JPH075407B2 - Ceramics metallized composition, metallized method and metallized product - Google Patents
Ceramics metallized composition, metallized method and metallized productInfo
- Publication number
- JPH075407B2 JPH075407B2 JP859586A JP859586A JPH075407B2 JP H075407 B2 JPH075407 B2 JP H075407B2 JP 859586 A JP859586 A JP 859586A JP 859586 A JP859586 A JP 859586A JP H075407 B2 JPH075407 B2 JP H075407B2
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- JP
- Japan
- Prior art keywords
- metallized
- ceramics
- composition
- weight
- metallizing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000919 ceramic Substances 0.000 title claims description 42
- 239000000203 mixture Substances 0.000 title claims description 22
- 238000000034 method Methods 0.000 title claims description 15
- 239000011135 tin Substances 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 10
- 238000002844 melting Methods 0.000 claims description 10
- 229910052718 tin Inorganic materials 0.000 claims description 10
- 230000008018 melting Effects 0.000 claims description 9
- 229910052709 silver Inorganic materials 0.000 claims description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- 229910003460 diamond Inorganic materials 0.000 claims description 7
- 239000010432 diamond Substances 0.000 claims description 7
- 239000000843 powder Substances 0.000 claims description 7
- 229910008322 ZrN Inorganic materials 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 6
- 229910002804 graphite Inorganic materials 0.000 claims description 6
- 239000010439 graphite Substances 0.000 claims description 6
- 229910052762 osmium Inorganic materials 0.000 claims description 5
- 229910052702 rhenium Inorganic materials 0.000 claims description 5
- 229910052715 tantalum Inorganic materials 0.000 claims description 5
- 229910052721 tungsten Inorganic materials 0.000 claims description 5
- 239000000945 filler Substances 0.000 claims description 4
- 239000012535 impurity Substances 0.000 claims description 4
- 239000003870 refractory metal Substances 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 230000001590 oxidative effect Effects 0.000 claims description 3
- -1 V N Inorganic materials 0.000 claims 3
- 239000011812 mixed powder Substances 0.000 claims 2
- 239000002184 metal Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 8
- 238000005219 brazing Methods 0.000 description 7
- 229910052719 titanium Inorganic materials 0.000 description 7
- 229910052726 zirconium Inorganic materials 0.000 description 7
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 6
- 229910052758 niobium Inorganic materials 0.000 description 6
- 229910021332 silicide Inorganic materials 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 5
- 238000001465 metallisation Methods 0.000 description 5
- 150000004767 nitrides Chemical class 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000005496 eutectics Effects 0.000 description 3
- 238000011049 filling Methods 0.000 description 3
- 150000001247 metal acetylides Chemical class 0.000 description 3
- 229910052574 oxide ceramic Inorganic materials 0.000 description 3
- 239000011224 oxide ceramic Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000012071 phase Substances 0.000 description 3
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000001856 Ethyl cellulose Substances 0.000 description 2
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 2
- 229910016006 MoSi Inorganic materials 0.000 description 2
- 229910017309 Mo—Mn Inorganic materials 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 229910004166 TaN Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001249 ethyl cellulose Polymers 0.000 description 2
- 235000019325 ethyl cellulose Nutrition 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 229910000765 intermetallic Inorganic materials 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- 229910052720 vanadium Inorganic materials 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000975 Carbon steel Inorganic materials 0.000 description 1
- 229910001018 Cast iron Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910003271 Ni-Fe Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910052576 carbides based ceramic Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000010962 carbon steel Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910001293 incoloy Inorganic materials 0.000 description 1
- 229910001026 inconel Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Description
【発明の詳細な説明】 本発明は酸化物系,窒化物系,硼化物系,珪化物系ある
いは炭化物系などの各種のセラミツクスの表面をメタラ
イズ(金属化)するための新規な組成物と、それを用い
たメタライズ方法及びそれらを利用したメタライズ製品
に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a novel composition for metallizing (metallizing) the surface of various ceramics such as oxides, nitrides, borides, silicides or carbides. The present invention relates to a metallization method using the same and a metallized product using them.
従来、酸化物セラミツクスであるAl2O3セラミツクスの
ように、数%以上のSiO2成分を含有する場合に限り、M
o,Mnおよびフリツト成分を混合して湿水素中で1300〜15
00℃の温度範囲で焼付けセラミツクスの表面をメタライ
ズする方法、即ちMo−Mn法が採用されて来た。しかしな
がら、高純度のAl2O3,部分安定化ZrO2,MgO,BeO,等のSiO
2成分を含有しない酸化物セラミツクス、Si3N4,AlN,TiN
等の窒化物セラミツクス、TiB2,ZrB2,BN等の硼化物セラ
ミツクス、MoSi2,WSi2,TaSi2とうの珪化物セラミツクス
あるいはSiC,SiC−Si,TiC等の炭化物セラミツクス等を
対象とする強固な結合力を有するメタライズ技術が確立
されていなかつた。その為、これらのセラミツクスと金
属とを接合する場合のろう付の際の前段階の処理とし
て、あるいは導電回路のパターン焼付け処理として含Si
O2のAl2O3セラミツクスを対象とするMo−Mn法の如きメ
タライズ方法の開発が要求されていた。Conventionally, M is limited only when it contains a few% or more of SiO 2 component like Al 2 O 3 ceramics which is an oxide ceramic.
