating method having a high deposition rate is practical.
これは例えば、硫酸ニッケル300g/リットルと亜リン酸1
7.6g/リットルとからなるめっき液に硫酸を加えてpHを
1.5〜2.0に調整し、電流密度2〜10A/dm2、浴温度60〜7
0℃の条件で成形金型1を陰極にして電気めっきすると
いう通常の方法が採用できる。This is, for example, 300 g / l nickel sulphate and 1 phosphorous acid.
Add sulfuric acid to the plating solution consisting of 7.6 g / liter to adjust the pH.
Adjusted to 1.5-2.0, current density 2-10A / dm 2 , bath temperature 60-7
It is possible to employ a usual method in which the molding die 1 is used as a cathode under the condition of 0 ° C. and electroplating is performed.
また無電解めっきによることもできるが、析出速度はや
や遅くなる。この場合にも金型内面に触媒化処理を行っ
た後ブルーシューマー等のめっき液を適用するという公
知の方法で行うことができる。Alternatively, electroless plating can be used, but the deposition rate is slightly slower. In this case as well, it can be carried out by a known method in which the inner surface of the mold is subjected to a catalytic treatment and then a plating solution such as Blue Sumer is applied.
このようにして金型1内面に非磁性ニッケル−リンめっ
き層2を形成した後、第2図に示すように合成樹脂3を
供給充填し、加熱下にめつき層2と樹脂3とを一体化す
る。この場合、めっき層2の樹脂3と接する側にあらか
じめ接着剤を塗布しておくこともできる。After the non-magnetic nickel-phosphorus plating layer 2 is formed on the inner surface of the mold 1 in this way, synthetic resin 3 is supplied and filled as shown in FIG. 2, and the plating layer 2 and the resin 3 are integrated under heating. Turn into. In this case, an adhesive may be applied in advance to the side of the plating layer 2 that contacts the resin 3.
合成樹脂3としては耐熱性の高いものが望ましく、熱可
塑性樹脂としてはポリフェニレンサルファイド、ポリエ
ーテルエーテルケトン、ポリエーテルイミド、ポリエー
テルサルフォン等が、また熱硬化性樹脂としてはポリイ
ミド、ビスマレイミド−トリアジン樹脂、エポキシ樹脂
等が好適である。またこれらをガラス繊維等により補強
したものでもよい。It is desirable that the synthetic resin 3 has high heat resistance, the thermoplastic resin is polyphenylene sulfide, polyether ether ketone, polyether imide, polyether sulfone and the like, and the thermosetting resin is polyimide, bismaleimide-triazine. Resin, epoxy resin and the like are suitable. Further, these may be reinforced with glass fiber or the like.
樹脂の充填方法としては、熱可塑性樹脂については、射
出成形、溶融樹脂を金型内に注入してから型締めする圧
縮成形等によることができる。また熱硬化性樹脂であれ
ば、トランスファー成形、液状の樹脂を注入して加圧下
に加熱硬化する圧縮成形、樹脂を繊維布に含浸して供給
し加熱硬化する方法等によることができる。As a resin filling method, for a thermoplastic resin, injection molding, compression molding in which a molten resin is injected into a mold and then the mold is clamped, or the like can be used. In the case of a thermosetting resin, transfer molding, compression molding in which a liquid resin is injected and heat-cured under pressure, a method of impregnating a fiber cloth with a resin and supplying it, and heat-curing the resin can be used.
電気めっき法は、析出速度が大きく、得られるめっき層
も密で強度大であるという利点を有するが、めっき層2
の厚さが均一になりにくく、デイスクの場合周縁部のめ
っき厚さが大きくなる。ところが本発明方法によれば、
めっき層2の厚さが不均一であっても流動状態にある樹
脂3ととも加圧することにより厚さ振れが吸収され、デ
イスク基板の表面は平坦なものになる。なおこのめっき
層2は、デイスクにヘッドクラッシュ性を付与するもの
であって、表面が平滑であれば多少厚さが不均一となっ
ても性能上問題はない。The electroplating method has the advantages that the deposition rate is high and the obtained plating layer is dense and has high strength.
