JPH0770872B2 - Electronic component mounting device - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for mounting an electronic component having a lead wire on a printed circuit board, and more particularly to detection of positional deviation of the lead wire.

2. Description of the Related Art Some electronic components have a body to which a large number of lead wires are attached. Electronic components called flat package type electronic components, plastic lead chip carriers and the like are one of them, and these types of electronic components are soldered to the printed circuit of the printed circuit board at the tips of the lead wires. Therefore, the tips of the many lead wires are positioned on one plane of the main body, and all the lead wires are soldered to the printed circuit without omission. In this case, it is usual to bend the tip of the lead wire almost parallel to the main body and take a large soldering area to firmly fix it to the printed circuit board.When mounting, electronic parts are held by the holding head. The lead wire is fixed in a state in which the tip portion of the lead wire is in direct contact with a predetermined position on the printed circuit or in a state of indirect contact via solder.

When such an electronic component is mounted on a printed circuit board, if the lead wire is misaligned, it is not soldered to a predetermined position on the printed circuit, resulting in a defective product. Therefore, JP-A-62-76
In the electronic component mounting apparatus described in Japanese Patent No. 529, it is configured to detect whether or not the tip end portion of the lead wire is deviated from a plane where it should be originally located in a direction perpendicular to the plane. The detection of this positional deviation (this positional deviation is referred to as a positional deviation in the perpendicular direction in order to distinguish it from the positional deviation in the parallel direction, that is, the positional deviation in the direction parallel to the one plane) is detected. It was obtained by contacting the tip with a semi-transparent plate, irradiating light from the electronic component side to the semi-transparent plate in that state, and imaging the shadow of the lead wire generated on the semi-transparent plate from the back side of the semi-transparent plate. This is performed by comparing the information with reference information corresponding to a normal electronic component in which the lead wire is not displaced. If the tip of the lead wire is in close contact with the semi-transparent plate, a clear shadow will be generated in the semi-transparent plate, whereas if it is not in close contact, the shadow will be unclear or will become smaller. Mismatches occur between them, and it is possible to detect misalignment in the perpendicular direction.

If the displacement of the tip of the lead wire in the perpendicular direction is detected in this way, soldering can be performed by stopping the mounting of the defective electronic component based on the detection result, or by correcting the lead wire before use. It is possible to reduce the occurrence of defective electronic circuits due to defective mounting.

However, in the case of detecting the positional deviation of the lead wire in the right-angled direction in this way, it is necessary to closely attach and separate the lead wire of the electronic component to and from the semitransparent plate. It is unavoidable that it takes a long time, and there is a problem that the contact time becomes long when the detection is performed at the time of mounting the electronic component. Further, there is a limit in improving the accuracy of detecting the positional deviation.

It is an object of the first invention to provide an electronic component mounting apparatus capable of detecting a positional deviation of a tip portion of a lead wire in a direction perpendicular to the lead wire without contacting the lead wire.

A second aspect of the present invention has an object to provide an electronic component mounting apparatus that can detect a positional deviation in a parallel direction in addition to a positional deviation in a right angle direction of a tip portion of a lead wire in a non-contact manner. Is.

A third aspect of the present invention provides an electronic component mounting apparatus capable of detecting, in a non-contact manner, a positional displacement in a direction parallel to a mounting head of an electronic component main body, in addition to a positional displacement of a tip portion of a lead wire in a direction perpendicular to the mounting head. The task was to do.

A fourth aspect of the present invention has an object to provide an electronic component mounting apparatus capable of easily discriminating and detecting a positional deviation between a tip end portion of a lead wire and a parallel direction.

A fifth aspect of the present invention has an object to provide an electronic component mounting apparatus capable of more easily discriminating and detecting the positional deviation between the tip end portion of the lead wire and the parallel direction.

Means for Solving the Problems In order to solve the above problems, the first invention emits a detection wave in a direction intersecting with the one plane in a state where an electronic component is held by a holding head, A detection wave emitting device for applying a spot of each tip of the lead wire smaller than the width of each tip, and (b) receiving the reflected wave from each tip of the detection wave, A wave receiving device that outputs an electronic signal that changes depending on the position in the direction perpendicular to
(C) The detection wave emitted from the detection wave emitting device by relatively moving the detection wave emitting device and the wave receiving device and the component holding head in a direction parallel to the arrangement direction of the plurality of lead wires. The spot where
A moving device for sequentially moving across the large number of lead wires, and (d) the one plane of the tips of the large number of lead wires based on an electric signal output from the wave receiving device during movement by the moving device. And a determination device that determines whether or not the position in the direction perpendicular to is deviated by a reference amount or more.

The detection wave may be light, ultrasonic waves, or any other wave that is reflected by the lead wire.

Further, the positional deviation may be determined based on the mutual relationship between the tip portions of the plurality of lead wires, or a reference position may be set separately from the lead wires, and determination may be made based on the relationship with the reference position. The determination can be made in various modes, and the reference amount may be appropriately set for each.
In the case of the former, for example, the difference between the two most distant tip parts among a large number of tip parts is obtained, and when the difference is equal to or more than a set value, the position of the lead wire tip part is not suitable for mounting. It is determined that there is a deviation, and in this case, the set value of the difference is the reference amount. In the latter case, for example, the emission position of the detected wave can be set to the reference position, and it can be determined whether or not the distance from the reference position to the tip of the lead wire is within the set range. In this case, the above setting range is the reference amount.

According to a second invention, in the wave receiving device according to the first invention, a position in a direction parallel to one plane of each tip portion based on reflected waves from each tip portion of a large number of lead wires is measured in a direction perpendicular to the one plane. A reference for detecting a position shift in a direction parallel to a plane of the tip portion in the determination device according to the first aspect of the present invention, which is provided with a discrimination detection unit that detects the position separately. It is characterized in that means for determining whether or not there is a deviation from the quantity by a reference quantity or more is provided.

Also in this case, the reference amount may be appropriately set according to the position shift determination mode, and various modes such as the determination based on the mutual relationship between the tip portions or the relationship with the preset reference position may be used. Can be determined by, and the reference amount is set correspondingly. When determining whether or not there is a positional shift depending on the positional relationship between the tip portions, for example, the distance between the adjacent tip portions is calculated, and if the distance is outside the set range, it is determined that there is a shift. The setting range becomes the reference amount. In the latter case, the presence or absence of positional deviation can be determined by obtaining the distance from the reference position of the tip and comparing it with the distance from the reference position when each tip is mounted without deviation. In this case, the distance from the reference position of the tip portion when there is no deviation is the reference amount.

According to a third aspect of the invention, in the wave receiving device according to the first aspect of the invention, the position in a direction parallel to one plane of each tip portion based on the reflected wave from each tip portion of a large number of lead wires A distinction detection means for detecting the position separately from the position is provided, and the electronic part pulling / mounting device is mounted on the mounting head of the main body of the electronic component based on the detected position in the direction parallel to the one plane of each tip part. It is characterized in that a means for obtaining a positional deviation in a direction parallel to one plane is added.

Here, the displacement of the main body with respect to the mounting head refers to the displacement of the center of the main body with respect to the center of the mounting head, the displacement in the rotation direction around the center line of the mounting head of the main body, or both.

A fourth invention is the electronic component mounting apparatus according to the second invention or the third invention, wherein the detection wave emitting device and the wave receiving device are provided with a plane in which the tip ends of a large number of lead wires are located. It is assumed that the wave-receiving device is provided with a detection element that outputs an electric signal whose size changes in response to a change in the incident position of the reflected wave, and is arranged relatively inclined so as to intersect with each other in the vicinity. Based on the magnitude of the electric signal from the detection element, the device determines whether or not the positions in the direction perpendicular to one plane of the tip portions of many lead wires deviate by more than a reference amount, and It is characterized in that the distinction detecting means detects the position of each tip of a large number of lead wires in the direction parallel to the one plane based on the interval of the abrupt change time of the electric signal from the detecting element.

A fifth invention is, in the electronic component mounting apparatus according to the fourth invention, arranging the detection wave emitting device in a direction orthogonal to a plane on which the tips of a large number of lead wires should be located,
The wave receiving device is characterized in that the axis of the wave receiving device is arranged so as to obliquely intersect with a plane on which the tips of the plurality of lead wires should be located.

Action and Effect In the electronic component mounting apparatus according to the first aspect of the invention, the deviation of the tip portions of the lead wires from the one plane where they should be originally located is detected based on the reflected wave from the lead wires. Since the positional deviation in the right angle direction is detected in a non-contact manner, it is not necessary to bring the lead wire into close contact with a semitransparent plate or the like when detecting the positional deviation, and the detection time and the electronic component mounting time can be shortened. Moreover, since the positional deviation of the lead wires is detected while relatively moving the electronic parts and the detected wave emitting device and the wave receiving device, even if the electronic parts are large and have a large number of lead wires, they are small in size. The positional deviation of the lead wire can be detected by using the detected wave emitting device and the wave receiving device, and the device cost can be reduced. In particular, in a mounting device in which electronic components are transported because they are mounted on a printed circuit board, if the displacement is detected by using the movement, it is not necessary to provide a dedicated moving device, and it is cheaper and more efficient. Detection can be performed. Further, it is easy to improve the detection accuracy as compared with the case where the semi-transparent plate is brought into close contact with the semi-transparent plate to detect the positional deviation in the perpendicular direction.

In the electronic component mounting apparatus according to the second aspect of the invention, both the positional deviation of the tip portion of the lead wire in the perpendicular direction and the positional deviation in the parallel direction are detected. Therefore, it is possible to more surely reduce the occurrence of defective electronic circuits while shortening the detection time, and it is possible to reduce the detection cost as compared with the case where the two types of positional deviations are detected separately.

In the electronic component mounting apparatus according to the third aspect of the invention, in addition to the positional displacement of the tip portion of the lead wire in the perpendicular direction, the positional displacement of the main body with respect to the mounting head is detected. Therefore, it is possible to reduce the generation time of defective products and the detection cost while shortening the detection time.

In the electronic component mounting apparatus according to the fourth aspect of the present invention, the detection wave emitting device and the wave receiving device, the axes of both devices in a state of intersecting each other in the vicinity of one plane where the tips of many lead wires should be located, Since they are arranged relatively inclined, if the position of the tip of the lead wire in the perpendicular direction changes, the incident position of the reflected wave in the wave receiving device on the detection element changes, and the detection element changes to this incident position. It outputs an electric signal whose magnitude changes accordingly. Therefore, the determination device can determine whether the positions of the tips of the many lead wires in the direction perpendicular to each other are deviated by the reference amount or more based on the magnitude of the electric signal from the detection element.

Also, if the detection wave emitted from the detection wave emitting device hits the tip of the lead wire, it is reflected to the wave receiving device, but if it does not hit, it is not reflected, so the time when the detection wave hits the tip of the lead wire The magnitude of the electric signal output from the detection element suddenly changes between the time when it does not hit and the time when it does not hit. Therefore,
Based on the interval of the abrupt change time, the distinction detecting means can detect the interval between the tip portions of the lead wires.

In this way, by using a detection element that outputs an electric signal whose magnitude changes according to the incident position of the reflected wave, it is possible to detect the positional deviation between the direction perpendicular to the tip of the lead wire and the parallel direction separately. Can be facilitated and the device cost can be reduced.

In the electronic component mounting apparatus according to the fifth aspect of the present invention, since the detection wave emitting device is arranged such that its axis line is orthogonal to the one plane on which the tips of the many lead wires should be located, the detection wave emission It is emitted at a right angle to the plane, and the timing at which the detected wave starts or does not hit the tip of the lead wire is not affected by the displacement of the tip of the lead wire in the right angle direction. Therefore, the positional deviation in the parallel direction can be obtained very easily based on the interval between the times when the magnitude of the electric signal suddenly changes and the relative movement speed between the electronic component and the detection wave emitting device.

Even if the detection wave emitting device is arranged in a direction in which its axis intersects diagonally with the plane where the tips of many lead wires should be located, the parallel direction is based on the interval of the time when the magnitude of the electric signal suddenly changes. It is possible to obtain the positional deviation of. However, in this case, in order to accurately detect the displacement of the lead wires in the parallel direction, it is necessary to correct the interval between the times when the magnitude of the electric signal suddenly changes, which is troublesome. .
When the axis of the detection wave emitting device intersects obliquely with one plane where the tips of many lead wires should be located, the detection wave emitted from the detection wave emitting device is also with respect to that one plane. Since the light is incident on the tip of the lead wire from an inclined method, if there is a position shift in the right angle direction at the tip part, the detected wave will also start hitting the tip part of the lead wire or will not hit even if the position shift in the right angle direction occurs. Influence the timing.
The magnitude of this effect depends on the amount of positional deviation of the lead wires at the right angle direction (this can be determined from the magnitude of the electrical signal output from the detection element) and the positions of the tips of many lead wires. And the angle of inclination of the axis of the detection wave emitting device with respect to one plane to be measured. Therefore, if the interval of the time when the magnitude of the electric signal suddenly changes is corrected by the amount of the above influence, the corrected interval accurately represents the positional deviation of the lead wire in the parallel direction. However, this correction is troublesome.

Embodiment Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.

FIG. 5 is a plan view showing an electronic component mounting apparatus which is an embodiment of the present invention. In this mounting apparatus, an electronic component holding head (hereinafter, referred to as an ejection head) 12 for taking out an electronic component supplied by two electronic component supply devices 10 and 11 is taken out and placed on a placing table 13, and the placing table is placed. A mounting electronic component holding head (hereinafter, referred to as a mounting head) 14 receives the electronic component from 13, and after the detection head 16 detects the positional deviation of the electronic component, the printed circuit board is transported and positioned by a printed circuit board transport positioning device 18. It is for mounting electronic parts. Hereinafter, the electronic component supply devices 10 and 11, the take-out head 12, the mounting table 13, the mounting head 14, the detection head 16, and the printed circuit board transport positioning device 18 will be described. This is almost the same as the electronic component mounting apparatus described in the application of Japanese Patent Application No. 63-9186 of the present applicant, and will be omitted.

The printed circuit board transport positioning device 18 is provided on the base 20 together with the take-out head 12, the mounting table 13, the mounting head 14, and the detection head 16, and the printed circuit board positioning device 22 and the printed circuit board transport direction of the positioning device 22. It has a carry-in conveyor 24 and a carry-out conveyor 26, which are provided on both sides in the left-right direction in FIG. 5 (this direction is referred to as the X-axis direction). Printed circuit board positioning device
22 includes a table 28. Table 28 is the above X
The screw shaft 34 is supported by a pair of guide rails 32 provided in the Y-axis direction (vertical direction in FIG. 5) perpendicular to the axial direction.
Is rotated by a servo motor (not shown) so that it is moved between a position aligned in series with the conveyors 24, 26 and an electronic component mounting position adjacent to that position in the Y-axis direction. A fixed guide 38 is attached to one side of the two sides of the table 28 parallel to the X-axis direction.
A movable guide 40 is attached to the other side portion so as to be movable in the Y-axis direction, and serves to guide the movement of the printed circuit board 42 in the X-axis direction and to perform rough positioning in both the X- and Y-axis directions. The printed circuit board 42 carried on the table 28 is pushed from below by a pusher 44 (see FIG. 6), and is fixed to the table 28 by being pushed against the lower surfaces of the fixed guide 38 and the step portion of the movable guide 40.

Each of the carry-in conveyor 24 and the carry-out conveyor 26 includes a pair of side plates 46 extending in the X-axis direction, a fixed guide 48 fixed to one side plate 46, and a movable guide 50 movable with respect to the other side plate 46. . These movable guides 50 are moved in the Y-axis direction by being guided by the guide rods 52 by rotating the screw shaft 54 of the carry-out conveyor 26 by operating the handle 56 and rotating the screw shaft 54 of the carry-in conveyor 24. The conveyor width is changed all at once. These movable guides 50 are connected to the movable guides 40 of the printed board positioning device 22 by a connecting device (not shown) when the conveyor width is changed. guide
The distance between 38 and the movable guide 40) can be changed.

Although not shown, conveyor belts are attached to the inner surfaces of the fixed guide 48 and the movable guide 50 that face each other. This conveyor belt is moved by rotating a rotating shaft 60 supported by a pair of side plates 46 by a servo motor 62, and the printed circuit board 42 placed on it is conveyed. Although not shown, the fixed guide 3 of the printed circuit board positioning device 22 is not shown.
8, conveyor belts are also attached to the inner surfaces of the movable guides 40, and the printed circuit board 42 sent by the carry-in conveyor 24 by the movement of the conveyor belts.
Is sent to the table 28, and the printed circuit board 42 on the table 28 is sent to the carry-out conveyor 26.

Next, the electronic component supply devices 10 and 11 will be described. These supply devices 10 and 11 are made symmetrical with respect to each other, and when a large number and kinds of electronic components need to be supplied, two units are used side by side, and when there are few kinds of electronic components, etc. 1
Used one by one. Hereinafter, the electronic component supply device 10 will be representatively described.

In this supply device 10, a plurality of component supply trays 66, which are stored in electronic components, are vertically stacked and accommodated in a magazine 68, and 10 magazines 68 are arranged vertically, and each magazine 68 is sequentially arranged. The electronic component is supplied by being positioned by the component supply device. Each magazine 68 is supported by a magazine support member 69. These magazine support members 69 are slidably fitted to a cam shaft 74 and a guide rod 76 provided on a column 72 fixed on the base 70 with a certain gap in the vertical direction. It can be moved in the vertical direction by being rotated.

To take out electronic components from the component supply tray 66, the lowest magazine supporting member 69 among the ten magazine supporting members 69 is located at the lowermost end of the cam shaft 74, and the ten magazine supporting members 69 are slightly removed. This is performed at a height at which the uppermost component supply tray 66 is located among the ten component supply trays 66 accommodated in the uppermost magazine support member 69 in a state in which the uppermost component supply tray 66 is located close to each other. This position is the component take-out position, and the component supply tray 66 is positioned by a positioning device (not shown). Also, the parts supply tray 66
The position of the magazine support member 69 when the is positioned at the component take-out position is the component supply position.

The lead angle of the cam groove formed on the camshaft 74 is the position where a distance is necessary for the pick-up head 12 to enter above the component supply position (the avoidance position shown by the alternate long and short dash line in FIG. 7). The portion between and is larger than the other portions, and the magazine support member 69 below the component supply position and above the avoidance position can be moved a distance of one magazine support member by three rotations of the camshaft 74. In contrast,
The magazine support member 69 positioned at the component supply position is adapted to be moved to the avoidance position. Therefore, the rotation of the cam shaft 74 causes the retreat of the magazine support member 69 at the component supply position to the avoidance position and the positioning of the new magazine support member 69 at the component supply position at the same time.

Next, the take-out head 12 will be described. The ejection head 12 is
A column 84 (see FIGS. 5 and 7) long on the base 20 and extending in the X-axis direction is provided on the electronic component supply device 10, 11 side. The take-out head 12 is guided by the guide rail 86 and moves between a first position which is separated from the electronic component supply device 10 to the left side in FIG. 5 and a second position which is separated from the electronic component supply device 11 to the right side. A belt 92 slidably mounted on the X-axis slide 88 and wound around a pair of rollers 90 on the X-axis slide 88, and an inner position close to the column 84 as shown in FIG. 7th
As shown in the figure, it protrudes from the base 20, and the component supply tray
It is moved to and from the outer position of 66, which reaches the furthest part from the base 20. This Y-axis movement and X-axis slide
By the movement of 88 in the X-axis direction, the take-out head 12 is moved to any position within the horizontal plane defined by the first position, the second position, the inner position, and the outer position, and is positioned at the component supply position. Parts supply tray 66 for two magazines 68
The desired electronic component is taken out from any of the above. The take-out head 12 is equipped with a suction tool 94 capable of sucking an electronic component by vacuum and moving up and down. After picking up a desired electronic component from the component supply tray 66, the electronic component is placed on the mounting table 13. Reference numerals 96 and 98 are flexible carriers in which a vacuum supply hose, an electric cord, etc. are accommodated.

The mounting table 13 is provided at a position deviated to the right from the electronic component supply device 11 in the X-axis direction, guided by a guide rail 100 arranged in the Y-axis direction, and by a screw shaft 102 and a motor (not shown), It is moved to a pick-up position on the pick-up head 12 side of the column 84 for receiving electronic parts from the pick-up head 12 and an electronic-part supply position on the opposite side of the column 84 for supplying electronic parts to the mounting head 14. Ejection head 12
Is positioned right above the mounting table 13 at the receiving position when positioned at the second position and the inner position.

Next, the mounting head 14 will be described. The mounting head 14 is provided on the side of the column 84 opposite to the side on which the take-out head 12 is provided. As shown in FIG. 6, a pair of guide rails 106 extending in the X-axis direction are attached to the column 84, and slidably support the main body 108 of the mounting head 14. The main body 108 is screwed onto a screw shaft 110 arranged in parallel with the guide rail 106, and the screw shaft 110 serves as a servo motor.
By being rotated by 112 (see FIG. 7), it is moved between the electronic component supply position and the electronic component mounting position.

As shown in FIG. 9, on the front surface of the main body 108, a vacuum pipe 118 is fitted to the pair of protrusions 114 and 116 so as to be rotatable and slidable in the vertical direction. Vacuum pipe 11
A bracket 126 is attached to a portion between the portions supported by the protrusions 114 and 116 of 8. The nut 128 fixed to the bracket 126 is attached to the main body 108 as shown in FIG.
Is screwed with a screw shaft 130 attached in the vertical direction, and the vacuum pipe 118 is moved in the vertical direction by rotating the screw shaft 130 by a servo motor 132. A spring 134 is attached to the vacuum pipe 118, and the compression of the spring 134 allows the vacuum pipe 118 to move up a small distance with respect to the bracket 126.

The vacuum pipe 118 is fitted to the lower projection 116 via a sleeve 135, and the sleeve 135 is spline fitted to the vacuum pipe 118 and is fitted to the projection 116 rotatably and immovably in the axial direction. ing. This sleeve 13
5 is large diameter gear 136, small diameter gear 138, medium diameter gear 140, drive gear 1
It is rotated by the servo motor 142 via 41, which in turn rotates the vacuum pipe 118.

A chuck 146 is attached to a lower end portion of the vacuum pipe 118 protruding from the sleeve 135 so as to hold the suction tool 150. The chuck 146 includes a collet 151 which is freely opened and a sleeve 152 which is fitted to the outer side of the collet 151. When the sleeve 152 is urged downward by a spring 158, the collet 151 is kept closed. Be drunk Further, a releasing member 160 for releasing the tightening is engaged with the collet 151. The releasing member 160 is moved up and down by the hydraulic cylinder 162, and when the collet 151 is closed, it is at the lower end position, and the spring 158 biases the sleeve 152 to allow the collet 151 to be tightened. On the other hand, in the case of releasing the tightening, the releasing member 160 is raised, and the sleeve 152 is moved upward against the biasing force of the spring 158.

The suction tool 150 has a cylindrical held portion 166 held by the chuck 146 at one end, and a suction portion 170 for sucking the electronic component 168 at the other end. Vacuum pipe 1
The vacuum hose 172 is connected to a vacuum source (not shown) by a vacuum hose 172 connected to the upper end of the 18 via a joint member 171. The vacuum source is provided with an electromagnetic direction switching valve, and the suction unit 170 suctions or separates the electronic component 168 according to the switching.

As shown in FIGS. 10 and 11, the electronic component 168 has a rectangular main body 176 and lead wires 178 attached to the four side surfaces of the main body 176 at equal intervals.
It consists of and. The lead wire 178 is extended parallel to the plate surface of the main body 176, then bent at a right angle to the plate surface, and further bent away from the main body 176 to provide a tip portion 180 parallel to the main body 176. ing. Each tip 180 is provided so as to be located in one plane, and is soldered to the printed circuit of the printed circuit board 42 at this tip 180. In this embodiment, the electronic component 168 is mounted on the printed circuit board 42 in which the main body 176 is held horizontally by the mounting head 14 and is supported horizontally, and the tip ends 180 of the multiple lead wires 178 should be located. One plane is a horizontal plane, and the direction perpendicular to this one plane is the vertical direction.

Further, as is clear from FIG. 8, a CCD camera 190 is attached at a position adjacent to the vacuum pipe 118 of the main body 108 of the mounting head 14 in the X-axis direction, and the reference mark provided on the printed board 42 is attached to the CCD camera 190. It is designed to be read.

The mounting head 14 is in the standby position on the carry-in conveyor 24 side from the electronic component mounting position when not in operation, as shown in FIG. 5, but when the electronic component is mounted, it is located between the electronic component mounting position and the electronic component supplying position. Can be moved with. A detection head 16 is provided below the moving path of the mounting head 14 and adjacent to the mounting table 13 at the electronic component supply position.

The detection head 16 is provided with two lead wire detection devices 200 and 202, as shown in FIG. These lead wire detection devices 200 and 202 are mounted on slides 204 and 206, respectively. These slides 204 and 206 are attached to the frame 208 by the Y
It is slidably fitted to a guide 210 provided in parallel with the axial direction, and is screwed into a feed screw 212 arranged in parallel with the guide 210 with nuts 216 and 218. The lead screw 212 has two parts in which the screw directions are opposite to each other,
Nuts 216 and 218 are respectively screwed into the two parts. The feed screw 212 is supported by the frame 208 so as to be rotatable and immovable in the axial direction.
It is connected to a servo motor 228 via a timing belt 226. As a result, when the servo motor 228 rotates in the forward direction and the reverse direction, respectively, the slides 204 and 206 and the lead wire detection devices 200 and 202 maintain a symmetrical relationship with each other with respect to the vertical plane including the transport path of the electronic component 168 by the mounting head 14. The detection devices 200 and 202 are brought close to and separated from each other, and the distance between the detection devices 200 and 202 is adjusted to a size corresponding to the size of the electronic component 168.

The lead wire detection devices 200 and 202 have the same configuration, and the lead wire detection device 200 will be representatively described. The lead wire detection device 200 detects a positional deviation of the lead wire 178 by applying laser light to the lead wire 178,
Laser light is the detection wave. This lead wire detection device 200
As shown in FIG. 1, a housing 230, and a laser light emitting body 232 built in the housing 230 and serving as a detection wave emitting device for emitting laser light upward in the vertical direction,
A light receiving lens 234 that collects the reflected light from the lead wire 178,
The light receiving lens 234 includes a detection element 236 as a wave receiving device that receives the light condensed. The light receiving lens 234 and the detection element 236 are provided so as to be inclined with respect to the optical axis of the laser light emitted from the laser light emitting body 232. In addition, the detection element 23
6 is a high resistance silicon substrate 2 as shown in FIG.
A p layer is formed on the surface of 38 and an n layer is formed on the back surface, and electrodes 240 and 242 for signal extraction are provided at both ends thereof. If light is incident on this detection element 236,
A current proportional to the intensity of the light is generated and taken out from the electrodes 240 and 242 through the p layer. The p layer is a uniform resistance layer, and the current drawn from the electrodes 240 and 242 is inversely proportional to the distance from the light incident point to each electrode. Then, the incident position of light changes as the position of the tip 180 changes in the vertical direction perpendicular to the horizontal plane, as shown in FIG. 1 by drawing only the tip 180 of the lead wire 178. If the tip 180 is in the horizontal plane where it should be located, the reflected light will be detected by the detector
6 is incident on the middle position in the longitudinal direction, while the tip 18
If they are displaced upward or downward from the horizontal plane like 0 ′, 180 ″, they will be incident on the positions on the opposite sides of the intermediate position of the detection element 236. Therefore, they are taken out from the electrodes 240, 242. The vertical position of the tip 180 can be known based on the magnitude of the current, and it can be determined whether or not there is a deviation in the position.
242 is connected to the control device 244, and the current extracted from the electrodes 240 and 242 is converted into a voltage and supplied to the control device 244. The control device 244 is mainly composed of a computer, and controls the entire operation of the electronic component mounting device. The control device 244 controls the lead wires 178 based on the magnitude of the voltage supplied.
Then, it is determined whether or not there is a displacement in the above-mentioned right angle direction. The control device 244 constitutes the determination device.

In the electronic component mounting apparatus configured as described above,
When not in operation, the ejection head 12 and the mounting head 14 are both in the positions shown in FIG. 5 and are on standby, and in the electronic component supply devices 10 and 11, each of the ten magazine support members 69 is a component. It is located below the supply position. Then, the electronic component 168 is attached to the printed circuit board 42.
When mounting on the printed circuit board 42, the printed circuit board 42 and the mounting head 14 fixed to the table 28 are first moved to the electronic component mounting position, and the mounting head 14 is separated by the CCD camera 190 from two positions on the printed circuit board 42. Read the reference mark provided on the. Printed circuit board based on its reading
The positional deviation ΔX of 42 in the X-axis direction and the positional deviation ΔY in the Y-axis direction are calculated in the control device 244.

The electronic component 16 is taken out by the take-out head 12 in parallel with the positioning and calculation of the printed circuit board 42 as described above.
The take-out head 12 is moved in a horizontal plane to take out the electronic component 168 from the component supply tray 66, and then moved to a position where the electronic component 168 is placed on the mounting table 13. At this time, the mounting table 13 is moved to the electronic component receiving position, and the ejection head 12 mounts the electronic component 168 on the mounting table 13. Next, the take-out head 12 is moved to take out the electronic component 168 to be mounted next, and the mounting table 13 is moved to the electronic component supply device. At this time, the mounting head 14 has been moved to the electronic component supply position and sucks the electronic component 168 placed on the mounting table 13.

After picking up the electronic component 168, the mounting head 14 is attached to the printed circuit board 42.
The electronic component 168 is moved toward the electronic component mounting position so that the electronic component 168 can be mounted on the detection head 16 and the positional deviation of the tip end portion 180 of the lead wire 178 and the main body 176 is detected when passing over the detection head 16. The distance between the lead wire detection devices 200 and 202 is
According to the size of the electronic component 168, it is adjusted so that the laser light strikes the central portions in the lengthwise direction of the line portions 180 of the lead wires 178 on the two sides facing each other. When passing above, the laser light is sequentially applied to the tip end portions 180 of the lead wires 178 attached to the two sides parallel to the moving direction. The emission of laser light is started when the mounting head 14 reaches the laser emission start position on the short distance electronic component supply position side of the laser emitter 232 after the electronic component 168 is adsorbed, and this position is set to 0. Time measurement starts. Then, when the lead wire 178 reaches the laser irradiation position where the laser light strikes, the reflected light from the tip 180 is detected by the detection element 2
36, the voltage is supplied to the controller 244, and the controller 2
It is stored in 44 memories in association with time. The relationship between time and voltage at this time is shown in FIG. When the lead wire 178 is not provided, light does not enter the detection element 236, and the voltage in this case becomes the detection limit value. While the laser beam is applied to the tip 180, the voltage corresponding to the vertical position is applied to the controller.
Since the voltage is supplied to 244, the width of the detected voltage represents the width of the lead wire 178. As mentioned above, the height of the voltage is
180 represents the vertical position, and the reflected light from the tip portion 180 is incident on the detection element 236 at each tip portion 180 at intervals with the movement of the electronic component 168, and the voltage value is obtained. The horizontal position of the tip portion 180 can be detected separately from the vertical position.

When the detection of the lead wires 178 attached to the two sides parallel to the moving direction of the electronic component 168 is completed, the suction tool 150 is rotated by 90 degrees, and the mounting head 14 is slightly electronic component from the laser emission start position. It is returned to the position on the supply position side, and then moved again to the electronic component mounting position. As a result, the position of the tip end portion 180 of the lead wire 178 attached to the other two sides of the electronic component 168 is detected. In this case as well, as in the case of the first detection, the laser emission start position is set to 0 and the time is measured, and the detected voltage and the time are associated and stored in the memory of the control device 244.

When the detection of the lead wires 178 on all four sides is completed, the control device 244 determines whether or not there is a positional deviation between the tip end portion 180 and the main body 176. In this embodiment, the vertical and horizontal misalignment of the tip portion 180 is determined, and the main body 176 is misaligned in the X-axis direction and the Y-axis direction with respect to the axis of the suction tool 150 in the horizontal plane. The positional deviation in the rotation direction about the axis of is determined.

First, the determination of the vertical displacement of the tip portion 180 will be described. First, the average value of the voltage representing the position of the tip portion 180 is obtained for each side of the main body 176. The average of the positions of a large number of tip parts 180 is obtained, and then the obtained average value is compared with the voltage value representing the position of each tip part 180, and the voltage value representing the position of a certain tip part 180 is averaged. If the value corresponds to a position above the position corresponding to the value by a certain distance or more, it is determined that the tip end portion 180 has a positional deviation in the vertical direction that is not suitable for mounting. Although the voltage value representing the above-mentioned constant distance is the reference amount, the reference amount is determined in this way because the electronic component 168 is fixed when the lead wire 178 is soldered to the printed circuit of the printed circuit board 42. This is because the lead wire 178 is pressed upward to the printed circuit board 42 by force, and the lead wire 178 is bent upward, and if a small amount of misalignment occurs, it is eliminated and soldered to the printed circuit board 42 without any trouble. If it is determined that the tip 180 has an unacceptable vertical displacement, the mounting head 14 is moved to the discarding position on the left side of the electronic component mounting apparatus in FIG. 5 to discard the electronic component 168. .

The horizontal position of the tip 180 is detected as follows. The detection voltage supplied to the control device 244 is stored in association with the elapsed time from the start of laser emission, and the moving speed of the mounting head 14 and the distance between the laser irradiation position and the laser emission start position are known. Therefore, it is possible to calculate the position (horizontal position) with the laser irradiation position of each tip 180 as the origin when the center of the suction tool 150 of the mounting head 14 reaches the laser emission start position. If this is expressed using coordinates, it becomes as shown in FIG. It should be noted that the horizontal axis is the Y axis because the electronic component 16
This is because the lead wire 178 is rotated 90 degrees after detecting the lead wire 178 on one of the two sides of the main body 176, and the lead wire 178 on the two sides detected for the first time is positioned in the Y-axis direction when mounted. .

Lead wire attached to one side for ease of explanation
Assuming that the number of 178 is three, the distance L ₁ from the laser irradiation position of the tip end 180 on the side closest to the laser irradiation position is
Time t ₁ until the tip 180 reaches the laser irradiation position
It is obtained by multiplying (stored in the memory of the control device 244) by the moving speed v of the mounting head 14. Further, the distance L ₂ of the tip portion 180 at the center is obtained by multiplying the moving time t ₂ by the moving speed v to obtain the distance L ₃ of the farthest tip portion 180.
Is obtained by multiplying the time t ₃ by the moving speed v.
Note that x _a is equal to the distance between the laser irradiation position and the laser emission start position, and x _b and x _c respectively represent the positions of the lead wire detection devices 200 and 202 with respect to the movement path of the mounting head 14.

As is clear from the above description, in this embodiment,
The mounting head 14 as a component holding head is parallel to the arrangement direction of a large number of lead wires 178 with respect to the laser light emitting body 232 as a detection wave emitting device and the wave receiving device including the light receiving lens 234 and the detection element 234. By relatively moving the laser light as a detection wave emitted from the laser light emitting body 232 in such a direction, the spot where the laser light as a detection wave hits the tip end portion 180 of the lead wire 178 can be moved sequentially across a large number of lead wires 178. The guide rail 106 that moves the mounting head 14, the screw shaft 110, the servo motor 112, and the like constitute a moving device. Further, the portion of the control device 244 that detects the position in the parallel direction of the tip end portion 180 of the lead wire 178 based on the interval between the sudden changes in the voltage of FIG. A distinction detecting means for detecting the position by distinguishing it from the position in the perpendicular direction is configured.

The distance of the lead wire 178 attached to the other two sides of the main body 176 from the laser irradiation position when the suction tool 150 is at the laser emission start position can be similarly obtained. If the first detection and the second detection are combined and shown in the coordinates, the 14th
As shown in the figure.