Mix O, Mn and frit components in wet hydrogen at 1300-15
The method of metallizing the surface of the baking ceramics in the temperature range of 00 ° C, that is, the Mo-Mn method has been adopted. However, high-purity Al 2 O 3 , partially stabilized ZrO 2 , MgO, BeO, etc.
Oxide ceramics not containing two components, Si 3 N 4 , AlN, TiN
Nitrides etc. ceramics, TiB 2, ZrB 2, BN borides such as ceramics, MoSi 2, WSi 2, TaSi 2 Tang silicide ceramics or SiC, SiC-Si, strongly directed to the carbide ceramics or the like of TiC etc. The metallization technology with strong bond strength has not been established. Therefore, as a pre-treatment at the time of brazing when joining these ceramics and metal, or as a pattern baking treatment of the conductive circuit, Si-containing
Development of a metallization method such as Mo-Mn method for O 2 Al 2 O 3 ceramics has been required.
本発明はこのような状況に鑑みてなされたものであり、
メタライズ組成物として、次の組成式で表わされる成分
及び不可避的不純物からなることを特徴とする組成物、 a・Ag+b・Cu+c・Sn+d・Ti+e・Nb+f・V+g
・Zr+h・F+i・Mn+j・Be 但し、ここでFは高融点金属であるW,Ta,Re,Osあるいは
高融点無機物の黒鉛,ダイヤモンド,TiN,ZrN,VN,TaN,Ti
B2,ZrB2のいずれか1種又は2種以上の充填材料であ
り、a,b,c,d,e,f,g,h,i,jは各々次の数値の範囲内の重
量%とする。The present invention has been made in view of such a situation,
A metallized composition comprising a component represented by the following composition formula and inevitable impurities: a · Ag + b · Cu + c · Sn + d · Ti + e · Nb + f · V + g
・ Zr + h ・ F + i ・ Mn + j ・ Be where F is high melting point metal such as W, Ta, Re, Os or high melting point inorganic graphite, diamond, TiN, ZrN, VN, TaN, Ti
Any one of B 2 and ZrB 2 or two or more kinds of filling materials, and a, b, c, d, e, f, g, h, i, j are each weight% within the range of the following numerical values. And
13.0≦a≦72.4,13.6≦b≦44.0, 1.2≦c≦9.0,3.6≦d≦18.0, 1.6≦e≦11.0,0.2≦f≦4.5,0.8≦g≦5.0, h≦40.0,i≦10.0,j≦5.0 但し、a+b+c+d+e+f+g+h+i+j=100
である。13.0 ≦ a ≦ 72.4, 13.6 ≦ b ≦ 44.0, 1.2 ≦ c ≦ 9.0, 3.6 ≦ d ≦ 18.0, 1.6 ≦ e ≦ 11.0, 0.2 ≦ f ≦ 4.5, 0.8 ≦ g ≦ 5.0, h ≦ 40.0, i ≦ 10.0, j ≦ 5.0 where a + b + c + d + e + f + g + h + i + j = 100
Is.
本発明のメタライズの対象とするセラミツクスとはAl2O
3,安定化及び部分安定化ZrB2,MgO,BeO,マイカセラミツ
クス,ガラスセラミツクス,チタン酸バリウムなどの酸
化物セラミツクス、サイアロン、Si3N4,AlN,TiNなどの
窒化物セラミツクス、TiB2,ZrB2,BNなどの硼化物セラミ
ツクス、MoSi2,WSi2,TaSi2などの珪化物セラミツクスあ
るいはSiC,SiC−Si,TiCなどの炭化物セラミツクスなど
である。The ceramics to be metallized in the present invention is Al 2 O
3 , stabilized and partially stabilized ZrB 2 , MgO, BeO, mica ceramics, glass ceramics, oxide ceramics such as barium titanate, sialon, nitride ceramics such as Si 3 N 4 , AlN, TiN, TiB 2 , ZrB Examples thereof include boride ceramics such as 2 and BN, silicide ceramics such as MoSi 2 , WSi 2 and TaSi 2, and carbide ceramics such as SiC, SiC-Si and TiC.