It is difficult to make the thickness uniform, and in the case of a disk, the plating thickness of the peripheral portion becomes large. However, according to the method of the present invention,
Even if the thickness of the plating layer 2 is not uniform, the thickness fluctuation is absorbed by pressing with the resin 3 in a fluid state, and the surface of the disk substrate becomes flat. The plating layer 2 imparts a head crushing property to the disk, and if the surface is smooth, there is no problem in performance even if the thickness is somewhat uneven.
また無電解めっきの場合には、めっき層2の厚さは比較
的均一になるが、水素の発生を伴なうのでめっき液に接
触した面にピンホールが生じやすい。しかし本発明方法
によれば、めっき液に接触しない面がデイスクの外面に
くるのでかかる問題が生じない。Further, in the case of electroless plating, the thickness of the plating layer 2 becomes relatively uniform, but since hydrogen is generated, pinholes are easily generated on the surface in contact with the plating solution. However, according to the method of the present invention, such a problem does not occur because the surface not contacting the plating solution comes to the outer surface of the disk.
樹脂3をメッキ層2と一体化した後、加圧を維持しなが
ら冷却してデイスク基板を取りだすと、めっき層2は金
型1内面から剥離し、その表面は型面が転写された平滑
かつ平坦な面となり、研磨をする必要がなくなる。そし
てめっき層2の上に直ちに常法により磁性層を形成すれ
ば、軽量の磁気デイスクを得ることができる。After the resin 3 is integrated with the plating layer 2, the disk substrate is taken out by cooling while maintaining pressure, and the plating layer 2 is peeled from the inner surface of the mold 1, and the surface is smooth and has the transferred mold surface. It becomes a flat surface, eliminating the need for polishing. If a magnetic layer is immediately formed on the plated layer 2 by a conventional method, a lightweight magnetic disk can be obtained.
第3図は、本発明の別の実施例を示す断面図であって、
めっき層2を形成した金型1内にアルミニウム合金等の
非磁性金属芯板4を挿入し、その芯板4とめっき層2と
の間に樹脂3を供給充填し、その樹脂3により芯板4と
めっき層2とを一体化するものである。これは例えば、
金型内に、樹脂3を含浸した繊維布、芯板4、樹脂3を
含浸した繊維布を順次重ね、加熱加圧することにより行
なう。FIG. 3 is a sectional view showing another embodiment of the present invention,
A non-magnetic metal core plate 4 such as an aluminum alloy is inserted into the mold 1 on which the plating layer 2 is formed, a resin 3 is supplied and filled between the core plate 4 and the plating layer 2, and the core plate is formed by the resin 3. 4 and the plating layer 2 are integrated. This is for example
The resin 3 impregnated fiber cloth, the core plate 4, and the resin 3 impregnated fiber cloth are sequentially stacked in the mold and heated and pressed.
この場合芯板4としては、表面を研磨していないものを
そのまま用いることができる。In this case, the core plate 4 whose surface is not polished can be used as it is.
樹脂3の厚さは、接着力を確保するとともにめっき層2
の厚さ振れや芯板4の表面粗れを吸収するため、100μ
m以上とするのがよい。The thickness of the resin 3 ensures the adhesive force and the plating layer 2
100μ in order to absorb the thickness fluctuations and surface roughness of the core plate 4.
It is better to be m or more.
このデイスク基板は、金属芯板と樹脂表層からなるた
め、金属のみのものよりも軽量であり、また金属芯板に
より成形時のひけが減少し、一層平坦性のよいものとな
る。Since this disk substrate is composed of a metal core plate and a resin surface layer, it is lighter in weight than a metal only plate, and the metal core plate reduces sink marks at the time of molding, resulting in even better flatness.
以上の説明では両面にめっき層を設けているが、これは
片面でもよいことは勿論である。In the above description, the plating layers are provided on both sides, but it goes without saying that this may be on one side.
(発明の効果) 本発明方法によれば、成形金型の平滑内面に非磁性ニッ
ケル−リンめっき層を形成し、これを型内で加熱下に樹
脂と一体化して金型内面から剥離するようにしたから、
デイスク基板の表面に位置するめっき面は金型表面を転
写した極めた平滑なものとなり、構造欠陥を含む等の問
題もない。(Effect of the Invention) According to the method of the present invention, a non-magnetic nickel-phosphorus plating layer is formed on a smooth inner surface of a molding die, and the non-magnetic nickel-phosphorus plating layer is integrated with the resin under heating in the die so as to be separated from the inner surface of the die. Because I chose
The plated surface located on the surface of the disk substrate is a very smooth surface obtained by transferring the surface of the mold, and there is no problem such as structural defects.
