JPH0748062B2 - Preheating / precooling temperature automatic setting device for thermal shock tester - Google Patents
Preheating / precooling temperature automatic setting device for thermal shock testerInfo
- Publication number
- JPH0748062B2 JPH0748062B2 JP5441890A JP5441890A JPH0748062B2 JP H0748062 B2 JPH0748062 B2 JP H0748062B2 JP 5441890 A JP5441890 A JP 5441890A JP 5441890 A JP5441890 A JP 5441890A JP H0748062 B2 JPH0748062 B2 JP H0748062B2
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- exposure
- tank
- low
- preheating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000035939 shock Effects 0.000 title claims description 23
- 238000012360 testing method Methods 0.000 claims description 57
- 239000007788 liquid Substances 0.000 claims description 16
- 238000011084 recovery Methods 0.000 claims description 10
- 238000001514 detection method Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 230000003247 decreasing effect Effects 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
Landscapes
- Feedback Control In General (AREA)
- Control Of Temperature (AREA)
Description
〔産業上の利用分野〕 この発明は、電子回路等の被試験物に対して高温さらし
試験及び低温さらし試験を行うようにした熱衝撃試験器
の予熱・予冷温度自動設定装置に関するものである。 〔従来の技術〕 従来の気槽式熱衝撃試験器においては、試験槽内に被試
験物をおき、この試験槽内に高温槽から熱気を送り込ん
で所定の高温状態と成すことにより、高温さらし試験を
行うようにしている。また、試験槽内に低温槽から冷気
を送り込んで所定の低温状態と成すことにより、低温さ
らし試験を行うようにしている。 あるいは、液槽式熱衝撃試験器においては、被試験物を
高温液を有する高温槽内に浸けて高温状態と成すことに
より、高温さらし試験を行うようにしている。また、被
試験物を低温液を有する低温槽内に浸けて低温状態と成
すことにより低温さらし試験を行うようにしている。 気槽式熱衝撃試験器において高温さらしと低温さらしと
を交互に行う２ゾーンサイクル試験を行う場合は、高温
さらしを行っている時には、低温槽を予冷しておき、低
温さらしを行っている時は、高温槽を予熱しておく。そ
して、高温さらし又は低温さらしが一定時間行われる
と、高温槽又は低温槽を閉じ、低温槽又は高温槽を開く
ことにより、次の低温さらし又は高温さらしが行われ
る。 高温さらし，常温さらし，低温さらし，常温さらし又は
低温さらし，常温さらし，高温さらし，常温さらしのサ
イクルで行われる３ゾーン試験を行う場合は、常温さら
しの期間にも予熱又は予冷が行われる。また、一般に予
熱温度は高温さらし温度の設定値より高く設定され、予
冷温度は低温さらし温度の設定値より低く設定される。 上記高温槽の予熱を行うための予熱温度及び低温槽の予
冷を行うための予冷温度は、次の低温さらし又は高温さ
らしに移ったとき、試験槽内の温度が低温さらし温度又
は高温さらし温度の設定値に達するまでの時間に影響を
与える。即ち、予熱温度の設定値が高いか又は予冷温度
の設定値が低い場合は、試験槽内の温度は高温さらし温
度又は低温さらし温度の設定値を一旦通り過ぎオーバシ
ュート又はアンダシュートした後、設定値に戻るが、高
温さらし開始時間から高温さらし温度に最初に達するま
での時間、すなわち、復帰時間が短くなる。また、逆に
予熱温度の設定値が低いか又は予冷温度の設定値が高い
場合は、上記復帰時間が長くなるか又は場合によっては
オーバシュート又はアンダシュートが発生せず、設定値
になかなか到達しないことになる。 第６図は高温さらしから低温さらしに移行する場合を例
として、高温さらし温度TH、低温さらし温度TC及び予冷
温度TP3，TP2，TP1の関係を示す。この図より明らかな
ように、予冷温度TP2，TP3が低い程、カーブ2,3で示す
ように低温さらし温度TCに対するアンダシュート量が大
きくなり、最初に低温さらし温度TCに達するまでの時間
が短くなる。また、予冷温度TP1で示すように予冷温度
が高過ぎると、カーブ１で示すように、アンダシュート
が発生せず、この場合は最初に低温さらし温度TCに達す
る時間は非常に長くなる。 液槽式熱衝撃試験器において高温さらしと低温さらしと
を交互に行う２ゾーンサイクル試験を行う場合は、高温
さらしを行っている時には、低温槽を予冷しておき、低
温さらしを行っている時は、高温槽を予熱しておく。そ
して、高温さらし又は低温さらしが一定時間行われる
と、高温槽又は低温槽にある試料を、低温槽又は高温槽
へ移動することにより、次の低温さらし又は高温さらし
が行われる。 高温さらし，常温さらし，低温さらし，常温さらし又は
低温さらし，常温さらし，高温さらし，常温さらしのサ
イクルで行われる３ゾーン試験を行う場合は、常温さら
しの期間にも予熱又は予冷が行われる。また、一般に予
熱温度は高温さらし温度の設定値より高く設定され、予
冷温度は低温さらし温度の設定値より低く設定される。 上記高温槽の予熱を行うための予熱温度及び低温槽の予
冷を行うための予冷温度は、次の低温さらし又は高温さ
らしに移ったとき、試験槽内の温度が低温さらし温度又
は高温さらし温度の設定値に達するまでの時間に影響を
与える。即ち、予熱温度の設定値が低いか又は予冷温度
の設定値が高い場合は、高温槽又は低温槽の温度は高温
さらし温度又は低温さらし温度の設定値を一旦通り過ぎ
アンダシュート又はオーバシュートした後、設定値に戻
るが、高温さらし開始時間から高温さらし温度に最初に
達するまでの時間は短くなる。また、逆に予熱温度の設
定値が高いか又は予冷温度の設定値が低い場合は、上記
戻り時間が長くなるか又は場合によってはアンダシュー
ト又はオーバシュートが発生せず、各さらし温度になか
なか到達しないことになる。 第７図は低温さらしから高温さらしに移行する場合を例
として、高温さらし温度TH、及び予熱温度TP3，TP2，T
P1の関係を示す。この図より明らかなように、予熱温度
TP2，TP3が低い程、カーブ2,3で示すように高温さらし
温度THに対するアンダシュート量が大きくなり、最初に
高温さらし温度THを通過するまでの時間が短くなる。ま
た、予熱温度TP1で示すように予熱温度が高過ぎると、
カーブ１で示すように、アンダシュートが発生せず、こ
の場合は最初に高温さらし温度THに達する時間は長くな
る。 従って、予熱温度及び予冷温度の適性な設定は試験効率
を上げるうえで大きな要因となる。従来はこの予熱温度
及び予冷温度の設定は、オペレータが経験的に行ってい
るのが現状である。 〔発明が解決しようとする課題〕 上述したように、従来は予熱温度及び予冷温度の設定を
オペレータが経験的に判断して行っているので、オペレ
ータに大きな負担がかかっていた。また、設定を誤った
場合は、試験時間が長くなり、効率を著しく阻害するこ
とになる等の問題点があった。 この発明は上記のような実情に鑑み成されたもので、予
熱温度及び予冷温度を自動的に適正に設定することので
きる熱衝撃試験器の予熱・予冷温度自動設定装置を得る
ことを目的としている。 〔課題を解決するための手段〕 請求項１の発明においては、高温さらし時又は低温さら
し時に上記オーバシュート量又はアンダシュート量を測
定し、この測定値と所定の比例定数とを乗算した値に基
づいて、予熱温度又は予冷温度の設定値を更新するよう
にしている。 請求項２の発明においては、測定されたオーバシュート
量又はアンダシュート量及び試験槽の高温さらし又は低
温さらしの開始から最初に設定温度に達するまでの試験
槽の復帰時間等に基づいて、予熱温度又は予冷温度の設
定値を変更するようにしている。 請求項３の発明においては、高温さらし又は低温さらし
の開始から高温液を入れた高温槽又は低温液を入れた低
温槽が、予め設定した高温さらし温度又は低温さらし温
度に達するまでの通過時間及び高温槽の最低温度及び低
温槽の最高温度に基づいて、高温槽の予熱温度及び低温
槽の予冷温度の設定値を変更するようにしている。 〔作用〕 サイクル試験中に予熱温度又は予冷温度の設定値が自己
学習されて最適値に近くなり、効率的な運転が可能にな
る。 〔発明の実施例〕 以下、この発明の一実施例を図について説明する。 第１図において、１は熱衝撃試験器、２は被試験物がお
かれる試験槽、３は試験槽２に熱気を送り込む高温槽、
４は試験槽２に冷気を送り込む低温槽、５は高温槽３及
び低温槽４の温度制御を行うコントローラ、６は試験槽
２内に設けられた温度センサ、７は温度センサ６の検出
信号をディジタルデータに変換するA/D変換器、８は高
温さらし温度，低温さらし温度，予熱温度及び予冷温度
を設定すると共に、熱衝撃試験器１の操作を行う設定手
段としてのキーボード部、９はキーボード部８及びA/D
変換器７からの信号に基づいてコントローラ５を制御す
るディジタル演算装置である。 次に、予熱温度及び予冷温度を自動的に設定する原理に
ついて、低温さらしから高温さらしに移行する場合を例
として説明する。 第２図は気槽熱衝撃試験器において所定の低温さらし温
度TCから所定の高温さらし温度THに移行する場合におけ
る、種々の予熱温度TP3＞TP2＞TP1＞TP0に対する温度移
行特性を示すもので、εはオーバシュート量を示す。 設定された予熱温度の有効性を判定する基準として、高
温さらし時のオーバシュート量εを用いる。即ち、「過
大なオーバシュートは高すぎる予熱温度に起因し、オー
バシュートしないのは低すぎる予熱温度に起因する」と
解釈することにする。 例えば、第２図において、（ｃ）のεを理想値とする
と、（ａ）の時は予熱温度を大きく下げ、（ｂ）の時は
予熱温度を少し下げる。また、（ｄ）の時は予熱温度を
少し上げる、というような制御を行う。 次に上記原理に基づく第１の設定方法の動作について、