本発明のメタライズ組成物中のTiは活性な元素であり、
対象セラミツクスの表面上で、メタライズ組成物が溶融
あるいは半溶融する際にセラミツクス内部へ拡散してTi
の酸化物,窒化物,硼化物,珪化物あるいは炭化物など
を生成し、強固な結合を果すのに有効であり、又融点を
低下させるためにも3.6〜18.0重量%含有させる必要が
ある。Ti in the metallized composition of the present invention is an active element,
When the metallized composition melts or semi-melts on the surface of the target ceramics, it diffuses into the ceramics and Ti
It is effective in forming a strong bond by forming oxides, nitrides, borides, silicides or carbides of the above, and it is necessary to contain 3.6 to 18.0% by weight in order to lower the melting point.
ZrはTiよりもさらに活性であり、少量でも強力な結合を
達成するのに有効である。しかし、あまり多量に含有さ
せると溶融あるいは半溶融させて、メタライズ層を溶着
させる際に塗布面積よりも溶着面積の方が縮小してしま
う現象、即ち、焼け縮みの現象が生じ問題となるので0.
8〜5.0重量%の範囲が有効である。Zr is more active than Ti and is effective in achieving strong bonds even in small amounts. However, if it is contained in too large an amount, it will be melted or semi-melted, and when welding the metallized layer, the phenomenon that the welded area becomes smaller than the applied area, that is, the phenomenon of shrinkage occurs, which causes a problem. .
A range of 8 to 5.0% by weight is effective.
NbはTiよりも活性度が低い一部反応に関与し、TiやZrが
セラミツクスと金属層との界面に生成する上記の酸化
物,窒化物,硼化物,珪化物あるいは炭化物などと母相
であるCu,Ag,Snなどとの結合を強化促進させる働きがあ
るので、機械的強度の優れたメタライズ層を形成させる
のに有効である。しかし、あまり多量に配合するとZrと
同様、焼け縮みの問題を生じ易くなるので1.6〜11.0重
量%の範囲とする。Nb participates in a partial reaction that is less active than Ti and forms a matrix with the above oxides, nitrides, borides, silicides or carbides that Ti and Zr are formed at the interface between the ceramic and the metal layer. Since it has a function of strengthening and promoting the bond with certain Cu, Ag, Sn, etc., it is effective for forming a metallized layer having excellent mechanical strength. However, if a too large amount is blended, the problem of shrinkage tends to occur similarly to Zr, so the range is 1.6 to 11.0% by weight.
Vも活性な元素のひとつであるが、前記のTi,Zrあるい
はNbよりも活性の程度が低い。但し、酸素と結合し融点
の低い液相酸化物を形成し易いので全体が溶融する以前
に雰囲気中あるいは粉末に吸着吸蔵されているO2と反応
して融点の低いガラス状酸化物を造り、各粒子表面を保
護する働きがあるので、Ti,ZR,Nbなどの活性を高温まで
維持させるのに役立ち、メタライズ表面を平滑にする作
用がある。但し、あまり多量に含有させると同様に焼け
縮みを生じ易くなるので0.2〜4.5重量%の範囲とする。V is also one of the active elements, but it is less active than Ti, Zr or Nb. However, since it is easy to form a liquid phase oxide having a low melting point by combining with oxygen, it reacts with O 2 which is adsorbed and stored in the atmosphere or in the powder before the whole is melted to form a glassy oxide having a low melting point, Since it has a function of protecting the surface of each particle, it helps maintain the activity of Ti, ZR, Nb and the like at high temperatures, and has a function of smoothing the metallized surface. However, if it is contained in too much amount, similarly, shrinkage easily occurs, so the content is made 0.2 to 4.5% by weight.
Snは比較的、早期に母相元素を溶解させる働きがあり、
Ti,ZR,Nbなどの活性な元素が残留O2に直接に接触して、
酸化されてしまうことを防止するために昇温中の早い時
期に粒子の表面を保護コーテイングする役割を果す。1.
2〜9.0重量%が適切であり、これ以上配合量を増すとメ
タライズ層の表面の凹凸を増大させる傾向があり、好ま
しくない。Sn has a function of dissolving the matrix element relatively early,
Active elements such as Ti, ZR, Nb directly contact the residual O 2 ,
In order to prevent the particles from being oxidized, they play a role of protecting and coating the surface of the particles at an early stage during temperature rising. 1.
2 to 9.0% by weight is suitable, and if the amount is further increased, the unevenness of the surface of the metallized layer tends to increase, which is not preferable.
