JPH0749156B2 - Cream solder printing machine - Google Patents

Description

TECHNICAL FIELD The present invention relates to a cream solder printing machine for printing cream solder on a printed circuit board or the like.

2. Related Art FIG. 3 shows the configuration of a conventional substrate position holding device. A printing screen plate 26 prints solder with a squeegee 27 on the lower substrate 1. The substrate 1 is guided by a block 28 and a plate 29, and is guided on a suction plate 30. A suction hose 32 is attached to the suction box 31. Reference numeral 20 denotes a guide shaft, the upper end is fixed to the suction box 31 by the collar 21, the stopper 22 is attached to the lower end, and the guide block 23 moves up and down. 18 is fixed to the guide block 23 by a plate, and at the same time, is fixed to the main body base 25 by the stud 24. 10 is a lifting cylinder and the body is a plate 18
The tip rod 19 is fixed to the suction box 31.

Next, the operation of the above conventional example will be described. In FIG. 3, when the suction is turned on by the suction hose 32 by an electric method, the inside of the suction box 31 becomes a vacuum state, and the substrate 1 guided by the block 28 and the plate 29 through the hole formed in the suction plate 30. Is fixed by adsorption. After the suction of the substrate 1 is completed, the lifting cylinder 10 is operated, and the stopper 22 is brought into contact with the guide block 23 at the position where the clearance between the upper surface of the substrate 1 and the printing screen plate 26 becomes the set value, and the lifting cylinder 10
Is detected by an electric method, and adsorption by the adsorption hose 32 is completed. The end of printing by the squeegee 27 is detected by an electric method, suction by the suction hose 32 is started again, the lifting cylinder 10 is lowered to a fixed position, and the operation is completed.

As described above, even in the above-described conventional substrate position holding device, the back surface of the substrate can be sucked and sucked to be fixed on the suction plate for printing.

Problems to be Solved by the Invention However, since the above-described conventional substrate position holding device is fixed by suction, when a plurality of holes or outs or warps are generated in the substrate, air is generated from that portion. Since it enters, the vacuum state cannot be continued, the suction force decreases, and the position shift occurs. Further, there is a problem that the suction force is lost to the close contact between the printing screen plate and the upper surface of the substrate after the printing is completed. In addition, in a printed circuit board that requires double-sided mounting, there is a problem in that the component is attached to the lower surface of the substrate, so that the component escapes to the adsorption plate and the component falls due to adsorption.

The present invention solves such a conventional problem,
An object of the present invention is to provide an excellent substrate position holding device capable of printing by aligning both ends of the substrate from the upper surface.

Means for Solving the Problems In order to achieve the above-mentioned object, the present invention provides a mechanism that can set both ends of the upper surface of a substrate with a thin plate having a large friction coefficient and a lifting and lowering operation in two stages to separate the lower surface of the substrate. It is equipped with a mechanism that receives the pins and avoids backside mounted components.

Action The present invention has the following actions due to the above-mentioned configuration. That is, when the bottom surface of the board is received by the pins, the holes formed on the board or the backside mounted components can be avoided, and the components can be prevented from falling. Further, while the lower surface of the substrate is received by the pins, the pressure is regulated by the thin plates having a large friction coefficient from both ends of the upper surface, so that the warp of the substrate can be regulated and the displacement due to the vertical movement can be prevented. Furthermore, after printing is completed, the substrate can be separated more easily than the printing screen,
The adhesion to the printing plate can be eliminated.

Practical Example FIG. 1 shows the configuration of an example of the present invention.
In FIG. 1, reference numeral 1 is a substrate, both ends of which are guided by a rail 22 and a rail 3. Reference numeral 4 denotes a pressing plate. One end of the pressing plate 4 is fixed to a tip rod 7 of a train wheel setting cylinder 5, and the other end is formed in a thin plate shape. The coefficient of friction with the upper surface of No. 1 is increased. Reference numeral 6 is a plate which fixes the cylinder 5 and is attached to the rails 2 and 3, respectively. A substrate receiving pin 8 is fixed to the plate 9. Reference numeral 10 denotes a one-stage lifting cylinder, which is fixed to the plate 9 by a tip rod 11 and the main body is attached to the plate 12. Reference numeral 13 denotes a guide shaft, the upper end of which is fixed to the plate 9 by a collar 14 and is vertically moved by a guide block 15 attached to the plate 12. Reference numeral 16 is a connecting rod that fixes the rail 2 and the rail 3 to the plate 12. 17 is a two-stage lifting cylinder, the main body of which is fixed to the plate 18, and the tip rod 19 is of the plate 12
Obsessed with. Reference numeral 20 is a guide shaft, the upper end of which is fixed to the plate 12 by a collar 21, a stopper 22 is attached to the lower end, and the guide block 23 moves up and down. A base 25 is fixed to the plate 18 by studs 24.

Next, the above embodiment will be described. In the above embodiment, when the first stage cylinder 10 moves upward, the substrate receiving pin 8 receives the lower surface of the substrate 1. When the ascending operation is detected by an electrical method, the setting cylinder 5 descends and presses and sets from both upper surfaces of the substrate. When the regulation is detected by an electrical method, 2
The step-up cylinder 17 starts to move up, and the stopper 22
Moves up to a position where it hits the guide block 23. Although not shown in FIG. 1, a printing screen plate 26 and a squeegee 27 similar to those shown in FIG. 3 are arranged above the substrate 1 to raise the upper surface of the substrate 1 and the printing screen plate 26. The gap between and becomes a preset value (usually set to about 0.5 mm). Further, the printing screen plate 26 is pressed by the squeegee 27 and brought into contact with the upper surface of the substrate 1 to print the cream solder on the upper surface of the substrate 1. Both ends of the board 1 are holding plates 4
Is slightly projected, the printing screen plate 26 is easily separated from the upper surface of the substrate 1 after printing when the squeegee 27 is removed. Printing is completed by detecting the end of printing by an electric method, moving the second-stage cylinder 17 downward, and raising the setting cylinder 5 and lowering the first-stage lifting cylinder 10.

As described above, according to the above-described embodiment, since the substrate receiving pin 8 moves up and down by the one-stage lifting cylinder 10 to receive the substrate 1,
This has the advantage of avoiding backside mounted components and preventing component drop.

Further, since the board 1 is sandwiched between the rail 2 and the rail 3 and the holding plate 4 to set the board, the board is positioned in the direction in which the warp of the board is set. Has the advantage of facilitating.

EFFECTS OF THE INVENTION The present invention has the following effects as is clear from the above-mentioned embodiments.

1) Since the bottom surface of the board is received by the pins, it is possible to prevent the parts from falling even on the board for double-sided mounting components.

2) Since the pressure is regulated by a thin plate having a large friction coefficient of the substrate, warpage of the substrate can be suppressed, and since the substrate is forcibly detached from the printing screen, plate separation is sure.

3) Since a vacuum generation source such as a vacuum pump or a ring blower due to adsorption is not required, piping equipment for vacuum is not required, and at the same time, restrictions on the target substrate due to adsorption do not occur.

[Brief description of drawings]

FIG. 1 is a front view of a cream solder printing machine according to an embodiment of the present invention, FIG. 2 is an enlarged view of a holding portion, and FIG. 3 is a front view of a conventional substrate holding device. 1 ... Board, 2 ... Rail, 3 ... Rail, 4 ... Holding plate, 5 ... Regulation cylinder, 6 ... Rod, 7 ... Plate, 8 ... Board receiving pin, 9 ... Plate, 10 …… 1
Lifting cylinder, 11 …… rod, 12 …… plate, 13
…… Guide shaft, 14 …… color, 15 …… block,
16 …… Connecting rod, 17 …… Two-stage lifting cylinder, 18 …… Plate, 19 …… Rod, 20 …… Guide shaft, 21 …… Collar, 22 …… Stopper, 23 …… Guide block, 24…
… Stud, 25 …… base, 26 …… printed screen version,
27 …… Squeegee.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Masanori Imada 4-3-1 Tsunashima-higashi, Kohoku-ku, Yokohama-shi, Kanagawa Matsushita Communication Industrial Co., Ltd. (56) References ) Actually open 56-78390 (JP, U) Actually open 56-53381 (JP, U) Actually open 53-34347 (JP, Y2)

Claims (1)

[Claims] 1. A printing screen plate for printing cream solder on the upper surface of a substrate, a plurality of pins for receiving arbitrary positions on the lower surface of the substrate, a first cylinder for driving these pins up and down, and a printing direction of the substrate. Side rails that support both ends, a pressing plate that presses the upper surface of the substrate by the lower surface of a thin plate portion that is vertically movable at one end and is supported by the rail, and the upper surface of the substrate and the printing screen. The first cylinder and the second cylinder that raises the rail are provided until the gap between the plate and the plate reaches a predetermined dimension, and the surface roughness of the lower surface of the thin plate portion is increased to increase the coefficient of friction with the upper surface of the substrate. Cream solder printing machine characterized by increased number.