予熱温度TPを設定する場合を例として、第３図のフロー
チャートと共に説明する。 先ず、ステップST1において、キーボード部８を操作し
て、予熱温度TPを経験的に適当に初期設定する。次に高
温さらし温度TH、低温さらし温度TC、予冷温度等を設定
した後、ステップST2でサイクル試験を行う。この試験
中においては、ディジタル演算装置９は、A/D変換器７
を通じて得られる試験槽２内の温度の検出値と設定され
た高温さらし温度TH又は低温さらし温度TCとに基づいて
試験槽２の温度制御量を算出すると共に、高温槽３又は
低温槽４の予熱又は予冷を行う制御量を算出してコント
ローラ５に送る。これにより、コントローラ５は高温槽
３又は低温槽４を所定の高温さらし温度又は低温さらし
温度に制御すると共に、低温槽４又は高温槽３を所定の
予冷温度又は予熱温度に制御する。 これと共に、ステップST3により第２図のオーバシュー
ト量εが測定される。この測定されたεに基づいて次の
ステップST4で、設定された予熱温度TPが更新される。
この予熱温度TPの更新は、 ΔTP＝ａε（ａ＜０） により決定する。但し、ａは比例定数であり、実験若し
くは経験により決まる定数である。この方法で、予熱温
度は試験サイクルの過程で逐次更新され、自動的に最適
値に設定される。なお、第２図（ｄ）の場合はステップ
ST4により、サイクル毎にΔTPが加算されていく制御が
行われる。 ΔTPは、次式で求められる。 ΔTP＝ｂ（ε1＋Ｔε）ｂ＞0,Tε≧０ 但し、ε1：高温さらし開始から一定時間t1後における
温度THとの差。 ｂ ：比例定数 Ｔε：温度の所定量 以上は低温さらしから高温さらしへ移行する場合におけ
る、予熱温度の自動設定について説明したが、高温さら
しから低温さらしへ移行する場合における、予冷温度の
設定についても、同様の方法が適用される。 次に、予熱温度，予冷温度の第２の設定方法について説
明する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a preheating / precooling temperature automatic setting device for a thermal shock tester that performs a high temperature exposure test and a low temperature exposure test on an object to be tested such as an electronic circuit. [Prior Art] In a conventional air-bath type thermal shock tester, an object to be tested is placed in a test tank, and hot air is sent from a high-temperature tank into this test tank to bring it to a predetermined high temperature state, thereby exposing it to high temperature. I'm trying to do a test. Further, a low temperature exposure test is performed by sending cold air from a low temperature tank into the test tank to establish a predetermined low temperature state. Alternatively, in a liquid tank type thermal shock tester, a high temperature exposure test is performed by immersing an object to be tested in a high temperature tank containing a high temperature liquid to bring it into a high temperature state. In addition, the test object is immersed in a low temperature tank containing a low temperature liquid so as to be in a low temperature state, so that a low temperature exposure test is performed. When performing a two-zone cycle test in which high-temperature exposure and low-temperature exposure are performed alternately in the air-tank thermal shock tester, when performing high-temperature exposure, pre-cool the low-temperature tank and perform low-temperature exposure. Preheat the high temperature bath. When the high temperature exposure or the low temperature exposure is performed for a certain period of time, the high temperature tank or the low temperature tank is closed and the low temperature tank or the high temperature tank is opened to perform the next low temperature exposure or high temperature exposure. When performing a three-zone test conducted in a cycle of high temperature exposure, normal temperature exposure, low temperature exposure, normal temperature exposure or low temperature exposure, normal temperature exposure, high temperature exposure, normal temperature exposure, preheating or precooling is also performed during the normal temperature exposure period. Further, generally, the preheating temperature is set higher than the set value of the high temperature exposure temperature, and the precooling temperature is set lower than the set value of the low temperature exposure temperature. The preheating temperature for preheating the high temperature tank and the precooling temperature for precooling the low temperature tank are the low temperature exposure temperature or the high temperature exposure temperature when the temperature in the test tank is changed to the next low temperature exposure or high temperature exposure. Affects the time to reach the set value. That is, when the set value of the preheating temperature is high or the set value of the precooling temperature is low, the temperature in the test tank once passes the set value of the high temperature exposure temperature or the low temperature exposure temperature, and after overshooting or undershooting, the set value is set. However, the time from the high temperature exposure start time to the first high temperature exposure temperature, that is, the recovery time becomes shorter. On the contrary, if the set value of the preheat temperature is low or the set value of the precool temperature is high, the above recovery time becomes long, or overshoot or undershoot does not occur in some cases, and the set value does not reach easily. It will be. FIG. 6 shows the relationship between the high temperature exposure temperature T H , the low temperature exposure temperature T C, and the precooling temperatures T P3 , T P2 , T P1 by taking the case of transition from high temperature exposure to low temperature exposure as an example. As is clear from this figure, the lower the pre-cooling temperatures T P2 and T P3 , the larger the undershoot amount for the low temperature exposure temperature T C as