JPH0758864B2 - Piezoelectric oscillator - Google Patents
Piezoelectric oscillatorInfo
- Publication number
- JPH0758864B2 JPH0758864B2 JP60178134A JP17813485A JPH0758864B2 JP H0758864 B2 JPH0758864 B2 JP H0758864B2 JP 60178134 A JP60178134 A JP 60178134A JP 17813485 A JP17813485 A JP 17813485A JP H0758864 B2 JPH0758864 B2 JP H0758864B2
- Authority
- JP
- Japan
- Prior art keywords
- connection
- prolonged
- lead
- piezoelectric vibrator
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Oscillators With Electromechanical Resonators (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は圧電振動子と発振回路とを同一パツケージ内に
収納した圧電発振器に関する。The present invention relates to a piezoelectric oscillator in which a piezoelectric vibrator and an oscillation circuit are housed in the same package.
従来の圧電発振器の構成を水晶振動子を用いた水晶発振
器を例として第３図に正断面図で示し説明する。第３図
において半導体素子21と前記半導体素子21と金属細線22
（本例ではAu細線）によりワイヤーボンデイング接続さ
れたリード端子23がトランスフアーモールド樹脂25で成
形封止されている。この時水晶振動子24の固着位置は、
予めトランスフアーモールド型によつて中空状態になつ
ておりトランスフアーモールド樹脂硬化後、前記中空部
に水晶振動子24を投入して水晶振動子接続用リード端子
23′に半田付等で固着し、残りの中空部はエポキシ樹脂
26等をボツテイングにより充填して硬化させ封止する構
成となつていた。The structure of a conventional piezoelectric oscillator will be described with reference to FIG. 3 as a front cross-sectional view of a crystal oscillator using a crystal oscillator as an example. In FIG. 3, the semiconductor element 21, the semiconductor element 21 and the thin metal wire 22 are shown.
The lead terminal 23, which is wire-bonded and connected by (Au thin wire in this example), is molded and sealed by the transfer mold resin 25. At this time, the fixed position of the crystal unit 24 is
It has been made hollow beforehand by a transfer mold, and after the transfer mold resin has hardened, the crystal unit 24 is inserted into the hollow part to connect the crystal unit to the lead terminal.
23 'is fixed by soldering etc., and the remaining hollow part is epoxy resin
The structure was such that 26 and the like were filled in by bottling, hardened, and sealed.
しかし前述の従来技術では、中空部に充填してあるエポ
キシ等の樹脂とトランスフアーモールド樹脂の界面が大
きな面積で存在するために、その界面を浸透する水分に
よつて、水晶振動子の発振異常が発生する等の問題点を
有していた。However, in the above-mentioned conventional technique, since the interface between the resin such as epoxy and the transfer mold resin with which the hollow portion is filled exists in a large area, the oscillation abnormalities of the crystal oscillator are caused by the moisture penetrating the interface. There was a problem such as occurrence of.
そこで、先行技術として、半導体等の電子部品及びリー
ド端子、圧電振動子を樹脂により同時に成形パツケージ
ングする方法を提案しているが、圧電振動子接続用リー
ド端子は、接続部の巾が圧電振動子接続用リード端子の
巾より細く又、一本による接続であり、接続剛性が弱い
ため圧電振動子固着時に圧電振動子接続用リード端子が
たわんだり曲がつたりして金属細線を傷めるという問題
点を有している。Therefore, as a prior art, a method of simultaneously molding and packaging electronic components such as semiconductors, lead terminals, and piezoelectric vibrators with a resin has been proposed. Since the width is smaller than the width of the lead terminal for child connection and the connection is made by one wire, the connection rigidity is weak and the lead terminal for connecting the piezoelectric vibrator is bent or bent when the piezoelectric vibrator is fixed, which damages the thin metal wire. Have a point.