Agは耐酸化性のある元素であり、Ti,ZR,Nbなどの酸化を
防止するうえで必要不可欠の元素であり、又、本発明組
成物の溶着温度の900℃程度では、AgはTiやZrと硬く脆
い金属間化合物を形成しにくいのでメタライズ層をより
柔軟にする傾向があり、熱膨張係数が小さく、強度の低
いセラミツクスをメタライズするような場合にはAgの配
合量を増加させるなどして、13.0〜72.4重量%の範囲内
で調節する。これ以上配合量を増加させるとメタライズ
層のセラミツクスへの結合力を低下させるのでかえつて
不利となる。Ag is an element having an oxidation resistance, and is an essential element for preventing the oxidation of Ti, ZR, Nb, etc. Further, at the welding temperature of the composition of the present invention of about 900 ° C., Ag is Ti or Since it is difficult to form a hard and brittle intermetallic compound with Zr, it tends to make the metallized layer more flexible.In the case of metallizing ceramics with low thermal expansion coefficient and low strength, the amount of Ag should be increased. Adjust within the range of 13.0 to 72.4% by weight. Increasing the blending amount more than this lowers the bonding strength of the metallized layer to the ceramics, which is disadvantageous.
CuはAgとともに母相を構成する主要な元素であり、Ti及
びZrと共に共晶を形成して融点を低下させるのに有効な
元素である。但し、あまり多量に配合するとメタライズ
層の表面の凹凸を大きくしたり、脆弱なTiやZrとの金属
間化合物の相の量を増大させて悪影響を及ぼすので13.6
〜44.0重量%の範囲に配合する必要がある。Cu is a main element that constitutes the mother phase together with Ag, and is an element effective in forming a eutectic with Ti and Zr to lower the melting point. However, if added in a too large amount, the unevenness of the surface of the metallized layer will be increased, and the amount of the phase of the intermetallic compound with fragile Ti and Zr will be increased, which will have an adverse effect.
It is necessary to blend in the range of up to 44.0% by weight.
Beは常圧焼結のSiCや、反応焼結でSiを含浸させて造ら
れるSiC−Siセラミツクスなどの炭化物系セラミツクス
に対してメタライズ相の結合を強化するのに有効な元素
である。本来900℃程度の温度範囲ではSiCやTiやZrなど
に対して安定で反応しにくいが、BeはSiCの成分のSiと
同程度の温度で共晶を作り易く、SiCとの濡れ性が良い
うえに、脆弱なBe珪化物や遊離カーボンを形成すること
もないので非常に有効な元素である。5重量%以下の任
意の範囲で配合することが出来るが、これ以上配合する
場合にはメタライズ層の表面の凹凸を増大するので好ま
しくない。Be is an element effective for strengthening the bond of the metallized phase to SiC of normal pressure sintering and carbide-based ceramics such as SiC-Si ceramics produced by impregnating Si by reaction sintering. Originally, it is stable and difficult to react with SiC, Ti, Zr, etc. in the temperature range of about 900 ° C, but Be easily forms a eutectic at the same temperature as Si, which is a component of SiC, and has good wettability with SiC. In addition, it is a very effective element because it does not form brittle Be silicide or free carbon. It can be blended in an arbitrary range of 5% by weight or less, but if it is blended more than this, unevenness on the surface of the metallized layer increases, which is not preferable.
F成分は高融点金属のW,Ta,Re,Osや高融点無機物の黒
鉛,ダイヤモンド,TiN,ZrN,TaN,VN,TiB2,ZrB2などであ
る。これらの成分はいずれも本発明の組成物の溶着温度
である900℃程度では、溶融成分のAg,Cu,Sn,Ti,Nb,V,Zr
あるいはBeなどの合金中に溶解してしまうことがなく、
単に、濡れ性を有するだけの充填材料である。その為、
下成分の有するいろいろな性質、例えば熱膨張率,電気
伝導率,熱電導率,硬度,耐熱性,耐酸化性などの特性
を調節したり、付与したりする為に40重量%まで任意の
範囲で配合することが出来る。The F component is W, Ta, Re, Os of refractory metals, graphite, diamond, TiN, ZrN, TaN, VN, TiB 2 , ZrB 2 of refractory inorganic substances. All of these components have a melting temperature of about 900 ° C. of the composition of the present invention, and Ag, Cu, Sn, Ti, Nb, V, Zr
Or it will not dissolve in alloys such as Be,
It is a filling material having only wettability. For that reason,
An arbitrary range up to 40% by weight for adjusting or imparting various properties of the lower component, such as thermal expansion coefficient, electric conductivity, thermoelectric conductivity, hardness, heat resistance, and oxidation resistance. Can be blended with.