shown by curves 2 and 3, until the low temperature exposure temperature T C is reached first. Time will be shortened. Further, if the precooling temperature is too high as shown by the precooling temperature T P1 , undershoot does not occur as shown by the curve 1, and in this case, the time to reach the low temperature exposure temperature T C first becomes very long. When performing a two-zone cycle test in which high-temperature exposure and low-temperature exposure are alternately performed in a liquid tank thermal shock tester, when performing high-temperature exposure, pre-cool the low-temperature tank and perform low-temperature exposure. Preheat the high temperature bath. Then, when the high temperature exposure or the low temperature exposure is performed for a certain period of time, the next low temperature exposure or high temperature exposure is performed by moving the sample in the high temperature tank or the low temperature tank to the low temperature tank or the high temperature tank. When performing a three-zone test conducted in a cycle of high temperature exposure, normal temperature exposure, low temperature exposure, normal temperature exposure or low temperature exposure, normal temperature exposure, high temperature exposure, normal temperature exposure, preheating or precooling is also performed during the normal temperature exposure period. Further, generally, the preheating temperature is set higher than the set value of the high temperature exposure temperature, and the precooling temperature is set lower than the set value of the low temperature exposure temperature. The preheating temperature for preheating the high temperature tank and the precooling temperature for precooling the low temperature tank are the low temperature exposure temperature or the high temperature exposure temperature when the temperature in the test tank is changed to the next low temperature exposure or high temperature exposure. Affects the time to reach the set value. That is, when the set value of the preheating temperature is low or the set value of the precooling temperature is high, the temperature of the high temperature tank or the low temperature tank once passes through the set value of the high temperature exposure temperature or the low temperature exposure temperature and undershoots or overshoots, Although it returns to the set value, the time from the high temperature exposure start time to the first high temperature exposure temperature is shortened. On the contrary, if the set value of preheat temperature is high or the set value of precool temperature is low, the above return time becomes long, or undershoot or overshoot does not occur in some cases, and each exposure temperature is reached easily. Will not do. Fig. 7 shows the case of transition from low temperature exposure to high temperature exposure as an example, high temperature exposure temperature T H , and preheating temperatures T P3 , T P2 , T
The relationship of P1 is shown. As is clear from this figure, the preheating temperature
As T P2 and T P3 are lower, the amount of undershoot with respect to the high temperature exposure temperature T H is larger as shown by curves 2 and 3, and the time until the first high temperature exposure temperature T H is passed becomes shorter. Further, if the preheating temperature is too high as shown by the preheating temperature T P1 ,
As shown by the curve 1, undershoot does not occur, and in this case, the time to reach the high temperature exposure temperature T H first becomes long. Therefore, proper setting of the preheating temperature and the precooling temperature is a major factor in increasing the test efficiency. Conventionally, the setting of the preheating temperature and the precooling temperature is empirically performed by the operator at present. [Problems to be Solved by the Invention] As described above, since the operator conventionally empirically determines the settings of the preheating temperature and the precooling temperature, a great burden is placed on the operator. Further, if the setting is incorrect, there is a problem that the test time becomes long and the efficiency is significantly impaired. The present invention has been made in view of the above circumstances, and an object thereof is to obtain a preheating / precooling temperature automatic setting device for a thermal shock tester capable of automatically and properly setting the preheating temperature and the precooling temperature. There is. [Means for Solving the Problem] In the invention of claim 1, at the time of high temperature exposure or low temperature exposure, the above-mentioned overshoot amount or undershoot amount is measured, and the measured value is multiplied by a predetermined proportional constant. Based on this, the set value of the preheating temperature or the