JPH0760707B2 - Interlayer connection structure of laminated busbar wiring board - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a busbar wiring board that constitutes an internal circuit of an electrical connection box used for interconnection of wire harnesses, and to a laminated structure of the wiring board. It is an improvement.

[Conventional technology]

FIG. 4 shows a laminated structure of busbar wiring boards in an electric junction box previously proposed by the applicant (Japanese Patent Application No. 63-313830).

In the figure, reference numerals 1 and 1'indicate an upper case and a lower case, respectively, which form a box body of an electric junction box, and are provided with insertion portions 2, 2'for a connector of a terminal of a wire harness.

3a is a first-layer insulating plate, 3b is a second-layer insulating plate, and the first-layer bus bar 4 is provided between the upper and lower cases 1, 1'and the first and second-layer insulating plates 3a, 3b.
a, a second-layer bus bar 4b, and a third bus bar 4c are provided.

Each of the bus bars 4a to 4c of each layer has external connection terminals (tabs) that are erected upward or downward as shown by reference numerals 5A and 5B, and the terminals 5A and 5B are insulating plates and / or, respectively. It penetrates through the terminal insertion hole 6 of the case and projects to the connector insertion portion 2 or 2 '.

Further, the first layer bus bar indicated by reference numeral 4a ₁ has downward interlayer connection terminals 5b ₁ and 5b ₂ at both ends, and the terminals 5b ₁ and 5b ₂ are respectively the third layer bus bar 4c ₂ and the second layer bus bar 4c ₂ . The bus bar 4b ₁ is press-fitted and connected to the terminal press-fitting hole 7 to form an interlayer connection. Similarly, the second-layer bus bar 4b ₁ has an upward-facing interlayer connection terminal 5
a and a downward-facing interlayer connection terminal 5b, each of which has a first
An interlayer connection is made between the layer bus bar 4a ₁ and the third layer bus bar 4c ₁ .

FIG. 5 is an exploded perspective view of a part of the above-mentioned interlayer connection. Reference numeral 8 is a relief groove for the tip of the interlayer connection terminal (5b ₂ ), which also serves as an insulating plate. 'Is also provided.

[Problems to be Solved by the Invention]

In the laminated structure shown in FIGS. 4 and 5, the bus bars 4a to 4 of each layer are
As c has upward and downward tabs 5A and 5B, respectively, the assembly and stacking work of the busbar wiring board is performed on the lower case 1'in order of the third layer busbar 4c, the second layer insulation board 3b, and the second layer busbar. As in 4b ..., it must be done step by step from the lower layer or the upper layer.

Also, there are many layers downward and upward terminals 5a for connection, a second layer bus bar 4b ₁ of such external connection terminals 5A having 5b, even terminals without a 5B.

Therefore, if the bus bar that should be disposed in the lower layer or the intermediate layer is mistakenly disposed, the assembly must be restarted from the beginning, the work is complicated, considerable skill is required, and the efficiency is low.

Furthermore, as the interlayer connection terminals 5b _2, when what is distal from the terminal press-fit hole 7 projects is present in the intermediate layer, to escape the protruding length α min, fled to (the second layer) insulating plate 3b Groove 8
Therefore, it is necessary to increase the thickness t of the insulating plate itself, and the length of the tabs 5A, 5B, which are external connection terminals that are independent of the interlayer connection, must be increased accordingly. . This means that when the bus bar and the tab are punched from the conductive metal plate and formed by bending, the punching yield is reduced, and accordingly, the bus bar wiring density is also reduced.

An object of the present invention is to solve the above problems and further simplify the laminated structure of a busbar wiring board including busbars having terminals for interlayer connection, to facilitate assembly and workability, and to further improve the punching yield and distribution of busbars. Another object of the present invention is to provide a laminated bus bar wiring board that can improve the installation density.

