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JPH077859B2 - Laser processing equipment - Google Patents
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JPH077859B2 - Laser processing equipment - Google Patents

Laser processing equipment

Info

Publication number
JPH077859B2
JPH077859B2 JP60171562A JP17156285A JPH077859B2 JP H077859 B2 JPH077859 B2 JP H077859B2 JP 60171562 A JP60171562 A JP 60171562A JP 17156285 A JP17156285 A JP 17156285A JP H077859 B2 JPH077859 B2 JP H077859B2
Authority
JP
Japan
Prior art keywords
laser
output
processing
condenser lens
laser processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60171562A
Other languages
Japanese (ja)
Other versions
JPS6231184A (en
Inventor
統吾 西岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP60171562A priority Critical patent/JPH077859B2/en
Publication of JPS6231184A publication Critical patent/JPS6231184A/en
Publication of JPH077859B2 publication Critical patent/JPH077859B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment
    • B23K26/705Beam measuring devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Lasers (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)

Description

【発明の詳細な説明】 産業上の利用分野 本発明はレーザ光により被加工物を加工するレーザ加工
装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing apparatus for processing a workpiece with laser light.

従来の技術 従来例を第2図を用いて説明する。2. Description of the Related Art A conventional example will be described with reference to FIG.

レーザ加工を行なう場合、レーザ発振器1より取り出し
たレーザ光5を全反射ミラー2等により加工テーブル4
まで導き、集光レンズ3により集光し、加工テーブル4
上の被加工物6に照射し、加工を行なう。
When performing laser processing, the laser light 5 extracted from the laser oscillator 1 is processed by the total reflection mirror 2 and the like on the processing table 4
To the processing table 4
The upper workpiece 6 is irradiated and processed.

その場合、被加工物6の種類により、加工条件が異な
る。つまり、連続出力のレーザ光を用いる場合や、パル
ス出力のレーザ光を用いる場合がある。また形状により
連続出力とパルス出力を組合せる事もある。さらに連続
出力においてもパルス出力においても出力レベルを調整
する必要がある。つまり出力が少なければ加工が不十分
となりまた大きすぎても加工状態が悪くなるのである。
In that case, the processing conditions differ depending on the type of the workpiece 6. That is, continuous output laser light may be used, or pulse output laser light may be used. Depending on the shape, continuous output and pulse output may be combined. Furthermore, it is necessary to adjust the output level in both continuous output and pulse output. That is, if the output is small, the processing becomes insufficient, and if the output is too large, the processing state deteriorates.

そこでレーザ発振器には出力調整要素がたいてい設けら
れている。ガスレーザ発振器の場合は、放電電流値を可
変にすることによりレーザ出力レベルをコントロールす
ることが多い。
Therefore, the laser oscillator is usually provided with an output adjusting element. In the case of a gas laser oscillator, the laser output level is often controlled by making the discharge current value variable.

発明が解決しようとする問題点 一般にレーザ加工装置を作成した場合、第3図に示す様
なレーザ出力特性をチェックする。第3図の場合は、放
電電流とレーザ出力の関係を示している。この様な特性
から、被加工物の種類,加工形状により、レーザ出力を
あるレベルに設定するため放電電流をいくらかにするか
を決めるのである。しかし、この場合、レーザ発振器の
経年的出力低下、及び全反射鏡,集光レンズ等の光学系
の汚染等による出力損失等から、第3図において、当初
イの出力特性が、ロの出力特性へと変化した場合、従来
設定の放電電流値では、加工に必要なレーザ出力が得ら
れていないことになる。
Problems to be Solved by the Invention Generally, when a laser processing apparatus is produced, the laser output characteristics as shown in FIG. 3 are checked. In the case of FIG. 3, the relationship between the discharge current and the laser output is shown. From such characteristics, depending on the type and shape of the work piece, it is determined what the discharge current should be to set the laser output to a certain level. However, in this case, due to the output reduction of the laser oscillator over time, the output loss due to the contamination of the optical system such as the total reflection mirror, the condenser lens, etc., the initial output characteristic in FIG. If the value changes to, it means that the laser output required for processing cannot be obtained with the discharge current value set in the related art.

問題を解決するための手段 そこで本発明では、問題を解決するための手段として、
レーザ発振器より取り出したレーザ光を、全反射ミラー
等の光学系により加工テーブルまで導き、集光レンズに
より集光し、加工テーブル上の被加工物に照射し加工す
るレーザ加工装置において、集光レンズ通過後のレーザ
光の出力を測定するレーザ出力測定装置及び、レーザ出
力調整要素(放電電流等)とレーザ出力の相互関係を分
析するコントロール部を有するものである。
Therefore, in the present invention, as means for solving the problem,
In a laser processing device that guides laser light extracted from a laser oscillator to a processing table by an optical system such as a total reflection mirror, collects it with a condenser lens, and irradiates and processes a workpiece on the processing table. It has a laser output measuring device for measuring the output of the laser beam after passing, and a control part for analyzing the mutual relation between the laser output adjusting element (discharge current etc.) and the laser output.

作用 上記構成により、加工点でのレーザ出力を均一にできる
ことから、常に同一加工条件が満たされ、加工品質の向
上,加工ミスの解消がはかれる。
Operation With the above configuration, the laser output at the processing point can be made uniform, so that the same processing conditions are always satisfied, the processing quality is improved, and processing errors are eliminated.

実施例 本発明の一実施例を第1図により説明する。レーザ発振
器1より取り出されたレーザ光5は全反射鏡2等により
加工テーブル4まで導かれ、集光レンズ3で集光され加
工テーブル4上に設置された被加工物6に照射され、加
工を行なう。レーザ出力測定器7は、可動形であり、加
工する前に、集光レンズ3下へ移動させる。コントロー
ル部8により第3図の様な出力特性がチェックされ、当
初の出力特性に一致させるための補正を行なう。チェッ
ク終了後、作業者が従来の加工条件をセットすれば、コ
ントロール部8から校正された信号が、レーザ発振器1
に送られ、従来と同一レーザ出力で加工が行なえること
になる。
Embodiment An embodiment of the present invention will be described with reference to FIG. The laser beam 5 extracted from the laser oscillator 1 is guided to the processing table 4 by the total reflection mirror 2 and the like, is condensed by the condenser lens 3 and is irradiated to the workpiece 6 placed on the processing table 4, and the machining is performed. To do. The laser output measuring instrument 7 is movable, and is moved below the condenser lens 3 before processing. The control unit 8 checks the output characteristic as shown in FIG. 3, and performs correction to match the original output characteristic. After the check, if the operator sets the conventional processing conditions, the calibrated signal from the control unit 8 is the laser oscillator 1
It will be processed with the same laser output as before.

発明の効果 以上のように本発明によれば、安定した加工を行なうた
めに不可欠な加工点でのレーザ出力の安定性が得られる
ことや、不具合発生(出力低下)時に、その原因がレー
ザ発振器か外部光学系かを容易に判断することができる
ことから、レーザ加工の信頼性向上に大きく寄与する優
れた効果を奏するものである。
EFFECTS OF THE INVENTION As described above, according to the present invention, it is possible to obtain the stability of the laser output at the processing point, which is indispensable for performing stable processing, and the cause is the laser oscillator when a defect occurs (output is reduced). Since it can be easily determined whether it is an external optical system or not, it has an excellent effect that greatly contributes to the improvement of the reliability of laser processing.

【図面の簡単な説明】[Brief description of drawings]

第1図は本発明の一実施例を示すレーザ加工装置の概略
構成図、第2図は従来例のレーザ加工装置の概略構成
図、第3図は放電電流とレーザ出力の特性を示した特性
図である。 1……レーザ発振器、2……全反射鏡、3……集光レン
ズ、4……加工テーブル、5……レーザ光、6……被加
工物、7……レーザ出力測定器、8……コントロール
部。
FIG. 1 is a schematic configuration diagram of a laser processing apparatus showing one embodiment of the present invention, FIG. 2 is a schematic configuration diagram of a conventional laser processing apparatus, and FIG. 3 is a characteristic showing characteristics of discharge current and laser output. It is a figure. 1 ... Laser oscillator, 2 ... Total reflection mirror, 3 ... Condensing lens, 4 ... Processing table, 5 ... Laser light, 6 ... Workpiece, 7 ... Laser output measuring instrument, 8 ... Control section.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】レーザ発振器より取り出したレーザ光を、
全反射ミラー等の光学系により加工テーブルまで導き、
集光レンズにより集光し、前記加工テーブル上の被加工
物に照射し、加工するレーザ加工装置において、加工前
に前記集光レンズを通過後のレーザ光の出力を測定する
位置に移動するレーザ出力測定器を具備し、放電電流等
のレーザ出力調整要素とレーザ出力の相互関係を分析す
るコントロール部を具備したことを特徴とするレーザ加
工装置。
1. A laser beam extracted from a laser oscillator,
An optical system such as a total reflection mirror leads to the processing table,
In a laser processing device that collects light with a condenser lens, irradiates the workpiece on the processing table, and processes the laser, a laser that moves to a position where the output of the laser light after passing through the condenser lens before processing is measured. A laser processing apparatus comprising an output measuring device and a control unit for analyzing a mutual relation between a laser output adjusting element such as a discharge current and a laser output.
JP60171562A 1985-08-02 1985-08-02 Laser processing equipment Expired - Lifetime JPH077859B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60171562A JPH077859B2 (en) 1985-08-02 1985-08-02 Laser processing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60171562A JPH077859B2 (en) 1985-08-02 1985-08-02 Laser processing equipment

Publications (2)

Publication Number Publication Date
JPS6231184A JPS6231184A (en) 1987-02-10
JPH077859B2 true JPH077859B2 (en) 1995-01-30

Family

ID=15925436

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60171562A Expired - Lifetime JPH077859B2 (en) 1985-08-02 1985-08-02 Laser processing equipment

Country Status (1)

Country Link
JP (1) JPH077859B2 (en)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58223391A (en) * 1982-06-22 1983-12-24 Nec Corp Gas laser device
JPS6028290A (en) * 1983-07-27 1985-02-13 Nec Corp Argon gas laser

Also Published As

Publication number Publication date
JPS6231184A (en) 1987-02-10

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