precooling temperature is updated. In the invention of claim 2, the preheating temperature is based on the measured overshoot amount or undershoot amount and the recovery time of the test tank from the start of high temperature exposure or low temperature exposure of the test tank to the first reaching the set temperature. Alternatively, the set value of the precooling temperature is changed. In the invention of claim 3, the passage time from the start of high temperature exposure or low temperature exposure until the high temperature tank containing the high temperature liquid or the low temperature tank containing the low temperature liquid reaches a preset high temperature exposure temperature or low temperature exposure temperature and The set values of the preheating temperature of the high temperature tank and the precooling temperature of the low temperature tank are changed based on the minimum temperature of the high temperature tank and the maximum temperature of the low temperature tank. [Operation] During the cycle test, the set value of the preheating temperature or the precooling temperature is self-learned and becomes close to the optimum value, which enables efficient operation. [Embodiment of the Invention] An embodiment of the present invention will be described below with reference to the drawings. In FIG. 1, 1 is a thermal shock tester, 2 is a test tank in which an object to be tested is placed, 3 is a high temperature tank for sending hot air to the test tank 2,
4 is a low temperature tank for sending cold air to the test tank 2, 5 is a controller for controlling the temperature of the high temperature tank 3 and the low temperature tank 4, 6 is a temperature sensor provided in the test tank 2, and 7 is a detection signal of the temperature sensor 6. A / D converter for converting to digital data, 8 is a keyboard section as setting means for setting the high temperature exposure temperature, the low temperature exposure temperature, the preheating temperature and the precooling temperature, and operating the thermal shock tester 1, and 9 is the keyboard Part 8 and A / D
It is a digital arithmetic unit that controls the controller 5 based on a signal from the converter 7. Next, the principle of automatically setting the preheating temperature and the precooling temperature will be described by taking the case of shifting from low temperature exposure to high temperature exposure as an example. Fig. 2 shows the temperature transition for various preheating temperatures T P3 > T P2 > T P1 > T P0 when the temperature is changed from a low temperature exposure temperature T C to a high temperature exposure temperature T H. It shows the characteristic, and ε shows the amount of overshoot. The overshoot amount ε at the time of high temperature exposure is used as a criterion for determining the effectiveness of the set preheating temperature. That is, it is interpreted that "excessive overshoot is caused by too high preheating temperature, and not overshooting is caused by too low preheating temperature". For example, in FIG. 2, assuming that ε in (c) is an ideal value, the preheating temperature is greatly decreased in (a), and the preheating temperature is slightly decreased in (b). Further, in the case of (d), control is performed such that the preheating temperature is slightly raised. Next, regarding the operation of the first setting method based on the above principle,
An example of setting the preheating temperature T P will be described together with the flowchart of FIG. First, in step ST1, the keyboard unit 8 is operated to empirically initialize the preheating temperature T P appropriately. Next, after setting the high temperature exposure temperature T H , the low temperature exposure temperature T C , the precooling temperature, etc., a cycle test is performed in step ST2. During this test, the digital arithmetic unit 9 operates the A / D converter 7
The temperature control amount of the test tank 2 is calculated based on the detected value of the temperature in the test tank 2 obtained through the above and the set high temperature exposure temperature T H or low temperature exposure temperature T C, and the high temperature tank 3 or the low temperature tank 4 is calculated. The control amount for preheating or precooling is calculated and sent to the controller 5. Thereby, the controller 5 controls the high temperature tank 3 or the low temperature tank 4 to a predetermined high temperature exposure temperature or a low temperature exposure temperature, and also controls the low temperature tank 4 or the high temperature tank 3 to a predetermined precooling temperature or a preheating temperature. At the same time, the overshoot amount ε in FIG. 2 is measured in step ST3. Based on this measured ε, the set preheating temperature T P is updated in the next step ST4.
