JPH0755502B2 - Method for impregnating varnish on substrate - Google Patents
Method for impregnating varnish on substrateInfo
- Publication number
- JPH0755502B2 JPH0755502B2 JP26324186A JP26324186A JPH0755502B2 JP H0755502 B2 JPH0755502 B2 JP H0755502B2 JP 26324186 A JP26324186 A JP 26324186A JP 26324186 A JP26324186 A JP 26324186A JP H0755502 B2 JPH0755502 B2 JP H0755502B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- impregnation
- varnish
- base material
- resin varnish
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002966 varnish Substances 0.000 title claims description 29
- 238000000034 method Methods 0.000 title claims description 9
- 239000000758 substrate Substances 0.000 title description 6
- 229920005989 resin Polymers 0.000 claims description 30
- 239000011347 resin Substances 0.000 claims description 30
- 239000000463 material Substances 0.000 claims description 17
- 238000005470 impregnation Methods 0.000 description 27
- 239000002904 solvent Substances 0.000 description 5
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 238000007872 degassing Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 230000006837 decompression Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- -1 polybutylene terephthalate Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
- Reinforced Plastic Materials (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Description
【発明の詳細な説明】 〔技術分野〕 本発明は化粧板用基材、積層板用基材へのワニス含浸方
法に関するものである。TECHNICAL FIELD The present invention relates to a method for impregnating a base material for a decorative board and a base material for a laminated board with varnish.
従来、紙、布、ガラス織布等の化粧板用基材や積層板用
基材にワニスを含浸、乾燥してプリプレグを製造する場
合、一般に含浸性を向上せしめるためワニス槽内の含浸
ロールの数を増加したり、ロール間距離を長くしたり、
基材速度を遅くしたり、加圧ロールを用いたり、超音波
をかけたりしていたが各れの方法でも含浸性を大きく向
上せしめることはできなかった。又、真空含浸において
は連続化が難しく、連続化されても空気の流入が多く動
力費のアップ、シート部品の消耗、基材の反りネジレの
多発、真空含浸装置の大型化に伴う費用アップと保守の
困難さ等が問題になっていた。Conventionally, when a prepreg is manufactured by impregnating a varnish into a base material for a decorative plate or a base material for a laminated plate such as paper, cloth, glass woven cloth, etc., in general, in order to improve the impregnating ability, Increase the number, increase the distance between rolls,
Although the substrate speed was slowed down, a pressure roll was used, and ultrasonic waves were applied, it was not possible to greatly improve the impregnating property by each method. In addition, continuous vacuum impregnation is difficult, and even if it is continuous, air inflow is large and power cost rises, consumption of sheet parts, frequent warpage twist of base material, increase in cost due to enlargement of vacuum impregnation device Difficulty in maintenance was a problem.
本発明の目的とするところは、連続化が容易で含浸装置
が簡素化された基材へのワニス含浸方法を提供すること
にある。It is an object of the present invention to provide a method for impregnating a varnish on a substrate, which can be easily continuous and has a simplified impregnation apparatus.
本発明は基材を減圧脱泡処理した樹脂量5〜50重量%
(以下単に%と記す)の樹脂ワニスに含浸後、減圧脱泡
処理した樹脂量50〜80%の樹脂ワニスに所要回数含浸さ
せ、スクイズロールを径て移動させることを特徴とする
基材へのワニス含浸方法のため、空気を含有しなく空気
溶解力の大きい樹脂ワニスが基材に残存する空気の周囲
を通過した時、基材の残存空気を強力に吸収し基材外に
放出し基材内の残存空気を皆無にするため、基材内に均
質に樹脂ワニスを侵透させ、基材内の樹脂未含浸部をな
くすることができるものである。以下本発明を詳細に説
明する。In the present invention, the amount of resin obtained by degassing the substrate is 5 to 50% by weight.
After impregnating the resin varnish (hereinafter simply referred to as “%”), the resin varnish having a resin amount of 50 to 80% subjected to vacuum defoaming treatment is impregnated a required number of times, and a squeeze roll is moved to a base material characterized by Due to the varnish impregnation method, when a resin varnish that does not contain air and has a large air-dissolving power passes around the air remaining in the base material, it strongly absorbs the residual air of the base material and releases it to the outside of the base material. Since there is no residual air inside, the resin varnish can be uniformly penetrated into the base material to eliminate the resin-unimpregnated portion in the base material. The present invention will be described in detail below.