最後にMnは上記の各種充填材料成分と溶融成分との間の
濡れ性を改良し、メタライズ層自身の強度を向上させる
のに有効な元素である。あまり多量に配合すると耐酸化
性を損うので10.0重量%以下の任意の量となる。Finally, Mn is an element effective for improving the wettability between the above-mentioned various filling material components and the melting component and improving the strength of the metallized layer itself. If added in a too large amount, the oxidation resistance will be impaired, so an arbitrary amount of 10.0% by weight or less is set.
本発明のメタライズ組成物を各種のセラミツクスに溶着
させる本発明方法は、前記の如き組成の150メツシユ以
下、好ましくは325メツシユ以下、さらに微細なパター
ンを溶着させるには500メツシユ以下の合金あるいは各
金属の混合した微粉末に適度な流動性とセラミツクス表
面への付着力を付与するために、粘結剤として、エチル
セルロース系、アクリル系などのビークルを混入してペ
ースト状とする。セラミツクス表面にペーストを塗布す
るには、スクリーン印刷,ヘラ塗り,はけ塗りなどの方
法によつて実施し、乾燥後、Ar,H2,N2あるいは真空など
の非酸化性雰囲気中で880〜940℃の温度範囲で5〜20分
間保持して溶融あるいは半溶融させてセラミツクスの表
面と金属層とを反応させてメタライズ層を溶着させる方
法である。The method of the present invention of depositing the metallized composition of the present invention on various ceramics is 150 mesh or less of the composition as described above, preferably 325 mesh or less, and 500 mesh or less of the alloy or each metal for depositing a finer pattern. In order to impart appropriate fluidity and adhesion to the surface of the ceramics to the mixed fine powder of (1), a vehicle such as ethyl cellulose or acrylic is mixed as a binder to form a paste. To apply the paste to the surface of the ceramics, screen printing, spatula coating, brush coating, etc. are carried out, and after drying, it is dried in a non-oxidizing atmosphere such as Ar, H 2 , N 2 or vacuum 880 ~ In this method, the temperature is kept at 940 ° C. for 5 to 20 minutes to melt or semi-melt it to react the surface of the ceramic with the metal layer to weld the metallized layer.
前記の本発明方法によつて表面を金属化させたセラミツ
クス製品は、そのまま直接、ろう付することも出来る
が、あるいはさらに、そのメタライズ表面に、Co,Ag,Ni
などを積層メツキさせた製品とすることによつて、ろう
付時に、メタライズ層中のTi,Zr,Nb,Vなどがろう付気流
中の微量の残存O2ガス成分によつて表面に酸化物を形成
させて、銀ろうなどのろう材の流れ性を阻害するのを防
ぐことが出来る。この為、コバール,42%Ni−Fe合金,W,
Mo,Cu,Cu合金,Ag,Al,Al合金,炭素鋼,特殊鋼,鋳鉄,
ステンレス鋼,インコネル,インコロイなどの各種の実
用合金にろう付することが出来る。この際、セラミツク
スと接合しようとする金属との熱膨張係数が著しく異な
る場合には、両者の間に比較的柔軟な銅や銀などの金属
を挾んでろう付することにより、ろう付の際の冷却過程
で発生する収縮歪の差を吸収して、安定強固なろう付を
達成することも出来る。The ceramic product whose surface is metallized by the above-mentioned method of the present invention can be directly brazed as it is, or, further, on its metallized surface, Co, Ag, Ni
By using a product in which the metal is laminated, Ti, Zr, Nb, V, etc. in the metallized layer are not oxidized on the surface due to a trace amount of residual O 2 gas component in the brazing air flow during brazing. Can be formed to prevent the flowability of a brazing material such as silver brazing from being impeded. Therefore, Kovar, 42% Ni-Fe alloy, W,
Mo, Cu, Cu alloy, Ag, Al, Al alloy, carbon steel, special steel, cast iron,
It can be brazed to various practical alloys such as stainless steel, Inconel and Incoloy. At this time, when the coefficient of thermal expansion of the ceramic and the metal to be joined is remarkably different, a relatively soft metal such as copper or silver is brazed between the two to braze it. It is also possible to achieve stable and firm brazing by absorbing the difference in shrinkage strain generated in the cooling process.
本発明のメタライズ組成物とメタライズ方法とを適用し
て、本発明の結合力の強い優れたメタライズ面を有する
セラミツクス製品を製造出来るようになつた結果、従来
はセラミツクス単体で構成されたり、あるいは単に機械
的に組み合されていた各種の製品に対し、特製上も経済
的観点からも、最も合理的な素材同志の組み合わせが可
能となつた。又、単独のメタライズされたセラミツクス
製品としても熱伝導特性や、電気伝導性などの特性を生
かした新規な用途に利用することが出来るようになつ
た。そのため、自動車部品、電子部品、その他の産業機
械あるいは耐摩耗板など各種の用途にセラミツクスの用
途を広げることが出来るようになつた。By applying the metallizing composition and the metallizing method of the present invention, it has become possible to produce a ceramics product having a strong metallizing surface with a strong bonding force of the present invention, as a result, conventionally composed of a ceramic alone, or simply For various products that were mechanically combined, it was possible to combine the most rational materials from the viewpoint of special production and economical viewpoint. Also, as a single metallized ceramic product, it can be used for a new application utilizing the characteristics such as thermal conductivity and electrical conductivity. Therefore, it has become possible to expand the use of ceramics to various uses such as automobile parts, electronic parts, other industrial machines, and wear-resistant plates.
以下、本発明の実施例について説明を加える。Examples of the present invention will be described below.
実施例1. 本発明のメタライズ組成物として、第1表に記載の組成
物として第1表に記載の配合物を325メツシユ以下の各
金属元素の微粉末で配合し、エチルセルロース系のビー
クルを粘度を調整しながら、適量配合し、ペースト状と
した後、同表に記載のセラミツクスに上記ペーストをス
クリーン印刷して乾燥させた後、同表記載の雰囲気中、
910〜930℃の温度範囲で10分間保持して溶着させた後、
Co,Ag,Niをこの順に積層してメツキ処理し、必要に応じ
て0.3mm厚みの銅板を中間緩衝材として用いて、直径8mm
の円筒形のコバールの個片の端面を72%共晶銀ろうによ
つて、840℃,H2気流中で5分間保持してろう付して剪断
強度試験片を作つた。試験結果は同表に記載の如く実用
性のある良好な値を示した。Example 1. As the metallized composition of the present invention, the composition shown in Table 1 as the composition shown in Table 1 was compounded with fine powder of each metal element of 325 mesh or less, and an ethylcellulose-based vehicle was prepared. While adjusting, after mixing in an appropriate amount, to form a paste, after the paste is screen-printed on the ceramics described in the table and dried, in the atmosphere described in the table,
After holding for 10 minutes in the temperature range of 910 ~ 930 ℃ to weld,
Co, Ag, and Ni are laminated in this order and plated, and if necessary, a copper plate with a thickness of 0.3 mm is used as an intermediate cushioning material with a diameter of 8 mm.
The end face of each of the cylindrical Kovar pieces of No. 2 was brazed with 72% eutectic silver brazing in an H 2 stream at 840 ° C. for 5 minutes to prepare a shear strength test piece. The test results showed good practical values as shown in the table.
実施例2. 本発明のメタライズ組成物として、Ag19.9重量%,Cu24.
7重量%,Sn5.9重量%,Ti12.8重量%,Nb6.7重量%,V2.5
重量%,Zr3.4重量%,W30.0重量%,Mn5.0重量%を含む配
合物を500メツシユ以下の微粉末で配合して前記実施例
1.と同様の方法によつてペースト状とし、99.5%の高純
度のAl2O3,AlN,Si3N4の厚さ約0.64mmの板に幅0.1mmの線
を0.2mm間隙でスクリーン印刷し、905〜915℃で7分間
溶着させ幅0.1mm,厚さ0.020mmの微細なメタライズパタ
ーンを形成させることが出来る。さらに全く同様な方法
にて2mm口のメタライズパターンを形成させ、Niメツキ
を施こした後0.3mmの太さのCu線をはんだ付して、引抜
き強度を測定したところ荷重2kg以上の実用に充分耐え
得る値を示した。Example 2. As a metallized composition of the present invention, Ag 19.9 wt%, Cu24.
7wt%, Sn5.9wt%, Ti12.8wt%, Nb6.7wt%, V2.5
% Of Zr, 3.4% by weight of Zr, 30.0% by weight of W, 5.0% by weight of Mn was added as a fine powder of 500 mesh or less in the above-mentioned Example.
Using the same method as in 1, make a paste and screen 99.5% high-purity Al 2 O 3 , AlN, Si 3 N 4 with a thickness of about 0.64 mm and a line with a width of 0.1 mm with a gap of 0.2 mm. It can be printed and welded at 905 to 915 ° C for 7 minutes to form a fine metallized pattern with a width of 0.1 mm and a thickness of 0.020 mm. In addition, a metallization pattern of 2 mm opening was formed by the same method, Ni plating was applied, and then a Cu wire with a thickness of 0.3 mm was soldered, and the pull-out strength was measured. The value that can be endured is shown.
実施例3. 本発明のメタライズ組成物として、Ag21.4重量%,Cu26.
6重量%,Sn4.1重量%,Ti9.0重量%,Nb4.7重量%,V1.8重
量%,Zr2.4重量%,Mn5.0重量%,さらにダイヤモンド,
黒鉛,TiN,ZrN,TaN,VN,TiB2,ZrB2の各種の充填材料を25
重量%,325メツシユ以下の微粉末で配合し、前記の実施
例1.あるいは2.と同様の方法にてペースト状とした後、
含SiO2の94%Al2O3セラミツクスとAlNセラミツクスの0.
64mm厚みの板に2mmの線幅、長さ25mmのパターンを印刷
し、H2気流中で930℃で10分間保持して、厚さ0.035mmの
メタライズ層を形成させた後、ダイヤモンド砥石で研磨
して、研磨中に容易にメタライズ層が脱落しないことを
確認した。 Example 3. As a metallized composition of the present invention, Ag 21.4 wt%, Cu26.
6wt%, Sn4.1wt%, Ti9.0wt%, Nb4.7wt%, V1.8wt%, Zr2.4wt%, Mn5.0wt%, and diamond,
25 various filler materials such as graphite, TiN, ZrN, TaN, VN, TiB 2 and ZrB 2
% By weight, blended with a fine powder of 325 mesh or less, and made into a paste by the same method as in Example 1 or 2 above,
SiO 2 containing 94% Al 2 O 3 ceramics and AlN ceramics 0.
A pattern with a line width of 2 mm and a length of 25 mm is printed on a plate with a thickness of 64 mm, kept at 930 ° C for 10 minutes in an H 2 stream to form a metallized layer with a thickness of 0.035 mm, and then polished with a diamond grindstone. It was confirmed that the metallized layer did not easily fall off during polishing.
以上のように本発明によれば、いろいろなセラミツクス
に対して、優れた結合強度を有するメタライズが可能と
なり、本発明の製品はいろいろな分野の用途に利用する
ことが出来る。As described above, according to the present invention, it is possible to perform metallization having excellent bonding strength with respect to various ceramics, and the product of the present invention can be used in various fields.
Claims (3)
的不純物から成ることを特徴とするセラミックスのメタ
ライズ組成物、 a・Ag+b・Cu+c・Sn+d・Ti+e・Nb+f・V +g・Zr+h・F+i・Mn+j・Be 但し、ここでFは高融点金属であるW、Ta、Re、Osある
いは高融点無機物の黒鉛、ダイヤモンド、TiN、ZrN、V
N、TaN、TiB2、ZrB2のいずれか1種又は2種以上の充填
材料であり、a、b、c、d、e、f、g、h、i、j
は各々次の数値の範囲内の重量%とする。 13.0≦a≦72.4、13.6≦b≦44.0、 1.2≦c≦9.0、3.6≦d≦18.0、 1.6≦e≦11.0、0.2≦f≦4.5、 0.8≦g≦5.0、h≦40.0、i≦10.0、 j≦5.0 但し、a+b+c+d+e+f+g+h+i+j=100 である。1. A ceramic metallized composition comprising a component represented by the following composition formula and unavoidable impurities: a.Ag + b.Cu + c.Sn + d.Ti + e.Nb + f.V + g.Zr + h.F + i.Mn + j・ Be where F is a refractory metal such as W, Ta, Re, Os or refractory inorganic graphite, diamond, TiN, ZrN, V
N, TaN, TiB 2 or ZrB 2 which is one or more filler materials, and is a, b, c, d, e, f, g, h, i, j.
Is the weight% within the range of the following numerical values. 13.0 ≦ a ≦ 72.4, 13.6 ≦ b ≦ 44.0, 1.2 ≦ c ≦ 9.0, 3.6 ≦ d ≦ 18.0, 1.6 ≦ e ≦ 11.0, 0.2 ≦ f ≦ 4.5, 0.8 ≦ g ≦ 5.0, h ≦ 40.0, i ≦ 10.0, j ≦ 5.0, where a + b + c + d + e + f + g + h + i + j = 100.
的不純物から成ることを特徴とするセラミックスのメタ
ライズ組成物の成分の合金の粉末あるいは混合した粉末
をセラミックスの表面に塗布し、非酸化性雰囲気中で溶
融あるいは半溶融させてセラミックスの表面を金属化さ
せることを特徴とするメタライズを特徴とするメタライ
ズ方法。 a・Ag+b・Cu+c・Sn+d・Ti+e・Nb+f・V +g・Zr+h・F+i・Mn+j・Be 但し、ここでFは高融点金属であるW、Ta、Re、Osある
いは高融点無機物の黒鉛、ダイヤモンド、TiN、ZrN、V
N、TaN、TiB2、ZrB2のいずれか1種又は2種以上の充填
材料であり、a、b、c、d、e、f、g、h、i、j
は各々次の数値の範囲内の重量%とする。 13.0≦a≦72.4、13.6≦b≦44.0、 1.2≦c≦9.0、3.6≦d≦18.0、 1.6≦e≦11.0、0.2≦f≦4.5、 0.8≦g≦5.0、h≦40.0、i≦10.0、 j≦5.0 但し、a+b+c+d+e+f+g+h+i+j=100 である。2. A powder of an alloy or a mixed powder of a component of a metallizing composition for ceramics, which is composed of a component represented by the following composition formula and unavoidable impurities, is applied to the surface of the ceramic to obtain a non-oxidizing property. A metallizing method characterized by metallizing the surface of ceramics by melting or semi-melting in an atmosphere. a ・ Ag + b ・ Cu + c ・ Sn + d ・ Ti + e ・ Nb + f ・ V + g ・ Zr + h ・ F + i ・ Mn + j ・ Be where F is a refractory metal such as W, Ta, Re, Os or refractory inorganic graphite, diamond, TiN , ZrN, V
N, TaN, TiB 2 or ZrB 2 which is one or more filler materials, and is a, b, c, d, e, f, g, h, i, j.
Is the weight% within the range of the following numerical values. 13.0 ≦ a ≦ 72.4, 13.6 ≦ b ≦ 44.0, 1.2 ≦ c ≦ 9.0, 3.6 ≦ d ≦ 18.0, 1.6 ≦ e ≦ 11.0, 0.2 ≦ f ≦ 4.5, 0.8 ≦ g ≦ 5.0, h ≦ 40.0, i ≦ 10.0, j ≦ 5.0, where a + b + c + d + e + f + g + h + i + j = 100.
的不純物から成ることを特徴とするセラミックスのメタ
ライズ組成物の成分の合金の粉末あるいは混合した粉末
をセラミックスの表面に塗布し、非酸化性雰囲気中で溶
融あるいは半溶融させて、表面を金属化させ、あるいは
さらに、Co、Ag、Niを積層してメッキさせたことを特徴
とするメタライズ製品。 a・Ag+b・Cu+c・Sn+d・Ti+e・Nb+f・V +g・Zr+h・F+i・Mn+j・Be 但し、ここでFは高融点金属であるW、Ta、Re、Osある
いは高融点無機物の黒鉛、ダイヤモンド、TiN、ZrN、V
N、TaN、TiB2、ZrB2のいずれか1種又は2種以上の充填
材料であり、a、b、c、d、e、f、g、h、i、j
は各々次の数値の範囲内の重量%とする。 13.0≦a≦72.4、13.6≦b≦44.0、 1.2≦c≦9.0、3.6≦d≦18.0、 1.6≦e≦11.0、0.2≦f≦4.5、 0.8≦g≦5.0、h≦40.0、i≦10.0、 j≦5.0 但し、a+b+c+d+e+f+g+h+i+j=100 である。3. A powder of an alloy or a mixed powder of a component of a metallizing composition for ceramics, which is composed of a component represented by the following composition formula and unavoidable impurities, is applied to the surface of the ceramic to make it non-oxidizing. A metallized product characterized by being melted or semi-melted in an atmosphere to have its surface metallized, or further, Co, Ag, and Ni are laminated and plated. a ・ Ag + b ・ Cu + c ・ Sn + d ・ Ti + e ・ Nb + f ・ V + g ・ Zr + h ・ F + i ・ Mn + j ・ Be where F is a refractory metal such as W, Ta, Re, Os or refractory inorganic graphite, diamond, TiN , ZrN, V
N, TaN, TiB 2 or ZrB 2 which is one or more filler materials, and is a, b, c, d, e, f, g, h, i, j.
Is the weight% within the range of the following numerical values. 13.0 ≦ a ≦ 72.4, 13.6 ≦ b ≦ 44.0, 1.2 ≦ c ≦ 9.0, 3.6 ≦ d ≦ 18.0, 1.6 ≦ e ≦ 11.0, 0.2 ≦ f ≦ 4.5, 0.8 ≦ g ≦ 5.0, h ≦ 40.0, i ≦ 10.0, j ≦ 5.0, where a + b + c + d + e + f + g + h + i + j = 100.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP859586A JPH075407B2 (en) | 1986-01-17 | 1986-01-17 | Ceramics metallized composition, metallized method and metallized product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP859586A JPH075407B2 (en) | 1986-01-17 | 1986-01-17 | Ceramics metallized composition, metallized method and metallized product |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62167273A JPS62167273A (en) | 1987-07-23 |
| JPH075407B2 true JPH075407B2 (en) | 1995-01-25 |
Family
ID=11697328
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP859586A Expired - Lifetime JPH075407B2 (en) | 1986-01-17 | 1986-01-17 | Ceramics metallized composition, metallized method and metallized product |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH075407B2 (en) |
-
1986
- 1986-01-17 JP JP859586A patent/JPH075407B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62167273A (en) | 1987-07-23 |
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