The update of the preheating temperature T P is determined by ΔT P = aε (a <0). However, a is a proportional constant and is a constant determined by experiment or experience. In this way, the preheat temperature is sequentially updated during the test cycle and automatically set to the optimum value. In the case of FIG. 2 (d), the step
The ST4, control will be subject to [Delta] T P for each cycle. ΔT P is calculated by the following equation. ΔT P = b (ε 1 + Tε) b> 0, Tε ≧ 0, where ε 1 is the difference from the temperature T H after a fixed time t 1 from the start of high temperature exposure. b: Proportional constant Tε: A predetermined amount of temperature or more has been described for automatic setting of the preheating temperature when shifting from low temperature exposure to high temperature exposure, but also for setting the precooling temperature when transitioning from high temperature exposure to low temperature exposure. , A similar method applies. Next, a second setting method of the preheating temperature and the precooling temperature will be described.
【予熱温度の自動設定】 高温さらし中、試験槽２の風上温度のオーバシュート
量ε（実際には最高値）を測定する。この温度が（高温
さらし温度TH）＋所定温度（例えば３℃）を超えたら超
えた温度だけ予熱温度を下げる。この条件に当てはまら
ない時は次のを実行する。 高温さらし開始から高温さらし温度THに達するまでの
試験槽２の温度復帰時間を測定する。 復帰時間が所定時間、例えば２分以内だったら、予熱温
度を例えば１℃下げ、４分超えたら例えば１分に付き１
℃上げる（４分なら１℃、５分なら２℃……）。但し、
高温さらし直前の高温槽３の温度が予熱温度に達してい
なかった時は、上記復帰時間が４分を超えても予熱温度
は上げない。 予熱温度は（高温さらし温度TH）＋所定温度（例えば
25℃）を上限とする。[Automatic setting of preheating temperature] During high temperature exposure, the overshoot amount ε (actually the maximum value) of the windward temperature of the test tank 2 is measured. When this temperature exceeds (high temperature exposure temperature TH ) + predetermined temperature (for example, 3 ° C), the preheating temperature is lowered by the exceeded temperature. If this condition is not met, do the following. The temperature recovery time of the test tank 2 from the start of high temperature exposure to the high temperature exposure temperature T H is measured. If the recovery time is within a predetermined time, for example, 2 minutes, the preheating temperature is lowered by 1 ° C., and if it exceeds 4 minutes, for example, every 1 minute
Raise ℃ (1 ℃ for 4 minutes, 2 ℃ for 5 minutes ...). However,
When the temperature of the high temperature tank 3 just before the high temperature exposure has not reached the preheating temperature, the preheating temperature is not raised even if the above recovery time exceeds 4 minutes. The preheating temperature is (high temperature exposure temperature TH ) + predetermined temperature (eg
25 ℃) as the upper limit.
【予冷温度の自動設定】 低温さらし中、試験槽２の風上温度のアンダシュート
量ε（実際には最小値）を測定する。この温度が（低温
さらし温度TC）−所定温度（例えば３℃）を下回った
ら、下回った温度だけ予冷温度を上げる。この条件に当
てはまらない時は次のを実行する。 低温さらし開始から低温さらし温度TCに達するまでの
試験槽２の温度復帰時間を測定する。復帰時間が所定時
間、例えば２分以内だったら、予冷温度を例えば１℃上
げ、例えば４分を超えたら例えば１分に付き１℃予冷温
度を下げる（４分なら１℃、５分なら２℃……）。但
し、低温さらし開始直前の低温槽４の温度が予冷温度に
達していなかった時は、上記復帰時間が４分を超えても
予冷温度は下げない 予冷温度は（低温さらし温度TC）−所定温度（例えば
20℃）を下限とする。 なお、上記各設定においては、装置に定められた上限
値，下限値は最優先される。 以上説明した第1,2の設定方法は、２ゾーンサイクル試
験及び３ゾーンサイクル試験において実行することがで
きる。 第４図は液槽を用いて被試験物の熱衝撃試験を実施する
液槽式熱衝撃試験器の予熱・予冷温度自動設定装置を示
す。同図において、1Aは熱衝撃試験器、11は被試験物移
送装置12によって移送される被試験物13を浸漬する高温
液、14は高温液11を収容する高温槽、15は低温液、16は
低温液15を収容する低温槽、17,18は高温槽14及び低温
槽16の温度をそれぞれ監視する温度センサで、このほか
の第１図に示したものと同一又は同等の構成部分には同
一符号を付して、その重複する説明を省く。また、第５
図（ａ），（ｂ），（ｃ）は高温槽14の温度が高温さら
し温度に達するまでの通過時間の長短による予熱温度及
び高温さらし温度の温度移行特性を示す。 次に、この実施例において、予熱温度及び予冷温度を自
動設定する動作について説明する。[Automatic setting of precooling temperature] The undershoot amount ε (actually the minimum value) of the windward temperature of the test tank 2 is measured during low temperature exposure. If this temperature falls below (low temperature exposure temperature T C ) −predetermined temperature (for example, 3 ° C.), the precooling temperature is increased by the lowered temperature. If this condition is not met, do the following. The temperature recovery time of the test tank 2 from the start of the low temperature exposure to the low temperature exposure temperature T C is measured. If the recovery time is within a predetermined time, for example, 2 minutes, the precooling temperature is increased by 1 ° C, for example, if it exceeds 4 minutes, the precooling temperature is decreased by 1 ° C per 1 minute (for example, 1 ° C for 4 minutes, 2 ° C for 5 minutes). ......). However, when the temperature of the low temperature tank 4 has not reached the precooling temperature immediately before the start of the low temperature exposure, the precooling temperature is not lowered even if the above recovery time exceeds 4 minutes. Precooling temperature is (low temperature exposure temperature T C ) -predetermined Temperature (eg