本発明に用いる基材はガラス、アスベスト等の無機繊維
やポリエステル、ポリアミド、ポリビニルアルコール、
アクリル等の有機合成繊維や木綿等の天然繊維からなる
織布、不織布、マット或は紙又はこれらの組合せ基材等
で好ましくは厚さが0.1〜0.3mmの基材が望ましいことで
ある。The substrate used in the present invention is glass, inorganic fibers such as asbestos and polyester, polyamide, polyvinyl alcohol,
A woven fabric, a non-woven fabric, a mat or paper made of organic synthetic fibers such as acrylic and natural fibers such as cotton, or a base material having a combination thereof is preferably a base material having a thickness of 0.1 to 0.3 mm.
樹脂ワニスとしてはフエノール樹脂、クレゾール樹脂、
エポキシ樹脂、不飽和ポリエステル樹脂、メラミン樹
脂、ポリイミド、ポリブタジエン、ポリアミド、ポリア
ミドイミド、ポリスルフオン、ポリフエニレンサルフア
イド、ポリフエニレンオキサイド、ポリブチレンテレフ
タレート、ポリエーテルエーテルケトン、弗化樹脂等の
単独、変性物、混合物等が用いられ必要に応じて粘度調
整に水、メチルアルコール、アセトン、シクロヘキサノ
ン、スチレン等の溶媒を添加したものであるが、好まし
くは溶剤としては20〜25℃における蒸気圧が150mmHg以
下であるメチルセロソルブ、ジメチルホルムアミド等を
用いることが望ましい。1次含浸用樹脂ワニスの樹脂量
は5〜50%であることが必要である。即ち50%をこえる
と含浸時間に長時間を要することになるからである。2
次含浸用以降の樹脂ワニスの樹脂量は50〜80%であるこ
とが必要である。即ち50%未満では必要とする樹脂量を
含浸されることができず、80%をこえると含浸時間に長
時間を要することになるからである。樹脂ワニスの減圧
脱泡処理は1次含浸用及び2次含浸用以降共に減圧度15
0Torr以下で含浸時間は1分以上であることが好まし
い。樹脂ワニスとしては1次含浸用及び2次含浸用以降
が同一樹脂ワニスであっても又、異種樹脂ワニスであっ
てもよく任意であり、更に2次含浸以降については2次
含浸丈でもよく又、2次含浸等のように必要に応じて所
要回数含浸させるものである。なお、ワニスが含浸され
た基材の乾燥、巻取り、切断等は通常のプリプレグの製
造で用いられるものを用いることができる。更に樹脂含
浸基材を無圧乃至加圧で連続積層加熱成形することもで
きるものである。As resin varnish, phenol resin, cresol resin,
Epoxy resin, unsaturated polyester resin, melamine resin, polyimide, polybutadiene, polyamide, polyamideimide, polysulfone, polyphenylene sulfide, polyphenylene oxide, polybutylene terephthalate, polyether ether ketone, fluororesin, etc. alone or modified Water, methyl alcohol, acetone, cyclohexanone, and a solvent such as styrene are added to adjust the viscosity of the mixture, if necessary, using a mixture, but the vapor pressure at 20 to 25 ° C. is preferably 150 mmHg or less as the solvent. It is preferable to use methyl cellosolve, dimethylformamide or the like. The resin amount of the resin varnish for primary impregnation needs to be 5 to 50%. That is, if it exceeds 50%, the impregnation time will take a long time. Two
The resin content of the resin varnish for the subsequent impregnation needs to be 50 to 80%. That is, if it is less than 50%, the required amount of resin cannot be impregnated, and if it exceeds 80%, the impregnation time will take a long time. The vacuum defoaming treatment of the resin varnish is for both the primary impregnation and secondary impregnation.
It is preferable that the impregnation time is 0 Torr or less and the impregnation time is 1 minute or more. As the resin varnish, the same resin varnish for the first impregnation and the second impregnation and thereafter may be different resin varnishes, and the second impregnation may be the second impregnation length. It is impregnated as many times as necessary, such as secondary impregnation. For the drying, winding, cutting and the like of the base material impregnated with the varnish, those used in the usual production of prepreg can be used. Further, the resin-impregnated base material can be continuously laminated and heat-molded without pressure or pressure.
以下本発明の一実施例を図面により説明する。An embodiment of the present invention will be described below with reference to the drawings.