Based on the detection result of the horizontal position of the tip end portion 180, the displacement of the main body 176 with respect to the suction tool 150 in the X-axis direction and the Y-axis direction is detected. First, as shown in FIG.
Average horizontal position of tip 180 on each side of body 176
A, B, C, and D correspond to the midpoints of the sides of the body 176, and the straight lines l ₁ and l ₂ that connect the average positions of the lead wires on the opposite sides pass through the center of the body 176 and their intersections are the body points. Based on the assumption that it is the center point of 176, the coordinates of the center position O ′ of the main body 176 (x ₀ , y ₀ )
Is required. Then, by comparing the coordinate value of the center position O ′ of the main body 176 with the coordinate O (x _a , y _a ) when the suction tool 150 is located at the laser emission start position, the main body 176 with respect to the suction tool 150 is compared. Displacement in X-axis direction and Y-axis direction ΔX ′, Δ
Y'can be obtained.

Further, a posture error Δθ which is a positional deviation in the rotation direction of the main body 176 from the inclinations of the two straight lines with respect to the X axis and the Y axis.
Is required.

Since the positional deviation of the main body 176 is corrected later, the position of the tip end portion 180 of each lead wire 178 when this correction is performed is obtained based on the detection result of the horizontal position. Then, the obtained result and the planned position of each tip 180 (the position where the tip 180 is expected to be located when the suction tool 150 is located at the laser emission start position with the laser irradiation position as the origin) Compared with all the tips
If the amount of deviation of the 180 position from the planned position is within a certain range, it is determined that the horizontal position does not exceed the reference amount and is mounted on the printed circuit board 42. However, even one exceeds the above-mentioned certain amount. If so, the electronic component 163 is discarded.

The position shift of the main body 176 is corrected after the detection by the detection head 16 and before the mounting head 14 reaches the electronic component mounting position. In the control device 244, the central positional deviations ΔX ′, ΔY ′ and the positional deviation ΔX,
Based on ΔY, the mounting position data of the electronic component 168 set based on the reference mark is corrected, and the mounting head 14 and the table 28 are moved to the corrected positions. Further, the servo motor 142 is driven, the vacuum pipe 118 is rotated, and the posture error Δθ
It can be rotated by the angle necessary to eliminate. As a result, the first electronic component 168 is mounted at a predetermined position on the printed circuit board 42 in a proper posture in which the positional deviation is eliminated.

The electronic component 168 is temporarily fixed to the printed circuit board 42 by the cream solder applied to the printed circuit board 42, and after transportation, the cream solder is heated and soldered by a soldering device (not shown).

After mounting the electronic component 168, the mounting head 14 is moved to the electronic component supply position, but the electronic head 168 is taken out by the take-out head 12 in parallel with the mounting of the electronic component 168 by the mounting head 14. After mounting the first electronic component 168, the mounting head 14 can immediately mount the next electronic component 168.

In addition, in this embodiment, the detection head 16 is the electronic component 16
8 is provided in the middle of the transportation path of 8, and the tip portion 180 is detected by utilizing the movement of the mounting head 14. Therefore, a dedicated movement for moving the electronic component 168 to detect the lead wire 178. Since it is not necessary to provide a device, it is possible to detect at low cost.

Further, the detection head 16 is adapted to detect the vertical and horizontal displacements of the lead wire 178 based on the detection of the tip portion 180 of the lead wire 178 and the displacement of the main body 176 of the electronic component 168. All the positional deviations necessary for mounting the 168 can be detected by the single detection head 16, and the detection cost can be reduced also from this point.

However, the detection head 16 may detect only the positional deviation of the tip portion 180 of the lead wire 178 in the vertical direction, and other positional deviations may be detected by another detection head. In this case, for example, the reading head described in Japanese Patent Application No. 63-9186 may be used.

In the above embodiment, the electronic component 168 is the mounting head 1
Although it was held horizontally by 4 and mounted horizontally on the printed circuit board 42, it may be mounted while being held in another direction such as vertical or diagonal. In that case, the irradiation direction of the laser light is changed according to the holding direction of the electronic component 168,
The direction may be such that the tip 180 of the lead wire 176 intersects with the plane on which it should be located.

The second detection of the tip portion 180 may be performed when the electronic component 168 is rotated 90 degrees and returned to the electronic component supply position side after the first detection is completed.

Further, in the above embodiment, the positional deviation of the tip end portion 180 was detected along with the transportation of the electronic component 168, but the mounting head 14 is stopped and the lead wire detection device 200,
202 may be moved and detected.

Furthermore, only one lead wire detection device may be provided for detection.

Further, in the above-described embodiment, the positional deviation of the lead wire 178 and the main body 176 of the electronic component 168 held by the mounting head 14 is detected, but the positional deviation of the lead wire 178 is held by the ejection head 12. The detected electronic component 168 may be detected.

Furthermore, the detection wave for detecting the tip portion 180 is not limited to laser light, and visible light may be used as well as ultrasonic waves. When ultrasonic waves are used, for example, ultrasonic waves are repeatedly emitted from the ultrasonic oscillator at a constant minute time interval, and while the ultrasonic waves are reflected to the ultrasonic oscillator itself, the tip portion 180 of the lead wire 178 is exposed to the ultrasonic wave. It detects the position of the tip 180 in the horizontal direction (generally in the parallel direction) as if it is facing the sonic oscillator, and it also measures the length of time that elapses from the time each ultrasonic wave is emitted to the time it reaches after reflection. Based on this, the position in the vertical direction (generally, the right angle direction) can be detected. In this case, the ultrasonic oscillator serves as both the detection wave emitting device and the wave receiving device.

Further, instead of determining whether the vertical position shift of the tip 180 exceeds the reference amount based on the comparison between the voltage value obtained for each tip 180 and the average value thereof, this voltage value Based on all leads 178, their tips 1
Calculate the pressing force to the printed circuit board 42 of the electronic component 168 necessary to bend until 80 are all located on one plane, and the pressing force is an appropriate amount, for example, the electronic component 168 actually when soldering. If the applied pressure is smaller than the applied pressure, it can be determined that the vertical displacement does not exceed the reference amount. In this case, the pressing force actually applied to the electronic component 168 is the reference amount for determining the positional deviation.

Further, it is also possible to determine the positional deviation of the tip portions 180 of the lead wires 178 in the horizontal direction by determining whether or not the distance between the tip portions 180 adjacent to each other deviates from a certain range. The fixed range of is the reference amount for determining the positional deviation in the horizontal direction.

Further, instead of pressing the electronic component 168 against the printed circuit board 42 with a constant force and soldering with the lead wire 178 bent, the mounting head 14 is placed at a predetermined height position (generally, a print position is set). Solder in a state where it is lowered to a position perpendicular to the plate surface of the board 42), or lowered to a position which is a predetermined distance above the measured actual height position of the printed board 42. In this case, it is necessary to detect the positional deviation of the tip end portion 180 of the lead wire 178 in the vertical direction (generally a right angle direction) with reference to a predetermined fixed position. Become.

Further, when there is a shift in the vertical or horizontal position of the tip 180 of the lead wire 178, the lead wire 178 may be corrected and mounted on the printed circuit board 42. In this case, the electronic component 168 is corrected after detection. Transport to equipment.

Furthermore, the present invention can also be applied to a mounting device in which a mounting head is fixedly provided and a printed circuit board, an electronic component supply device, etc. are moved to supply and mount the electronic component 168.

In addition, although not exemplified, the present invention can be implemented in various modified and improved modes based on the knowledge of those skilled in the art.

[Brief description of drawings]

FIG. 1 is a front view schematically showing a lead wire detecting device of an electronic component mounting apparatus which is an embodiment of the present invention. FIG. 2 is a perspective view showing a state in which the lead wire detecting device detects a lead wire. FIG. 3 is a side view (partial cross section) showing the lead wire detecting device together with a moving mechanism. FIG. 4 is a front sectional view showing a detecting element of the lead wire detecting device.
FIG. 5 is a plan view showing the mounting apparatus. FIG. 6 is a front view of the mounting apparatus, and FIG. 7 is a side view. FIG. 8 is a front view showing a mounting head of the mounting apparatus,
FIG. 9 is a side view (partial cross section) thereof. FIG. 10 is a plan view showing electronic components mounted on a printed circuit board by the mounting apparatus, and FIG. 11 is a front view. FIG. 12 is a graph showing the relationship between the detection voltage output from the lead wire detection device and time. FIG. 13 is a diagram for explaining the calculation of the horizontal position of the tip portion of the lead wire based on the detection by the lead wire detection device. FIG. 14 is a diagram for explaining the calculation of the displacement of the main body of the electronic component with respect to the suction tool based on the detection of the lead wire detection device. 10, 11: Electronic component supply device 12: Extraction head, 14: Mounting head 16: Detection head 18: Printed circuit board transfer positioning device 42: Printed circuit board, 150: Suction tool 168: Electronic component, 176: Main body 178: Lead wire, 180: Tip 200, 202: Lead wire detection device 232: Laser emitter, 236: Detection element 244: Control device

Claims (5)

[Claims] 1. An electronic device of a type in which a large number of lead wires, each of which has to be located on one plane, are juxtaposed from a main body and the tip parts of the lead wires are soldered to a printed circuit of a printed circuit board. In an electronic component mounting apparatus for holding a component by a holding head and mounting it on a printed circuit board, a detection wave is emitted in a direction intersecting with the one plane in a state where the electronic component is held by the holding head, and the plurality of lead wires are provided. A detection wave emitting device that applies a spot smaller than the width of each of the tip parts of each of the tip parts, and a reflected wave from each of the tip parts of the detection wave, in a direction perpendicular to the one plane of the tip parts. The wave receiving device that outputs an electric signal that changes depending on the position, the detected wave emitting device and the wave receiving device, and the component holding head are placed in a direction parallel to the arrangement direction of the plurality of lead wires. The relative movement causes the spot hit by the detection wave emitted from the detection wave emission device to move sequentially across the many lead wires, and the movement device that emits the wave from the reception device during movement by the movement device. A determination device that determines whether or not the positions of the tip portions of the plurality of lead wires in the direction perpendicular to the one plane are deviated by a reference amount or more based on the electric signal generated. Component mounting equipment. 2. In the wave receiving device, the positions of the respective tip portions in the direction parallel to the one plane are determined based on the reflected waves from the respective tip portions of the plurality of lead wires in a direction perpendicular to the one plane. A distinction detecting means for detecting the position separately from the position is provided, and
2. The determining device is provided with means for determining whether or not the position of the tip portion in the direction parallel to the one plane deviates from the reference amount by a reference amount or more. Electronic component mounting apparatus described. 3. In the wave receiving device, the positions of the respective tip portions in the direction parallel to the one plane based on the reflected waves from the respective tip portions of the plurality of lead wires are the positions in the direction perpendicular to the one plane. The electronic component mounting apparatus is provided with a distinction detection means for detecting the distinction from the above-mentioned one plane with respect to the mounting head of the main body based on the detected position of each tip in the direction parallel to the one plane. 2. The electronic component mounting apparatus according to claim 1, further comprising means for determining a positional deviation in a direction parallel to the. 4. The detection wave emitting device and the wave receiving device,
The axes of both of these devices are arranged relatively inclined so that the tip ends of the lead wires intersect each other in the vicinity of a plane where the tips of the lead wires should be located, and the wave receiving device changes the incident position of the reflected wave. According to the detection device for outputting an electric signal whose magnitude changes, the determination device is based on the magnitude of the electric signal from the detection element, and is arranged on the one plane of the tip portions of the plurality of lead wires. It is for determining whether or not the position in the direction at right angles is deviated by a reference amount or more, and the distinction detection means is based on the interval of the abrupt change time of the electric signal from the detection element, and the plurality of lead wires. The electronic component mounting apparatus according to claim 2 or 3, which detects a position of each of the tip ends in a direction parallel to the one plane. 5. The detection wave emitting device is arranged such that its axis is orthogonal to a plane on which the tips of the plurality of lead wires should be located, and the wave receiving device has an axis thereof. 5. The electronic component mounting apparatus according to claim 4, wherein the tip end of the lead wire is arranged so as to obliquely intersect with a plane on which the lead wire should be located.