JPH0748532B2 - Optical sensor package - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial field of application) The present invention relates to a package in which, among semiconductor devices, an optical sensor is mounted.

(Prior Art) FIG. 3 (a) is a sectional view of a conventional package of this type, and FIG. 3 (b) is a front view of the package. The package of FIG. 3 is mounted with a solid-state optical sensor of a backside illumination type, which has a structure in which bonding wiring is performed from the front side. This package includes an insulating frame 15, a bonding pad 6 and a conductor 7.
Consists of. In the frame body 15, a hole smaller than the solid-state photosensor and having a size that does not block light to be incident on the light-receiving region of the solid-state photosensor is formed in the central portion. Around the hole on the side that is not the light incident surface (the upper side in FIG. 3A), there are formed two stepped recesses that are recessed from the outer peripheral portion. The bonding pad 6 is provided on the flat portion of the first hollow of the frame body 15, and the conductor 7 electrically connected to the bonding pad 6 is drawn out through the frame body 15. The second recess of the frame is wider than the solid-state photosensor.
As shown in FIG. 4, the solid-state optical sensor 11 is adhered to the flat portion of the recess of the second stage with the back surface facing the light incident side, and the bonding pad of the solid-state optical sensor 11 and the bonding pad 6 of the package are connected. The package and the solid-state optical sensor 11 are assembled by wiring with the wire 12.

(Problems to be Solved by the Invention) In the conventional package in which the solid-state photosensor of the above-mentioned back-illuminated type in which bonding wiring is performed from the front side is mounted, light is transmitted to the solid-state photosensor through a hole provided in the center. The structure is such that the light is incident, and the solid-state optical sensor is bonded to the flat portion of the second-stage depression around the hole with the back surface facing the light incident side. The conventional package having such a structure must have a non-light-receiving area having a sufficient area for the solid-state photosensor to be mounted to adhere to the periphery of the light-receiving area. It is difficult to miniaturize because it requires an area to fit it. Some of the above-mentioned solid-state photosensors are used by cooling, but in the conventional package, the flat outer periphery of the recess on the side having the double recess is connected or bonded to the cooling device, so that it is mounted. The heat of the solid-state optical sensor is radiated through the bonding part with the flat part of the second-step depression and the connecting part (bonding part) between the package and the cooling device. Therefore, in the conventional package, the cooling efficiency is originally poor, and if the area of the bonding portion between the solid-state optical sensor and the package and the connection portion (bonding portion) between the package and the cooling device is reduced for downsizing, the efficiency is further reduced. It has the drawback of decreasing.

(Means for Solving the Problems) Means provided by the present invention for solving the above problems are an optical sensor package in which a solid-state optical sensor of a backside irradiation type in which bonding wiring is performed from the front side is mounted. In, in the shape of a frame having a hole larger than the solid-state photosensor
Only one surface has a recess recessed from the outer peripheral portion around the hole in the center, and the other surface has a surface shape capable of temporarily adhering a temporary support portion to which the solid-state optical sensor is temporarily attached during assembly. A main body based on an insulator, having a bonding pad on a flat portion of the recessed concave portion of the insulator, and a conductor electrically connected to the bonding pad being drawn out through the insulator to the outside; The part that is adhered to the outer peripheral portion of the concave portion and supports the solid-state optical sensor, has an adhesive reservoir provided near the center of the surface on the side that is adhered to the main body, and passes through parts other than the adhesive reservoir. A bottom portion having pores, and provided on the surface when the surface of the bottom portion on the adhesive reservoir side is bonded to the surface of the solid-state optical sensor by an adhesive in the adhesive reservoir. The Bo An optical sensor package, wherein the adhesive reservoir to the region not touch the wire connecting the bonding pads of the loading pad and the main body is provided.

(Operation) In the optical sensor package of the present invention, a jig called a temporary support portion is used to maintain the fixing of the solid-state optical sensor and the package main body during the bonding wiring step of the solid-state optical sensor and the bonding step with the base. However, it is removed from the main body when the solid-state photosensor is assembled, and the solid-state photosensor is supported by the base. Therefore, in the solid-state photosensor mounted in the photosensor package of the present invention, the non-light-receiving region around the light-receiving region can be minimized to provide peripheral components such as bonding pads, etc. The hole in the center of the main body of the optical sensor package of the present invention, which corresponds to the depression, has only to be large enough to accommodate the solid-state optical sensor, so that the problem in miniaturization is solved. Further, even when mounting a solid-state photosensor that requires cooling, in the photosensor package of the present invention, a wide area of the base portion can be applied to connection or adhesion with a cooling device,
In addition, since the bonding area between the solid-state optical sensor and the base can be widened, the problem of cooling efficiency can be solved.

(Example) Next, this invention is demonstrated with reference to drawings.