まためっき層(特に電気めっき層)の厚さが不均一にな
ることは避けたいが、本発明方法によれば、めっき層の
金型に接しない面の凹凸が流動樹脂により埋められて、
全体としては平坦性のよいデイスク基板が得られる。Further, it is desired to avoid that the thickness of the plating layer (particularly the electroplating layer) becomes non-uniform, but according to the method of the present invention, the unevenness of the surface of the plating layer which is not in contact with the mold is filled with the fluid resin,
A disk substrate having good flatness as a whole can be obtained.
第1図は本発明方法の一例の第1工程を示す断面図、第
2図は同じく第2工程を示す断面図。第3図は、本発明
方法の他の例を示す断面図。 1…金型、111、121…金型内面 2…非磁性ニッケル−リンめっき層 3…合成樹脂、4…非磁性金属芯板FIG. 1 is a sectional view showing a first step of an example of the method of the present invention, and FIG. 2 is a sectional view showing the same second step. FIG. 3 is a sectional view showing another example of the method of the present invention. DESCRIPTION OF SYMBOLS 1 ... Mold, 111, 121 ... Mold inner surface 2 ... Nonmagnetic nickel-phosphorus plating layer 3 ... Synthetic resin, 4 ... Nonmagnetic metal core plate
Claims (2)
形金型の内面に、非磁性ニッケル−リンめっき層を形成
し、その金型内に合成樹脂を供給して加熱下に樹脂とめ
っき層とを一体化してデイスク基板とし、ついで成形さ
れたデイスク基板を冷却して取りだすことを特徴とする
磁気デイスク基板の製造方法。1. A nonmagnetic nickel-phosphorus plating layer is formed on the inner surface of a molding die having disk-shaped cavities and a smooth inner surface, and a synthetic resin is supplied into the die to heat the resin and the plating layer. Is integrated into a disk substrate, and the molded disk substrate is then cooled and taken out.
形金型の内面に、非磁性ニッケル−リンめっき層を形成
し、その金型内に非磁性金属芯板を挿入するとともにめ
っき層と芯板との間に合成樹脂を供給して、加熱下にめ
っき層と芯板とを合成樹脂により一体化してデイスク基
板とし、ついで成形されたデイスク基板を冷却して取り
だすことを特徴とする磁気デイスク基板の製造方法。2. A nonmagnetic nickel-phosphorus plating layer is formed on the inner surface of a molding die having disk-shaped cavities and a smooth inner surface, and a nonmagnetic metal core plate is inserted into the die and the plating layer and the core are inserted. A magnetic disk characterized in that a synthetic resin is supplied between the plate and the plating layer and the core plate are integrated by a synthetic resin under heating to form a disk substrate, and then the molded disk substrate is cooled and taken out. Substrate manufacturing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12514986A JPH0740360B2 (en) | 1986-05-30 | 1986-05-30 | Method for manufacturing magnetic disk substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12514986A JPH0740360B2 (en) | 1986-05-30 | 1986-05-30 | Method for manufacturing magnetic disk substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62281122A JPS62281122A (en) | 1987-12-07 |
| JPH0740360B2 true JPH0740360B2 (en) | 1995-05-01 |
Family
ID=14903079
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12514986A Expired - Lifetime JPH0740360B2 (en) | 1986-05-30 | 1986-05-30 | Method for manufacturing magnetic disk substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0740360B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL1015104C2 (en) * | 2000-05-03 | 2001-11-06 | Guus Jochem Van Der Sluis | Surface treatment of parts of injection molding and extrusion machines. |
| JP5960554B2 (en) * | 2012-08-30 | 2016-08-02 | 住友ゴム工業株式会社 | Laminated gasket |
| US20170260638A1 (en) * | 2016-03-14 | 2017-09-14 | J. T. Labs Limited | Method for manufacturing composite part of polymer and metal |
-
1986
- 1986-05-30 JP JP12514986A patent/JPH0740360B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62281122A (en) | 1987-12-07 |
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