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JPH0763668B2 - Coating device - Google Patents
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JPH0763668B2 - Coating device - Google Patents

Coating device

Info

Publication number
JPH0763668B2
JPH0763668B2 JP2091684A JP9168490A JPH0763668B2 JP H0763668 B2 JPH0763668 B2 JP H0763668B2 JP 2091684 A JP2091684 A JP 2091684A JP 9168490 A JP9168490 A JP 9168490A JP H0763668 B2 JPH0763668 B2 JP H0763668B2
Authority
JP
Japan
Prior art keywords
cup
lid
plate
coating
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2091684A
Other languages
Japanese (ja)
Other versions
JPH03293055A (en
Inventor
宏仁 佐合
勝彦 工藤
宗雄 中山
道夫 橋本
和志 川上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Tazmo Co Ltd
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Tazmo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd, Tazmo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Priority to JP2091684A priority Critical patent/JPH0763668B2/en
Publication of JPH03293055A publication Critical patent/JPH03293055A/en
Publication of JPH0763668B2 publication Critical patent/JPH0763668B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Liquid Crystal (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は液晶ディスプレイ(LCD)の製造工程等に用い
る塗布装置に関する。
TECHNICAL FIELD The present invention relates to a coating device used in a manufacturing process of a liquid crystal display (LCD) or the like.

(従来の技術) ブラウン管(CRT)に代わる表示装置として液晶ディス
プレイが注目されている。
(Prior Art) A liquid crystal display is receiving attention as a display device that replaces a cathode ray tube (CRT).

液晶ディスプレイは表面に画素を構成する電極や素子を
形成した2枚のガラス基板の間に液晶を注入した構造と
なっている。そして各画素を薄膜トランジスタ(TFT)
や金属/絶縁体/金属接合(MIM)などの素子で駆動せ
しめるアクティブマトリクス方式が高画質の画面が得ら
れるため主流になりつつある。
A liquid crystal display has a structure in which liquid crystal is injected between two glass substrates having electrodes and elements forming pixels on the surface. And each pixel is a thin film transistor (TFT)
Active matrix systems that can be driven by elements such as metal and insulator / metal junction (MIM) are becoming mainstream because they can provide high-quality images.

そして、上記の薄膜トランジスタをガラス基板上に形成
する技術はシリコンウェハ等に集積回路を形成する半導
体製造技術をそのまま応用している。レジスト液の塗布
も一連の工程のうちの一つであり、この工程ではカップ
内にガラス基板をセットして、ガラス基板上にレジスト
液を滴下し、次いでカップを回転せしめ遠心力によって
ガラス基板表面にレジスト液を均一に塗布するようにし
ている。
The technique for forming the thin film transistor on the glass substrate is directly applied to the semiconductor manufacturing technique for forming an integrated circuit on a silicon wafer or the like. Applying the resist solution is also one of a series of steps. In this step, the glass substrate is set in the cup, the resist solution is dropped on the glass substrate, and then the cup is rotated and centrifugal force is applied to the surface of the glass substrate. The resist solution is evenly applied to.

(発明が解決しようとする課題) 上述したレジスト液の塗布において、カップを回転せし
める際にはカップ上面を蓋体によって閉塞しレジスト液
のカップ外への飛散を防止した状態で行なっている。ま
たカップの下部側壁にはドレインパイプを取り付け、回
転中にカップ側壁に付着したレジスト液をカップ外に排
出するようにしている。
(Problems to be Solved by the Invention) In the application of the resist solution described above, when the cup is rotated, the upper surface of the cup is closed with a lid to prevent the resist solution from scattering outside the cup. Further, a drain pipe is attached to the lower side wall of the cup so that the resist solution adhering to the side wall of the cup is discharged to the outside of the cup during rotation.

