JPH0760938B2 - Method for manufacturing multilayer printed wiring board - Google Patents
Method for manufacturing multilayer printed wiring boardInfo
- Publication number
- JPH0760938B2 JPH0760938B2 JP2382993A JP2382993A JPH0760938B2 JP H0760938 B2 JPH0760938 B2 JP H0760938B2 JP 2382993 A JP2382993 A JP 2382993A JP 2382993 A JP2382993 A JP 2382993A JP H0760938 B2 JPH0760938 B2 JP H0760938B2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- double
- wiring board
- paste
- sided
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title description 13
- 238000004519 manufacturing process Methods 0.000 title description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 35
- 229910052802 copper Inorganic materials 0.000 claims description 35
- 239000010949 copper Substances 0.000 claims description 35
- 229920001187 thermosetting polymer Polymers 0.000 claims description 32
- 229920005992 thermoplastic resin Polymers 0.000 claims description 27
- 229920005989 resin Polymers 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 17
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 4
- 238000004080 punching Methods 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims 2
- 239000010410 layer Substances 0.000 description 20
- 229910000679 solder Inorganic materials 0.000 description 11
- 238000000465 moulding Methods 0.000 description 7
- 238000007650 screen-printing Methods 0.000 description 7
- 239000012790 adhesive layer Substances 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 239000006071 cream Substances 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 238000005553 drilling Methods 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は多層プリント配線板の製
造方法に関し、特に銅ペーストを層間の接続に用いた多
層プリント配線板の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer printed wiring board, and more particularly to a method for manufacturing a multilayer printed wiring board using a copper paste for connecting layers.
【０００２】[0002]
【従来の技術】図４（ａ），（ｂ）は従来の多層プリン
ト配線板の製造方法の一例を説明する工程順に示した断
面図である。従来の多層プリント配線板の製造方法は、
まず、図４（ａ）に示すように、選択的にスルーホール
１を形成した２枚の両面プリント配線板２の各々の対抗
する接続部にクリームはんだを印刷し、はんだリフロー
によりはんだバンプ１３を形成する。次に、各々の両面
プリント配線板２の対向する面のはんだバンプ１３以外
の全面にスクリーン印刷により絶縁樹脂層１４を形成
し、半硬化状態にしておく。2. Description of the Related Art FIGS. 4 (a) and 4 (b) are sectional views showing a sequence of steps for explaining an example of a conventional method for manufacturing a multilayer printed wiring board. The conventional method for manufacturing a multilayer printed wiring board is
First, as shown in FIG. 4 (a), cream solder is printed on the opposing connection portions of each of the two double-sided printed wiring boards 2 on which the through holes 1 are selectively formed, and solder bumps 13 are formed by solder reflow. Form. Next, the insulating resin layer 14 is formed by screen printing on the entire surface of each double-sided printed wiring board 2 except the solder bumps 13 on the opposite surface, and is left in a semi-cured state.
【０００３】次に、図４（ｂ）に示すように、このよう
にして得られた両面プリント配線板２をはんだバンプ１
３同志が向かい合うように組み合わせ成型治具板などで
挟み込み、加熱加圧成型を行う。この時、対向するはん
だバンプ１３は押しつぶされながら溶融しはんだバンプ
接合部１５が得られる。その後、絶縁樹脂層１４を溶融
密着させ硬化することにより、絶縁接着層１６を形成
し、貫通スルーホールの加工に伴うスメア不良やウエッ
ト処理時のしみこみによる内層導体の酸化などの悪影響
のない多層プリント配線板を得ていた。Next, as shown in FIG. 4 (b), the double-sided printed wiring board 2 thus obtained is connected to the solder bumps 1.
3 Insert the combination molding jig plates so that they face each other, and heat and press mold. At this time, the solder bumps 13 facing each other are melted while being crushed, and the solder bump joints 15 are obtained. After that, the insulating resin layer 14 is melted and adhered and cured to form an insulating adhesive layer 16, and a multilayer printing without adverse effects such as smear defects associated with processing of through-holes and oxidation of inner layer conductors due to infiltration during wet processing. I was getting a wiring board.
【０００４】[0004]
【発明が解決しようとする課題】この従来の多層プリン
ト配線板の製造方法では、板圧が０．１ｍｍのような薄
い両面プリント配線板にクリームはんだや絶縁樹脂層を
スクリーン印刷法で形成する場合、取り扱いが困難であ
るという問題点を有している上に、さらに絶縁樹脂接着
層の厚みの制御が困難であり、とくに０．２ｍｍ以上の
厚膜化は、スクリーン印刷を複数回繰り返す必要があり
工程が煩雑化するという欠点があった。In this conventional method for manufacturing a multilayer printed wiring board, when a cream solder or an insulating resin layer is formed by a screen printing method on a thin double-sided printed wiring board having a board pressure of 0.1 mm. However, in addition to the problem that it is difficult to handle, it is also difficult to control the thickness of the insulating resin adhesive layer, and in particular, in order to increase the thickness to 0.2 mm or more, it is necessary to repeat screen printing a plurality of times. There was a drawback that the process was complicated.
【０００５】本発明の目的は、板厚の薄い両面プリント
配線板の取扱が容易で、さらに絶縁樹脂接着層の厚みの
制御が可能で厚膜化が容易な多層プリント配線板の製造
方法を提供することにある。An object of the present invention is to provide a method for manufacturing a multilayer printed wiring board, which allows easy handling of a double-sided printed wiring board having a small board thickness, allows control of the thickness of an insulating resin adhesive layer, and facilitates thickening. To do.
【０００６】[0006]
【課題を解決するための手段】本発明の多層プリント配
線板の製造方法は、 （１）スルーホールを有する両面プリント配線板を形成
し該両面プリント配線板の内層となるパッドの接続部に
熱硬化性銅ペーストを塗布してペースト付両面板を作成
する工程と、熱可塑性絶縁樹脂板の前記熱硬化性銅ペー
ストと対応する位置に貫通孔を穿孔して穴あき熱可塑性
樹脂板を作成する工程と、一対の前記ペースト付両面板
にて前記穴あき熱可塑性樹脂板を前記熱硬化性銅ペース
トが前記貫通孔を介して向い合うように位置合わせして
組み立て加熱加圧して積層成型する工程とを含む。The method for manufacturing a multilayer printed wiring board according to the present invention comprises: (1) forming a double-sided printed wiring board having through holes, and applying heat to a pad connecting portion which is an inner layer of the double-sided printed wiring board. A step of applying a curable copper paste to form a double-sided board with a paste, and forming a perforated thermoplastic resin plate by punching through holes at positions corresponding to the thermosetting copper paste of the thermoplastic insulating resin plate Step, and step of assembling the perforated thermoplastic resin plate with a pair of the double-sided plate with the paste so that the thermosetting copper paste faces through the through hole, and assemble by heating, pressing and laminating Including and
【０００７】（２）スルーホールを有する両面プリント
配線板を形成し該両面プリント配線板の内層となるパッ
ドの接続部に熱硬化性銅ペーストを塗布してペースト付
両面板を作成する工程と、熱可塑性絶縁樹脂板の前記熱
硬化性銅ペーストと対応する位置に貫通孔を穿孔して穴
あき熱可塑性樹脂板を形成し前記貫通孔の周囲の一方の
面に前記熱硬化性銅ペーストを塗布してペースト付き熱
可塑性樹脂板を作成する工程と、スルーホールを回路形
成してフレキシブル両面プリント配線板を作成する工程
と、該フレキシブル両面プリント配線板の両面に前記ペ
ースト付熱可塑性樹脂板と前記ペースト付両面板とをそ
れぞれ前記スルーホールと前記熱硬化性銅ペーストと
を、さらに前記貫通孔と前記熱硬化性銅ペーストとを位
置合わせして組み立て加熱加圧して積層成型する工程と
を含む。(2) a step of forming a double-sided printed wiring board having a through hole and applying a thermosetting copper paste to a connection portion of a pad which is an inner layer of the double-sided printed wiring board to form a double-sided board with paste; A through hole is formed at a position corresponding to the thermosetting copper paste of the thermoplastic insulating resin plate to form a holed thermoplastic resin plate, and the thermosetting copper paste is applied to one surface around the through hole. To form a thermoplastic resin plate with a paste, a step of forming a circuit for a through hole to form a flexible double-sided printed wiring board, and the thermoplastic resin plate with a paste and the above-mentioned thermoplastic resin plate on both sides of the flexible double-sided printed wiring board. The double-sided plate with paste is assembled by aligning the through hole and the thermosetting copper paste, respectively, and further aligning the through hole and the thermosetting copper paste. And a step of laminating molding by heating and pressing.
