JPH0770800B2 - PCB mounting method - Google Patents
PCB mounting methodInfo
- Publication number
- JPH0770800B2 JPH0770800B2 JP59164865A JP16486584A JPH0770800B2 JP H0770800 B2 JPH0770800 B2 JP H0770800B2 JP 59164865 A JP59164865 A JP 59164865A JP 16486584 A JP16486584 A JP 16486584A JP H0770800 B2 JPH0770800 B2 JP H0770800B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- package
- mounting
- package component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【発明の詳細な説明】 〔発明の技術分野〕 本発明はプリント基板へのパッケージ部品の実装に関す
る。Description: TECHNICAL FIELD OF THE INVENTION The present invention relates to mounting a package component on a printed circuit board.
近年LSI容量の増大により、そのパッケージも大形化
し、引出しピンの数も増し100ピンを有するフラットパ
ッケージのものも普通になった。しかし現在のところそ
れらのLSIは機能的には同じであっても、そのパッケー
ジを見るとメーカ毎に大きさ、ピンの配列、ピン間隔が
異なるものが多く、これらをプリント基板上にマウント
する側からすれば同じ機能のLSIだからといって、どれ
でも取付け可能というわけに行かず、１つの型のLSIだ
けを用いた基板へのマウント設計では、この種LSIの受
給不足の状況もあり、マウント生産上に不都合があっ
た。そのためプリント基板上でパッケージの異なる同一
機能部品のどちらもマンウト出来るよう、それぞれに対
しマウント可能な専用スペースを設けプリント配線の引
廻しも行っていた。その結果は機能上必要な１つのパッ
ケージのために２つ分のスペースを占有され、プリント
配線の引廻しにも多くのスペースを必要としプリント基
板上のスペースの利用に無駄が大きい欠点があった。Due to the increase in LSI capacity in recent years, the size of the package has also increased, and the number of lead-out pins has increased, and flat packages with 100 pins have become common. However, even though those LSIs are functionally the same at the moment, when looking at the package, many manufacturers differ in size, pin arrangement, and pin spacing, and the side that mounts these on the printed circuit board. Therefore, even if the LSIs have the same function, it does not mean that any LSI can be mounted. In the mount design on a board using only one type of LSI, there is a shortage of supply of this kind of LSIs, which causes a problem in mount production. There was an inconvenience. Therefore, in order to mount both of the same functional parts with different packages on the printed circuit board, a dedicated space that can be mounted is provided for each and the printed wiring is also routed. As a result, there is a disadvantage in that one package that is functionally required occupies two spaces, and a large amount of space is required for arranging the printed wiring, and the space on the printed circuit board is wasted. .
本発明上記欠点を除去できる部品取付法を提供すること
を目的とする。An object of the present invention is to provide a component mounting method capable of eliminating the above-mentioned drawbacks.
本発明は、機能的には互換性があるが構造的に互換性の
ない、かつ同数のピンを備えた第１、第２のパッケージ
部品のいずれかを採用するパッケージ部品のプリント基
板への実装において、プリント基板の表面と裏面に分け
て第１又は第２のパッケージ取付用ランドを第１のピン
を基準にしてそれぞれ左右逆回りに設けておき、採用し
たパッケージ部品に応じて表面又は裏面に実装する構成
としたので、機能的に互換性を有するLSIの２つのパッ
ケーシに対する取付用ランドをプリント基板の表と裏に
別々に設けて基板上のスペースを１パッケージ分でよく
し、表裏の縦の接続も利用できて基板上での配線の引廻
しスペースの減少も可能としたものである。The present invention is to mount a package component, which is functionally compatible but structurally incompatible, and which employs either the first package component or the second package component having the same number of pins, on a printed circuit board. In the above, the first and second package mounting lands are separately provided on the front surface and the back surface of the printed circuit board in the right and left reverse directions with respect to the first pin, and the front surface or the back surface is provided on the front surface or the back surface depending on the package component adopted. Since it is configured to be mounted, mounting lands for two functionally compatible LSI packages are separately provided on the front and back of the printed circuit board, and the space on the circuit board is sufficient for one package. The connection can also be used, and the wiring space on the board can be reduced.
第１図は本発明の一実施例を示す側面図、第２図はプリ
ント基板の一方の面にマウントされたパッケージの平面
図、第３図はプリント基板の他方の面にマウントされた
パッケージの平面図である。これらの図に於て、（１）
及び（２）はそれぞれ機能的には同じでパッケージが異
なるLSI、（３）はこれらLSI（１）（２）が表裏両面に
分けてマウントされるプリント基板、（４）はパッケー
ジ本体、（５）接続ピンである。これら両パッケージの
ピンから入出力する信号の配置は第一のピンを基準にし
てそれぞれが左右逆まわり、即ち、重ねて透視した場合
の同まわりになるようにしてプリント基板の表裏で同一
信号の接続を容易にすることにより配置線の引廻しを少
くするようランドの配置を考慮することが望ましい。FIG. 1 is a side view showing an embodiment of the present invention, FIG. 2 is a plan view of a package mounted on one surface of a printed circuit board, and FIG. 3 is a package mounted on the other surface of the printed circuit board. It is a top view. In these figures, (1)
And (2) are LSIs having the same functions but different packages, (3) is a printed circuit board on which these LSIs (1) and (2) are mounted separately on the front and back sides, (4) is the package body, and (5) ) Connection pin. The arrangement of the signals input and output from the pins of both these packages is such that the left and right sides are opposite to each other with respect to the first pin, that is, they are the same around the case where they are seen through, and the same signal on the front and back sides of the printed circuit board. It is desirable to consider the layout of the lands so as to reduce the layout wiring by facilitating the connection.
本発明は以上のようになるものであって、LSI特に１社
の製品について部品欠品の対象となり易いものを機能上
採用した場合においても欠品の場合他社のLSIを使用し
てマウント生産上の事故を回避でき、しかもプリント基
板上に格別のスペースを必要としない効果がある。The present invention has been made as described above, and even if an LSI, especially a product of one company, which is likely to be subject to parts shortage, is functionally adopted, the LSI is manufactured by another company for mount production. This has the effect of avoiding the above accident and does not require a special space on the printed circuit board.
第１図は本発明の一実施例を示す側面図、第２図及び第
３図はプリント基板のそれぞれ表裏にマウントされたパ
ッケージの平面図である。 1:第１のパッケージ部品、2:第２のパッケージ部品、 3:プリント基板、4:パッケージ本体、5:接続ピン。FIG. 1 is a side view showing an embodiment of the present invention, and FIGS. 2 and 3 are plan views of packages mounted on the front and back sides of a printed circuit board, respectively. 1: First package part, 2: Second package part, 3: Printed circuit board, 4: Package body, 5: Connection pin.
Claims (1)
のない、かつ同数のピンを備えた第１、第２のパッケー
ジ部品のいずれかを採用するパッケー部品のプリント基
板への実装において、プリント基板の表面と裏面に分け
て第１又は第２のパッケージ取付用ランドを第１のピン
を基準にしてそれぞれ左右逆回りに設けておき、採用し
たパッケージ部品に応じて表面又は裏面に実装すること
を特徴とするプリント基板部品取付法。Claim: What is claimed is: 1. A package component for a printed circuit board, which is functionally compatible but structurally incompatible and which employs either the first or second package component having the same number of pins. In mounting, the first and second package mounting lands are separately provided on the front surface and the back surface of the printed circuit board in the right and left reverse directions with respect to the first pin, and the front surface or the back surface is provided depending on the package component adopted. A method for mounting printed circuit board parts, characterized by mounting on.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59164865A JPH0770800B2 (en) | 1984-08-08 | 1984-08-08 | PCB mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59164865A JPH0770800B2 (en) | 1984-08-08 | 1984-08-08 | PCB mounting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6143496A JPS6143496A (en) | 1986-03-03 |
| JPH0770800B2 true JPH0770800B2 (en) | 1995-07-31 |
Family
ID=15801388
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59164865A Expired - Lifetime JPH0770800B2 (en) | 1984-08-08 | 1984-08-08 | PCB mounting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0770800B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11548356B2 (en) | 2020-03-10 | 2023-01-10 | Racing Optics, Inc. | Protective barrier for safety glazing |
| US11490667B1 (en) | 2021-06-08 | 2022-11-08 | Racing Optics, Inc. | Low haze UV blocking removable lens stack |
| US11709296B2 (en) | 2021-07-27 | 2023-07-25 | Racing Optics, Inc. | Low reflectance removable lens stack |
| US11808952B1 (en) | 2022-09-26 | 2023-11-07 | Racing Optics, Inc. | Low static optical removable lens stack |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5849654Y2 (en) * | 1978-07-31 | 1983-11-12 | 東芝テック株式会社 | Printed wiring board with double-sided pattern |
-
1984
- 1984-08-08 JP JP59164865A patent/JPH0770800B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6143496A (en) | 1986-03-03 |
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