このように、カップ側壁にドレインパイプを取り付ける
と回転に伴う遠心力によりカップ内の空気或いはガスが
ドレインパイプを通って排出されカップ内が減圧状態と
なる。そしてレジスト液の塗布が終了し減圧状態で蓋体
を外してガラス基板をカップから取り出そうとすると、
内部が減圧状態のため急激にカップ内に空気が流入し、
乾燥して固化したレジストの微細粉がガラス基板表面に
付着する不利がある。これを解消すべく蓋体にガラス導
入ノズルを取り付けることも考えられるが、カップ内に
ノズルを臨ませるとこのノズルによって乱流が生じ且つ
ノズルから噴出するガスによってガラス基板上に塗布し
たレジスト液の厚みが部分的に異なることになる。
As described above, when the drain pipe is attached to the side wall of the cup, air or gas in the cup is discharged through the drain pipe due to the centrifugal force caused by the rotation, and the inside of the cup is in a reduced pressure state. Then, when application of the resist solution is completed and the glass substrate is taken out from the cup by removing the lid under reduced pressure,
Since the inside is depressurized, air suddenly flows into the cup,
There is a disadvantage that fine powder of the resist that is dried and solidified adheres to the surface of the glass substrate. It is possible to attach a glass introduction nozzle to the lid to eliminate this, but when the nozzle faces the cup, a turbulent flow is generated by this nozzle and the gas ejected from the nozzle causes the resist liquid applied on the glass substrate to flow. The thickness will be partially different.

特に液晶ディスプレイの製造にあってはガラス基板上に
多数のトランジスタを埋め込む(1平方センチ当たり50
個以上)こととなり、このうちの1個のトランジスタが
不良でも基板全体が不良品ということになる。これがア
クティブマトリクス方式の液晶ディスプレイの製造とLS
Iなどの半導体の製造との歩留まりの面における決定的
な差となっている。
Especially in the manufacture of liquid crystal displays, many transistors are embedded on the glass substrate (50 per square centimeter).
Even if one of the transistors is defective, the entire substrate is defective. This is the manufacturing of active matrix liquid crystal displays and LS
It is a decisive difference in the yield from the manufacturing of semiconductors such as I.

(課題を解決するための手段) 上記課題を解決すべく本発明は、カップ(23)の内部と
外部をドレン孔(25)で連通し、カップ(23)内にセッ
トした板状被処理物(W)の表面に塗布液を滴下し、次
いでカップ(23)上面を蓋体(28)で閉塞してカップ
(23)を回転することで板状被処理物(W)の表面に滴
下した塗布液を均一に拡散せしめるようにした塗布装置
において、前記蓋体(28)の下面にはカップ(23)内に
入り込む寸法の整流板(36)を所定間隔離して取り付
け、この整流板(36)と前記蓋体(28)との間の空間に
ガス導入ノズル(33)を開口せしめたことを特徴とす
る。
(Means for Solving the Problems) In order to solve the above problems, the present invention relates to a plate-like object to be processed which is set in the cup (23) by communicating the inside and the outside of the cup (23) with a drain hole (25). The coating liquid was dropped on the surface of (W), and then the upper surface of the cup (23) was closed with a lid (28) and the cup (23) was rotated to be dropped on the surface of the plate-shaped object (W). In a coating device configured to evenly diffuse a coating liquid, a rectifying plate (36) having a size to be inserted into the cup (23) is attached to the lower surface of the lid (28) at a predetermined interval, and the rectifying plate (36 ) And the lid (28), the gas introduction nozzle (33) is opened.

(作用) カップ内にガラス基板等の板状被処理物をセットし、こ
の板状被処理物の表面に塗布液を滴下し、次いでカップ
上面を蓋体で閉塞してカップを回転することで板状被処
理物の表面に滴下した塗布液を均一に拡散せしめた後、
蓋体に取り付けたガス導入ノズルからカップ内にガスを
導入しカップ内の減圧状態を解除してから蓋体を開けて
被処理物を取り出す。
(Function) By setting a plate-shaped object to be processed such as a glass substrate in the cup, dropping the coating liquid on the surface of the plate-shaped object, then closing the upper surface of the cup with a lid and rotating the cup. After uniformly spreading the coating liquid dropped on the surface of the plate-shaped object,
Gas is introduced into the cup from a gas introduction nozzle attached to the lid to release the depressurized state in the cup, and then the lid is opened to take out the object to be treated.

(実施例) 以下に本発明の実施例を添付図面に基づいて説明する。(Example) Below, the Example of this invention is described based on an accompanying drawing.

第1図は本発明に係る塗布装置を組み込んだ被膜形成ラ
インの平面図、第2図は同塗布装置の蓋体を上げた状態
の断面図、第3図は同塗布装置の蓋体を閉じた状態の断
面図であり、被膜形成ラインは最上流部(第1図におい
て左端)にガラス基板等の板状被処理物Wの投入部1を
設け、この投入部1の下流側に本発明に係る塗布装置2
を配置し、この塗布装置2の下流側に順次、減圧乾燥装
置3、被処理物Wの裏面洗浄装置4及びホットプレート
5a…を備えた加熱部5を配置し、投入部1から加熱部5
に至るまでは搬送装置6によって被処理物Wの前後端の
下面を支持した状態で搬送し、加熱部5においては垂直
面内でクランク動をなす搬送装置7により被処理物Wの
下面を支持した状態で各ホットプレート5a上を順次移し
換えるようにしつつ被処理物Wを搬送するようにしてい
る。
FIG. 1 is a plan view of a coating film forming line incorporating the coating apparatus according to the present invention, FIG. 2 is a cross-sectional view of the coating apparatus with its lid raised, and FIG. 3 shows the lid of the coating apparatus closed. FIG. 3 is a cross-sectional view of the state in which the film forming line is provided with a charging part 1 for a plate-shaped object W such as a glass substrate at the most upstream part (left end in FIG. 1), and the present invention is provided downstream of the charging part 1. Coating device 2
Are arranged in this order on the downstream side of the coating device 2, and the reduced-pressure drying device 3, the back surface cleaning device 4 for the workpiece W, and the hot plate are sequentially installed.
The heating unit 5 including 5a ... is disposed, and the charging unit 1 to the heating unit 5 are arranged.
Up to the above, the lower surface of the front and rear ends of the object to be processed W is carried by the carrying device 6, and the lower surface of the object to be processed W is supported by the carrying device 7 that cranks in the vertical plane in the heating section 5. In this state, the workpiece W is transported while being sequentially transferred on each hot plate 5a.

次に塗布装置2の詳細について第2図及び第3図に基づ
いて説明する。
Next, details of the coating device 2 will be described with reference to FIGS. 2 and 3.

塗布装置2はアウターカップ21の内側にスピンナー装置
の軸22に取り付けられたインナーカップ23を配置してい
る。インナーカップ23は上面を開放するとともに中央部
に被処理物Wを吸着固定する真空チャック24を備え、更
にインナーカップ23の側壁下部にはドレインパイプ25を
取り付けている。
The coating device 2 has an inner cup 23 attached to a shaft 22 of a spinner device inside an outer cup 21. The inner cup 23 is provided with a vacuum chuck 24 having an open upper surface and adsorbing and fixing the object W to be processed in the central portion, and further, a drain pipe 25 is attached to a lower portion of a side wall of the inner cup 23.

一方、アウターカップ21及びインナーカップ23の上方に
は第1図に示すようにアーム26、27を配置している。こ
れらアーム26、27は直線動、回転動、上下動或いはこれ
らを合成した動きが可能で互いに干渉しないようになっ
ている。そして、アーム26にはレジスト液等の塗布液を
滴下するノズルを取り付け、アーム27には蓋体28を取り
付けている。
On the other hand, arms 26 and 27 are arranged above the outer cup 21 and the inner cup 23 as shown in FIG. These arms 26, 27 are capable of linear movement, rotation movement, vertical movement, or a combination of these movements so that they do not interfere with each other. A nozzle for dropping a coating liquid such as a resist liquid is attached to the arm 26, and a lid 28 is attached to the arm 27.

蓋体28はアーム27の先端から下方に伸びる軸29にベアリ
ング30及び磁気シール31を介してボス部32を回転自在に
嵌合し、このボス部32に円板状をなすアルミニウム製の
蓋体28を取り付けている。
The lid 28 has a shaft 29 extending downward from the tip of the arm 27, and a boss portion 32 rotatably fitted to the shaft 29 via a bearing 30 and a magnetic seal 31. The disc-shaped aluminum lid body is fitted to the boss portion 32. 28 is attached.

また、前記軸29にはノズル孔33を穿設し、このノズル孔
33をジョイント34を介してチッ素ガスなどの圧気源につ
なげている。
A nozzle hole 33 is formed in the shaft 29, and the nozzle hole 33 is formed.
33 is connected to a pressure source such as nitrogen gas through a joint 34.

一方、蓋体28の下面にはビス35によって整流板36を取り
付けている。この整流板36にプラスチックを用いると静
電気を帯びやすくゴミが付着して好ましくないので、ア
ルミニウム等の金属板を用いるのがよい。また整流板36
の外径寸法はインナーカップ23の内径寸法よりも若干小
径とされ、また蓋体28の下面と整流板36上面との間に形
成される空間に前記ノズル孔33が開口する。
On the other hand, a current plate 36 is attached to the lower surface of the lid 28 with screws 35. It is preferable to use a metal plate such as aluminum because plastic is apt to be charged with static electricity and dust is attached to the rectifying plate 36, which is not preferable. In addition, the straightening plate 36
The outer diameter of the inner cup 23 is slightly smaller than the inner diameter of the inner cup 23, and the nozzle hole 33 is opened in the space formed between the lower surface of the lid 28 and the upper surface of the current plate 36.

以上において、ガラス基板等の被処理物W表面にレジス
ト液を均一に塗布するには、インナーカップ23の上面を
開放して真空チャック24上に固着されている被処理物W
の表面にアーム26に取り付けられているノズルからレジ
スト液を滴下し、次いでアーム26を後退せしめて第2図
に示すようにインナーカップ23上にアーム27を回動させ
て蓋体28を臨ませる。そして第3図に示すように、アー
ム27を下降することで蓋体28によりインナーカップ23の
上面を閉塞したならば、スピンナーによってインナーカ
ップ23を回転せしめ、遠心力によりレジスト液を被処理
物Wの表面に均一に拡散塗布する。
In the above, in order to uniformly apply the resist solution to the surface of the object W to be processed such as a glass substrate, the object W to be processed fixed on the vacuum chuck 24 with the upper surface of the inner cup 23 open.
The resist solution is dripped on the surface of the nozzle from the nozzle attached to the arm 26, and then the arm 26 is retracted to rotate the arm 27 on the inner cup 23 to expose the lid 28 as shown in FIG. . Then, as shown in FIG. 3, when the upper surface of the inner cup 23 is closed by lowering the arm 27 by the lid 28, the inner cup 23 is rotated by a spinner and the resist solution is applied to the object W by centrifugal force. Spread evenly on the surface of.

そして、以上の処理においてインナーカップ23内は減圧
状態になっているので、レジスト液が均一に塗布された
被処理物Wを取り出すには、先ずノズル孔33を介して蓋
体28と整流板36の間の空間にチッ素ガス等を導入する。
すると導入されたガスは整流板26とインナーカップ23と
の間の隙間を通ってインナーカップ内に行き渡り、減圧
状態が解除される。このときノズル孔33からのガスは整
流板36があるため、被処理物W表面のレジスト液に直接
吹き付けられることがない。
In the above process, the inner cup 23 is in a depressurized state, and therefore, in order to take out the object W to which the resist solution is uniformly applied, first, the lid 28 and the current plate 36 are inserted through the nozzle holes 33. Nitrogen gas or the like is introduced into the space between.
Then, the introduced gas passes through the gap between the straightening plate 26 and the inner cup 23 and spreads inside the inner cup, and the depressurized state is released. At this time, the gas from the nozzle holes 33 is not directly sprayed on the resist liquid on the surface of the object to be processed W because of the flow regulating plate 36.

(効果) 以上に説明したように本発明によれば、塗布装置のカッ
プ上面を閉じる蓋体にガス導入ノズルを取り付け、更に
このガス導入ノズルよりも下方位置となるように整流板
を蓋体下面に取り付けたので、カップを回転させた場合
にカップ内に乱流が生じにくく、また塗布完了後にカッ
プ内にガスを導入する際に導入ガスによって塗布された
液体に悪影響を及ぼすことがない。
(Effect) As described above, according to the present invention, the gas introducing nozzle is attached to the lid that closes the cup upper surface of the coating device, and the straightening plate is provided on the lower surface of the lid so as to be located below the gas introducing nozzle. Since the turbulent flow is unlikely to occur in the cup when the cup is rotated, and when the gas is introduced into the cup after the completion of coating, the introduced gas does not adversely affect the applied liquid.

【図面の簡単な説明】[Brief description of drawings]

第1図は本発明に係る塗布装置を組み込んだ被膜形成ラ
インの平面図、第2図は同塗布装置の蓋体を上げた状態
の断面図、第3図は同塗布装置の蓋体を閉じた状態の断
面図である。 尚、図面中1は板状被処理物の投入部、2は塗布装置、
21はアウターカップ、23はインナーカップ、28は蓋体、
33はノズル孔、36は整流板、Wは板状被処理物である。
FIG. 1 is a plan view of a coating film forming line incorporating the coating apparatus according to the present invention, FIG. 2 is a cross-sectional view of the coating apparatus with its lid raised, and FIG. 3 shows the lid of the coating apparatus closed. It is a sectional view of the state where it was opened. In the drawing, 1 is a loading portion of the plate-like object to be treated, 2 is a coating device,
21 is an outer cup, 23 is an inner cup, 28 is a lid,
33 is a nozzle hole, 36 is a straightening plate, and W is a plate-shaped object to be processed.

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 FI 技術表示箇所 H01L 21/027 (72)発明者 橋本 道夫 岡山県後月郡芳井町種646 (72)発明者 川上 和志 岡山県小田郡矢掛町東三成2397―1─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification number Reference number within the agency FI Technical indication location H01L 21/027 (72) Inventor Michio Hashimoto 646 Yoshii-cho, Goizuki-gun, Okayama Prefecture 646 (72) Inventor Kazushi Kawakami 2397-1 Higashisanari, Yakage Town, Oda District, Okayama Prefecture

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】カップ(23)の内部と外部をドレン孔(2
5)で連通し、カップ(23)内にセットした板状被処理
物(W)の表面に塗布液を滴下し、次いでカップ(23)
上面を蓋体(28)で閉塞してカップ(23)を回転するこ
とで板状被処理物(W)の表面に滴下した塗布液を均一
に拡散せしめるようにした塗布装置において、前記蓋体
(28)の下面にはカップ(23)内に入り込む寸法の整流
板(36)を所定間隔離して取り付け、この整流板(36)
と前記蓋体(28)との間の空間にガス導入ノズル(33)
を開口せしめたことを特徴とする塗布装置。
1. A drain hole (2) is provided inside and outside the cup (23).
5), the coating liquid is dropped on the surface of the plate-shaped object (W) set in the cup (23), and then the cup (23)
In the coating apparatus, the upper surface of which is closed by a lid (28) and the cup (23) is rotated to uniformly diffuse the coating liquid dropped on the surface of the plate-shaped object (W). A rectifying plate (36) having a size that fits into the cup (23) is attached to the lower surface of the (28) so as to be separated by a predetermined distance.
Gas introduction nozzle (33) in the space between the lid and the lid (28)
The coating device is characterized in that it is opened.
JP2091684A 1990-04-06 1990-04-06 Coating device Expired - Lifetime JPH0763668B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2091684A JPH0763668B2 (en) 1990-04-06 1990-04-06 Coating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2091684A JPH0763668B2 (en) 1990-04-06 1990-04-06 Coating device

Publications (2)

Publication Number Publication Date
JPH03293055A JPH03293055A (en) 1991-12-24
JPH0763668B2 true JPH0763668B2 (en) 1995-07-12

Family

ID=14033328

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2091684A Expired - Lifetime JPH0763668B2 (en) 1990-04-06 1990-04-06 Coating device

Country Status (1)

Country Link
JP (1) JPH0763668B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3194071B2 (en) * 1995-03-15 2001-07-30 東京エレクトロン株式会社 Method and apparatus for forming coating film
JP2994228B2 (en) * 1995-04-24 1999-12-27 東京応化工業株式会社 Rotating cup type coating device and coating method

Also Published As

Publication number Publication date
JPH03293055A (en) 1991-12-24

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