【０００８】[0008]
【実施例】次に、本発明の実施例について図面を参照し
て説明する。Embodiments of the present invention will now be described with reference to the drawings.
【０００９】図１（ａ）〜（ｄ）は本発明の第１の実施
例を説明する工程順に示した断面図である。第１の実施
例は、まず、図１（ａ）に示すように、所定の位置に直
径が０．１〜１．０ｍｍのスルーホール１を形成した板
厚が０．０５〜１．０ｍｍの両面プリント配線板２のパ
ッド３上の接続部に選択的に熱硬化性銅ペースト４をス
クリーン印刷法にて１００μｍの厚みに印刷し、一対の
ペースト付両面板５を作成する。一方、図１（ｂ）に示
すように、厚みが０．１ｍｍの熱可塑性樹脂板のペース
ト付両面板５の熱硬化性銅ペースト４と対応する位置に
選択的に直径が０．１５ｍｍの貫通孔をドリリング，パ
ンチングまたはレーザー光照射等を用いて穿孔し穴あき
熱可塑性樹脂板６を作成する。尚、両面プリント配線板
２及び熱可塑性樹脂板の材質としては、エポキシ樹脂，
ポリイミド樹脂，テフロン系の樹脂等を用いることが出
来る。FIGS. 1A to 1D are sectional views showing the first embodiment of the present invention in the order of steps. In the first embodiment, first, as shown in FIG. 1A, a through hole 1 having a diameter of 0.1 to 1.0 mm is formed at a predetermined position and the plate thickness is 0.05 to 1.0 mm. A thermosetting copper paste 4 is selectively printed on the connection portion on the pad 3 of the double-sided printed wiring board 2 to a thickness of 100 μm by a screen printing method to form a pair of double-sided boards 5 with paste. On the other hand, as shown in FIG. 1B, a 0.15 mm diameter through hole is selectively formed at a position corresponding to the thermosetting copper paste 4 on the paste-coated double-sided plate 5 of a thermoplastic resin plate having a thickness of 0.1 mm. The holes are drilled using drilling, punching, laser light irradiation, or the like to form the perforated thermoplastic resin plate 6. The materials for the double-sided printed wiring board 2 and the thermoplastic resin board are epoxy resin,
Polyimide resin, Teflon-based resin or the like can be used.
【００１０】次に、このようにして得られた一対のペー
スト付両面板５と穴あき熱可塑性樹脂板６とを図１
（ｃ）に示すように熱硬化性銅ペースト４が穴あき熱可
塑性樹脂板６の貫通孔を介して向かい合うように配置し
て成型治具板等で挟み込み、温度１７０℃，加圧力２５
ｋｇｆ／ｃｍ2 で加熱加圧成型を行う。この時、図１
（ｄ）に示すように、熱硬化性銅ペースト４が熱溶融し
対向する熱硬化性銅ペースト４同志が接合し、その後熱
硬化することにより銅ペースト接合部７が形成される。
同時に、穴あき熱可塑性樹脂板６が熱溶融して両面プリ
ント配線板２に密着した後常温まで冷却することにより
絶縁樹脂層８を形成し、貫通スルーホールの無い多層プ
リント配線板であるスルーホール無し４層板９を得るこ
とが出来る。Next, the pair of paste-coated double-sided plates 5 and the perforated thermoplastic resin plate 6 thus obtained are shown in FIG.
As shown in (c), the thermosetting copper pastes 4 are arranged so as to face each other through the through holes of the perforated thermoplastic resin plate 6 and sandwiched by a molding jig plate or the like, and the temperature is 170 ° C. and the pressing force is 25.
Heat press molding is performed at kgf / cm 2 . At this time,
As shown in (d), the thermosetting copper paste 4 is melted by heat, the opposing thermosetting copper pastes 4 are joined together, and then they are thermoset, whereby the copper paste joint portion 7 is formed.
At the same time, the perforated thermoplastic resin plate 6 is melted by heat and adheres to the double-sided printed wiring board 2 and then cooled to room temperature to form an insulating resin layer 8 to form a through hole which is a multilayer printed wiring board without through holes. It is possible to obtain the four-layer plate 9 without the above.
【００１１】図２（ａ）〜（ｃ）及び図３（ａ），
（ｂ）は本発明の第２の実施例を説明する工程順に示し
た断面図である。第２の実施例は、まず、図２（ａ）に
示すように、所定の位置に直径が０．１〜１．０ｍｍの
スルーホール１を形成した板厚が０．０５〜１．０ｍｍ
の両面プリント配線板２のパッド３上の接続部に選択的
に熱硬化性銅ペースト４をスクリーン印刷法にて１００
μｍの厚みに印刷し、一対のペースト付両面板５を作成
する。一方、図２（ｂ）に示すように、厚みが０．１ｍ
ｍの熱可塑性樹脂板のペースト付両面板５の熱硬化性銅
ペースト４と対応する位置に選択的に直径が０．１５ｍ
ｍの貫通孔をドリリング，パンチングまたはレーザ光照
射等を用いて穿孔し穴あき熱可塑性樹脂板６を形成し、
貫通孔の周囲に熱硬化性銅ペースト４をスクリン印刷法
にて１００μｍの厚みに印刷し、一対のペースト付熱可
塑性樹脂板１０を作成する。さらに、図２（ｃ）に示す
ように、スルーホール１を回路形成してフレキシブル両
面プリント配線板１１を作成する。2 (a)-(c) and FIG. 3 (a),
(B) is sectional drawing shown in order of a process explaining the 2nd Example of this invention. In the second embodiment, first, as shown in FIG. 2A, the through hole 1 having a diameter of 0.1 to 1.0 mm is formed at a predetermined position and the plate thickness is 0.05 to 1.0 mm.
100% of the thermosetting copper paste 4 is selectively applied to the connection portion on the pad 3 of the double-sided printed wiring board 2 by the screen printing method.
Printing is performed to a thickness of μm, and a pair of double-sided plates with paste 5 is created. On the other hand, as shown in FIG. 2B, the thickness is 0.1 m.
m of thermoplastic resin plate with a diameter of 0.15 m selectively at a position corresponding to the thermosetting copper paste 4 of the double-sided plate 5 with a paste.
The through hole of m is drilled by using drilling, punching or laser light irradiation to form a perforated thermoplastic resin plate 6,
A thermosetting copper paste 4 is printed around the through holes by a screen printing method to a thickness of 100 μm to form a pair of paste-added thermoplastic resin plates 10. Further, as shown in FIG. 2C, a circuit is formed in the through hole 1 to form a flexible double-sided printed wiring board 11.
【００１２】次に、このようにして得られた一対のペー
スト付熱可塑性樹脂板１０とフレキシブル両面プリント
配線板１１とを図３（ａ）に示すように熱硬化性銅ペー
スト４がスルーホール１の周囲を囲むように、さらにペ
ースト付熱可塑性樹脂板１０の貫通孔と熱硬化性銅ペー
スト４とを位置合わせし一対のペースト付両面板を最外
層に配置して成型治具板等で挟み込み、温度１７０℃，
加圧力２５ｋｇｆ／ｃｍ2 で加熱加圧成型を行う。この
時、図３（ｂ）に示すように、熱硬化性銅ペースト４が
熱溶融し各々の対向する熱硬化性銅ペースト４同志が接
合し、その後熱硬化することにより銅ペースト接合部が
形成される。同時に、穴あき熱可塑樹脂板６が熱溶融し
て両面プリント配線板２とフレキシブル両面プリント配
線板１１に密着した後常温まで冷却することにより絶縁
樹脂層８を形成し、貫通スルーホールの無い多層プリン
ト配線板であるスルーホール無し６層板１２を得ること
が出来る。Next, as shown in FIG. 3 (a), the thermosetting copper paste 4 is applied to the through hole 1 of the thermoplastic resin plate 10 with a paste and the flexible double-sided printed wiring board 11 thus obtained. Further, the through holes of the thermoplastic resin plate with paste 10 and the thermosetting copper paste 4 are aligned so as to surround the periphery of, and a pair of double-sided plates with paste are arranged in the outermost layer and sandwiched by a molding jig plate or the like. , Temperature 170 ℃,
Heat press molding is performed with a pressing force of 25 kgf / cm 2 . At this time, as shown in FIG. 3 (b), the thermosetting copper paste 4 is melted by heat and the opposing thermosetting copper pastes 4 are joined to each other, and then thermoset to form a copper paste joint portion. To be done. At the same time, the perforated thermoplastic resin plate 6 is melted by heat and adheres to the double-sided printed wiring board 2 and the flexible double-sided printed wiring board 11 and then cooled to room temperature to form the insulating resin layer 8 to form a multi-layer without through-holes. It is possible to obtain a 6-layer board 12 having no through holes which is a printed wiring board.
【００１３】[0013]
【発明の効果】以上説明したように本発明は、一対の両
面プリント配線板の接続部となるパッド上に熱硬化性銅
ペーストを塗布し、熱硬化性銅ペーストと対応する位置
に貫通孔を有する穴あき熱可塑性樹脂板を挟むように配
置して加熱加圧成型することにより、クリームはんだや
絶縁樹脂層をスクリーン印刷法で形成する必要が無くな
るので、板厚が０．１ｍｍのような薄い両面プリント配
線板の取扱いが容易となる効果がある。As described above, according to the present invention, the thermosetting copper paste is applied onto the pads which are the connecting portions of the pair of double-sided printed wiring boards, and the through holes are formed at the positions corresponding to the thermosetting copper paste. By arranging the perforated thermoplastic resin plate so as to sandwich it and performing heat pressure molding, it is not necessary to form the cream solder or the insulating resin layer by the screen printing method, so the plate thickness is as thin as 0.1 mm. There is an effect that the double-sided printed wiring board can be easily handled.
【００１４】又、絶縁樹脂接着層の厚みの制御は、使用
する熱可塑性樹脂板の厚みの制御が容易であるので、
０．２ｍｍ以上の厚板化が容易となる効果もある。Further, the thickness of the insulating resin adhesive layer can be easily controlled because the thickness of the thermoplastic resin plate used can be easily controlled.
There is also an effect that it becomes easy to make a thick plate of 0.2 mm or more.
【００１５】さらに、絶縁樹脂層の両面印刷が不要とな
り、フレキシブル両面プリント配線板等を用いた６層以
上の多層プリント配線板が容易に得られるという効果が
ある。Further, there is an effect that double-sided printing of the insulating resin layer is not necessary, and a multilayer printed wiring board having six or more layers using a flexible double-sided printed wiring board or the like can be easily obtained.
【図１】（ａ）〜（ｄ）は本発明の第１の実施例を説明
する工程順に示した断面図である。FIG. 1A to FIG. 1D are cross-sectional views showing a process sequence for explaining a first embodiment of the present invention.
【図２】（ａ）〜（ｃ）は本発明の第２の実施例を説明
する工程順に示した断面図である。2 (a) to 2 (c) are sectional views showing a second embodiment of the present invention in the order of steps.
【図３】（ａ），（ｂ）は本発明の第２の実施例を説明
する工程順に示した断面図である。3A and 3B are cross-sectional views showing a second embodiment of the present invention in the order of steps.
【図４】（ａ），（ｂ）は従来の多層プリント配線板の
製造方法の一例を説明する工程順に示した断面図であ
る。4 (a) and 4 (b) are cross-sectional views showing a sequence of steps for explaining an example of a conventional method for manufacturing a multilayer printed wiring board.
１ スルーホール ２ 両面プリント配線板 ３ パッド ４ 熱硬化性銅ペースト ５ ペースト付両面板 ６ 穴あき熱可塑性樹脂板 ７ 銅ペースト接合部 ８ 絶縁樹脂層 ９ スルーホール無し４層板 １０ ペースト付熱可塑性樹脂板 １１ フレキシブル両面プリント配線板 １２ スルーホール無し６層板 １３ はんだバンプ １４ 絶縁樹脂層 １５ はんだバンプ接合部 １６ 絶縁接着層 1 Through Hole 2 Double Sided Printed Wiring Board 3 Pad 4 Thermosetting Copper Paste 5 Double Sided Plate with Paste 6 Perforated Thermoplastic Resin Plate 7 Copper Paste Joint 8 Insulating Resin Layer 9 No Through Hole 4 Layer Board 10 Thermoplastic Resin with Paste Board 11 Flexible double-sided printed wiring board 12 6-layer board without through hole 13 Solder bump 14 Insulating resin layer 15 Solder bump joint 16 Insulating adhesive layer
Claims (2)
板を形成し該両面プリント配線板の内層となるパッドの
接続部に熱硬化性銅ペーストを塗布してペースト付両面
板を作成する工程と、熱可塑性絶縁樹脂板の前記熱硬化
性銅ペーストと対応する位置に貫通孔を穿孔して穴あき
熱可塑性樹脂板を作成する工程と、一対の前記ペースト
付両面板にて前記穴あき熱可塑性樹脂板を前記熱硬化性
銅ペーストが前記貫通孔を介して向い合うように位置合
わせして組み立て加熱加圧して積層成型する工程とを含
むことを特徴とする多層プリント配線の製造方法。1. A step of forming a double-sided printed wiring board having a through hole and applying a thermosetting copper paste to a connection portion of a pad which is an inner layer of the double-sided printed wiring board to prepare a double-sided board with paste, A step of forming a perforated thermoplastic resin plate by punching through holes at positions corresponding to the thermosetting copper paste of the plastic insulating resin plate, and the perforated thermoplastic resin plate with a pair of the double-sided plates with paste. A step of aligning the thermosetting copper paste so as to face each other through the through hole, assembling, heating, pressurizing, and laminating to form a multilayer printed wiring board.
板を形成し該両面プリント配線板の内層となるパッドの
接続部に熱硬化性銅ペーストを塗布してペースト付両面
板を作成する工程と、熱可塑性絶縁樹脂板の前記熱硬化
性銅ペーストと対応する位置に貫通孔を穿孔して穴あき
熱可塑性樹脂板を形成し前記貫通孔の周囲の一方の面に
前記熱硬化性銅ペーストを塗布してペースト付き熱可塑
性樹脂板を作成する工程と、スルーホールを回路形成し
てフレキシブル両面プリント配線板を作成する工程と、
該フレキシブル両面プリント配線板の両面に前記ペース
ト付熱可塑性樹脂板と前記ペースト付両面板とをそれぞ
れ前記スルーホールと前記熱硬化性銅ペーストとを、さ
らに前記貫通孔と前記熱硬化性銅ペーストとを位置合わ
せして組み立て加熱加圧して積層成型する工程とを含む
ことを特徴とする多層プリント配線板の製造方法。2. A step of forming a double-sided printed wiring board having a through hole, applying a thermosetting copper paste to a connecting portion of a pad which is an inner layer of the double-sided printed wiring board to form a double-sided board with a paste, A through hole is punched at a position corresponding to the thermosetting copper paste of the plastic insulating resin plate to form a holed thermoplastic resin plate, and the thermosetting copper paste is applied to one surface around the through hole. A step of creating a thermoplastic resin board with paste, and a step of forming a circuit for through holes to create a flexible double-sided printed wiring board,
The thermoplastic resin board with paste and the double-sided board with paste are provided on both sides of the flexible double-sided printed wiring board, the through-hole and the thermosetting copper paste, respectively, and the through-hole and the thermosetting copper paste. A step of aligning, assembling, heating, pressurizing, and laminating to form a multilayer printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2382993A JPH0760938B2 (en) | 1993-02-12 | 1993-02-12 | Method for manufacturing multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2382993A JPH0760938B2 (en) | 1993-02-12 | 1993-02-12 | Method for manufacturing multilayer printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06237083A JPH06237083A (en) | 1994-08-23 |
| JPH0760938B2 true JPH0760938B2 (en) | 1995-06-28 |
Family
ID=12121272
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2382993A Expired - Fee Related JPH0760938B2 (en) | 1993-02-12 | 1993-02-12 | Method for manufacturing multilayer printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0760938B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100448685B1 (en) * | 2002-06-28 | 2004-09-13 | 주식회사 코스모텍 | method for manufacturing build-up multi-layer printed circuit board |
| JP4968616B2 (en) * | 2005-04-21 | 2012-07-04 | 住友電気工業株式会社 | Manufacturing method of multilayer printed wiring board |
-
1993
- 1993-02-12 JP JP2382993A patent/JPH0760938B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06237083A (en) | 1994-08-23 |
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