JPH0749310B2 - IC carrier - Google Patents

Description

TECHNICAL FIELD The present invention accommodates a frame portion forming a carrier body and an IC package body formed in an inner area of the frame portion.
The present invention relates to an IC carrier including an IC housing portion and a lead support portion that supports a lead of an IC package housed in the IC housing portion.

The prior art IC carrier protects the IC package and further facilitates its handling. As shown in FIG. 1, the IC package body is housed in an IC housing portion 2 defined in the center of the IC carrier body 1. , IC leads protruding from the IC package
It is supported by the lead support portion 3 formed in the peripheral area of the housing portion 2,
Removably engage the lock claw 4 with the IC package body,
It is used for stockpiling, transportation, or unloading on the line, and for the purpose of protecting the IC package, it is integrally formed of synthetic resin that is highly insulative and has high mechanical and thermal strength.

Problems to be Solved by the Invention The above IC carrier is, for example, in a line carrier or the like, because the bottom surface or the outer peripheral surface of the IC carrier comes into contact with a belt or a guide to generate static electricity and be charged, so that the IC package is held in the IC package. It has a bad influence and frequently causes problems such as IC destruction.

In addition, as another problem, in order to enrich the mechanical and thermal strength of the IC carrier, mixing glass fibers, etc. will reduce the flowability, making it difficult to thin the partition walls that intervene between IC leads, and to achieve high-density molding. Conversely, if the synthetic resin with high fluidity is emphasized and the whole is molded with highly fluid synthetic resin in order to cope with the high density pitch of the IC leads, that is, the high density pitch of the partition walls, sufficient mechanical strength is not protected. It incorporates the conflicting problem of lacking functionality.

The present invention is intended to provide an IC carrier having a good suitability, which effectively solves the problem of electrostatic charge stored in the IC carrier and also solves the problem of strength.

Means for Solving the Problems The present invention provides a method for solving the above problems.
In the IC carrier, the lead support part is made of non-conductive synthetic resin, and the frame part is made of conductive synthetic resin.
A carrier having an integrated composite structure of the frame portion and the lead support portion is constructed.

Function As described above, the frame part of the IC carrier is molded with conductive synthetic resin, the lead support part is molded with non-conductive synthetic resin, and the lead support part and the frame part are made into an integrated composite structure. This effectively prevents electrostatic charging caused by contact with an external object such as a belt or guide due to the conductivity of the frame part, and eliminates adverse effects on the lead support part, while at the same time providing non-conductive lead support part. By this, good insulation between the leads can be achieved, and the problem of electrostatic damage caused by friction with an external object can be eliminated.

Further, by utilizing the above-mentioned composite structure, the above-mentioned leads and supporting portions are made of synthetic resin having a high fluidity or flexibility while having each characteristic in each of the above-mentioned portions, and the frame portion is provided with mechanical and thermal strength. It can be made of synthetic resin with abundant properties, and the mechanical and thermal strength of the frame part that comes into contact with external objects can be used for a good purpose of protecting the IC package, while the formability of the lead support part can be improved by selecting the above materials. Can be effectively dealt with by increasing the density of the lead partition walls.

EXAMPLES The present invention will be described below with reference to FIGS. 2 to 6.

The IC carrier is the IC housing part that houses the main body 15 of the IC package.
12 and a lead support portion 13 for supporting the leads 16 protruding laterally from the IC package body 15 housed in the IC housing portion 12.
And a frame portion 11 forming an IC carrier body, and a lock claw 14 provided on the frame portion 11 detachably engages a green portion of the IC package body 15 housed in the IC housing portion 12 with the carrier. It is configured to hold the IC package. According to the present invention, the lead support portion 13 and the frame portion 11 are made of appropriate different materials, as will be described later.

The lead supporting portion 13 is formed for each group of leads 16 protruding from each piece of the IC package, and has a rear wall 18 extending in the lead row direction.
And a lead support wall 19 and a partition wall arranged in parallel along the extending direction of the rear wall 18 and the lead support wall 19 or corresponding to the lead pitch.
It consists of 17 and is made by integrally molding the three parties 17, 18, and 19. The lead supporting portions 13 are individually molded for each group of leads 16 in each row, or the lead supporting portions 13 are integrally molded so as to be a single component.

The frame portion 11 has a peripheral wall 20 and a bottom wall 21, both of which are
21 is integrally formed, and the lead supporting portion 13 is arranged in the inner region of the frame portion 11. The outer surface side of the lead supporting portion 13 is the outer peripheral wall 20, and the bottom surface side is the bottom wall 21. Each of the ICs is backed up in
The accommodation section 12 is defined.

As shown in FIGS. 2A, 2B and 3, the frame portion 11 and the lead support portion 13 are composite-molded and the base materials are fused together to form an integral composite structure. As another example, as shown in FIG.
Mold the lead support part 13 and the frame part 11 as separate parts,
Engaging legs 22 are vertically provided on the lead supporting portion 13, and the engaging legs 22 are inserted into the engaging holes formed in the bottom wall 21 of the frame portion 11 and engaged with the inner walls thereof to form an integrated composite structure. Alternatively, as another example, as shown in FIG. 6, each lead support portion 13 is fastened to the bottom wall 21 of the frame portion 11 with a screw 23. Further, both 11 and 13 are integrated into a composite structure with an adhesive.

As described above, depending on the functions of the lead supporting portion 13 and the frame portion 11, the lead supporting portion 13 is formed of a non-conductive synthetic resin, the frame portion 11 is formed of a conductive synthetic resin, and the frame portion 11 is formed. The non-conductive rear wall 18 of the lead supporting part 13 is backed up by the conductive peripheral wall 20 of the above, and the non-conductive lead supporting wall 19 of the lead supporting part 13 is backed up by the conductive bottom wall 21 of the frame part 11. And

Polyether sulfone mixed with carbon as a conductive resin forming the frame portion 11, polyether imide,
Polyphenylene sulfide is used, and as the non-conductive resin forming the lead supporting portion 13, the above-mentioned resin in which the above-mentioned carbon is not mixed is used. A metal filler such as an aluminum filler can be used instead of the carbon.

As another example, the above-mentioned composite structure is used to form the lead supporting portion 13 with a non-conductive synthetic resin having a high fluidity, and the frame portion 11 is a highly rigid conductive synthetic resin with a high mechanical and thermal strength. The peripheral wall 20 of the rich strength of the frame portion 11 formed by
As a strength member by backing up the poor strength rear wall 18 of the lead supporting portion 13 and further backing up the poor strength lead supporting portion 19 of the lead supporting portion 13 by the rich strength bottom wall 21 of the frame portion 11. The structure is such that the lead support portion 13 can be formed easily while satisfying the frame function.

As still another example, the lead support portion 13 is formed of a non-conductive synthetic resin having a high flexibility, and the frame portion 11 is formed of a conductive synthetic resin having a high mechanical and thermal strength. The rear wall 18 of the lead supporting portion 13 is backed up by the peripheral wall 20 of the frame portion 11 of high strength, and the lead supporting wall 19 of the lead supporting portion 13 of poor rigidity is replaced with the bottom wall of the frame portion 11 of high strength.
By backing up at 21, the structure is such that the problem of chipping of the partition wall 17 of the lead supporting portion 13 and the like accompanying the thinning is effectively prevented while satisfying the frame function as a strength member.

As the conductive synthetic resin having a high mechanical and thermal strength to form the frame portion 11, carbon, glass fiber mixed polyether sulfone, polyether imide, polyphenylene sulfide is used to form the lead support portion 13. As the non-conductive resin having high fluidity and high flexibility, the above-mentioned carbon, glass-fiber-free polyether sulfone or polyether imide is used.

Next, a molding method for composite-molding the lead supporting portion 13 and the frame portion 11 will be described (see FIG. 4).

As shown in FIG. 4A, the molten resin is injected by the female mold 24 and the male mold 25 through the injection hole 26 formed in the bottom wall of the female mold 24 to mold the frame portion 11 shown in FIG. 4B. At this time, a hole forming pin 27 is provided so as to project from the male die 25 in the cavity for molding the frame bottom wall 21, and the above molding is performed to form a resin injection hole 28 penetrating the bottom wall 21 of the frame portion 11. To do.

Next, as shown in FIG. 6C, the frame portion 11 is molded into a female die 29 and a male die 30 for molding the lead support portion 13, and the female die 29 is molded.
A resin injection hole 31 communicating with the resin injection hole 28 is made in the bottom wall of the resin injection hole 28, and a molten resin is injected from the resin injection hole 31 so that the resin injection hole 28 is interposed between the frame portion 11 and the male mold 29. Resin is filled into the molding cavity of the formed lead support portion 13,
The lead support portion 13 is molded. That is, the frame portion 11 functions as a resin injection means and a female mold for molding the lead support portion 13. Thus, an integrally molded product in which the lead support portion 13 and the frame portion 11 shown in FIG. The lead supporting portion 13 and the frame portion 11 are fused at the interface between the base materials and are joined at 32 formed by filling the resin injection hole 28.

Further, when the lead supporting portion 13 and the frame portion 11 are integrated by each of the above means, as shown in FIG. 2B, the joint interface between the lead supporting wall 19 of the lead supporting portion 13 and the bottom wall 21 of the frame portion 11 is joined. Tooth-shaped projections 33 and 34 that are alternately engaged with each other are formed, and preferably, the tooth-shaped projections 34 on the side of the bottom wall 21 are arranged with a half pitch offset with respect to the partition wall 17 of the lead support portion 13, and the valley portion between the partition walls 17 is formed. It is arranged so that (the surface of the lead support wall) and the tooth-shaped projection 34 face each other.

The occlusal structure of the tooth-shaped projections 33 and 34 is intended to enhance the bonding strength between the lead supporting portion 13 and the frame portion 11, and at the same time, the tooth-shaped projection 34 reduces the distance R from the surface of the lead supporting wall 19 (lead supporting surface). The intention is to make the resistance as small as possible to reduce the resistance therebetween, and to reduce the potential difference between the lead supporting portion 13 and the frame portion 11 to enhance the antistatic effect.

As shown in FIGS. 2A and 3, a dovetail-shaped connecting portion 35 is integrally formed on the back side of the rear wall 18 of the lead supporting portion 13 to form the case connecting portion 35 on the outer peripheral wall of the frame portion 11. It is joined so that it will bite into, and the bond strength of both 11 and 13 is strengthened. Also, the connecting portion 35
Positioning hole into which the IC socket positioning pin is inserted
Provide 36.

In the illustrated embodiment, the lead supporting portion 13 is provided with a large number of partition walls 17, but the lead supporting portion 13 is not provided with the partition walls and the surface of the lead supporting portion is made flat.
The present invention can be applied to a carrier configured to collectively support the lead group of each row on the flat lead support surface.

EFFECTS OF THE INVENTION As described above, the frame portion of the IC carrier is molded with the conductive synthetic resin, and the lead supporting portion is molded with the non-conductive synthetic resin, so that the frame portion and the lead supporting portion are integrated into a composite structure. This effectively prevents the generation and charging of static electricity due to the conductivity of the frame part that comes into contact with external objects such as belts and guides, and eliminates the adverse effects on the lead support part while also allowing non-conductive lead support parts. This makes it possible to achieve good greening between the leads, eliminate the problem of electrostatic damage caused by friction with an external object, and exert the carrier function.

Also, by utilizing the above composite structure, the lead supporting part is made of a synthetic resin having a high fluidity or flexibility while having each characteristic in each part, and the frame part is provided with mechanical and thermal strength. It can be made of synthetic resin with abundant properties, and it depends on the mechanical and thermal strength of the frame that comes into contact with external objects.
It is possible to improve the formability by effectively selecting the above-mentioned material of the lead supporting portion while effectively achieving the protection purpose of the IC package, and it is possible to effectively cope with the thinning and high density of the lead partition wall.

[Brief description of drawings]

FIG. 1 is a perspective view showing a conventional IC carrier, FIG. 2A is a partially cutaway perspective view showing an IC carrier according to the present invention, and FIG. 2B is an enlarged view of a joint portion between a lead supporting portion and a frame portion. FIG. 3 is a sectional view of an IC carrier on which an IC package can be mounted, FIG. 4A is a sectional view of a frame molding die, FIG. 4B is a sectional view of a frame portion molded by the molding die, and FIG. Is a cross-sectional view of a lead support mold, FIG. D is a cross-sectional view of an IC carrier molded by the mold, FIG. 5 is an exploded perspective view showing another example of assembly of the lead support and the frame, FIG. [Fig. 6] is an exploded perspective view showing still another assembly example of both. 11 ... Frame part, 12 ... IC housing part, 13 ... Lead support part, 15 ... IC package body, 16 ... Lead, 17 ... Lead support partition wall, 18 ... Same rear wall, 19 ... … Reed support wall, 20 …… Frame outer peripheral wall, 21… Bottom wall.

Claims (1)

[Claims] Claim: What is claimed is: 1. An IC containing an IC housing for housing a main body of an IC package and a frame defining the IC housing, the IC being housed in the IC housing on at least two opposite sides of the IC housing.
IC with a lead support that supports the package leads
In the carrier, an IC characterized in that the lead support portion is formed of a non-conductive synthetic resin, the frame portion is formed of a conductive synthetic resin, and the frame portion and the lead support portion are integrally combined. Career.