JPH0744053B2 - IC socket - Google Patents

Description

The present invention relates to an IC socket for testing a flat type IC package, and more particularly to an IC socket having a contact pin suitable for inspecting and measuring a high frequency IC.

[Conventional technology]

As shown in FIG. 3, the flat type IC package 1 has a flat rectangular parallelepiped shape, and the lead terminals 2, 2 ... Are arranged side by side on the side thereof. The lead terminals 2, 2, ... Shown in the drawings project laterally in the shape of a leg, but there are also those wound around the sides of the package 1 in a loop.

The IC socket 4 for testing the flat type IC package 1 is, as illustrated in FIGS. 3 and 4, a socket body 6 having a recess 5 for accommodating the IC package 1 and a socket body 6 embedded in the socket body 6. The contact pin 3 and the presser cover 7 that is pivotally supported by the socket body 5 and presses the IC package 1 or the lead terminal 2 mounted in the recess 5 to connect the lead terminal 2 and the contact pin 3 to each other. The holding cover 7 is pivotally supported on the socket body 6 (see FIG. 3) or is locked in a closed state by a lock lever 8 pivotally supported on the holding cover 7 (see FIG. 4).

The contact pin 3 is formed by punching out a thin elastic plate, and the lead terminals 2, 2 ...
It is generally arranged in a position corresponding to ... and is elastically contacted with the lead terminals 2, 2 as shown in Fig. 3 so that the upper adhesive part is bent into a hairpin shape to form a spring part. There is a problem to be solved by the invention. However, in this case, since the flow path of the current is a loop-shaped path that passes through the spring portion, the distance from the lead terminal 2 of the IC package 1 to the lower end of the contact pin 3 becomes long. At the same time, the L component due to the loop portion, that is, the self-inductance becomes as high as about 10 nH, which makes it impossible to accurately inspect the high frequency characteristics. In particular, the disturbance due to this self-inductance is extremely large at high frequencies such as 100 MHz or higher.

The present invention eliminates such drawbacks, and improves the contact pin 3 to provide an IC socket without the above-mentioned drawbacks.

[Means for solving problems]

The present invention is an IC socket in which contact pins 3 made by punching a flat plate that comes into contact with the lead terminals 2 of an IC package 1 are arranged in parallel. A connection terminal 3a to the circuit is extended on one side, and a first contact piece 3c forming a contact surface 3e whose one side surface is inclined is extended at a position substantially corresponding to the connection terminal 3a on the other side. A contact surface 3f that extends from the base portion 3b to the same side as the first contact piece 3c via a spring acting portion and is smaller than the contact surface 3e that is provided so as to be spaced apart from the contact surface 3e and contactable at the free end. A second contact piece 3g having a contact end portion on which the lead terminal 2 of the IC package 1 is placed and pressed, and the lead terminal 2 is placed and pressed on the contact end portion. At this time, the contact surface 3f of the second contact piece 3g moves with the biasing force of the spring action portion of the first contact piece 3c. Sliding in pressure contact with contact surface 3e,
It is characterized in that both contact surfaces 3e and 3f are separated again by the elastic restoring force of the spring action portion when the pressing on the contact end portion is released.

[Action]

When the contact end of the second contact piece 3g is pressed by the lead terminal 2 of the IC package 1, the contact surfaces 3e and 3f come into pressure contact.
C package 1 lead terminal 2, second contact piece 3g, first contact piece
Current flows through 3c, base 3b, and connection terminal 3a, and the distance between the IC package 1 and the printed circuit board is shortened, and the flow path of the current is linear, so the self-inductance is reduced to about 3 to 5 nH or less. The high frequency characteristic of No. 1 can be accurately measured.

〔Example〕

FIG. 1 shows a first embodiment of a contact pin according to the present invention. The connection terminal 3a of the contact pin 3 extends vertically downward with respect to the base portion 3b, and the first contact piece 3c has a connection terminal 3a of the base portion 3b.
The triangular plate extends upward from the upper edge at a position substantially corresponding to the upper edge of the hypotenuse of which serves as the contact surface 3e. In this case, the angle formed by the contact surface 3e with respect to the base portion 3b is 60 °, but in practice 45 ° to
Can be set to 90 °. The spring action portion 3d extends upward from the other side of the upper edge of the base portion 3b and is curved in a semi-circular shape. The second contact piece 3g extends obliquely upward from the end of the spring action portion 3d at an angle of 40 ° to 50 °, preferably 45 °, and its lower edge is the second contact surface.
Make 3f. The contact surface 3f at the lower edge of the second contact piece 3g is formed in parallel with the inclined contact surface 3e of the first contact piece 3c in the free state,
The distance is 0.1 to 0.3 mm, preferably 0.2 mm.

