JPH085179B2 - Substrate holding method for printing machine - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to printing for printing a paste such as cream solder with a printing machine and positioning and holding a printed circuit board or the like on which a variety of electronic components are mounted with a mounting machine. It is a substrate holding method of the machine.

2. Description of the Related Art In recent years, screen printing machines have been applied to mass production such as printing of cream solder on a printed circuit board on which electronic parts are mounted, and full-automatic screen printing machines have begun to spread. Under such circumstances, various methods for highly accurately positioning and holding the substrate have been studied.

As a first example, in the device described in Japanese Patent Application No. 62-245190, as shown in FIG. 7, when the cylinder 1 moves to the right, the plate 3 fixed to the lever 2 is centered around the pin 4. Counterclockwise, the reference pin 5 at the tip of the plate 3 is inserted from the lower surface of the base plate 6 into a predetermined reference hole provided in the base plate 6 from the reference pin release position 5A, and when returning, the compression spring 7 The reference pin 5 is lowered below the substrate 6 by force.

After positioning, the table 10 of the ascending / descending unit 9 directly connected to the vacuum position (not shown) is lifted to the tip of the cylinder 8 which can be stopped intermediately, and the substrate 6 is attracted and fixed to the upper surface of the table 10 and the lower surface of the screen plate 11 is fixed. Raise the base plate 6 to the position 6B.

As a second example, there is a structure in which the movable roller 12 and the fixed roller 13 are arranged in a positional relationship as shown in FIG. 8 and the substrate 6 is held. The fixed rollers 13 are attached to the tips of the blankets 15 fixed to the lower part of the guide plates 14, respectively. Further, the movable roller 12 is attached to the tip of the movable bracket of the pressing mechanism 15 provided below the guide plate 14.

The movable roller 12 pushes the edge of the substrate and the other end is the fixed roller.
When contacting the substrate 13, the substrate is pressed and fixed by the fixed roller 13 and the movable roller 12 to be positioned. Next, after screen-printing on the surface of the substrate, the substrate is conveyed to the next step by operating in the reverse order of the above.

However, in the case of the former, for example, a recent printed circuit board has a large number of through-holes for mounting electronic components on both front and back surfaces for the purpose of high-density mounting. The number of substrates on the board is increasing, and the adsorption area for fixing the substrate to be printed is reduced.As a result, the suction and fixing force is weakened, and the board is misaligned during printing, which prevents normal printing. are doing. In addition, there is a problem in that solder bleeding occurs from the through holes due to suction.

In the latter case, it is a device that positions the board by adjusting the edge of the board.Therefore, when the board that you want to position with the reference pin is conveyed, accurate positioning cannot be performed, and pin-based pattern printing is not possible. In that case, high-precision printing cannot be performed.

In view of the above problems, the present invention is a substrate holding method for a screen printing machine that reliably and accurately positions and fixes a substrate that is automatically supplied.

Means for Solving the Problems The substrate holding method of the screen printing machine of the present invention for solving the above problems, a step of positioning the substrate by inserting a reference pin into a predetermined hole of the substrate, A step of abutting and pressing a plurality of first pressing members, which are slidable in parallel to the substrate carrying surface, in the state where the reference pins are inserted, to the end faces of the three sides of the substrate; and the first pressing member. Fixing each of them at a contact position with respect to the end face of the substrate, removing the reference pin from the hole of the substrate after the position of the first pressing member is fixed, and the first pressing member. And a step of pressing the remaining end faces of the substrate other than the three sides with which the abutting contacts the second pressing member.

Effect of the Invention With the above-described configuration, the present invention releases the reference pin after pressing the movable roller while positioning the substrate that has been automatically supplied by the reference hole adjusting method, and thus enables reliable positioning and high-precision printing. Will be possible.

Example Hereinafter, a method of positioning a screen printing machine according to an example of the present invention will be described with reference to the drawings.

FIG. 1 is a flowchart showing the process sequence of the present invention. The first step is to position the substrate with the reference pins.
In the second step, the substrate is pressed from above by the substrate retainer.
The third step is pressing and fixing of the substrate end face by the substrate positioning lever which is the first pressing member, and the fourth step is another first step which is slidable in a direction orthogonal to the sliding direction of the substrate positioning lever. This is a step of pressing and fixing the end surface of the substrate by the reference roller which is the first pressing member. The next fifth step is a step of releasing the reference pin used for positioning in the first step and the substrate retainer in the second step, and the sixth step is the rest except the three sides pressed in the third step and the fourth step. Is a step of pressing the end surface of one side of the above with the clamp roller which is the second pressing member. In the seventh step, the stage is raised and printing is performed.

FIG. 2 is a plan view of the substrate holding device of the printing machine of the present invention. FIG. 3 is a front view thereof. The reference pin 16 moves to the air cylinder 17, and the reference pin can be released by positioning and holding the end face of the substrate. This mechanism has two symmetrical positions. Substrate retainers 18 are provided on the left and right, and the lever system using an air cylinder prevents the substrate from floating. Board positioning levers 19 are provided on the left and right, and are linked to the air cylinder 20,
After being positioned by the reference pin and held by the board retainer,
Operate. Slidable reference rollers 21 are provided on the left and right and are interlocked with an air cylinder 22, and press the end faces of the end faces pressed by the substrate positioning lever 19 that are orthogonal to each other. The lock mechanism 23 is interlocked with the air cylinder 24, and fixes the reference roller 21 by pressing the sliding shaft of the reference roller 21. Clamp roller 25
However, the substrate is positioned and held by pressing the end face of the substrate in the direction opposite to the pressing direction of the substrate positioning lever 19 as shown in FIG.