[Means for Solving the Problems]

To achieve the above object, in the present invention, a busbar wiring board including a plurality of busbars having a desired circuit pattern and an insulating plate is laminated in a plurality of layers, and the busbar wiring board includes an upper case and a lower case. In the laminated busbar wiring board, which is housed in the box and is formed by erected upwardly or downwardly on the busbar and piercing the insulation board and the terminal insertion hole of the box to project to the outside, A central partition plate is interposed in the middle of the insulating plate, and external connection terminals of the bus bar arranged in the upper layer of the partition plate are erected upwardly to form an external connection of the bus bar arranged in the lower layer of the partition plate. The terminals for upright standing are coupled downward, and a part of the upward and downward external connection terminals is formed short as an interlayer connection terminal, and the interlayer connection terminal is provided on the bus bar of the upper layer or the lower layer. Adopting a configuration for performing inter-layer connection by press-fit connection to the terminal press-fitting hole.

[Action]

The laminated busbar wiring board according to the present invention has the structure in which the external connection terminals standing upright on the busbars of the respective layers are aligned in one direction of the upright and downward directions with the central partition plate as a boundary. The simplification and workability are improved, and the upper and lower busbar wiring boards of the central partition plate can be assembled or laminated in separate steps, respectively, and the steps are simplified.

In addition, since the rising direction of the inter-layer connection terminal is the same as that of the external connection terminal, the thickness of the insulating plate can be reduced, and the startup height of each external connection terminal can be reduced. The punching yield and wiring density are also improved.

Hereinafter, the above configuration and operation will be specifically described with reference to the drawings illustrating an embodiment.

〔Example〕

In FIG. 1, 11 is an upper case which constitutes a box body of an electric connection box, 11 'is a lower case thereof, and both cases are provided with connector insertion portions 12, 12'.

13 ₁ is a first-layer insulating plate, 13 ₂ is a second-layer insulating plate, and a central partition plate 14 made of an insulator is interposed in the middle.

The front and rear surfaces of each insulating plate, are recessed the busbar wiring groove 15, the first layer upper surface of the insulating plate 13 ₁ a first layer bus bar 1
6 ₁ , the second layer bus bar 16 _{2 on} the lower surface is the above-mentioned bus bar arrangement groove 1
It is located at 5. Similarly, the second layer insulating plate 13 ₂
A third-layer bus bar 16 ₃ and a fourth-layer bus bar 16 ₄ are arranged in the above.

The first and second layer bus bars 16 ₁ and 16 ₂ above the central partition plate 14 each have an external connection terminal 17 facing upward, and the terminal 17 penetrates the terminal insertion hole 18 and projects into the connector insertion portion 12. ing. Further, the second layer bus bar designated by reference numeral 16 ₂ ′ has an upward interlayer connecting terminal 19 which is press-fitted into the terminal press-fitting hole 20 of the first layer bus bar 16 ₁ as shown in FIG. Then, the tip portion 19a protruding from the hole 20 is the upper case 1
It is accommodated and positioned in a relief groove 21 that is recessed in the inner surface of 1. It is preferable that a vertical slit 19b is formed in the interlayer connection terminal 19 so as to have appropriate elasticity so that the terminal press-fitting hole 20 can be contacted.

Contrary to the above, the third and fourth bus bars below the central partition plate 14 have 16 ₃ and 16 ₄ downward facing external connection terminals 17 ′,
The terminal 17 'penetrates the terminal insertion hole 18 and the connector insertion portion 1
It projects to 2 '. Further, another third layer bus bar 16 ₃ ′ has a downward facing interlayer connection terminal 19 ′, and the terminal 19 ′ is vertically inverted from the terminal 19 and is interlayer connected to the fourth layer bus bar 16 ₄ .

As described above, with the central partition plate 14 as a boundary, the busbars 16 ₁ , 16 _{2 in the} upper layer all have the external connection terminals 17 or the interlayer connection terminals 19 facing upward, and the busbars 16 ₃ , 16 _{4 in the} lower layer 16 ₃ . Has a downward facing terminal 17 'or 19'.

Therefore, as shown in FIG. 3, a busbar wiring board A composed of a first-layer insulating plate 13 ₁ and busbars (16 ₁ , 16 ₂ ...) On both front and back surfaces thereof, and a second-layer insulating plate 13 ₂ and front and back surfaces of the same. The busbar wiring board A'consisting of the busbars 16 ₃ , 16 _{4 on} both sides can be assembled in different steps and then laminated with the central partition plate 14 interposed therebetween.

As a result, the laminated structure is also divided and simplified, the assembling is easy, and the workability is improved.

Further, as shown in the present embodiment, the circuit capacitance of the laminated bus bar wiring board is different from that of the first and second layer insulating boards 13 ₁ and 13 ₂ and the first to fourth layer bus bars.
16 ₁ , 16 _{2 to} 16 ₄ …, if it is enough, terminal 1 for interlayer connection
Relief grooves 21 for 9,19 ′ are upper and lower cases 11,1
The insulating plates 13 ₁ and 13 ₂ (and the central partition plate) can be thinned by providing them on the inner surface of 1 '. As a result, the rising height of the external connection terminals 17 and 17 'and the interlayer connection terminals 19 and 19' can be reduced, and the bus bar punching yield and wiring density are improved.

The above effect is the same when the number of busbar wiring boards stacked is further increased, and the central partition plate 14 may be interposed between the appropriate intermediate layers.

The central partition plate 14 can be regarded as an insulating plate for disposing the second-layer bus bars 16 ₂ , 16 ₂ ′ and the third-layer bus bars 16 ₃ , 16 ₃ ′ as shown in FIG. Therefore, the central partition
14 can also be used as an insulating plate, and the point is that the upper and lower layers should be used as a boundary so that the rising directions of the external connection terminals 17 (17 ') and interlayer insulation terminals 19 (19') are aligned. Good.

〔The invention's effect〕

In the laminated bus bar wiring board according to the present invention, a central partition plate is interposed in the middle of the bus bar wiring boards of a plurality of layers, and the rising direction of the external connection terminals and the interlayer connection terminals which are vertically coupled to the bus bar above and below the central partition board is one direction. As a result, the laminated structure is simplified, the assembly is easy and the workability is improved.

Further, since the busbars are connected between the upper and lower parts of the central partition plate, the busbars can be connected to each other at an upper and lower positions, so that the punching yield and the arrangement density of the busbars can be improved.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a main part of a laminated bus bar wiring board showing an embodiment of the present invention, FIG. 2 is a perspective view showing a press-fit connection structure of an interlayer connecting terminal and a bus bar, and FIG. 3 is FIG. FIG. 4 is an explanatory view showing a stacking and assembling process of the laminated bus bar wiring board of FIG. 4, FIG. 4 is a sectional view of a main portion of a conventional laminated bus bar wiring board, and FIG. 5 is an exploded perspective view of a main portion showing the interlayer connection structure of FIG. . 11, 11 '... upper, lower case, 12, 12' ... connector insertion portion, 13 _1, 13 ₂ ... first layer, the second layer insulating plate, 14 ... center dividers, 16 _1, 16 ₂ , 16 ₃ , 16 ₄ ...... 1st, 2nd, 3rd, 4th layer busbar, 17,17 '...... External connection terminal, 18 ...... Terminal insertion hole, 19,19' ...... For interlayer connection Terminal, 20 ... Terminal press-fitting hole, 2
1 ... Escape groove.

Claims (2)

[Claims] 1. A busbar wiring board comprising a plurality of busbars having a desired circuit pattern and an insulating plate is laminated in a plurality of layers, and the busbar wiring boards are housed in a box body composed of an upper case and a lower case, and the busbar faces upward. Alternatively, in a laminated bus bar wiring board formed by downwardly standing externally connected terminals for external connection by penetrating the terminal insertion holes of the insulating plate and the box body, a central partition plate is interposed between the insulating plates of the respective layers. And the external connection terminals of the busbars arranged in the upper layer of the partition plate are erected upwardly, and the external connection terminals of the busbars arranged in the lower layer of the partition plate are erected downwardly. A part of the upward and downward external connection terminals is formed short as an inter-layer connection terminal, and the inter-layer connection terminal is press-fitted and connected to a terminal press-fitting hole provided in a bus bar of an upper layer or a lower layer of the layer indirect connection. Laminated bus bar wiring board, characterized in that to carry out the. 2. An upper case or a lower case constituting the box body also serves as an outermost insulating plate of the laminated bus bar wiring board, and an escape groove for an inter-layer connection terminal is formed on an inner surface of the upper case or the lower case. The laminated bus bar wiring board according to claim (1).