FIG. 1 is a view showing the structure of an embodiment of the present invention, in which FIG. 1 (a) is an overall vertical cross-sectional structural view including a temporary support portion, and FIG. 1 (b) is a front view of a main body seen from the recess side. The same figure (c) is a front view of the base seen from the adhesive reservoir side. A frame shape having a hole 4 larger than the solid-state optical sensor in the center, only one surface having a concave portion 5 recessed from the outer peripheral portion around the hole 4 in the center, and the other surface having a shape capable of temporarily adhering the temporary supporting portion 2 A main body 1 having a bonding pad 6 in the recessed flat portion of the insulator, and a conductor 7 electrically connected to the bonding pad 6 being drawn out to the outside through the insulator. This embodiment consists of two parts of the base part 3 which is made of an insulating material of the same type and has a structure in which an adhesive reservoir 10 is provided at the center of one surface of a parallel plate and a ventilation hole 9 is provided in the peripheral part thereof. The temporary support portion 2 used as a jig in the mounting work step has a parallel plate shape in this embodiment, and has a vent hole 8 in a portion which is not covered by the solid-state optical sensor when the solid-state optical sensor is temporarily bonded. There is. When the three parts shown in FIG.
The size of the package is designed so that the clearance between the highest portion of the solid-state optical sensor and the temporary support portion 2 is about the thickness of the solid-state optical sensor with some margin added. In addition, the opening of the adhesive reservoir 10 should be approximately the same size as the light receiving area of the solid-state optical sensor, and the adhesive reservoir 10 should touch the connection wire between the solid-state optical sensor and the bonding pad 6 of the main body 1. I try not to hurt.

Next, a method of using the package of the embodiment will be described. FIG. 2 is a diagram showing a work process of mounting the solid-state optical sensor on the package of the embodiment. Vent holes provided in the temporary support portion 2 and the base portion 3 are omitted from this figure. First, the temporary supporting portion 2 is temporarily adhered to the side of the main body portion 1 where there is no recess by a substance that melts at a relatively low temperature or an adhesive substance that is soluble in an organic solvent or the like. Next, the solid-state photosensor 11 is temporarily adhered to the temporary support part 2 using the same substance through the hole in the center of the main body part 1, and the solid-state photosensor 11 and the bonding pad of the main body part 1 are bonded by a connecting wire 12. (FIG. 2 (a)). After fully filling the adhesive agent 13 that can be filled in the adhesive agent reservoir 10 of the base portion 3 with the surface tension,
The base portion 3 is adhered to the main body portion with the adhesive 13 (FIG. 2 (b)). At this time, the adhesive 13 of the adhesive reservoir 10 contacts the solid-state optical sensor 11 in a large area (FIG. 2 (c)). The adhesive is left until it is completely cured, the temporary support portion 2 is removed, and the mounting is completed (FIG. 2 (d)). The base 3
The adhesive used for the adhesion between the main body part 1 and the temporary support part 2 and for the temporary support part 2 and the solid-state optical sensor 11 are If the substance used for temporary adhesion is a type that is heated and melted to be temporarily bonded, select one with good heat resistance, and if it is a type that dissolves and removes with an organic solvent, etc., at least for such chemicals. Use one that is insoluble after curing.

(Effect of the invention) As described above, the optical sensor package of the present invention is a back-illuminated type in which bonding wiring is performed from the front side. Has no components to support the sensor,
It is a structure in which the vicinity of the light receiving area on the surface of the solid-state photosensor is supported via an adhesive. By adopting such a structure, the optical sensor to be housed does not require a peripheral edge as a margin for the optical sensor package, so that the optical sensor can be miniaturized, and in turn, the optical sensor package can be miniaturized. Further, if the solid-state photosensor requiring cooling is mounted, the photosensor package of the present invention can improve the cooling efficiency.

[Brief description of drawings]

FIG. 1 is a diagram showing a configuration of an embodiment of the present invention, in which FIG. 1 (a) is a vertical sectional view of the entire embodiment including a temporary support portion, and FIG. 1 (b) is a main body portion viewed from the recess side. A front view and the same figure (c) are the front views of the base part seen from the adhesive reservoir side. Fig. 2 (a)
8D are views showing work steps of mounting a solid-state optical sensor of a backside illumination type having a structure in which bonding wiring is performed from the front side on the package of the same example. FIG. 3 is a view showing the structure of a conventional example, FIG. 3 (a) is a longitudinal sectional view, and FIG. 3 (b) is a front view seen from the double recess side. FIG. 4 is a mounting state diagram of the solid-state optical sensor of the conventional example. 1 ... Main part, 2 ... Temporary support part, 3 ... Base part, 4 ... Hole, 5 ...
Recesses, 6 ... Bonding pad, 7 ... Conductor, 8,9 ... Vent hole, 10 ... Adhesive agent reservoir, 11 ... Back-illuminated solid-state optical sensor, 12 ...
Connection wire, 13 ... adhesive.

Claims (1)

[Claims] 1. A photosensor package in which a solid-state photosensor of a back-illuminated type in which bonding wiring is performed from the front side is mounted, in a frame shape having a hole larger than the solid-state photosensor in the center,
Only one surface has a recess recessed from the outer peripheral portion around the hole in the center, and the other surface has a surface shape capable of temporarily adhering a temporary support portion to which the solid-state optical sensor is temporarily attached during assembly. A main body based on an insulator, having a bonding pad on a flat portion of the recessed concave portion of the insulator, and a conductor electrically connected to the bonding pad being drawn out through the insulator to the outside; The part that is adhered to the outer peripheral portion of the concave portion and supports the solid-state optical sensor, has an adhesive reservoir provided near the center of the surface on the side that is adhered to the main body, and passes through parts other than the adhesive reservoir. A bottom portion having pores, and provided on the surface when the surface of the bottom portion on the adhesive reservoir side is bonded to the surface of the solid-state optical sensor by an adhesive in the adhesive reservoir. The Bo Light sensor package, characterized in that said adhesive reservoir in a region not touch the wires that connect the loading pad and the bonding pads of the main body portion is provided.