そこで本発明は、このような問題点を解決しようとする
もので、その目的とするところは、圧電振動子接続用リ
ード端子のリードフレーム外縁部への接続部の剛性を高
め、圧電振動子の固着時の圧電振動子接続用リード端子
のたわみ、曲がりを防止して、金属細線の切れ、伸び、
はくり等を防いで、信頼性の向上した圧電発振器を提供
することにある。Therefore, the present invention is intended to solve such a problem, and an object of the present invention is to increase the rigidity of the connecting portion of the lead terminal for connecting the piezoelectric vibrator to the outer edge portion of the lead frame, and Prevents bending and bending of the lead terminal for connecting the piezoelectric vibrator when adhered, cutting, stretching,
It is to provide a piezoelectric oscillator with improved reliability by preventing peeling and the like.
本発明の圧電発振器は、 出力リード線を有する圧電振動子と、 該圧電振動子を発振させる半導体素子と、 一端に前記半導体素子を金属細線によりボンディング接
続するボンディング部を有し、他端にリードフレーム外
縁部に接続される接続部と該接続部近傍でかつ該接続部
より前記ボンディング部側に前記出力リード線を固着す
る固着部とを有するリード端子と、 を備えた圧電発振器において、 前記リードフレーム外縁部に接続される接続部の総幅
は、前記ボンディング部の幅より大きく構成され、 前記圧電振動子と前記半導体素子と前記リード端子と
は、前記接続部を一部残して樹脂により一体的にモール
ドされ、該残された接続部を前記リードフレーム外縁部
から切断されてなることを特徴とする。A piezoelectric oscillator of the present invention has a piezoelectric vibrator having an output lead wire, a semiconductor element for oscillating the piezoelectric vibrator, a bonding portion for bonding and connecting the semiconductor element with a thin metal wire at one end, and a lead portion at the other end. A piezoelectric oscillator comprising: a lead terminal having a connection portion connected to an outer edge portion of a frame and a fixing portion for fixing the output lead wire in the vicinity of the connection portion and closer to the bonding portion than the connection portion; The total width of the connecting portion connected to the outer edge portion of the frame is configured to be larger than the width of the bonding portion, and the piezoelectric vibrator, the semiconductor element, and the lead terminal are integrally formed of resin with the connecting portion partially left. And the remaining connection portion is cut from the outer edge portion of the lead frame.
本発明の圧電発振器の実施例を水晶振動子を用いた水晶
発振器を例として第１図（ａ），第１図（ｂ）に示し説
明する。第１図（ａ）は平面図、第１図（ｂ）は正面断
面図であり、水晶振動子を発振させる機能を有した半導
体素子１が金属薄板等から成るリードフレーム３上に接
着され金属細線（本例ではAuワイヤー）２によりワイヤ
ーボンデイング接続されて各リード端子7.8（リード端
子は他にも数本〜数十本あるが本説明では省略する）に
接続されている。リード端子7.8は水晶振動子４との接
続用リード端子であり、一方端はAuワイヤー２によつて
半導体素子１と接続されており、他の一方端はリードフ
レーム外縁部９に各々２本で構成する接続部11により延
長接続されており接続部11の近接箇所に設けてあるアイ
ランド12に水晶振動子４のリード線４′が溶接等により
固着されている。以上述べた、半導体素子1.、Auワイヤ
ー２、リードフレーム３、水晶振動子４、リード端子
７、８等はエポキシ樹脂等のトランスフアーモールドに
よつて成形された樹脂６の内部に包含されている。An embodiment of the piezoelectric oscillator of the present invention will be described with reference to FIGS. 1 (a) and 1 (b) by taking a crystal oscillator using a crystal oscillator as an example. 1 (a) is a plan view and FIG. 1 (b) is a front sectional view. A semiconductor element 1 having a function of oscillating a crystal unit is adhered onto a lead frame 3 made of a metal thin plate or the like to form a metal. Wire bonding connection is performed by a thin wire (Au wire in this example) 2 and is connected to each lead terminal 7.8 (there are several to several dozen other lead terminals, but omitted in this description). The lead terminal 7.8 is a lead terminal for connecting to the crystal unit 4, one end of which is connected to the semiconductor element 1 by the Au wire 2, and the other end of which is two on the outer edge portion 9 of the lead frame. The lead wire 4 ′ of the crystal unit 4 is fixed by welding or the like to the island 12 which is extendedly connected by the connecting portion 11 which is formed and which is provided in the vicinity of the connecting portion 11. The semiconductor element 1, the Au wire 2, the lead frame 3, the crystal unit 4, the lead terminals 7 and 8 described above are contained in the resin 6 formed by transfer molding such as epoxy resin. There is.