The contact pin 3 is made by integrally punching a plate of BeCuP having a thickness of 0.3 mm. The surface of this plate is Ni substrate 2
Au plating is plated on 0.5 μm or more and 0.5 μm or more is plated.

The dimensions of each part are as follows.

Contact terminal 3a length 5.2mm, width 0.5mm Base 3b length 1.0mm, width 10.5mm 1st contact piece 3c height 3.7mm, bottom 2.5mm Spring action part 3d width 0.4mm, radius of curvature 1.1mm Width 0.8 mm, length 5.0 mm of the second contact piece 3g In the above device, when the upper end of the second contact piece 3g comes into contact with the lead terminal 2 of the IC package and is pushed downward, the spring action part
The contact surface 3f formed on the lower edge of the 3d bends downward and is the first
It contacts the contact surface 3e formed on the slanted edge of the contact piece 3c, and thereafter the contact surface 3f slides downward on the contact surface 3e while bending the spring action portion 3d to the side, and the two always contact each other. In this state, the second contact piece 3g moves only up and down and the IC does not slide on the lead terminal 2 surface of the IC package 1.
The surface of the lead terminal 2 of the package 1 is not damaged.

FIG. 2 shows a second embodiment of the contact pin according to the present invention, which has substantially the same shape as that of FIG. 1, but the first contact piece 3c.
The difference is that the distance between the spring action portion 3d and the second contact piece 3g extends laterally. The dimensions of each part are as follows.

Length of contact terminal 3a is 5.5mm, width is 0.5mm Length of base part 3b is 1.0mm, width is 9.6mm Height of first contact piece 3c is 2.5mm, bottom is 1.8mm Spring acting part 3d is 0.4mm in width and radius of curvature is 0.65mm The width of the second contact piece 3g is 0.7 mm, the oblique length is 3.7 mm, and the lateral length is 3.5 mm. Incidentally, although the contact surface of the second contact piece 3g in the above-mentioned embodiment is formed by a straight line, It may be projected in a semicircular shape, a mountain shape, or the like, or may be one in which the contact surface is formed into fine irregularities.

〔The invention's effect〕

As described above, according to the present invention, the current flow path is linear and short, and the L (self-inductance) component is small, so that the high-frequency IC can be accurately inspected and measured.
In addition, the contact pin can be manufactured at low cost because it can be manufactured by only one punching, and since the lead terminal is separated from the contact surface, it can be manufactured by simple punching, and therefore it is easy to plate, and the elasticity of the contact pin is also improved. It can be made strong, and there is no metal fatigue, so the contact pressure is unlikely to go wrong, and no measurement error occurs. Particularly, according to the present invention, since the first contact piece and the inclined surface of the second contact piece are brought into pressure contact with each other by sliding, they can be absorbed even if the contact pressure is too strong, and reliable contact can be achieved with an appropriate contact pressure. The effect is ensured, and the wiping action by sliding allows the new surfaces to come into contact with each other all the time, eliminating the problem of contact resistance and enabling more accurate inspection and measurement of high-frequency ICs.

[Brief description of drawings]

1 is a front view of the first embodiment of the present invention, FIG. 2 is a front view of the second embodiment of the present invention, and FIG. 3 is a conventional IC package.
FIG. 4 is a side view showing a partial cross section of the IC socket, and FIG. 4 is a perspective view of another conventional IC socket. 1 ... IC package, 2 ... lead terminal, 3 ... contact pin, 4 ... IC socket, 3a ... connection terminal, 3b ...
Base part, 3c ... first contact piece, 3d ... spring acting part, 3e ... contact surface, 3f ... contact surface, 3g ... second contact piece.

Continuation of the front page (56) References JP-A-60-59681 (JP, A) Actually opened 60-113991 (JP, U) Actually opened 62-157086 (JP, U)

Claims (1)

[Claims] 1. An IC socket in which contact pins made by punching a flat plate that comes into contact with a lead terminal of an IC package are provided side by side, wherein the contact pins are provided on one side with respect to a base portion. A connection terminal to the circuit is extended, and a first contact surface piece forming a contact surface with one side surface inclined is extended at a position substantially corresponding to the connection terminal on the other side, and further, the first contact from the base portion. On the same side as the piece, a contact surface smaller than the contact surface, which extends through the spring action portion and is arranged so as to be spaced apart from the contact surface at the free end, and a lead terminal of the IC package are mounted. A second contact piece having a contact end to be pressed is formed, and when the lead terminal is placed on the contact end and pressed, the contact surface of the second contact piece is With the biasing force, it slides in pressure contact with the contact surface of the first contact piece, and the contact end IC socket, characterized in that the elastic restoring force of the spring acting portion with release of the pressure, both the contact surface is configured to isolate again against.