実施例 メチルセロソルブを溶媒とする樹脂量30%の1次含浸用
エポキシ樹脂ワニス1を減圧釜2で減圧度22〜25Torrで
30分間減圧脱泡処理した後、1次含浸槽3に送り、該樹
脂ワニスに厚さ0.18mm、重量200g/m2のガラス布4を1
分間含浸させ樹脂量を20%とし、更にメチルセロソルブ
を溶媒とする樹脂量70%の2次含浸用エポキシ樹脂ワニ
ス5を別の減圧釜6で減圧度20〜25Torrで30分間減圧脱
泡処理した樹脂ワニスを収納する2次含浸槽7に含浸さ
せて合計樹脂量が45%になるようにスクイズロール8で
調整した後、乾燥してプリプレグを得た。Example An epoxy resin varnish 1 for primary impregnation having a resin amount of 30% using methyl cellosolve as a solvent was placed in a vacuum kettle 2 at a pressure reduction degree of 22 to 25 Torr.
After degassing for 30 minutes under reduced pressure, the resin varnish was sent to a primary impregnation tank 3 and a glass cloth 4 having a thickness of 0.18 mm and a weight of 200 g / m 2 was used.
The epoxy resin varnish 5 for secondary impregnation having a resin content of 20% after being impregnated for 20 minutes and a methylcellosolve solvent as a solvent was further degassed under reduced pressure for 20 minutes at a pressure reduction degree of 20 to 25 Torr in another vacuum vessel 6. The secondary impregnation tank 7 containing the resin varnish was impregnated, adjusted with a squeeze roll 8 so that the total amount of resin was 45%, and then dried to obtain a prepreg.
比較例 1次含浸用及び2次含浸用樹脂ワニスを減圧脱泡処理せ
ずに用いた以外は実施例と同様に処理してプリプレグを
得た。Comparative Example A prepreg was obtained by treating in the same manner as in Example except that the resin varnish for primary impregnation and the resin varnish for secondary impregnation were used without being subjected to degassing under reduced pressure.
実施例及び比較例のプリプレグの残存空気泡数は第1表
で明白なように本発明のものの泡数は少なく、本発明の
基材へのワニス含浸方法の優れていることを確認した。Regarding the number of residual air bubbles in the prepregs of Examples and Comparative Examples, as is clear from Table 1, the number of bubbles of the present invention was small, and it was confirmed that the method for impregnating varnish on the substrate of the present invention was excellent.
図面は本発明の方法の一実施例を示す簡略工程図であ
る。 1は1次含浸用樹脂ワニス、2は減圧釜、3は1次含浸
槽、4は基材、5は2次含浸用樹脂ワニス、6は別の減
圧釜、7は2次含浸槽、8はスクイズロール、9は真空
ポンプである。The drawings are simplified process diagrams showing an embodiment of the method of the present invention. 1 is a resin varnish for primary impregnation, 2 is a decompression tank, 3 is a primary impregnation tank, 4 is a base material, 5 is a resin varnish for secondary impregnation, 6 is another decompression tank, 7 is a secondary impregnation tank, 8 Is a squeeze roll, and 9 is a vacuum pump.
Claims (1)
%の樹脂ワニスに含浸後、減圧脱泡処理した樹脂量50〜
80重量%の樹脂ワニスに所要回数含浸させ、スクイズロ
ールを径て移動させることを特徴とする基材へのワニス
含浸方法。1. A resin varnish having a resin amount of 5 to 50% by weight which has been degassed under reduced pressure, and then has a resin amount of 50 to 50% which has been degassed under reduced pressure.
A method for impregnating a varnish into a base material, which comprises impregnating a resin varnish of 80% by weight a required number of times and moving the squeeze roll in a radial direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26324186A JPH0755502B2 (en) | 1986-11-05 | 1986-11-05 | Method for impregnating varnish on substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26324186A JPH0755502B2 (en) | 1986-11-05 | 1986-11-05 | Method for impregnating varnish on substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63116809A JPS63116809A (en) | 1988-05-21 |
| JPH0755502B2 true JPH0755502B2 (en) | 1995-06-14 |
Family
ID=17386735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26324186A Expired - Fee Related JPH0755502B2 (en) | 1986-11-05 | 1986-11-05 | Method for impregnating varnish on substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0755502B2 (en) |
-
1986
- 1986-11-05 JP JP26324186A patent/JPH0755502B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63116809A (en) | 1988-05-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |