JPH0779124B2 - Wafer carrier - Google Patents
Wafer carrierInfo
- Publication number
- JPH0779124B2 JPH0779124B2 JP3382186A JP3382186A JPH0779124B2 JP H0779124 B2 JPH0779124 B2 JP H0779124B2 JP 3382186 A JP3382186 A JP 3382186A JP 3382186 A JP3382186 A JP 3382186A JP H0779124 B2 JPH0779124 B2 JP H0779124B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- carrier
- rib
- maximum diameter
- outside
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 235000012431 wafers Nutrition 0.000 claims description 63
- 230000008878 coupling Effects 0.000 description 5
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 101100334001 Caenorhabditis elegans rib-1 gene Proteins 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 101150098638 RNASE1 gene Proteins 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Packaging Frangible Articles (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は半導体工業で取扱うシリコン等からなるウェハ
ーの加工、貯蔵、運搬の際に使用するウェハーキャリャ
ーに関する。TECHNICAL FIELD The present invention relates to a wafer carrier used for processing, storing and transporting a wafer made of silicon or the like handled in the semiconductor industry.
半導体工業で取扱うシリコン等からなるウェハーは高価
であり、しかももろく、また直径10cm以上、厚み0.2mm
以下のものが普通であるため、ウェハーの加工、貯蔵、
運搬に使用されるキャリャーにはウェハーの保持、ウェ
ハー相互の隔離、加熱、および薬液による洗浄後の形状
保持等の特性を必要とする。Wafers made of silicon, etc. handled in the semiconductor industry are expensive, fragile, and have a diameter of 10 cm or more and a thickness of 0.2 mm.
Since the following are common, wafer processing, storage,
The carrier used for transportation needs characteristics such as holding wafers, separating wafers from each other, heating, and maintaining shape after cleaning with a chemical solution.
然るに従来、加熱または薬液による洗浄後、キャリャー
の形状、特にウェハー相互を隔離する部分が微妙に変化
する為、ウェハーの取出し、挿入に支障をきたし、ウェ
ハーの破損、製品の分どまり低下などの問題があった。However, conventionally, after heating or cleaning with chemicals, the shape of the carrier, especially the part that isolates the wafers from each other, changes subtly, which hinders the removal and insertion of the wafers, causing damage to the wafers and lowering of product retention. was there.
本発明はウェハーの加工、貯蔵、運搬の際に使用するウ
ェハーキャリャーにおいて、加熱または薬液に浸たされ
ても形状に変化がなく、ウェハーを容易に取出し、挿入
しうる新しいウェハーキャリャーに関する。The present invention relates to a wafer carrier used for processing, storing, and transporting wafers, which does not change its shape even when it is heated or immersed in a chemical solution, and can easily take out and insert a wafer.
本発明者らは前記の問題点を解決するため各種検討した
結果、キャリャーの形状として、各ウエハーの主面が垂
直面となり、かつ、平行となるようにウエハーを装着
し、該ウエハーを両側方より支持するための向きあった
側壁（および）と、ウエハーを挿入および取出すた
めの開放頂部面（Ａ）、並びに両側壁（および）の
各前端間及び同後端間を連結する結合部（、および
）よりなるウエハーキヤリヤーであって、該側壁（
および）は、 （１）．各ウエハーを相互に隔離するリブ（）、 （２）．各リブ（）を相互に固定するフランジ（お
よび）、 （３）．ウエハーがキヤリヤー外に突出する事を防ぐ保
持部（および）及び （４）．開放頂部の面（Ａ）を上方に向けた際にウエハ
ーを下方から支持するための取はずし可能な支持部
（）よりなり、 当該ウエハーキヤリヤーの側壁（および）を構成す
るリブ（）は、 （５）．開放頂部の面（Ａ）に平行な断面（第４図）に
おいて、該リブの中央部に最大径の部分（−３）を有
し、 （６）．最大径部よりキヤリヤーの外側のリブ面とウエ
ハーの主面とが特定の角度（θ2）をなし、かつ、最大
径部よりキャリヤーの内側のリブ面とウエハーの主面と
が特定の角度（θ1）をなすようにリブ面がキャリヤー
の内側及び外側に向かってテーパーを有し、 （７）．最大径部よりキヤリヤーの内側のリブ面とウエ
ハーの主面とがなす角度（θ1）が１ないし20°であ
り、且つ （８）．上記の当該リブの断面巾の最大径部（−３）
からのキヤリヤーの内側へのリブ長さ（l1）と外側への
リブ長さ（l2）の比（l1/l2）が６以下であることを特
徴とするウエハーキヤリヤーにより本発明を完成するに
至った。As a result of various studies to solve the above-mentioned problems, the present inventors mounted the wafers such that the main surfaces of the respective wafers were vertical and parallel to each other as the shape of the carrier, and the wafers were mounted on both sides. The side walls (and) facing each other for better support, the open top surface (A) for inserting and removing the wafer, and the joints (,) connecting the front ends and the rear ends of the side walls (and) with each other. And a wafer carrier comprising the side wall (
And) are (1). Ribs () for isolating each wafer from each other, (2). Flange (and) for fixing each rib () to each other, (3). Holding parts (and) and (4) to prevent the wafer from protruding outside the carrier. The rib (), which comprises a removable support part () for supporting the wafer from below when the surface (A) of the open top is directed upward, and which constitutes the side wall (and) of the wafer carrier, (5). In a cross section (Fig. 4) parallel to the surface (A) of the open top portion, a portion (-3) having the maximum diameter is provided in the central portion of the rib, (6). The rib surface outside the carrier from the maximum diameter portion and the main surface of the wafer form a specific angle (θ 2 ), and the rib surface inside the carrier from the maximum diameter portion and the main surface of the wafer form a specific angle ( The rib surface has a taper toward the inside and outside of the carrier so as to form θ 1 ), and (7). The angle (θ 1 ) formed by the rib surface on the inner side of the carrier from the maximum diameter portion and the main surface of the wafer is 1 to 20 °, and (8). The maximum diameter part (-3) of the cross-sectional width of the rib
The present invention provides a wafer carrier characterized in that the ratio (l 1 / l 2 ) of the rib length (l 1 ) to the inside of the carrier from ( 1 ) to the rib length (l 2 ) to the outside is 6 or less. Has been completed.
本発明によるキャリャーは軸線方向に整合したウェハー
をその間に支持するための向きあった側壁と、ウェハー
を挿入、および取出すための開放頂部および側壁間を連
結する結合部よりなり、第１図は本発明のウェハーキャ
リャーの開放頂部からの上面図、第２図は結合部側から
の正面図、第３図は側壁側からの側面図で、一部側壁の
内側を示したものであり、対抗する平行な側壁、、
側壁を結ぎ合わせる結合部、、からなり、側壁は
ウェハーを相互に隔離するリブ、リブを相互に固定す
るフランジ、、ウェハーがキャリャーの外部に突出
することを防ぐ保持部、、ウェハーを支持するため
の支持部、および端部よりなり、さらに該支持部は
ビス等により固定されており、使用条件によっては取り
はずし可能である。The carrier according to the present invention comprises side walls facing each other for supporting an axially aligned wafer therebetween, an open top for inserting and removing the wafer, and a coupling part for connecting the side walls. A top view from the open top of the wafer carrier of the invention, FIG. 2 is a front view from the side of the coupling part, and FIG. 3 is a side view from the side wall side, showing the inside of part of the side wall. Parallel side walls,
The side wall is connected to each other, and the side wall is a rib for separating the wafers from each other, a flange for fixing the ribs to each other, a holding portion for preventing the wafer from protruding to the outside of the carrier, and a wafer for supporting the wafer. And a end portion, and the support portion is fixed by a screw or the like, and can be removed depending on use conditions.
次いで第４図は第３図の線Ａ−Ａにおける断面図であ
り、当該ウエハーキヤリヤーの側壁（および）を構
成するリブ（）は、 （１）．開放頂部の面（Ａ）に平行な断面（第４図）に
おいて、該リブの中央部に最大径の部分（−３）を有
し、 （２）．最大径部よりキヤリヤーの外側のリブ面とウエ
ハーの主面とが特定の角度（θ2）をなし、かつ、最大
径部よりキャリヤーの内側のリブ面とウエハーの主面と
が特定の角度（θ1）をなすようにリブ面がキャリヤー
の内側及び外側に向かってテーパーを有し、 （３）．最大径部よりキヤリヤーの内側のリブ面とウエ
ハーの主面とがなす角度（θ1）が１ないし20°であ
り、且つ （４）．上記の当該リブの断面巾の最大径部（−３）
からのキヤリヤーの内側へのリブ長さ（l1）と外側への
リブ長さ（l2）の比（l1/l2）が６以下である。Next, FIG. 4 is a sectional view taken along the line AA in FIG. 3, and the ribs () forming the side walls (and) of the wafer carrier are (1). In a cross section (Fig. 4) parallel to the surface (A) of the open top portion, a portion (-3) having the maximum diameter is provided in the central portion of the rib, (2). The rib surface outside the carrier from the maximum diameter portion and the main surface of the wafer form a specific angle (θ 2 ), and the rib surface inside the carrier from the maximum diameter portion and the main surface of the wafer form a specific angle ( The rib surface has a taper toward the inside and outside of the carrier so as to form θ 1 ), and (3). The angle (θ 1 ) formed by the rib surface on the inner side of the carrier from the maximum diameter portion and the main surface of the wafer is 1 to 20 °, and (4). The maximum diameter part (-3) of the cross-sectional width of the rib
The ratio of the rib length to the inner Kiyariya from (l 1) and the rib length to the outside (l 2) (l 1 / l 2) is 6 or less.
即ち内面に向ってテーパーが１°以内である場合には内
蔵されるウェハーのスムースな移動に効果がなく、逆に
テーパーを20°以上にした場合、ウェハーのスムースな
移動には効果的であるが、逆にウェハーの保持が不安定
になり好ましくない。またl1/l2が６以上であると側壁
自身の寸法保持がわるくなり、ウェハーのスムースな移
動を困難にする為、好ましくない。以上のようにキャリ
ャーの内向き部−１が内面に向って１ないし20°のテ
ーパーを有し、リブの断面巾の最大部位−３からキ
ャリャーの内側の長さl1と外側の長さl2の比l1/l2が６
以下にすることにより、内蔵されるウェハーのスムース
な移動、キャリャーの成形のし易すさ、およびキャリャ
ーが外力、高温等にさらされた場合の変化防止の役割を
している。That is, when the taper toward the inner surface is within 1 °, there is no effect on the smooth movement of the built-in wafer, and conversely, when the taper is 20 ° or more, it is effective on the smooth movement of the wafer. However, on the contrary, the holding of the wafer becomes unstable, which is not preferable. Further, when l 1 / l 2 is 6 or more, the dimension of the side wall itself is poorly maintained, which makes smooth movement of the wafer difficult, which is not preferable. As described above, the inward portion -1 of the carrier has a taper of 1 to 20 ° toward the inner surface, and from the maximum portion -3 of the cross-sectional width of the rib to the inner length l 1 and outer length l of the carrier. 2 ratio l 1 / l 2 6
By the following, it plays a role of smooth movement of the built-in wafer, easiness of molding of the carrier, and prevention of change when the carrier is exposed to external force, high temperature and the like.
第５図は同じく第３図の線Ｂ−Ｂの断面図である。図５
はフランジ、保持部、および支持部を示した
ものである。保持部、の位置および数はキャリャー
に収納するウェハーの径、厚み、種類により適宜定めら
れるが、保持部の数は少くとも１本以上必要であるが、
ガスまたは液のキャリャー側壁をとおしての流通の自由
度を高めるため等により必要最少限にする事が好まし
い。支持部の位置、形状、もキャリャーの使用条件、
収納するウェハーの形状、重量等により定められるが、
収納するウェハーの安定な保持等の面より、支持部の位
置は側壁の開放頂部より3/4前後の位置が好ましい。FIG. 5 is a sectional view taken along the line BB of FIG. Figure 5
Shows a flange, a holding portion, and a supporting portion. The position and the number of holding portions are appropriately determined depending on the diameter, thickness, and type of the wafer to be stored in the carrier, but the number of holding portions is at least one or more.
It is preferable to minimize the required amount by, for example, increasing the degree of freedom of circulation of the gas or liquid through the carrier side wall. The position and shape of the support, the usage conditions of the carrier,
Depending on the shape and weight of the wafers to be stored,
From the standpoint of stable holding of stored wafers, the position of the supporting portion is preferably about 3/4 of the open top of the side wall.
さらに、本発明で云うウェハーキャリャーは、それ自体
の運搬、移送等の目的で、結合部、、を有する面
等に、ハンドル、把手などをとりつける事も可能であ
る。Further, in the wafer carrier referred to in the present invention, a handle, a handle and the like can be attached to the surface having the coupling portion, for the purpose of transporting and transferring the wafer carrier.
本発明によるウェハーキャリャーには従来公知の材料、
例えばポリプロピレン等の汎用樹脂、又はテトラフルオ
ロエチレン等のフッ素樹脂、アルミニウムにフッ素樹脂
を被覆した材料、さらにはガラス転移温度140℃以上の
樹脂、例えばポリエーテルエーテルケトン、液晶性芳香
族ポリエステルも好適である。Conventionally known materials for the wafer carrier according to the present invention,
For example, general-purpose resins such as polypropylene, or fluororesins such as tetrafluoroethylene, materials obtained by coating aluminum with fluororesins, and resins having a glass transition temperature of 140 ° C. or higher, such as polyether ether ketone and liquid crystalline aromatic polyester are also suitable. is there.
第１図は本発明のウェハーキャリャーの開放頂部からの
上面図、第２図は結合部側からの正面図、第３図は側壁
側からの側面図で、一部側壁の内側を示したものであ
る。第４図は軸線方向（ａ−ａ′方向）における第３図
の線Ａ−Ａにおける断面図で、第５図は同じく第３図の
線Ｂ−Ｂの断面図である。 尚、図中の番号はそれぞれ次の部位を示す。 、……側壁 、、……結合部 ……リブ −１……リブの最大径部からキヤリヤーの内側に向か
うリブ壁の断面 −２……リブの最大径部からキヤリヤーの外側に向か
うリブ壁の断面 −３……リブの最大径の部分の断面 、……フランジ 、……保持部 ……支持部、……端部 ……ウエハー装着のためのスリット部 Ａ面……ウエハーキヤリヤーの開放頂部の面 ａ−・−ａ′……軸線方向FIG. 1 is a top view from the open top of the wafer carrier of the present invention, FIG. 2 is a front view from the side of the coupling portion, and FIG. 3 is a side view from the side wall side, showing a part of the inside of the side wall. It is a thing. 4 is a sectional view taken along the line AA of FIG. 3 in the axial direction (direction aa '), and FIG. 5 is a sectional view taken along the line BB of FIG. The numbers in the figure indicate the following parts, respectively. , ...... Side wall, ...... Coupling part ...... Rib -1 ... Cross section of rib wall that goes from the maximum diameter part of the rib to the inside of the carrier -2 ... Of rib wall that goes from the maximum diameter part of the rib to the outside of the carrier Cross-section-3: Cross-section of the maximum diameter of ribs: Flange: Holding part: Supporting part: End part: Slit part for wafer mounting A side: Open top part of wafer carrier Surface a- ・ -a '... Axial direction
Claims (1)
平行となるようにウエハーを装着し、該ウエハーを両側
方より支持するための向きあった側壁（および）
と、ウエハーを挿入および取出すための開放頂部面
（Ａ）、並びに両側壁（および）の各前端間及び同
後端間を連結する結合部（、および）よりなるウ
エハーキヤリヤーであって、該側壁（および）は、 （１）．各ウエハーを相互に隔離するリブ（）、 （２）．各リブ（）を相互に固定するフランジ（お
よび）、 （３）．ウエハーがキヤリヤー外に突出する事を防ぐ保
持部（および）及び （４）．開放頂部の面（Ａ）を上方に向けた際にウエハ
ーを下方から支持するための取はずし可能な支持部
（）よりなり、 当該ウエハーキヤリヤーの側壁（および）を構成す
るリブ（）は、 （５）．開放頂部の面（Ａ）に平行な断面（第４図）に
おいて、該リブの中央部に最大径の部分（−３）を有
し、 （６）．最大径部よりキヤリヤーの外側のリブ面とウエ
ハーの主面とが特定の角度（θ2）をなし、かつ、最大
径部よりキャリヤーの内側のリブ面とウエハーの主面と
が特定の角度（θ1）をなすようにリブ面がキャリヤー
の内側及び外側に向かってテーパーを有し、 （７）．最大径部よりキヤリヤーの内側のリブ面とウエ
ハーの主面とがなす角度（θ1）が１ないし20°であ
り、且つ （８）．上記の当該リブの断面巾の最大径部（−３）
からのキヤリヤーの内側へのリブ長さ（l1）と外側への
リブ長さ（l2）の比（l1/l2）が６以下である ことを特徴とするウエハーキヤリヤー。1. The main surface of each wafer is a vertical surface, and
Side walls (and) facing each other for mounting the wafers in parallel and supporting the wafers from both sides.
And an open top surface (A) for inserting and removing a wafer, and a connecting portion (and) connecting between front ends and rear ends of both side walls (and), the wafer carrier comprising: The side walls (and) are (1). Ribs () for isolating each wafer from each other, (2). Flange (and) for fixing each rib () to each other, (3). Holding parts (and) and (4) to prevent the wafer from protruding outside the carrier. The rib (), which comprises a removable support part () for supporting the wafer from below when the surface (A) of the open top is directed upward, and which constitutes the side wall (and) of the wafer carrier, (5). In a cross section (Fig. 4) parallel to the surface (A) of the open top portion, a portion (-3) having the maximum diameter is provided in the central portion of the rib, (6). The rib surface outside the carrier from the maximum diameter portion and the main surface of the wafer form a specific angle (θ 2 ), and the rib surface inside the carrier from the maximum diameter portion and the main surface of the wafer form a specific angle ( The rib surface has a taper toward the inside and outside of the carrier so as to form θ 1 ), and (7). The angle (θ 1 ) formed by the rib surface on the inner side of the carrier from the maximum diameter portion and the main surface of the wafer is 1 to 20 °, and (8). The maximum diameter part (-3) of the cross-sectional width of the rib
The wafer carrier, wherein the ratio (l 1 / l 2 ) of the rib length (l 1 ) from the inside to the outside rib length (l 2 ) of the carrier is 6 or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3382186A JPH0779124B2 (en) | 1986-02-20 | 1986-02-20 | Wafer carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3382186A JPH0779124B2 (en) | 1986-02-20 | 1986-02-20 | Wafer carrier |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62193258A JPS62193258A (en) | 1987-08-25 |
| JPH0779124B2 true JPH0779124B2 (en) | 1995-08-23 |
Family
ID=12397147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3382186A Expired - Fee Related JPH0779124B2 (en) | 1986-02-20 | 1986-02-20 | Wafer carrier |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0779124B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0422929U (en) * | 1990-06-14 | 1992-02-25 |
-
1986
- 1986-02-20 JP JP3382186A patent/JPH0779124B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62193258A (en) | 1987-08-25 |
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