尚、第２図に示す様に水晶振動子接続用リード端子の延
設部13のアイランド12との接合部分の巾（Ａ）より、接
続部11の巾（Ｂ）の方が大きければ、剛性が確保でき、
同等の効果を有する。As shown in FIG. 2, if the width (B) of the connecting portion 11 is larger than the width (A) of the joint portion of the extension portion 13 of the crystal resonator connecting lead terminal with the island 12, the rigidity is increased. Can be secured,
Has the same effect.
さらに、本発明の圧電発振器は実施例に示す水晶振動子
を用いた水晶発振器に限らず、タンタル酸リチウム振動
子、モリブデン酸リチウム振動子セラミツク振動子等を
用いた発振器でも良い。Further, the piezoelectric oscillator of the present invention is not limited to the crystal oscillator using the crystal oscillator shown in the embodiment, and may be an oscillator using a lithium tantalate oscillator, a lithium molybdate oscillator ceramic oscillator, or the like.
以上述べたように、本発明は、 ａ）ボンディング部の幅が、剛性を必要とする接続部の
総幅より小さいため、半導体素子の多ピン化に対応で
き、モールド樹脂間の相互の結合を阻害する部分を少な
くでき樹脂のクラックがなくなり、モールド用樹脂も流
れやすくモールドしやすい。As described above, according to the present invention: a) Since the width of the bonding portion is smaller than the total width of the connecting portion requiring rigidity, it is possible to deal with the increase in the number of pins of the semiconductor element, and to prevent mutual coupling between the mold resins. The hindrance can be reduced and the resin cracks disappear, and the molding resin is easy to flow and easy to mold.
ｂ）接続部の総幅がボンディング幅より大きいので、リ
ードフレーム外縁部との接続剛性を大きくすることがで
き、固着部に圧電振動子を固着するとき、半導体素子が
ボンディングされているリード端子の他端側への、振
動、たわみがなくなり、金属細線の切れ、伸び、剥離等
を防止できる。b) Since the total width of the connection portion is larger than the bonding width, it is possible to increase the connection rigidity with the outer edge portion of the lead frame, and when the piezoelectric vibrator is fixed to the fixing portion, the lead terminal to which the semiconductor element is bonded Vibration and bending to the other end side is eliminated, and it is possible to prevent breakage, elongation, peeling, etc. of the thin metal wire.
ｃ）半導体素子、リード端子、圧電振動子を樹脂により
一体モールドしたので、界面が存在せず、水分の浸透を
防止できる。c) Since the semiconductor element, the lead terminal, and the piezoelectric vibrator are integrally molded with resin, there is no interface, and the permeation of water can be prevented.
という効果を奏する。Has the effect.