Next, a detailed mechanism will be described in the order of each step. The first step is positioning of the substrate 6 with reference pins. FIG. 4 is a cross-sectional view of the mechanism for inserting and releasing the board hole of the reference pin. The reference pin 16 is bolted to a plate 26, which is in turn connected to a shaft 27 which is linked to an air cylinder. As this moves up and down, the reference pin is inserted into and released from the board hole. A guide shaft 28 is provided so that the reference pin moves vertically up and down.

Shaft 27 rises and plate 26 interlocked with it
The first step is that the reference pin 16 is inserted into the hole of the substrate and positioned by the rise of the.

The second step is substrate holding. FIG. 5 is a sectional view of the substrate pressing mechanism. The substrate retainer 18 can rotate about a pin 29, and its drive is by an air cylinder 30. To transmit the drive, the drive shaft 32 is operated by the pin 31 and the lever 34 which connects the substrate pressing device is operated by the pin 33.

When the shaft 32 that is interlocked with the air cylinder 30 rises, the lever 34 rises via the pin 31, and the substrate retainer 18 rotates clockwise around the pin 29 to hold down the substrate from above. There are two steps.

The third step is to press the end face with the board positioning lever,
It's a lock. FIG. 6 is a cross-sectional view of the end face pressing and locking mechanism by the platen positioning lever 19. A slider 35 that drives the board positioning lever 19 is interlocked with a shaft 37 of the air cylinder 36. When the shaft moves to the right, the positioning lever presses the board, and when the shaft moves to the left, a mechanism is released. There is. The lock mechanism is constructed by moving the shaft 38 up and down so that the shaft 39 connected to the shaft 37
By pressing, the substrate positioning lever is fixed and released. The lever 40 connects a shaft 38 via a pin 41 and a shaft 44 of an air cylinder 43 via a pin 42. As the shaft 44 moves up and down, the lever 40 rotates around the pin 45, and the shaft 38 moves up and down to press and release the shaft 39.

When the shaft 37 of the air cylinder 36 moves to the right, the interlocking slider 35 also moves and the substrate positioning lever 19 presses the substrate. Further, the shaft 44 of the air cylinder 43 moves upward, the lever 40 rotates clockwise around the pin 45, and the shaft 38 moves upward via the pin 41 to press the shaft 39, Fixing the substrate positioning lever is the third step.

In the fourth step, the slidable reference roller 21 shown in FIG. 2 is interlocked with the shaft 46 of the air cylinder and presses the end surface of the substrate. Further, the lock 23 connected to the air cylinder 24 acts to press the shaft 46 and press the reference roller 21.
Is fixed. In this case, this mechanism is provided on the left and right sides so that the left and right end faces can be used as a reference.

The fifth step is to release the reference pin and release the substrate. These are the reverse of the first and second steps.

In FIG. 4, the shaft 27 descends and the plate 26 interlocked with the shaft 27 descends to release the reference pin 16 from the substrate hole.

In FIG. 5, the shaft 32, which is interlocked with the air cylinder 30, descends to move the lever through the reference pin 31.
34 descends and the substrate retainer 18 rotates counterclockwise around the pin 29 and is released from the upper part of the substrate.

 The above is the fifth step.

The sixth step is a step of pressing the end faces of the end faces pressed by the substrate positioning lever 19 in FIG.

 In the seventh step, the stage is raised and printing is performed.

As described above, according to the present invention, the step of inserting the reference pin into the predetermined hole of the substrate to position the substrate, and the step of sliding the reference pin in parallel with the substrate transfer surface while the reference pin is inserted into the substrate. A step of abutting and pressing a plurality of possible first pressing members against end faces of three sides of the substrate; and a step of fixing each of the first pressing members at a contact position with respect to the substrate end face. After the position of the first pressing member is fixed, the step of pulling out the reference pin from the hole of the substrate, and the substrate transfer to the remaining substrate end faces other than the three sides with which the first pressing member abuts Since the substrate to be printed is held by the step of abutting and pressing the second pressing member that is slidable parallel to the surface, the pin-based pattern printing is accurately printed. In addition, there is no occurrence of solder bleeding from the through hole and weakening of the suction fixing force, unlike the case of suction holding.

[Brief description of drawings]

FIG. 1 is a flow chart of a substrate positioning method for a printing press according to an embodiment of the present invention, FIG. 2 is a plan view of a substrate positioning device of the printing press, and FIG. 3 is a front view of a substrate positioning device of the printing press. , FIG. 4 is a sectional view of a substrate hole insertion and release mechanism of a reference pin, FIG. 5 is a sectional view of a substrate pressing mechanism, FIG. 6 is a sectional view of an end face pressing lock mechanism by a substrate positioning lever, and FIG. FIG. 8 is a cross-sectional view of an apparatus for sucking and holding a substrate by the vacuum device of FIG. 8, and FIG. 6 ... Board, 16 ... Reference pin, 18 ... Board holder, 19 ...
… Substrate positioning lever, 21 …… Sliding reference roller,
23 …… Reference roller lock mechanism, 25 …… Clamp roller, 38 …… Board positioning lever lock shaft.

Claims (1)

[Claims] 1. A substrate holding method for a printing machine, wherein cream solder is printed on a substrate that has been positioned and held, the step of inserting a reference pin into a predetermined hole of the substrate to position the substrate, A step of abutting and pressing a plurality of first pressing members that are slidable in parallel with the substrate transfer surface in the state where the reference pin is inserted in the substrate, and the first pressing member. Fixing each of the members at a contact position with respect to the substrate end face, and removing the reference pin from the hole of the substrate after the position of the first pressing member is fixed,
A board of a printing machine, comprising a step of abutting and pressing a second pressing member that is slidable in parallel to the substrate transport surface against the remaining substrate end surfaces other than the three sides with which the first pressing member abuts. Retention method.