20 ℃) as the lower limit. In each of the above settings, the upper limit value and the lower limit value set for the device are given the highest priority. The first and second setting methods described above can be executed in the two-zone cycle test and the three-zone cycle test. FIG. 4 shows a preheating / precooling temperature automatic setting device of a liquid tank type thermal shock tester for carrying out a thermal shock test of a test object using a liquid tank. In the figure, 1A is a thermal shock tester, 11 is a high temperature liquid in which the DUT 13 transferred by the DUT transfer device 12 is immersed, 14 is a high temperature tank containing the high temperature liquid 11, 15 is a low temperature liquid, 16 Is a low temperature tank for containing the low temperature liquid 15, 17 and 18 are temperature sensors for monitoring the temperatures of the high temperature tank 14 and the low temperature tank 16, respectively, and the same or equivalent components as those shown in FIG. The same reference numerals are given and duplicate explanations are omitted. Also, the fifth
Figures (a), (b) and (c) show the temperature transfer characteristics of the preheating temperature and the high temperature exposure temperature depending on the length of the passage time until the temperature of the high temperature tank 14 reaches the high temperature exposure temperature. Next, an operation of automatically setting the preheating temperature and the precooling temperature in this embodiment will be described.
【予熱温度の自動設定】 高温さらし開始から、高温槽14の温度が高温さらし温
度THに達するまでの、第５図に示すような通過時間を監
視する。これが例えば１分を超えたら１分に付き１℃予
熱温度を下げる（１分で１℃、２分で２℃……、但し５
℃以上は変化させない）。この条件に当てはまらなかっ
たら次のを実行する。 高温さらし中の高温槽14の最低温度を監視する。これ
が（高温さらし温度TH−３℃）よりも下回ったら１℃に
付き１℃予熱温度を上げる（高温さらし温度TH−４℃な
ら予熱温度を１℃上げる）。但し、高温さらし開始直前
の高温槽14の温度が予熱温度に達していなかったら予熱
温度は上げない。 但し、予熱温度は（高温さらし温度）＋（10℃）を上
限とする。[Automatic setting of preheating temperature] The passing time as shown in FIG. 5 from the start of high temperature exposure until the temperature of the high temperature tank 14 reaches the high temperature exposure temperature T H is monitored. For example, if this exceeds 1 minute, the preheating temperature is lowered by 1 ° C per minute (1 ° C in 1 minute, 2 ° C in 2 minutes ...
Do not change above ℃). If this condition is not met, execute the following. The minimum temperature of the high temperature bath 14 during high temperature exposure is monitored. If this is lower than (high temperature exposure temperature TH -3 ° C), the preheating temperature is increased by 1 ° C per 1 ° C (if the high temperature exposure temperature TH -4 ° C, the preheating temperature is increased by 1 ° C). However, the preheating temperature is not raised unless the temperature of the high temperature tank 14 just before the start of the high temperature exposure has reached the preheating temperature. However, the upper limit of the preheating temperature is (high temperature exposure temperature) + (10 ° C).
この発明によれば、予熱温度及び予冷温度が自動設定さ
れ、このためオペレータの負担が軽減され、また、学習
機能により最適化されるので、試験が最適な設定の下で
実行できる。さらに、試験状態が高温から低温、低温か
ら高温へ変化する時に、予熱，予冷が最適化されること
により、最高の立ち上がり、立ち下がりが得られる。こ
れは温度コントローラの制御（PID等）の負担を軽減す
ることにもなり、より安定な制御が可能になる等の効果
が得られる。According to the present invention, the preheating temperature and the precooling temperature are automatically set, which reduces the burden on the operator and is optimized by the learning function, so that the test can be performed under the optimum setting. Furthermore, when the test state changes from high temperature to low temperature and from low temperature to high temperature, the preheating and precooling are optimized, so that the highest rise and fall can be obtained. This also reduces the load of control of the temperature controller (PID, etc.), and has effects such as more stable control.
第１図はこの発明の一実施例による気槽式熱衝撃試験器
の予熱・予冷温度自動設定装置を示すブロック図、第２
図は同熱衝撃試験器の予熱・予冷温度自動設定装置の試
験槽内の温度変化を示す特性図、第３図は同熱衝撃試験
器の予熱・予冷温度自動設定装置の動作を説明するため
のフローチャート、第４図は液槽式熱衝撃試験器の予熱
・予冷温度自動設定装置の他の実施例を示すブロック
図、第５図は同熱衝撃試験器の予熱・予冷温度自動設定
装置の高温槽内の温度変化を示す特性図、第６図は気槽
式熱衝撃試験器の試験槽内の温度変化を示す特性図、第
７図は液槽式熱衝撃試験器の高温槽内の温度変化を示す
特性図である。 １は熱衝撃試験器、２は試験槽、３は高温槽、４は低温
槽、８はキーボード部、９はディジタル演算装置、14は
高温槽、16は低温槽。FIG. 1 is a block diagram showing an automatic preheating / precooling temperature setting device for a thermal shock tester of the air tank type according to an embodiment of the present invention.
The figure is a characteristic diagram showing the temperature change in the test tank of the automatic preheating / precooling temperature setting device of the thermal shock tester, and Fig. 3 is for explaining the operation of the automatic preheating / precooling temperature setting device of the thermal shock tester. FIG. 4 is a block diagram showing another embodiment of the preheating / precooling temperature automatic setting device for the liquid tank type thermal shock tester, and FIG. 5 is the block diagram showing the preheating / precooling temperature automatic setting device for the thermal shock tester. Fig. 6 is a characteristic diagram showing the temperature change in the high temperature tank, Fig. 6 is a characteristic diagram showing the temperature change in the test tank of the gas tank type thermal shock test device, and Fig. 7 is a high temperature tank of the liquid tank type thermal shock test device. It is a characteristic view which shows temperature change. 1 is a thermal shock tester, 2 is a test tank, 3 is a high temperature tank, 4 is a low temperature tank, 8 is a keyboard section, 9 is a digital arithmetic unit, 14 is a high temperature tank, and 16 is a low temperature tank.
Claims (3)
成す高温槽と、上記試験槽内の雰囲気温度を任意の低温
状態に成す低温槽と、上記試験槽内の高温さらし温度
と、この高温さらし温度に対する上記高温槽の予熱温度
と、上記試験槽内の低温さらし温度と、この低温さらし
温度に対する上記低温槽の予冷温度とをそれぞれ設定す
る設定手段と、上記高温さらし時又は低温さらし時に、
上記設定手段で設定された上記高温さらし温度又は低温
さらし温度の設定値に対する上記試験槽内の温度のオー
バシュート量又はアンダシュート量を測定する測定手段
と、上記測定されたオーバシュート量又はアンダシュー
ト量と所定の比例定数とを乗算する乗算手段と、上記乗
算手段で得られた乗算値に基づいて上記予熱温度又は予
冷温度の設定値を変更する変更手段とを備えた熱衝撃試
験器の予熱・予冷温度自動設定装置。1. A high temperature tank for setting the atmosphere temperature in the test tank to an arbitrary high temperature state, a low temperature tank for setting the atmosphere temperature in the test tank to an arbitrary low temperature state, and a high temperature exposure temperature in the test tank, Preheating temperature of the high temperature tank for the high temperature exposure temperature, low temperature exposure temperature in the test tank, setting means for setting the precooling temperature of the low temperature tank for the low temperature exposure temperature, and the high temperature exposure or low temperature exposure Sometimes
Measuring means for measuring the amount of overshoot or undershoot of the temperature in the test tank with respect to the set value of the high temperature exposure temperature or the low temperature exposure temperature set by the setting means, and the measured overshoot amount or undershoot Preheating of a thermal shock tester, comprising: a multiplying unit that multiplies an amount by a predetermined proportional constant; and a changing unit that changes the set value of the preheating temperature or the precooling temperature based on the multiplication value obtained by the multiplying unit. -Automatic precooling temperature setting device.
成す高温槽と、上記試験槽内の雰囲気温度を任意の低温
状態に成す低温槽と、上記試験槽内の高温さらし温度
と、この高温さらし温度に対する上記高温槽の予熱温度
と、上記試験槽内の低温さらし温度と、この低温さらし
温度に対する上記低温槽の予冷温度とをそれぞれ設定す
る設定手段と、上記高温さらし時又は低温さらし時に、
上記設定手段で設定された上記高温さらし温度又は低温
さらし温度の設定値に対する上記試験槽内の温度のオー
バシュート量又はアンダシュート量を測定する測定手段
と、上記測定されたオーバシュート量又はアンダシュー
ト量が所定値を超えたとき、その超えた分だけ上記予熱
温度又は予冷温度の設定値を変更する変更手段と、上記
オーバシュート量又はアンダシュート量が上記所定量を
超えなかったとき、上記高温さらし又は低温さらしの開
始から設定された高温さらし温度又は低温さらし温度に
上記試験槽の温度が最初に達するまでの復帰時間を測定
する測定手段と、さらし開始時から最初にさらし温度に
到達するまでの時間に応じて上記予熱温度又は予冷温度
の設定値を変更する変更手段とを備えた熱衝撃試験器の
予熱・予冷温度自動設定装置。2. A high temperature tank for setting the atmosphere temperature in the test tank to an arbitrary high temperature state, a low temperature tank for setting the atmosphere temperature in the test tank to an arbitrary low temperature state, and a high temperature exposure temperature in the test tank, Preheating temperature of the high temperature tank for the high temperature exposure temperature, low temperature exposure temperature in the test tank, setting means for setting the precooling temperature of the low temperature tank for the low temperature exposure temperature, and the high temperature exposure or low temperature exposure Sometimes
Measuring means for measuring the amount of overshoot or undershoot of the temperature in the test tank with respect to the set value of the high temperature exposure temperature or the low temperature exposure temperature set by the setting means, and the measured overshoot amount or undershoot When the amount exceeds a predetermined value, the changing means for changing the set value of the preheating temperature or the precooling temperature by the excess amount, and the high temperature when the overshoot amount or the undershoot amount does not exceed the predetermined amount. Measuring means to measure the recovery time from the start of exposure or low temperature exposure until the temperature of the above test tank first reaches the set high temperature or low temperature exposure temperature, and from the start of exposure until the first exposure temperature is reached Of the thermal shock tester equipped with changing means for changing the set value of the preheating temperature or the precooling temperature according to the time of Setting device.