第１図（ａ），（ｂ）は本発明の圧電発振器の一実施例
としての水晶発振器を示し、（ａ）は平面図、（ｂ）は
正面断面図。 １……半導体素子、２……Auワイヤー、３……リードフ
レーム、４……水晶振動子、４′……水晶振動子のリー
ド線、６……成形されたトランスフアーモールド樹脂、
7,8……水晶振動子接続用リード端子、9,10……リード
フレーム外縁部、11……水晶振動子接続用リード端子の
接続部、12……水晶振動子固着用アイランド、13……水
晶振動子接続用リード端子の延設部 第２図は本発明の圧電発振器の一実施例としての水晶発
振器の水晶振動子接続用リード端子部分の応用例を示す
平面図。 第３図は、従来の圧電発振器の一実施例としての水晶発
振器の正面断面図。1 (a) and 1 (b) show a crystal oscillator as one embodiment of the piezoelectric oscillator of the present invention, (a) is a plan view, and (b) is a front sectional view. 1 ... Semiconductor element, 2 ... Au wire, 3 ... Lead frame, 4 ... Crystal oscillator, 4 '... Crystal oscillator lead wire, 6 ... Molded transfer mold resin,
7,8 ...... Crystal resonator connecting lead terminal, 9,10 ...... Lead frame outer edge part, 11 ...... Crystal resonator connecting lead terminal connecting part, 12 ...... Crystal resonator fixing island, 13 ...... Extension of Lead Terminal for Connecting Crystal Oscillator FIG. 2 is a plan view showing an application example of a lead terminal portion for connecting a crystal oscillator of a crystal oscillator as an embodiment of the piezoelectric oscillator of the present invention. FIG. 3 is a front sectional view of a crystal oscillator as an example of a conventional piezoelectric oscillator.
Claims (1)
続するボンディング部を有し、他端にリードフレーム外
縁部に接続される接続部と該接続部近傍でかつ該接続部
より前記ボンディング部側に前記出力リード線を固着す
る固着部とを有するリード端子と、 を備えた圧電発振器において、 前記リードフレーム外縁部に接続される接続部の総幅
は、前記ボンディング部の幅より大きく構成され、 前記圧電振動子と前記半導体素子と前記リード端子と
は、前記接続部を一部残して樹脂により一体的にモール
ドされ、該残された接続部を前記リードフレーム外縁部
から切断されてなることを特徴とする圧電発振器。1. A piezoelectric vibrator having an output lead wire, a semiconductor element for oscillating the piezoelectric vibrator, a bonding portion for bonding and connecting the semiconductor element with a thin metal wire at one end, and a lead frame outer edge at the other end. A lead terminal having a connecting portion connected to the connecting portion and a fixing portion for fixing the output lead wire in the vicinity of the connecting portion and on the side of the bonding portion from the connecting portion; The total width of the connection portion connected to the portion is configured to be larger than the width of the bonding portion, and the piezoelectric vibrator, the semiconductor element, and the lead terminal are integrally formed of resin with the connection portion partially left. A piezoelectric oscillator, which is molded and is formed by cutting the remaining connecting portion from the outer edge portion of the lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60178134A JPH0758864B2 (en) | 1985-08-13 | 1985-08-13 | Piezoelectric oscillator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60178134A JPH0758864B2 (en) | 1985-08-13 | 1985-08-13 | Piezoelectric oscillator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6238604A JPS6238604A (en) | 1987-02-19 |
| JPH0758864B2 true JPH0758864B2 (en) | 1995-06-21 |
Family
ID=16043242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60178134A Expired - Lifetime JPH0758864B2 (en) | 1985-08-13 | 1985-08-13 | Piezoelectric oscillator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0758864B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63217802A (en) * | 1987-03-06 | 1988-09-09 | Matsushima Kogyo Co Ltd | Piezo-oscillator |
| US4916413A (en) * | 1987-11-20 | 1990-04-10 | Matsushima Kogyo Kabushiki Kaisha | Package for piezo-oscillator |
| US5229640A (en) * | 1992-09-01 | 1993-07-20 | Avx Corporation | Surface mountable clock oscillator module |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5172162U (en) * | 1974-12-03 | 1976-06-07 | ||
| JPS5471962U (en) * | 1977-10-29 | 1979-05-22 | ||
| JPS57115718U (en) * | 1981-01-09 | 1982-07-17 |
-
1985
- 1985-08-13 JP JP60178134A patent/JPH0758864B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6238604A (en) | 1987-02-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |