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JPH0782948B2 - Small coil - Google Patents
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JPH0782948B2 - Small coil - Google Patents

Small coil

Info

Publication number
JPH0782948B2
JPH0782948B2 JP3225164A JP22516491A JPH0782948B2 JP H0782948 B2 JPH0782948 B2 JP H0782948B2 JP 3225164 A JP3225164 A JP 3225164A JP 22516491 A JP22516491 A JP 22516491A JP H0782948 B2 JPH0782948 B2 JP H0782948B2
Authority
JP
Japan
Prior art keywords
core
copper
glass
terminals
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP3225164A
Other languages
Japanese (ja)
Other versions
JPH0547560A (en
Inventor
明男 大越
正人 鈴木
崇文 戸田
進 宇都宮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toko Inc
Original Assignee
Toko Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toko Inc filed Critical Toko Inc
Priority to JP3225164A priority Critical patent/JPH0782948B2/en
Publication of JPH0547560A publication Critical patent/JPH0547560A/en
Publication of JPH0782948B2 publication Critical patent/JPH0782948B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は各種の電気機器で用いら
れる小型コイルに係り、特にフェライト製のコアに端子
を直付けしたタイプの小型コイルに関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a small coil used in various electric devices, and more particularly to a small coil in which terminals are directly attached to a ferrite core.

【0002】[0002]

【従来の技術とその課題】端子を植設したベース上に、
線材を巻回したコアを取付けた構造のコイルが一般的に
使われている。しかし、近年、このベースを取り去って
コアに端子を直付けすることにより、一層の小型化を図
った小型コイルも用いられるようになってきた。図1は
このようなコイルの一例を示すもので、フェライトコア
1の鍔2に燐青銅などからなる2本の板状の端子3、4
を接着し、コア1に巻回した線材5の端末6、7をそれ
ぞれ端子3、4に半田付けや溶接により接続した構造で
ある。ところが、従来は端子3、4とコア1との接着を
エポキシ系などの有機接着剤を用いて行っているため、
この接合部分が熱に弱く、プリント基板に実装する際の
300°C近い半田の熱で端子がコアから剥離してしま
うことがあった。
[Prior art and its problems] On a base with terminals implanted,
A coil having a structure in which a core formed by winding a wire is attached is generally used. However, in recent years, by removing the base and directly attaching the terminals to the core, a small coil which is further miniaturized has been used. FIG. 1 shows an example of such a coil. The flange 2 of the ferrite core 1 has two plate-like terminals 3 and 4 made of phosphor bronze or the like.
Is bonded and the ends 6 and 7 of the wire 5 wound around the core 1 are connected to the terminals 3 and 4 by soldering or welding. However, since the terminals 3 and 4 and the core 1 are conventionally bonded using an organic adhesive such as an epoxy-based adhesive,
This joint part is weak to heat, and the terminal may peel off from the core due to the heat of the solder near 300 ° C. when mounting on the printed board.

【0003】[0003]

【発明の目的】本発明は、プリント基板に半田付けする
際の熱で端子がコアから剥離してしまうことのないコア
に端子を直付けしたタイプの小型コイルを提供すること
を目的とする。
SUMMARY OF THE INVENTION It is an object of the present invention to provide a small coil of the type in which the terminals are directly attached to the core so that the terminals do not peel off from the core due to heat when soldering to the printed circuit board.

【0004】[0004]

【課題を解決するための手段】本発明はコア材料のフェ
ライトとガラスの熱膨張係数がほぼ同じである点に着目
してなされたもので、従来の有機接着剤に代えて高温で
溶けにくい無機質であるガラスによってコアと端子を接
合するとともに、熱膨張係数がガラス及びフェライトコ
アとほぼ同じ材料で端子を形成した小型コイルの構成を
特徴とする。
The present invention was made by paying attention to the fact that the core material ferrite and glass have substantially the same coefficient of thermal expansion. Instead of a conventional organic adhesive, an inorganic material that is difficult to melt at high temperatures is used. Is characterized in that the core and the terminal are joined by the glass, and the terminal is formed of a material having a thermal expansion coefficient substantially the same as that of the glass and the ferrite core.