液を任意の高温状態に成す高温槽と、上記被試験物を浸
ける低温液を有し、この低温液を任意の低温状態に成す
低温槽と、上記高温槽内の高温さらし温度と、上記低温
槽内の低温さらし温度と、上記高温さらし温度に対する
上記高温槽の予熱温度と、上記低温さらし温度に対する
上記低温槽の予冷温度とをそれぞれ設定する設定手段
と、上記高温さらし又は低温さらしの開始から上記高温
槽又は低温槽が上記設定された高温さらし温度又は低温
さらし温度に最初に達するまでの通過時間を測定する測
定手段と、上記測定された通過時間が所定量を超えたと
き、上記予熱温度又は予冷温度の設定値を変更する変更
手段と、上記測定された復帰時間が上記所定量を超えな
かったとき、上記高温さらし中又は低温さらし中におけ
る上記高温槽の最低温度又は上記低温槽の最高温度を検
出する検出手段と、上記検出された上記最低温度又は最
高温度に基づいて上記予熱温度又は予冷温度の設定値を
変更する変更手段とを備えた熱衝撃試験器の予熱・予冷
温度自動設定装置。3. A high-temperature bath for immersing the DUT, and a high-temperature bath for immersing the high-temperature liquid in an arbitrary high temperature state, and a low-temperature liquid for immersing the DUT in the low-temperature state. A low temperature tank, a high temperature exposure temperature in the high temperature tank, a low temperature exposure temperature in the low temperature tank, a preheating temperature of the high temperature tank for the high temperature exposure temperature, and a precooling temperature of the low temperature tank for the low temperature exposure temperature And setting means for setting respectively, and a measuring means for measuring the passage time from the start of the high temperature exposure or the low temperature exposure until the high temperature tank or the low temperature tank first reaches the set high temperature exposure temperature or low temperature exposure temperature. , When the measured transit time exceeds a predetermined amount, changing means for changing the set value of the preheating temperature or precooling temperature, and when the measured return time does not exceed the predetermined amount, the high A detection means for detecting the minimum temperature of the high temperature tank or the maximum temperature of the low temperature tank during exposure or low temperature exposure, and the set value of the preheating temperature or the precooling temperature based on the detected minimum temperature or maximum temperature. Automatic preheating / precooling temperature setting device for thermal shock tester equipped with changing means for changing.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1-143151 | 1989-06-07 | ||
| JP14315189 | 1989-06-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03214037A JPH03214037A (en) | 1991-09-19 |
| JPH0748062B2 true JPH0748062B2 (en) | 1995-05-24 |
Family
ID=15332113
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5441890A Expired - Lifetime JPH0748062B2 (en) | 1989-06-07 | 1990-03-06 | Preheating / precooling temperature automatic setting device for thermal shock tester |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0748062B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104568634A (en) * | 2014-12-31 | 2015-04-29 | 浙江华电器材检测研究所 | Testing tank for temperature cycle testing machine for insulator |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5204808B2 (en) * | 2010-06-29 | 2013-06-05 | エスペック株式会社 | Thermal shock test equipment |
| JP7265816B1 (en) * | 2022-12-15 | 2023-04-27 | エタックエンジニアリング株式会社 | Environment-forming device and program for environment-forming device |
-
1990
- 1990-03-06 JP JP5441890A patent/JPH0748062B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104568634A (en) * | 2014-12-31 | 2015-04-29 | 浙江华电器材检测研究所 | Testing tank for temperature cycle testing machine for insulator |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03214037A (en) | 1991-09-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5056047A (en) | Method and device for measuring fluidic or calorimetric parameters | |
| US3623356A (en) | Dew point hygrometer | |
| US6370450B1 (en) | Integrated total temperature probe system | |
| US20090097282A1 (en) | Frequency Converting Apparatus And Control Method For The Apparatus | |
| US6711531B1 (en) | Temperature control simulation method and apparatus | |
| EP0091930A1 (en) | Method and device for controlling the curing rate of concrete. | |
| JPH0748062B2 (en) | Preheating / precooling temperature automatic setting device for thermal shock tester | |
| KR920006976B1 (en) | Temperature control means | |
| EP0027112B2 (en) | Method and apparatus for regulating the temperature of a heating element in a water heater | |
| US5926390A (en) | Programmed temperature controller | |
| JPH03152441A (en) | Testing method for thermal fatigue | |
| US8150558B2 (en) | Temperature control method and temperature controller | |
| JPH11160217A (en) | Thermal shock test device with function of neutralization control | |
| JP3212716B2 (en) | Test sample temperature attainment determination method and exposure mode switching control device | |
| CA1332292C (en) | Temperature controlling means for a thermostat for use in measuring viscosity | |
| JPH0816568B2 (en) | Thermal shock tester | |
| JPH06123688A (en) | Temperature returning time controller | |
| JPH0512626B2 (en) | ||
| SU1168912A1 (en) | Method and apparatus for programmed control of temperature | |
| JP3278567B2 (en) | Method and apparatus for setting applied current value in thermal conductivity measurement | |
| JPH0259419B2 (en) | ||
| JPH06117785A (en) | Refrigerant defrosting method for exhaust heat heat pipe | |
| Cameron et al. | CONTROL OF OXIDE GROWTH BY REAL-TIME SIMULATION | |
| JPH02219977A (en) | Method for controlling heating temperature vertical induction heating furnace | |
| JPH05203553A (en) | Precooling and preheating temperature automatic setting method for liquid tank type thermal shock test device and the device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 14 Free format text: PAYMENT UNTIL: 20090524 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090524 Year of fee payment: 14 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 15 Free format text: PAYMENT UNTIL: 20100524 |
|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 15 Free format text: PAYMENT UNTIL: 20100524 |