JPH0782828B2 - Micro part analyzer - Google Patents
Micro part analyzerInfo
- Publication number
- JPH0782828B2 JPH0782828B2 JP61300325A JP30032586A JPH0782828B2 JP H0782828 B2 JPH0782828 B2 JP H0782828B2 JP 61300325 A JP61300325 A JP 61300325A JP 30032586 A JP30032586 A JP 30032586A JP H0782828 B2 JPH0782828 B2 JP H0782828B2
- Authority
- JP
- Japan
- Prior art keywords
- microbeam
- sample
- analysis
- irradiation
- sample surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Analysing Materials By The Use Of Radiation (AREA)
Description
【発明の詳細な説明】 イ.産業上の利用分野 本発明は電子線マイクロアナライザのようなマイクロビ
ームで試料を励起し、試料から発生するX線を分光する
等して試料に含まれる微粒子或は微小領域の分析を行う
装置に関する。Detailed Description of the Invention a. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus such as an electron beam microanalyzer for analyzing a fine particle or a minute region contained in a sample by exciting the sample with a microbeam and dispersing X-rays generated from the sample. .
ロ.従来の技術 マイクロビームを用いて試料の微小部分を分析する場
合、マイクロビームの試料照射位置を分析しようとする
点に固定して分析を行うが、マイクロビームで固定照射
する場合、試料が加熱されて熱膨脹を行い、或は帯電し
てマイクロビームが曲げられる等の原因で照射位置が不
安定になることがある。また装置自体の経時的変化によ
って照射位置がずれて来ることがある。電子線マイクロ
アナライザ等で試料の一微小領域を分析するのには相当
の時間がかかるので、その間にマイクロビームの照射点
がずれて来ると正確な分析ができない。この問題は分析
領域が小さくなる程影響が大きく、ミクロオーダ以下の
微小領域の分析においては甚だ重要な問題である。B. Conventional technology When using a microbeam to analyze a minute portion of a sample, the microbeam irradiation position is fixed at the point where the sample is to be analyzed, but when the microbeam is used for fixed irradiation, the sample is heated. There is a case where the irradiation position becomes unstable due to thermal expansion due to heat, or charging and bending of the microbeam. Further, the irradiation position may be displaced due to the change over time of the device itself. It takes a considerable amount of time to analyze one minute area of a sample with an electron beam microanalyzer or the like, so if the irradiation point of the microbeam is displaced during that time, accurate analysis cannot be performed. This problem has a greater effect as the analysis area becomes smaller, and is a very important problem in the analysis of a minute area of a micro order or less.
このため従来電子線マイクロアナライザで微小領域のX
線分光分析を行う場合、マイクロビームを固定している
分析モードと、マイクロビームで試料面を走査して試料
からの2次電子等による試料画像を形成させる走査確認
モードの切換えを行い、分析モードの途中で時々手動的
に確認モードに切換え、分析している微粒子の位置を確
認してマイクロビーム照射点のずれを修正すると云う方
法がとられている。For this reason, the conventional electron beam microanalyzer is used to
When performing line spectroscopic analysis, the analysis mode in which the microbeam is fixed and the scan confirmation mode in which the sample surface is scanned by the microbeam to form a sample image by secondary electrons from the sample are switched to the analysis mode. In the meantime, a method of manually switching to the confirmation mode, confirming the position of the particles being analyzed, and correcting the deviation of the microbeam irradiation point is adopted.
ハ.発明が解決しようとする問題点 マイクロビームによる試料の微小領域分析におけるマイ
クロビーム照射点の移動に対する上述した従来の対応方
法では、位置ずれの確認および修正は分析中常時行われ
ているのではなく、時々確認モードに切換えて行ってい
るだけなので、確認と確認の間で照射点が安定していた
か否か不明であり、分析結果の信頼性を低下させてい
る。C. DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention In the above-described conventional method for dealing with the movement of the microbeam irradiation point in the micro-region analysis of the sample by the microbeam, the confirmation and the correction of the positional deviation are not always performed during the analysis, Since it is only switched to the confirmation mode from time to time, it is unknown whether or not the irradiation point was stable between confirmations, and the reliability of the analysis results is reduced.
本発明は従来方法が分析位置の確認修正が時々しか行え
ないと云う点を改善して実際上常時位置確認修正が行わ
れているようにした微小部分分析装置を提供しようとす
るものである。SUMMARY OF THE INVENTION The present invention aims to provide a micro-partial analyzer in which the conventional method can be used only for confirming and correcting the analysis position only occasionally so that the position confirming and correcting can be performed practically always.
ニ.問題点解決のための手段 試料の微小領域を励起線で照射し、試料から放射される
種々な2次放射線により分析を行うと共に、上記2次放
射線の中の適宜の放射線をモニタ用として常時検出し、
その検出信号が変化したとき、励起線により試料面のそ
のときの照射点を含む小範囲を2次元的に走査し、上記
モニタ放射線の検出強度が元の値を示す位置を検出し
て、励起線の照射位置をその位置に修正するようにし
た。D. Means for Solving Problems Micro-regions of a sample are irradiated with excitation rays, various secondary radiations emitted from the sample are analyzed, and appropriate radiations among the secondary radiations are constantly detected for monitoring. Then
When the detection signal changes, a small area including the irradiation point at that time is two-dimensionally scanned by the excitation line, the position where the detection intensity of the monitor radiation shows the original value is detected, and excitation is performed. The irradiation position of the line was corrected to that position.
ホ.作 用 電子線マイクロアナライザ等で試料の微小領域を分析す
る場合、試料面を走査して2次電子像を映出し、分析対
象とする微粒子を探して、その微粒子に照射ビームを固
定してX線分光分析等を行う。このとき例えば2次電子
をモニタ用放射線として常時その検出出力をモニタして
いると、電子ビームの照射点がずれなければ、モニタ検
出信号の強さは変わらないが、照射ビームが分析対象の
微粒子から外れかかってくるとモニタ出力が変化する。
本発明はこの変化を検出して、自動的に試料面の小範囲
の走査を開始するので、オペレータが時々確認モードに
切換えるのと異なり、実際上常時確認が行われているこ
とになる。そして分析点を含む小領域で走査を行うの
で、走査範囲に他の微粒子が入って来ると云うようなこ
とがなく、モニタ検出出力がもとの値を示す位置を見出
せは、それが正しい分析点であるから、その位置に照射
ビームを修正すればよいのである。E. When analyzing a microscopic area of a sample with an electron beam microanalyzer, etc., scan the sample surface to display a secondary electron image, find the particles to be analyzed, and fix the irradiation beam on the particles to fix the X-ray. Perform line spectroscopy analysis. At this time, for example, if the detection output is constantly monitored by using secondary electrons as monitoring radiation, the intensity of the monitor detection signal does not change unless the irradiation point of the electron beam is shifted, but the irradiation beam is the particle to be analyzed. The monitor output changes when it comes off.
The present invention detects this change and automatically starts scanning the small area of the sample surface, so that the operator actually switches to the confirmation mode from time to time, which means that confirmation is actually being performed at all times. Then, since scanning is performed in a small area including the analysis point, it is unlikely that other particles will enter the scanning range, and it is necessary to find a position where the monitor detection output shows the original value, which is the correct analysis. Since it is a point, the irradiation beam may be corrected to that position.
ヘ.実施例 第1図は本発明の一実施例装置を示す。この実施例は試
料を電子線のマイクロビームで照射し、試料から放射さ
れるX線を分光することにより試料中の微細粒子の元素
分析を行う装置である。F. Embodiment FIG. 1 shows an apparatus according to an embodiment of the present invention. In this embodiment, a sample is irradiated with a microbeam of an electron beam, and X-rays emitted from the sample are dispersed to perform elemental analysis of fine particles in the sample.
図で1は電子銃、2はコンデンサレンズ、3は対物レン
ズで、これらの部分によって試料4を照射する電子線マ
イクロビームBが形成される。5はマイクロビームBを
偏向させる偏向コイルで図では一つに画いてあるが、X
方向走査用とY方向走査用の二組からなっている。6は
X線分光器の分光結晶、7はX線検出器で、これらは試
料面上のマイクロビーム照射点と共に一つのローランド
円上に位置するように機構的に連結されており、分光結
晶6および検出器7を動かすことにより検出X線の波長
走査が行われる。8は2次電子検出器で、試料のマイク
ロビーム照射点から放出される2次電子を検出し、その
検出出力は増幅器を経て信号処理表示装置10に入力さ
れ、マイクロビームBで試料面を走査した場合、試料面
の2次電子による像が信号処理表示装置によって表示さ
れる。信号処理表示装置の出力である2次電子による映
像信号は装置全体を制御しているマイクロコンピュータ
CPUに取込まれるようになっている。X線検出器7の出
力信号は増幅器11を介してX線信号計測装置12で計数さ
れ、計数率(単位時間内の計数値即ちX線強度)のデー
タに変換されてCPUに読込まれるようになっている。CPU
はラスタジェネレータ13にX,Y同期信号を送り、ラスタ
ジェネレータでX方向とY方向の走査信号を形成させ、
この走査信号を偏向コイル5および信号処理表示装置10
に入力させる。In the figure, 1 is an electron gun, 2 is a condenser lens, 3 is an objective lens, and these portions form an electron beam microbeam B for irradiating the sample 4. Denoted at 5 is a deflection coil for deflecting the micro beam B.
It consists of two sets, one for directional scanning and the other for Y-direction scanning. Reference numeral 6 is an X-ray spectroscope crystal, and 7 is an X-ray detector, which are mechanically linked together with the microbeam irradiation point on the sample surface so as to be located on one Rowland circle. And the wavelength scanning of the detected X-rays is performed by moving the detector 7. A secondary electron detector 8 detects secondary electrons emitted from the microbeam irradiation point of the sample, and the detection output is input to the signal processing display device 10 through the amplifier, and the sample surface is scanned with the microbeam B. In that case, an image of secondary electrons on the sample surface is displayed by the signal processing display device. The video signal by the secondary electron which is the output of the signal processing display device controls the entire device.
It is designed to be taken in by the CPU. The output signal of the X-ray detector 7 is counted by the X-ray signal measuring device 12 via the amplifier 11, converted into the data of the count rate (count value in unit time, that is, X-ray intensity) and read by the CPU. It has become. CPU
Sends an X, Y synchronization signal to the raster generator 13 and causes the raster generator to form scanning signals in the X and Y directions.
The scanning signal is applied to the deflection coil 5 and the signal processing display device 10.
To enter.
以上の装置構成で、試料中の微細粒子を分析する場合の
操作および装置動作を説明する。まずオペレータはマイ
クロビームBで試料面を2次元的に走査して試料面の2
次電子による像を信号処理表示装置10に表示させ、分析
対象とする微細粒子を選定して、その粒子像が表示面中
央に来るように試料位置を調整した後、X線分光分析動
作を開始させる。第2図はこのX線分光分析動作におけ
るCPUの制御動作のフローチャートである。An operation and an apparatus operation when analyzing fine particles in a sample with the above apparatus configuration will be described. First, the operator scans the sample surface two-dimensionally with the micro beam B and
An image by the next electron is displayed on the signal processing display device 10, fine particles to be analyzed are selected, and the sample position is adjusted so that the particle image comes to the center of the display surface, and then the X-ray spectroscopic analysis operation is started. Let FIG. 2 is a flowchart of the control operation of the CPU in this X-ray spectroscopic analysis operation.
分析動作をスタートさせると、まずそのときの2次電子
検出器8の検出信号強度Soを記憶(イ)し、X線分光器
の波長走査を開始(ロ)させ、X線強度データを取込み
記憶(ハ)し、2次電子検出信号Sを取込み(ニ)、次
に(ホ)のステップで|S−So|≦基準値であるか否か判
定し、判定がYESであれば、波長走査が終端まで来てい
ないことを検知(ヘ)して波長走査を継続し、(ホ)の
ステップの判定がNOのときは、波長走査を停止(ト)さ
せ、X線強度データの取込みも停止し(チ)、マイクロ
ビームで試料面の微小範囲を走査して2次電子検出信号
Sを取込み(リ)、|S−So|<基準値になるマイクロビ
ームの照射位置を検出(ヌ)し、その位置にマイクロビ
ームの照射位置を修正(ル)する。具体的にはマイクロ
ビームの照射位置は偏向コイル5の励磁電流として検出
されており、(ヌ)のステップで検出された偏向コイル
励磁電流に固定することで照射位置の修正が行われる、
その後動作はステップ(ヘ)に行き、波長走査が再開さ
れる。When the analysis operation is started, first, the detection signal intensity So of the secondary electron detector 8 at that time is stored (a), the wavelength scanning of the X-ray spectrometer is started (b), and the X-ray intensity data is acquired and stored. (C) Then, the secondary electron detection signal S is taken in (d), and in the step (e), it is determined whether or not | S−So | ≦ reference value. If the determination is YES, wavelength scanning is performed. Is detected to have not reached the end (f), wavelength scanning is continued, and when the judgment in step (e) is NO, wavelength scanning is stopped (g) and acquisition of X-ray intensity data is also stopped. (H), scan the microscopic area of the sample surface with the microbeam, capture the secondary electron detection signal S (re), and detect (nu) the irradiation position of the microbeam where | S-So | <reference value. , Correct the irradiation position of the microbeam to that position. Specifically, the irradiation position of the microbeam is detected as the excitation current of the deflection coil 5, and the irradiation position is corrected by fixing the deflection coil excitation current detected in the step (n).
After that, the operation goes to step (f), and the wavelength scanning is restarted.
ト.効 果 本発明においては、マイクロビームによる試料照射点か
ら放射される適宜の2次放射線を検出してその検出強度
を監視し、この検出強度の変化によって試料上のマイク
ロビーム照射点の移動を検知し、移動が検知されたら、
試料面の小範囲をマイクロビームで走査して正しい照射
位置を検出し、ビーム照射点をその位置に修正するの
で、或る程度以上の分析点移動が検知されたら直ちに位
置修正を行うので、常時位置監視をしながら位置修正し
て分析していることになり、時々確認操作を行う従来例
に比し、単にオペレータの負担が軽減されるだけでな
く、照射ビームの位置が安定しているので分析結果の信
頼性,精度の向上が得られる。G. Effect In the present invention, the secondary radiation emitted from the sample irradiation point by the microbeam is detected and its detection intensity is monitored, and the change of the detection intensity detects the movement of the microbeam irradiation point on the sample. Then, if movement is detected,
It scans a small area of the sample surface with a microbeam to detect the correct irradiation position and corrects the beam irradiation point to that position, so the position is corrected immediately when a certain amount of analysis point movement is detected. Since the position is corrected and analyzed while monitoring the position, the operator's burden is not only reduced, but the position of the irradiation beam is stable compared to the conventional example in which confirmation operations are sometimes performed. The reliability and accuracy of analysis results can be improved.
第1図は本発明の一実施例装置の構成を示すブロック
図、第2図は同実施例におけるCPUの動作のフローチャ
ートである。 4……試料、5……偏向コイル、6……X線分光結晶、
7……X線検出器、8……2次電子検出器、10……2次
電子検出信号に対する信号処理表示装置、12……X線信
号計測装置、13……ラスタジェネレータ。FIG. 1 is a block diagram showing the configuration of an apparatus according to an embodiment of the present invention, and FIG. 2 is a flowchart of the operation of the CPU in the same embodiment. 4 ... Sample, 5 ... Deflection coil, 6 ... X-ray dispersive crystal,
7 ... X-ray detector, 8 ... Secondary electron detector, 10 ... Signal processing display device for secondary electron detection signal, 12 ... X-ray signal measuring device, 13 ... Raster generator.
Claims (1)
と、試料面のマイクロビーム照射点から放射される試料
分析用の任意の2次放射線を検出する手段と、他のモニ
タ用の2次放射線を検出する手段と、このモニタ用2次
放射線の検出強度の変化を監視し、その強度変化が基準
値以上になったとき、試料面のマイクロビーム照射点を
含む小領域をマイクロビームで走査し、上記モニタ用2
次放射線の検出強度がもとの値或はそれに充分近い値を
示すマイクロビーム照射位置を検出し、マイクロビーム
照射点をその位置に修正する制御手段とを有する微小部
分分析装置。1. A means for scanning a sample surface with a microbeam, a means for detecting arbitrary secondary radiation for sample analysis emitted from a microbeam irradiation point on the sample surface, and a secondary radiation for other monitors. And a change in the detected intensity of the secondary radiation for monitoring, and when the change in intensity exceeds a reference value, a small area including a microbeam irradiation point on the sample surface is scanned with a microbeam. , For the above monitor 2
A micro-partial analyzer having a control means for detecting a microbeam irradiation position at which the detection intensity of the next radiation shows an original value or a value sufficiently close to the original value and correcting the microbeam irradiation point to that position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61300325A JPH0782828B2 (en) | 1986-12-16 | 1986-12-16 | Micro part analyzer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61300325A JPH0782828B2 (en) | 1986-12-16 | 1986-12-16 | Micro part analyzer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63152843A JPS63152843A (en) | 1988-06-25 |
| JPH0782828B2 true JPH0782828B2 (en) | 1995-09-06 |
Family
ID=17883414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61300325A Expired - Lifetime JPH0782828B2 (en) | 1986-12-16 | 1986-12-16 | Micro part analyzer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0782828B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008223343A (en) * | 2007-03-13 | 2008-09-25 | Sekisui Seikei Ltd | Method of fixing tatami mat surface |
-
1986
- 1986-12-16 JP JP61300325A patent/JPH0782828B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63152843A (en) | 1988-06-25 |
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