【0005】[0005]

【実施例】図2は本発明の小型コイルの一実施例を示す
もので、フェライトからなるコア20の下面に2本の端子
11、12をガラスによって接着してあり、コア20に巻回し
た線材30の端末31、32をそれぞれ端子11、12に溶接等の
手段で接続してある。端子11、12は、図3に断面で示す
ように、コバルト、ニッケル、鉄の合金であるコバール
8aの両面に銅8bを被着した三層構造のクラッド材か
らなる金属板8で形成してある。次に、このコイルの製
造方法について図2〜図5を参照して説明する。まず、
図3に示すような、コバール8aの両面に銅8bを被着
した三層構造のクラッド材からなる帯状の金属板8を用
意する。コバール単体の熱膨張係数は300°Cのとき
で54×10-7/°C前後であるが、コバールの両面に
銅を被着してクラッド材とすることによって熱膨張係数
をガラスやフェライトに近づけることができる。特に、
銅、コバール、銅の三層の厚みの比率を1:2:1とし
たときのクラッド材の熱膨張係数は例えば300°Cの
ときで93×10-7/°C前後になり、ガラスの95×
10-7/°Cにきわめて近似した値となる。このような
クラッド材からなる金属板8を打ち抜いて、図4のよう
に対向する端子部11、12を長手方向に所定の間隔で設け
たリードフレーム10を形成する。
EXAMPLE FIG. 2 shows an example of a small coil of the present invention. Two terminals are provided on the lower surface of a core 20 made of ferrite.
11 and 12 are bonded by glass, and the ends 31 and 32 of the wire 30 wound around the core 20 are connected to the terminals 11 and 12, respectively, by means such as welding. As shown in cross section in FIG. 3, the terminals 11 and 12 are made of a metal plate 8 made of a clad material having a three-layer structure in which copper 8b is adhered on both surfaces of a Kovar 8a which is an alloy of cobalt, nickel and iron. is there. Next, a method for manufacturing this coil will be described with reference to FIGS. First,
As shown in FIG. 3, a strip-shaped metal plate 8 made of a clad material having a three-layer structure, in which copper 8b is coated on both surfaces of Kovar 8a, is prepared. The coefficient of thermal expansion of Kovar alone is around 54 × 10 -7 / ° C at 300 ° C, but by applying copper to both sides of Kovar to form a clad material, the coefficient of thermal expansion can be changed to glass or ferrite. You can get closer. In particular,
When the thickness ratio of the three layers of copper, kovar, and copper is 1: 2: 1, the thermal expansion coefficient of the clad material is, for example, about 93 × 10 −7 / ° C at 300 ° C. 95 x
The value is extremely close to 10 -7 / ° C. The metal plate 8 made of such a clad material is punched out to form the lead frame 10 in which the opposing terminal portions 11 and 12 are provided at predetermined intervals in the longitudinal direction as shown in FIG.

【0006】次に、結晶性ガラス粉末と水を混合して作
ったガラスペーストと、フェライト材料からなるドラム
形コア20を用意し、ガラスペーストを端子部11、12の先
端11a、12aまたはコア20の下面またはその両方に塗布
してから、コア20をリードフレーム10の対向する端子部
11、12の先端11a、12a上に図5のように載置する。そ
して、コア20付きのリードフレーム10を焼成炉に通し、
窒素のような不活性ガスに酸素をわずかに混合した雰囲
気中でガラスペーストを焼成する。この焼成処理によっ
てガラスペーストの水分は蒸発し、溶けたガラスによっ
てコア20とリードフレーム10の端子部11、12はしっかり
接合される。
Next, a glass paste made by mixing crystalline glass powder and water and a drum-shaped core 20 made of a ferrite material are prepared, and the glass paste is applied to the tips 11a, 12a of the terminals 11, 12 or the core 20. On the bottom surface or both of the
The tips 11a and 12a are placed on the tips 11a and 12a as shown in FIG. Then, pass the lead frame 10 with the core 20 through a firing furnace,
The glass paste is fired in an atmosphere in which an inert gas such as nitrogen is slightly mixed with oxygen. By this baking treatment, the water content of the glass paste is evaporated, and the core 20 and the terminal portions 11 and 12 of the lead frame 10 are firmly joined by the melted glass.

【0007】この後、コア20に線材30を巻回し、その端
末31、32を端子部11、12に溶接または半田付けしてから
端子部11、12をリードフレーム10から切り離せば、端子
11、12がコバールの両面に銅を被着して三層構造となっ
たクラッド材で構成され、端子11、12とコア20がガラス
で接合された図2のような小型コイルが完成する。
After this, the wire 30 is wound around the core 20, the ends 31 and 32 thereof are welded or soldered to the terminals 11 and 12, and then the terminals 11 and 12 are separated from the lead frame 10.
A small coil as shown in FIG. 2 is completed in which 11 and 12 are made of a clad material having a three-layer structure in which both sides of Kovar are coated with copper, and the terminals 11 and 12 and the core 20 are joined by glass.

【0008】なお、焼成炉内の雰囲気中の酸素濃度は5
0ppm〜200ppmの範囲の低いものにするのがよ
い。酸素濃度をこれ以上高くすると、リードフレーム10
の銅表面が酸化して端子部11、12の半田付け性が悪化す
る。一方、これよりも酸素濃度を低くすると銅とガラス
の表面における化学的な結合が充分に行われず、リード
フレーム10とガラスとの接合強度が不足してしまう。ま
た、ガラス成分を溶かして充分な接合効果を得るために
は、約600°Cの高温で10分間程度焼成するのがよ
い。
The oxygen concentration in the atmosphere in the firing furnace is 5
It is preferable to have a low value in the range of 0 ppm to 200 ppm. If the oxygen concentration is further increased, the lead frame 10
The copper surface of is oxidized and the solderability of the terminals 11 and 12 deteriorates. On the other hand, if the oxygen concentration is lower than this, the chemical bond between the surfaces of the copper and the glass is not sufficiently performed, and the bonding strength between the lead frame 10 and the glass becomes insufficient. Further, in order to melt the glass component and obtain a sufficient bonding effect, it is preferable to bake at a high temperature of about 600 ° C. for about 10 minutes.

【0009】鉛硼素系の結晶性ガラス粉末と工業用純水
を混合してガラスペーストを作り、酸素濃度が100p
pmの窒素と酸素の混合雰囲気中において610°Cで
10分間焼成し、コア20の上鍔に真横方向から力を加え
てコア20がリードフレーム10から剥離する限界の力の値
を測定したところ、300グラムの力に耐えられる接着
強度があることが確認された。なお、ガラスペースト
は、水の代わりにシンナー等の有機溶剤をガラス粉末に
混合することにより作ってもよい。ただし、この場合は
有機溶剤を気化させるための酸素が要るので焼成時の酸
素濃度をやや高めにしなければならないが、酸素濃度を
厳密に制御するのが難しいためリードフレーム10の表面
が酸化し易く、焼成後にリードフレーム10の洗浄が必要
になることがある。端子の材料は、コバールの代わりに
42アロイ等の他の鉄系合金を用いてもよく、銅の代わ
りに黄銅のような別の銅系合金を用いてもよい。また、
熱膨張係数がガラスとほぼ同じものであれば他の金属材
料を用いてもよい。さらに、端子部の数や形状は種々変
形可能であり、たとえば図6に示すような4本一組の端
子部41、42、43、44を設けたリードフレーム40にコア20
を接合して、4本の端子を有する小型コイルを構成する
こともできる。
Lead boron-based crystalline glass powder and industrial pure water are mixed to form a glass paste having an oxygen concentration of 100 p.
After firing for 10 minutes at 610 ° C. in a mixed atmosphere of nitrogen and oxygen of pm, a force was applied to the upper brim of the core 20 from the lateral direction, and the limit force value at which the core 20 peels from the lead frame 10 was measured. It was confirmed that the adhesive strength was enough to withstand a force of 300 grams. The glass paste may be made by mixing an organic solvent such as thinner with glass powder instead of water. However, in this case, oxygen for vaporizing the organic solvent is required, so the oxygen concentration during firing must be slightly increased, but the surface of the lead frame 10 is oxidized because it is difficult to strictly control the oxygen concentration. In some cases, the lead frame 10 may need to be cleaned after firing. As a material for the terminal, other iron-based alloy such as 42 alloy may be used instead of Kovar, and another copper-based alloy such as brass may be used instead of copper. Also,
Other metal materials may be used as long as they have the same coefficient of thermal expansion as that of glass. Further, the number and shape of the terminal portions can be modified in various ways.
Can be joined together to form a small coil having four terminals.

【0010】[0010]

【発明の効果】本発明による小型コイルは、コアと端子
を半田付け程度の温度では溶けないガラスを用いて接着
したので、プリント基板に半田付けする際に高温が加わ
っても端子がコアから剥がれるおそれがない。また、コ
ア材料のフェライトや接着材料のガラスと熱膨張係数が
ほぼ同じ端子材料を用いるようにしたので、焼成直後の
冷却時やプリント基板への半田付け時において大きな温
度変化を受けた場合にも端子がコアから剥がれることは
なく、信頼性の高い小型コイルを得ることができる。
In the miniature coil according to the present invention, the core and the terminal are adhered by using a glass that does not melt at a temperature of about soldering, so that the terminal is peeled from the core even when a high temperature is applied to the printed board. There is no fear. In addition, since the terminal material that has almost the same coefficient of thermal expansion as ferrite as the core material and glass as the adhesive material is used, even when a large temperature change occurs during cooling immediately after firing or during soldering to the printed circuit board. The terminal does not peel off from the core, and a small coil with high reliability can be obtained.

【0011】[0011]

【図面の簡単な説明】[Brief description of drawings]

【図1】 従来のコイルの斜視図FIG. 1 is a perspective view of a conventional coil.

【図2】 本発明の小型コイルの一実施例を示す斜視図FIG. 2 is a perspective view showing an embodiment of a small coil of the present invention.

【図3】 同コイルの端子の一部の拡大断面図FIG. 3 is an enlarged sectional view of a part of the terminal of the coil.

【図4】 同コイルの製造に用いるリードフレームの平
面図
FIG. 4 is a plan view of a lead frame used for manufacturing the coil.

【図5】 組立工程の斜視図FIG. 5 is a perspective view of the assembly process.

【図6】 リードフレームの他の実施例を示す平面図FIG. 6 is a plan view showing another embodiment of the lead frame.

【符号の説明】 11 端子 12 端子 20 コア 30 線材[Explanation of symbols] 11 terminals 12 terminals 20 cores 30 wires

───────────────────────────────────────────────────── フロントページの続き (72)発明者 宇都宮 進 埼玉県入間郡鶴ヶ島町大字五味ヶ谷18番地 東光株式会社 埼玉事業所内 (56)参考文献 特開 昭57−193019(JP,A) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Susumu Utsunomiya 18 Tsurugashima-cho, Iruma-gun, Saitama Omi Gomigaya Toko Co., Ltd. Saitama Works (56) Reference JP-A-57-193019 (JP, A)

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 フェライト材料からなるコアに端子を直
付けした小型コイルにおいて、鉄系合金の両面に銅また
は銅系合金を被着して三層構造としたクラッド材で端子
を形成するともに、該コアと端子をガラスで接合したこ
とを特徴とする小型コイル。
1. A small coil in which a terminal is directly attached to a core made of a ferrite material , wherein copper or copper
Is a clad material with a three-layer structure coated with a copper alloy terminal
Together form a small coil, characterized in that the core and the terminal is bonded with a glass.
【請求項2】 コバールの両面に銅を被着したクラッド
材で端子を形成し、該銅、コバール、銅の三層の厚みの
比率をほぼ1:2:1とした請求項1の小型コイル。
2. A clad having copper coated on both sides of Kovar.
The terminal is formed of the material, and the thickness of the copper, kovar, and copper three layers
The miniature coil of claim 1 wherein the ratio is approximately 1: 2: 1 .
JP3225164A 1991-08-09 1991-08-09 Small coil Expired - Fee Related JPH0782948B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3225164A JPH0782948B2 (en) 1991-08-09 1991-08-09 Small coil

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3225164A JPH0782948B2 (en) 1991-08-09 1991-08-09 Small coil

Publications (2)

Publication Number Publication Date
JPH0547560A JPH0547560A (en) 1993-02-26
JPH0782948B2 true JPH0782948B2 (en) 1995-09-06

Family

ID=16824947

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3225164A Expired - Fee Related JPH0782948B2 (en) 1991-08-09 1991-08-09 Small coil

Country Status (1)

Country Link
JP (1) JPH0782948B2 (en)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57193019A (en) * 1981-05-25 1982-11-27 Tdk Electronics Co Ltd Method of producing solid state composite part

Also Published As

Publication number Publication date
JPH0547560A (en) 1993-02-26

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