JPH0752800B2 - Outer lead bonding machine - Google Patents

Description

The present invention relates to a semiconductor chip such as an IC chip having an outer lead on a substrate such as a printed circuit board, and a substrate lead and an outer lead of the semiconductor chip. The present invention relates to an outer lead bonding device (hereinafter abbreviated as a bonding device) that is attached by outer lead bonding (hereinafter abbreviated as a bonding).

[Conventional technology]

A conventional bonding apparatus supplies a semiconductor chip to a substrate supplied to a bonding stage to perform bonding.

[Problems to be solved by the invention] Therefore, after the substrate is transferred to the bonding stage,
Since the semiconductor chips are aligned and supplied, and then bonding is performed, the bonding cycle time is long.

The present invention is intended to solve this conventional problem, and an object thereof is to provide a bonding apparatus capable of shortening the bonding cycle time.

[Means for Solving the Problems]

The present invention provides a bonding stage having an outer lead bonder on an upper part of a guide rail for guiding and conveying a printed circuit board, and a semiconductor chip bonding stage which is provided in close proximity to the semiconductor chip bonding stage on the upstream side of the bonding stage. A semiconductor chip positioning / mounting device for sticking a semiconductor chip to a predetermined position of a printed circuit board is provided so as to face each other. A position detecting device for detecting the position and orientation of the IC chip on the table, a rotating device for rotating an arm having a vacuum suction tool attached to the tip capable of mounting the IC chip on the intermediate receiving table, and the rotating device. A transfer device composed of a vertical movement device that moves up and down, and a plurality of IC transfer devices that are arranged in parallel in the transfer direction of the printed circuit board. Is obtained by deploying movably along flop feeder group.

[Action]

The bonding apparatus of the present invention is a semiconductor chip positioning and mounting apparatus for providing a semiconductor chip sticking stage in the transport path of a substrate on the upstream side of the bonding stage and sticking a semiconductor chip at a predetermined position on the substrate of the semiconductor chip sticking stage. Is provided, the substrate on which the semiconductor chip is already attached to a predetermined position is transported to the bonding stage.
Since the semiconductor chip is attached to the substrate, the positional deviation with respect to the substrate does not occur during transportation. Therefore, since the outer lead bonder can perform bonding immediately after being conveyed, the bonding cycle time can be shortened.

〔Example〕

An embodiment in which the present invention is applied to a bonding apparatus for bonding a plurality of different types of semiconductor chips, such as IC chips, to one printed circuit board will be described with reference to the drawings.

FIG. 3 shows different types of IC chips 2 to 6 on the printed circuit board 1.
Shows that they are bonded to their respective predetermined mounting positions.

1 and 2 show the entire bonding apparatus for mounting the IC chips 2 to 6 on the printed board 1.

36 is an IC chip attachment stage (hereinafter abbreviated as attachment stage),
Reference numeral 37 denotes a bonding stage, which is a moving device (not shown) for moving the guide rails 17, 17 and the printed circuit board 1 so that the sticking stage 36 is on the upstream side and the bonding stage 37 is on the downstream side in the conveyance path of the printed circuit board 1. No) is provided. An IC chip semiconductor chip positioning mounting device (hereinafter abbreviated as a mounting device) 18 is attached to the bonding stage 36 and an outer lead bonder (hereinafter abbreviated as a bonder) 19 is attached to the bonding stage 37 in proximity to one side of the transport path. , Respectively.

Reference numerals 7 to 11 denote IC chip supply devices (hereinafter referred to as supply devices) for supplying the IC chips 2 to 6 to predetermined supply positions, and the line connecting the supply positions of the IC chips 2 to 6 is the conveyance direction of the printed circuit board 1 ( They are arranged side by side in the same direction as the (X direction). For example, the feeding device 9 is a feeder 13 for a carrier tape 12 holding the IC chip 4 at its outer lead portion.
Winding machine for carrier tape 12 with IC chip 4 removed
14 and a carrier tape conveying device composed of 14 and a cutting device composed of a punch 15 and a die 16 for separating the IC chip 4 from the carrier tape 12 by cutting the outer lead portion at a predetermined supply position. The separated IC chip 4 is a punch
The upper part of the punch 15 is left as a predetermined supply position on the punch 15. The other supply devices 7, 8, 10 and 11 are similarly formed by including a carrier tape carrier device holding each IC chip and a cutting device suitable for each IC chip.

Reference numeral 20 denotes an intermediate cradle, which is provided between the supply device group and the conveyance path of the printed circuit board 1, and an IC is provided between the intermediate cradle 20 and the supply device group.
A transfer device 38 for transferring the chips 2 to 6 from their respective supply positions to the intermediate pedestal 20 is provided.

The transfer device 38 includes an X-direction moving device 22 that moves the transfer device 38 in the X-direction.
A vacuum suction tool 25 is attached to the tip of an arm 21 provided with a vertical movement device 23 and a rotation device 24 that rotates around a vertical axis.

One or more IC chip mounting positions are provided on the intermediate pedestal 20. In this embodiment, three mounting positions 26, 27, 28 are provided, but it is also possible to provide five mounting positions and determine the mounting positions for each IC chip. Further, in this embodiment, it is fixedly provided, but when a plurality of them are provided, an X-direction moving device is provided on the intermediate receiving table 20 so that the receiving position from the transfer device 38 and the delivery position to the mounting device 18 are set at one position. Can be set in place.

The mounting device 18 picks up an IC chip placed on the intermediate pedestal 20 and attaches it to the printed circuit board 1 on the attachment stage 36. The X-direction moving device 29 is a horizontal direction perpendicular to the X-direction. A vacuum suction tool 34 having a rotating device 33 that rotates about a vertical axis is provided at the tip of an arm 32 that has a Y-direction moving device 30 and a vertical moving device 31 that are moved to a vertical direction. Then, the IC of the printed circuit board 1 of the bonding stage 36 is provided with the position detection device 35 for detecting the position and orientation of the IC chip on the intermediate receiving table 20 and the position of the lead is detected in advance from the detected position. Align the outer lead of the IC chip with the lead of the printed circuit board 1 at the chip mounting position, that is,
Each device 30, 31, 33 is controlled so that the position and the direction of the IC chip are corrected and the IC chip is transferred, placed and attached.

Then, the printed circuit board 1 is coated with the paste at the IC chip mounting position and conveyed to the bonding stage 36. Assuming that the IC chips are mounted in the order of IC chips 2, 3, 4, 5, and 6, the intermediate pedestal 20 has the IC chip 2 at the mounting position 26 and the IC chip 2 at the mounting position 27.
The IC chip 3 is supplied to the mounting position 28.

The IC chip 2 is attached to the printed circuit board 1 of the attachment stage 36 by the attachment device 18. At this time, first, the position detection device 35
The IC chip 2 by moving the above the mounting position 26 of the intermediate cradle 20.
Detects the misalignment of position and orientation. Next, the arm 32 is moved according to the detected value and the IC chip 2 is picked up by the vacuum suction tool 34. Then, the rotating device 33 is rotated by the value of the deviation of the direction of the IC chip 2 and the deviation of the direction of the lead corresponding to the IC chip 2 of the printed circuit board 1 which is detected in advance so as to match the directions of both, and it is detected in advance. The vacuum suction tool 34 is moved to a position where the IC chip 2 of the printed circuit board 1 is to be attached, and the IC chip 2 is placed on the printed circuit board 1. Then, the IC chip 2 is attached to the printed board 1 on the back surface of the main body by the paste applied in advance.

When the IC chip 2 is picked up by the mounting device 18, the transfer device 38 moves the IC chip 5 from the supply device 10 to the mounting position 26.
Is placed.

Then, in the same manner, the IC chips 3, 4, 5, 6 are sequentially arranged on the printed circuit board 1.
Transfer to and paste.

The printed circuit board 1 to which all the IC chips 2 to 6 are attached is transferred to the bonding stage 37, and the outer leads of the IC chip and the leads of the printed circuit board 1 are bonded by the bonder 19.

As the bonder 19, the one in which the bonding tool is moved in a horizontal plane to be aligned and then moved up and down to sequentially carry out outer lead bonding to the IC chip for each group (Fig. 3) is used and is used at the time of bonding. Bonding is continuously performed on the IC chips 2 to 6 based on the bonding position data. At this time, at the attachment stage 36, the work of fixing the IC chips 2 to 6 to the next printed circuit board 1 is performed in parallel.

Since the intermediate cradle 20 and the transfer device 38 are provided in this embodiment, it is convenient to attach the IC chips 2 to 6 supplied from the plurality of supply devices 7 to 11 by one mounting device 18. Is.

In the embodiment described above, the printed circuit board supporting member of the attachment stage 36 is a fixing member provided with a vertical movement device if necessary, and the mounting device 18 causes a deviation between the lead of the printed circuit board 1 and the outer lead of the IC chip ( Δx, Δy, Δθ) are corrected, but the X-direction moving device, the Y-direction moving device, the rotating device, etc. are provided on the printed circuit board supporting member of the bonding stage 36 to perform the correcting operation on the printed circuit board supporting member. You can also close it.

Further, it is possible to provide a plurality of bonding stages, mounting devices, bonding stages, and bonders.

In addition, the pasting paste may be used during the IC chip transfer process.
It can also be applied to the back surface of the chip body.

〔The invention's effect〕

In the bonding apparatus of the present invention, semiconductor chip bonding stages are provided in close proximity and parallel to each other on the substrate conveyance path on the upstream side of the bonding stage, and the semiconductor chips are mounted at predetermined positions on the printed circuit board facing the semiconductor chip bonding stage. A semiconductor chip positioning / mounting device for sticking is provided, and the semiconductor chip positioning / mounting device detects the intermediate cradle for the IC chip closely arranged on the side of the guide rail and the position and orientation of the IC chip on this intermediate cradle. On the intermediate pedestal
The transfer device is composed of a rotation device that rotates an arm having a vacuum suction tool attached to the tip on which an IC chip can be mounted, and a vertical movement device that moves the rotation device up and down. Further, the transfer device is printed. By arranging multiple IC chips in parallel in the substrate transfer direction so that they can move freely, it is possible to place multiple IC chips on the intermediate cradle one after another and prepare them for safe handling. In addition, since the IC chip and the substrate are accurately aligned, they can be placed at any time, not at the timing of transferring to a different chip intermediate cradle and from the intermediate cradle to the substrate. Since it is not a precise position, it is configured so that the position detection device of the semiconductor chip positioning and mounting device can combine and calculate the IC chip position and the substrate position for moving mounting. The time to separate the upper inner lead bonded IC chip and the IC chip positioning and mounting time can be overlapped, and the operation of the mounting device and the bonding operation time can be overlapped to significantly improve the work efficiency, Furthermore, it is possible to efficiently attach multiple different IC chips with one semiconductor chip positioning and mounting device, and the alignment of the semiconductor chips is precise and accurate, and when the printed circuit board is transferred to the bonding stage, Outer lead bonding can be performed immediately, and the cycle time of the entire device can be greatly shortened.

[Brief description of drawings]

FIG. 1 is a plan view of an embodiment of the present invention, and FIG. 2 is its II.
3 is a plan view of the printed board. 1 ... Printed circuit board, 2 ... IC chip, 3 ... IC chip, 4 ... IC chip, 5 ... IC chip, 6 ... IC chip, 7 ... Supply device, 8 ... Supply device, 9 ... … Supplier, 10 …… Supplier, 11 …… Supplier, 12 …… Carrier tape, 13 …… Supplier, 14 …… Winder, 15 …… Punch,
16 …… Die, 17 …… Guide rail, 18 …… Mounting device, 19
…… Bonder, 20 …… Intermediate cradle, 21 …… Arm, 22 ……
X-direction moving device, 23 ... Vertical moving device, 24 ... Rotating device,
25 …… Vacuum suction tool, 26 …… Placing position, 27 …… Placing position, 28 …… Placing position, 29 …… X direction moving device, 30 …… Y
Directional movement device, 31 ... Vertical movement device, 32 ... Arm, 33 ...
… Rotating device, 34 …… Vacuum suction tool, 35 …… Position detecting device, 36 …… Adhesion stage, 37 …… Bonding stage, 38 …… Transfer device.

Claims (1)

[Claims] 1. A bonding stage having an outer lead bonder on an upper portion of a guide rail for guiding and conveying a printed circuit board, and a semiconductor chip bonding stage provided in close proximity to each other on the upstream side of the bonding stage to bond the semiconductor chip. A semiconductor chip positioning / mounting device for sticking a semiconductor chip to a predetermined position of a printed circuit board facing the stage is provided, and the semiconductor chip positioning / mounting device is an intermediate cradle for an IC chip closely arranged on a side portion of a guide rail, A position detection device that detects the position and orientation of the IC chip on the intermediate cradle, and a rotation device that pivots an arm equipped with a vacuum suction tool at the tip where the IC chip can be placed on the intermediate cradle,
And a transfer device including a vertical movement device for moving the rotary motion device up and down, and the transfer device is movably arranged along a group of IC chip supply devices arranged in parallel in the transfer direction of the printed circuit board. An outer lead bonding device characterized by: