JPH0780280B2 - Molded resin containing chlorine - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial field of application) The present invention relates to a molded product of a chlorine-containing resin, and is particularly suitable for use as a manufacturing facility for electronic parts such as semiconductors, a packaging container, and its equipment case. Chlorine-containing resin molded product.

(Prior Art) Vinyl chloride (hereinafter abbreviated as PVC) resin, which is a typical example of chlorine-containing resin, is widely used as a synthetic resin molded product because it is inexpensive, tough, and has excellent chemical resistance and secondary workability. Has been. Due to the characteristics of the resin structure of the PVC resin, H and Cl chlorine are liberated and dehydrochlorinated due to the temperature during molding, and the molded product turns yellow or black, so a stabilizer for PVC resin is added to the resin material in advance. Generally, it is added. As such stabilizers, stabilizers of Pb or Sn-based metal compounds have been mainly used, and similar metal-based stabilizers have been used in chlorine-containing resins other than PVC.

(Problems to be solved by the invention) By the way, although the development of electronic parts mainly composed of approximate semiconductors is remarkable, manufacturing facilities of such semiconductors, packaging containers for semiconductor parts, and cases of equipment using the semiconductors It is well known that synthetic resin molded products have come to be used for related equipment such as. Such manufacturing equipment must be subjected to various treatments during the process, and the packaging container, equipment case, etc. must also be subjected to treatment such as pickling or water washing. The chlorine-containing resin containing the metal compound as a stabilizer is used for high-quality semiconductors such as 1-megabit semiconductors because these metal elements are eluted during the above treatment and adversely affect electronic parts and the like. It could not be used as a member. From such circumstances, there is a case where a fluororesin having extremely excellent thermal stability is used as the synthetic resin applied to the above-mentioned applications, but the fluororesin is expensive and undergoes secondary processing such as welding. Since it has the drawback of being difficult, it lacked versatility. Therefore, it has been strongly desired to apply the chlorine-containing resin, which does not have such a defect, to the above-mentioned use.

The present invention has been made in view of the above, and the surface of the above-mentioned conventional chlorine-containing resin (at least the surface on the side subjected to the above-mentioned treatment)
In addition, we will not provide a new chlorine-containing resin molded product that can be used extremely effectively and inexpensively for the above applications by laminating and integrating chlorine-containing resin stabilized with a stabilizer that does not contain metal elements such as Pb and Sn. To do.

(Means for Solving the Problems) The structure of the chlorine-containing resin molded product of the present invention for achieving the above object will be described with reference to the accompanying example drawings. FIG. 1 shows an example of the molded product of the present invention. The partial cutaway vertical sectional views, FIGS. 2, 3, and 3 are vertical sectional views of another embodiment, and FIG. 4 is a partially enlarged vertical perspective view of still another embodiment. That is,
The chlorine-containing resin molded product of the present invention is selected from a chlorine-containing resin base layer portion 1 stabilized by a metal-based stabilizer and a non-metal-based stabilizer such as aminocarboxylic acid, hydrazide, epoxy compound and organic phosphite ester. And a surface layer 2 of a chlorine-containing resin which is stabilized by any one or several of the above and which does not substantially contain a metal element, is laminated and integrated into a desired shape, and is used in a semiconductor component manufacturing process. It is characterized by being a chlorine-containing resin molded product for semiconductor packaging, packaging, or manufacturing-related equipment.

Here, the chlorine-containing resin common to the base layer part 1 and the surface layer part 2 is mainly vinyl chloride such as chlorinated vinyl chloride resin, ethylenized vinyl chloride resin, alloy with other resins, in addition to the above PVC resin. Refers to the resin. Although the degree of polymerization of such a chlorine-containing resin is variously selected, the processing temperature can be lowered and a low degree of polymerization which does not require heat resistance so much, for example, an average degree of polymerization of 700.
If you use ~ 800, the processing range is expanded and high quality molded products can be obtained. This resin having a low degree of polymerization is preferably used particularly when a transparent molded product is obtained.

The chlorine-containing resin forming the base layer part 1 is stabilized with a conventional stabilizer, and specific examples of the stabilizer include lead stearate, barium stearate, dibasic lead sulfate, Examples include metal stabilizers such as tribasic lead sulfate, octyltin mercapto, and butyltin malate, and other stabilizing aids, lubricants, UV absorbers, pigments and the like are added in the same manner as in the past.

On the other hand, the chlorine-containing resin forming the surface layer portion 2 is stabilized by the nonmetallic stabilizer as described above. Among the nonmetallic stabilizers, the aminocarboxylic acid is an amino group and a carboxylic acid group. Is a general term for compounds having and, as the compound having an amino group, ammonia, urea, acrylonitrile, aminoacetanilide, aminoanthraquinone,
Examples include aminoethanol, aminoethylene, aminoethylbenzene, aminocresol, aminophenol, caprolactam, and the like. Examples of the compound having a carboxylic acid group include butyric acid, caproic acid, lauric acid, palmitic acid, stearic acid, crotonic acid, and olein. Examples thereof include acids, linolenic acid, benzoic acid, naphthoic acid, malonic acid, succinic acid, adipic acid, maleic acid and phthalic acid. Further, as typical ones of aminocarboxylic acids which are these compounds, acetylglutamic acid, glycine, alaninepyrrolidonecarboxylic acid, lysine, alkynine, tryptophan, anthranilic acid, benzoic acid, β-
Aminocrotonic acid, α-aminoacrylic acid, α-aminoadipic acid, aminomaleic acid, acetylphenylalanine, acetylmethionine and ester compounds thereof, and ester compounds of acetylamino acid with pentaerythritol or dipentaerythritol, 2-pyrrolidone-5 -Ester compounds of carboxylic acid and pentaerythritol and the like can be mentioned. Among these aminocarboxylic acids, β-aminocrotonic acid ester has the general formula However, n; 1 to 6 R; is a residue of a monovalent to hexavalent alcohol. Further, specific examples of ROH) n constituting this ester include methanol, ethanol, propanol, isopropanol, butanol, and 2
-Ethylhexanol, isooctanol, octanol, isononanol, decanol, lauryl alcohol, myristyl alcohol, palmityl alcohol, stearyl alcohol, ethylene glycol, propylene glycol, 1,3-butanediol, 1,4-butanediol, 1,6- Hexanediol, 1,10-decanediol,
Diethylene glycol, thiodiethanol, trimethylolpropane, glycerin, tris (2-hydroxyethyl) isocyanurate, triethanolamine, pentaerythritol, ditrimethanolpropane, diglycerin, sorbitol, mannitol, xylitol,
Examples include dipentaerythritol. Then, these alcohols and β-aminocrotonic acid are polycondensed to obtain the above-mentioned ester, and preferred specific examples of the ester include stearyl alcohol β-aminocrotonic acid ester and 1,4 butanediol diβ-aminocrotonone. Acid ester, thiodiethanol β-aminocrotonic acid ester, trimethylolpropane triβ-aminocrotonic acid ester, pentaerythritol tetra β-aminocrotonic acid ester, dipentaerythritol hexaβ-
Amino crotonate ester etc. are mentioned.

The hydrazide is represented by the general formula RCONHNH ₂ (R is an alkyl group or an aryl group),
Specific examples thereof include acetohydrazide, butyric acid hydrazide, caproic acid hydrazide, lauric acid hydrazide, palmitic acid hydrazide, stearic acid hydrazide, crotonic acid hydrazide, oleic acid hydrazide, linolenic acid hydrazide, benzoic acid hydrazide, naphthoic acid hydrazide, and malonic acid. Hydrazides, succinic acid hydrazides, glutamic acid hydrazides, adipic acid hydrazides, maleic acid hydrazides, phthalic acid hydrazides and the like are used.

Further, examples of the epoxy compound include epoxy compounds such as epoxidized animal and vegetable oils, epoxidized fatty acid esters, epoxidized alicyclic compounds, glycidyl ether or glycidyl ester compounds, and epoxidized polymer compounds.
Specifically, as the epoxidized animal and vegetable oil, epoxidized soybean oil, epoxidized linseed oil, epoxidized safflower oil,
Epoxidized sunflower oil, epoxidized cottonseed oil, etc., as epoxidized fatty acid ester, epoxidized butyl stearate, epoxidized octyl octyl octylate, epoxidized linseed oil fatty acid butyl, etc., epoxidized alicyclic compound, epoxidized tetrahydro Phthalates (butanol, octanol, decanol, etc. as alcohols), glycidyl ether or glycidyl ester compounds such as bisphenol A glycidyl ether, glycidyl methacrylate and its polymers, epoxidized polymer compounds such as epoxidized polybutadiene, epoxidized acrylonitrile -Butadiene rubber and the like can be mentioned respectively.

Examples of the organic phosphite include triphenyl phosphite, tris (p-phenylphenyl) phosphite, tris (o-cyclohexylphenyl) phosphite, tris (p-nonylphenyl) phosphite,
Triaryl phosphites such as phenyl-p-nonylphenyl phosphite and tris (2,4 ditbutylphenyl) phosphite, alkyl aryl phosphites such as monoalkyldiphenyl phosphite and dialkylmonophenyl phosphite, glycols and polyols Oligophosphite or diphenyl amide
Acid phosphites such as phosphite and dilauryl amide phosphite are used.

As other non-metal stabilizers, phenol derivatives, polyhydric alcohols, nitrogen-containing compounds, sulfur-containing compounds and keto compounds are used. As the phenol derivative, hindered phenol, hindered bisphenol, etc. are used,
Examples of the polyhydric alcohol include glycerin, mannitol, xylitol, trimethylolpropane, pentaerythritol, sorbitol, polyethylene glycol, sorbitan monolaurate, glycerin monostearate and partial esterification products with carboxylic acid, nitrogen-containing polyhydric alcohol, sulfur-containing polyhydric alcohol. Dihydric alcohols and the like are used, as the nitrogen-containing compound, 2-phenylindole, diphenylthiourea, triazine and the like are used, and as the sulfur-containing compound, thiodipropionic acid ester, triazinethiol, thiolcarboxylic acid anhydride and the like. As the keto compound, acetoacetate ester, dehydroacetic acid, β-diketone and the like are adopted.

These stabilizers mainly add 0.5 to 7.0 parts by weight to 100 parts by weight of the chlorine-containing resin to mainly stabilize the chlorine-containing chlorine-containing resin, but these stabilizers contain metal elements such as Pb and Sn. Characterized by the fact that nothing is included. The proper amount of the stabilizer added to the chlorine-containing resin is as described above, but if it is less than 0.5 parts by weight, the thermal stability cannot be sufficiently obtained, while if it exceeds 7.0 parts by weight, the thermal stability is improved accordingly. However, it is economically disadvantageous. Among these stabilizers, aminocarboxylic acid, hydrazide, epoxy compound,
In the case of using organic astelphites alone or in combination,
In the range of 0.5 to 5 parts by weight, preferably 1.0 to 3.0 parts by weight, and 2 to 5 when the phenol derivative, polyhydric alcohol, nitrogen-containing compound, sulfur-containing compound, keto compound is used alone or in combination with the above stabilizer. It is used in an amount of 7 parts by weight, preferably 3 to 5 parts by weight. These stabilizers may be used alone or in combination,
When combined, a combination of an aminocarboxylic acid and an epoxy compound, a combination of an aminocarboxylic acid, an epoxy compound and an organic phosphite, a combination of a hydrazide, an epoxy compound and an organic phosphite, and a combination of an epoxy compound and an organic phosphite Etc. are preferably adopted.

Further, the above chlorine-containing resin contains higher fatty acids such as stearic acid in order to improve the release from the mold at the time of molding and to improve the finished appearance of the molded product (particularly, gloss and gloss). The so-called lubricant is added, but this higher fatty acid has a drawback that it lowers the deformation temperature (softening temperature, softening temperature) on the other hand. It is used. Examples of this acrylic lubricant include: A copolymer obtained by copolymerizing methyl methacrylate and acrylic acid ester and adding a surfactant ,. Methyl methacrylate copolymerized with a monomer mixture of acrylic or methacrylic acid ester and styrene ,. Examples of the acrylic acid ester and methacrylic acid ester include methyl methacrylate, ethyl acrylate, n-butyl acrylate, isobutyl acrylate, 2-hexyl acrylate, chloroethyl acrylate, and the like. Ethyl methacrylate, n-butyl methacrylate, n-ethylhexyl methacrylate, chloroethyl methacrylate, etc. are adopted. Anionic surfactants, cationic surfactants and nonionic surfactants are used as the surface active agents.

The stabilizer as described above contributes to the thermal stability of the chlorine-containing resin as a main stabilizer, and the lubricant imparts lubricity to the resin,
Other metal-free additives, such as amine-based, phenol-based, sulfur-based, phosphorus-based antioxidants, light stabilizers such as UV absorbers, phthalates, aromatic carboxylates, and aliphatic diesters. Plasticizer such as base ester, for transparency
Addition of additives such as ABS / MBS and other reinforcing agents, pigments, auxiliaries, antifungal agents, foaming agents, etc. to help stabilize the chlorine-containing resin, improve processability, and improve weather resistance. Mechanical properties can be improved or plasticized and foamed.

Furthermore, the molded article of the present invention is supplied as a transparent, semitransparent, or opaque molded article depending on the application, and is made semitransparent to opaque (hereinafter, these are collectively referred to as nontranslucent). Various colorants are used. Conventionally known coloring agents such as azo, anthraquinone, Sharney, tintin, etc. are used to color the chlorine-containing resin of the base layer part 1, but a metal is contained to color the chlorine-containing resin of the surface layer part 2. It suffices to add a non-organic pigment. To impart non-translucency, acrylic modified modifier, ABS resin (acrylonitrile-butadiene-styrene copolymer), MBS resin (methyl methacrylate-butadiene-styrene copolymer), AAS
Resin (acrylonitrile / acrylate / styrene copolymer), AES resin (acrylonitrile / polyethylene-
Polypropylene rubber / styrene copolymer), ACS resin (acrylonitrile / chlorinated polyethylene / styrene copolymer), AS resin (acrylonitrile / styrene copolymer), EVA resin (ethylene vinyl acetate copolymer), fluorine resin, chlorine It is possible to contain any one kind or several kinds of the non-metal colorants selected from chlorinated polyethylene and carbon black, but with respect to 100 parts by weight of the chlorine-containing resin, substances other than carbon black are 0.5 to 50 parts by weight in total. Carbon black is added in an amount of 0.01 to 3.0 parts by weight.
However, it is necessary to select this addition amount in various ways depending on the thickness of the molded product. That is, when the thickness is large, the light-transmissive property is obtained even if the addition amount is reduced. However, when the thickness is thin, the light-transmissive property must be increased to ensure the non-light-transmitting property. Among these non-translucency-imparting substances, the acrylic-modified modifier is a copolymer of acrylic acid ester and methyl methacrylate, a copolymer of alkyl acrylate and styrene, and then methyl methacrylate. Polymerization of methyl methacrylate, then copolymerization of acrylic acrylate and styrene, polymerization of methyl methacrylate, then polymerization of alkyl acrylate and styrene, and further polymerization of methyl methacrylate, butadiene and acrylic acid. Copolymerized with styrene, then graft-polymerized with methyl methacrylate, and then further polymerized with styrene, and with butadiene, acrylonitrile and styrene with copolymerized, then styrene was polymerized, further graft-polymerized with methyl methacrylate Was And the like of. Also,
Examples of the fluororesin include tetrafluoroethylene resin, perfluoro-alkoxy fluororesin, tetrafluoroethylene-6-fluoropropylene copolymer resin, tetrafluoroethylene-ethylene copolymer, trifluoroethylene chloride resin, and 2 fluororesin. Examples thereof include vinylidene chloride resin and vinyl monofluoride resin.

The chlorine-containing resins adjusted for the base layer portion 1 and the surface layer portion 2 as described above are laminated and integrated at the time of molding and molded into a desired shape. Here, the desired shape is a plate-like body as shown in FIG.
It includes the shape of the tubular body as shown in FIGS. 2 and 3, the box type case as shown in FIG. The molding method is a method in which the above-mentioned two types of chlorine-containing resin sheets or plates are fused and integrated by hot pressing or calender rolls, or the resin raw materials are simultaneously extruded and both are solidified together. The conventional synthetic resin laminating technique such as a method of injection molding and a method of injecting resin raw materials from different injection nozzles into the same mold to integrate them into each other are directly adopted.

Further, the surface layer portion 2 can be formed not only on the entire surface of the base layer portion 1, but also as a material for obtaining various structures by appropriately cutting this, for example, the plate-shaped body shown in FIG. In this case, it may be formed on both the upper and lower sides or on one side, and FIGS. 2 and 3 are used as pipes for feeding the chemical solution or the like of the manufacturing equipment. In such a case, the chemical solution is used. It is also possible to form the surface layer portion 2 only on the inner wall of the pipe that serves as a conduit for the above. On the other hand, as shown in FIG. 4, in the case of a box-shaped case used for semiconductor-related purposes, the surface layer portion 2 can be formed on the inner and outer surfaces.

(Function) In the molded product of the present invention obtained as described above, the temperature of the chlorine-containing resin becomes 150 to 200 ° C. at the time of molding, so that H and Cl of the resin structure are formed unless the stabilizer is contained in the resin. Are released and dehydrochlorinated, and the resin turns yellow or black. However, the chlorine-containing resin forming the surface layer portion 1 and the surface layer portion 2 of the molded product of the present invention does not discolor even when the temperature rises during molding because the respective stabilizers are provided with the thermal stability of warpage. .

Since the chlorine-containing resin that constitutes the surface layer portion 2 does not substantially contain a metal element, when used for the above-mentioned applications, the base layer portion 1 is used for the liquid for immersion treatment of semiconductor components such as chemical liquid or cleaning water. If this is used so that it does not contact and the surface layer portion 2 comes into contact, harmful metal elements such as Pb and Sn in the base layer portion 1 do not elute into these chemicals and other liquids for immersion treatment of semiconductor parts. There is no concern about the adverse effect of metal contamination on the semiconductor surface due to. In addition, it is not intentional to use the expression that it does not substantially contain a metal when manufacturing a chlorine-containing resin, a stabilizer, a lubricant, a coloring agent, or the like, and when manufacturing a surface layer portion. This is because a trace amount of metal may be mixed in an unavoidable range, and it cannot be said that the final molded product contains no metal. In addition, the inexpensive and tough properties and chemical resistance of chlorine-containing resins are maintained, and the above fertilizer stabilizers are particularly expensive, but the molded products as a whole are stable due to the inexpensive metal stabilizers that have been conventionally used. Since the base layer portion 1 of the liquefied chlorine-containing resin is the main structural member, the price does not soar.

Further, since the base layer portion 1 is stabilized by the metal-based stabilizer and has better heat resistance than the surface layer portion 2, even a thick material requiring heat resistance can be easily molded, and its transparency is increased. Can be held well, and good transparency can be maintained for the entire molded product.

In addition, as an example, the base layer portion 1 is freely colored with a conventionally known colorant containing a metal to become opaque.
The molded product can be made non-translucent without coloring the surface layer part 2, and a non-translucent colorful molded product which cannot be obtained by coloring the surface layer part 2 can be obtained. The surface layer portion 2 can be made non-translucent with a substance containing no metal, but the non-metallic substance becomes non-translucent due to the difference in refractive index from the PVC resin or due to the hiding power of carbon black. Only a white or black non-translucent plate can be made, and the color cannot be freely selected. Therefore, in addition to the above chemical resistance (against acid pickling, water washing, etc.), excellent moldability, appearance and heat distortion temperature, it can be colored very easily and becomes non-translucent. It is also very suitable for packaging containers, various cases, devices, etc. of the above electronic parts that are not desired to be processed.

Furthermore, if the above acrylic lubricant is added, good moldability and appearance are assured, and the heat distortion temperature rises. Therefore, when the resin is extruded by an extruder or the like, the mold releasability from the mold is improved. Good molding quality is ensured and smooth molding is obtained, and a molded product with excellent appearance such as gloss and gloss is obtained. Also, when molding with a calendar roll or press, adhesion to rolls and gloss plates is prevented and good moldability Is guaranteed, and it is also very suitable for use at high temperatures such as the above-mentioned semiconductor component manufacturing equipment and related equipment.

(Example) Next, an example will be described.

(I) Preparation of test piece (i-1) A chlorine-containing resin for the base layer was prepared according to the formulation shown in Table 1.

However, the numerical values in the table represent parts by weight.

(I-2) A chlorine-containing resin for the surface layer was prepared according to the formulation shown in Table 2.

However, the numerical values in the table represent parts by weight.

Each of the compound resins (i-3), (i-3) and (i-2) was formed into a 0.5 mm sheet by a calender roll (160 ° C x 5 minutes), and 18 sheets (i-1) were formed. Overlap on both sides (i
-2) Sheets are stacked one by one and pressed (160 ° C x 5
Min.) To form test pieces having a thickness of 10 mm by heating and pressurizing, and these are set to Examples (1) to (10) corresponding to (i-2) to (i-2). Further, a test piece prepared in the same manner by adding 0.2 part by weight of titanium oxide to the resin (i-1) was used as Example (11).

The resin of (i-4) and (i-1) is 20
The test pieces having a thickness of 10 mm were prepared by stacking the sheets and heating and pressurizing them in the same manner as in (i-3), which was used as Comparative Example (1). Further, a test piece prepared in the same manner as in (i-1) except that the acrylic lubricant in the resin was replaced with 1.0 part by weight of stearic acid was used as Comparative Example (2).

(Ii) Measurement of thermal stability The hue change of the outer surface of the test pieces obtained by the heat molding of (i-3) and (i-4) above was observed. The results are shown in Table 3.

As can be seen from Table 3, in Examples (1), (2) and (5) to (11), no hue change due to thermocompression molding was observed, and Comparative Examples (1) (2) ) Showed the same thermal stability. Examples (3) and (4) are comparative examples (1)
Although the thermal stability was slightly inferior to that of (2), the change was not so large as to cause a practical problem. Also, all the test pieces were excellent in moldability.

(Iii) Measurement of general physical properties General physical properties of the test pieces of Examples (1), (2), (6), (9), (11) and Comparative Example (1) were measured [however, for Example (11) Total light transmittance only]. The results are shown in Table 4. In addition, the above-mentioned embodiments (1) (2) (6)
Regarding the test pieces of (8), (9) and Comparative Examples (1), (2), the heat distortion temperature (load, 18.
6 kgf / cm ² ) It was measured. The results are shown in Table 5.

In Tables 4 and 5, "actual" and "ratio" represent examples and comparative examples, respectively.

As can be seen from Table 4 above, each of the examples has substantially the same physical property values as the comparative example (1), and it can be seen that they can be used in the same manner as the conventional PVC plate. In addition, it can be seen that the example (9 shows a Charpy cushioning value about twice that of the other examples and the comparative example (1), and has characteristics as an impact resistant PVC plate. It is understood that 11) has a significantly reduced total light transmittance as compared with the other Examples or Comparative Example (1), and can be sufficiently applied to the above-mentioned applications requiring semitranslucency. It can be seen from Table 5 that the heat distortion temperature of Example (8) is 2 ° C. higher than that of Example (6), and the PVC plate is hard to be heat deformed, and in Example (1), an acrylic lubricant is used in the surface layer portion. I didn't use it,
Since the surface layer portion contains this lubricant, the heat distortion temperature as a whole is higher than that of Comparative Example (2). This is based on the difference from the acrylic lubricants of Comparative Examples (1) and (2) having different heat distortion temperatures of 5 ° C.

(V) Dissolution test The above Example (1), Comparative Example (1), and Pb prepared separately
A sample of a PVC resin containing as a main stabilizer [referred to as Comparative Example (3)] was immersed in pure water based on JIS K6743, and the eluted trace metals were analyzed by atomic absorption spectrometry and ICP emission spectrometry. However, with respect to the test piece of Example (1), the edge portion was masked with the resin (i-2). The results are shown in Table 6.

As can be seen from Table 6, no metal was eluted from Example (6). In addition, Sn or Pb contained in the stabilizer was eluted from Comparative Examples (1) and (3).

In addition, the same test was performed on the PVC resin using the stabilizer other than the above examples, and substantially the same result was obtained.
Further, when the above-mentioned substances other than the acrylic modified modifier and the ethylene-vinyl acetate copolymer were used alone or in appropriate combination as the substance for imparting the non-translucency to the surface layer, substantially the same light transmittance was obtained. Furthermore, when the chlorinated vinyl chloride resin is used instead of the PVC resin of the surface layer portion and the base layer portion, the thermal softening temperature is improved to about 100 ° C., and when the ethylene vinyl chloride resin is used, the impact resistance is improved, and the alloy is used. Secondary workability is improved.

(Effect of the invention) As described above, the chlorine-containing resin molded product of the present invention has a surface layer portion of the chlorine-containing resin that does not contain a metal compound such as Pb or Sn as a stabilizer, and therefore, this is related to a semiconductor. When used for the purpose of equipment, etc., if the surface layer is used on the side in contact with acid or pure water, that is, on the surface treated with acid or pure water or the inner surface of the transport pipe, metal elements are eluted into these treatment liquids. There is no concern to In addition, since the chlorine-containing resin maintains the inherently inexpensive and tough properties and the excellent chemical resistance and secondary processability, it is very suitable for use in the above-mentioned applications and the like. In particular, since the conventional inexpensive metal-based stabilizer is used for the base layer, the price as a whole does not soar.
Furthermore, since heat stability is imparted to both the base layer portion and the surface layer portion by the above-mentioned stabilizers, the original appearance thereof is maintained without blackening even when the temperature rises during molding. also,
The base layer part can be colored or non-translucent by using various coloring agents like the conventional PVC board, and the molded product can be freely colored or opaque without coloring the surface layer part. It is possible to obtain a colorful non-translucent molded product, and it is suitably used for applications where it is desired to avoid see-through or to eliminate optical influences. In addition, when an acrylic lubricant is used as in the examples, the moldability and the finished appearance are excellent, and the heat distortion temperature is not lowered unlike the conventional higher fatty acids, and the applicability to the above applications is further improved.

The chlorine-containing resin molded product of the present invention, which is superior in such excellent performance, is extremely useful.

[Brief description of drawings]

FIG. 1 is a partially cutaway vertical sectional view showing an embodiment of the molded product of the present invention, FIGS. 2 and 3 are vertical sectional views of another embodiment, and FIG. 4 is a partially enlarged vertical section of yet another embodiment. It is a perspective view. (Explanation of symbols) 1 ... Base layer part, 2 ... Surface layer part.

Claims (1)

[Claims] 1. A base layer portion of a chlorine-containing resin stabilized by a metal stabilizer and any one selected from non-metal stabilizers such as aminocarboxylic acid, hydrazide, epoxy compound and organic phosphite, or Semiconductor packaging, packing, or manufacturing that is used in a semiconductor component manufacturing process by being laminated and integrated with the surface layer portion of a chlorine-containing resin that is stabilized by several types and does not substantially contain a metal element and is molded into a desired shape. Molded chlorine-containing resin products for related equipment.