JPH07123094B2 - Small coil manufacturing method - Google Patents
Small coil manufacturing methodInfo
- Publication number
- JPH07123094B2 JPH07123094B2 JP3225166A JP22516691A JPH07123094B2 JP H07123094 B2 JPH07123094 B2 JP H07123094B2 JP 3225166 A JP3225166 A JP 3225166A JP 22516691 A JP22516691 A JP 22516691A JP H07123094 B2 JPH07123094 B2 JP H07123094B2
- Authority
- JP
- Japan
- Prior art keywords
- core
- lead frame
- small coil
- terminals
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Manufacturing Cores, Coils, And Magnets (AREA)
- Coils Or Transformers For Communication (AREA)
Description
【発明の詳細な説明】Detailed Description of the Invention
【0001】[0001]
【産業上の利用分野】本発明は各種の電気機器で用いら
れる小型コイルに係り、特にコアに端子を直付けしたタ
イプの小型コイルの製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a small coil used in various electric devices, and more particularly to a method of manufacturing a small coil of a type in which terminals are directly attached to a core.
【0002】[0002]
【従来の技術とその課題】端子を植設したベース上に、
線材を巻回したコアを取付けた構造のコイルが一般的に
使われている。しかし、近年、このベースを取り去って
コアに端子を直付けすることにより、一層の小型化を図
った小型コイルも用いられるようになってきた。図1は
このようなコイルの一例を示すもので、フェライトコア
1の鍔2に燐青銅などからなる2本の板状の端子3、4
を接着し、コア1に巻回した線材5の端末6、7をそれ
ぞれ端子3、4に半田付けや溶接により接続した構造で
ある。ところが、従来は端子3、4とコア1との接着を
エポキシ系などの有機接着剤を用いて行っているため、
この接合部分が熱に弱く、プリント基板に実装する際の
300°C近い半田の熱で端子がコアから剥離してしま
うことがあった。[Prior art and its problems] On a base with terminals implanted,
A coil having a structure in which a core formed by winding a wire is attached is generally used. However, in recent years, by removing the base and directly attaching the terminals to the core, a small coil which is further miniaturized has been used. FIG. 1 shows an example of such a coil. The flange 2 of the ferrite core 1 has two plate-like terminals 3 and 4 made of phosphor bronze or the like.
Is bonded and the ends 6 and 7 of the wire 5 wound around the core 1 are connected to the terminals 3 and 4 by soldering or welding. However, since the terminals 3 and 4 and the core 1 are conventionally bonded using an organic adhesive such as an epoxy-based adhesive,
This joint part is weak to heat, and the terminal may peel off from the core due to the heat of the solder near 300 ° C. when mounting on the printed board.
【0003】[0003]
【発明の目的】本発明は、フェライトコアとリードフレ
ームを強固に接合しうる小型コイルの製造方法を提供す
ることを第1の目的とするものである。また、本発明の
第2の目的は、プリント基板に半田付けする際の熱で端
子がコアから剥離してしまうことのないコアに端子を直
付けしたタイプの小型コイルの製造方法を提供すること
にある。SUMMARY OF THE INVENTION It is a first object of the present invention to provide a method for manufacturing a small coil capable of firmly joining a ferrite core and a lead frame. A second object of the present invention is to provide a method for manufacturing a small coil of the type in which the terminals are directly attached to the core, which prevents the terminals from being separated from the core due to heat when soldering to the printed circuit board. It is in.
【0004】[0004]
【課題を解決するための手段】本発明は、従来の有機接
着剤に代えて高温で溶けにくい無機質であるガラスによ
ってコアと端子を接合した小型コイルの製造方法に関す
るものである。すなわち、本発明は、帯状の金属板を打
ち抜いてリードフレームを形成するとともに、結晶性ガ
ラス粉末を主成分とするガラスペーストをリードフレー
ムに設けた端子部の先端またはコアの下面の少なくとも
一方に塗布し、コアをこの端子部の先端上に載置した状
態で低酸素濃度の不活性ガス雰囲気中で加熱してガラス
ペーストを焼成する小型コイルの製造方法を特徴とす
る。SUMMARY OF THE INVENTION The present invention relates to a method of manufacturing a small coil in which a core and a terminal are joined by glass, which is an inorganic material which is difficult to melt at high temperature, instead of a conventional organic adhesive. That is, according to the present invention, a strip-shaped metal plate is punched to form a lead frame, and a glass paste containing crystalline glass powder as a main component is applied to at least one of the tip of the terminal portion provided on the lead frame or the lower surface of the core. The method of manufacturing a small coil is characterized by heating the glass paste in an inert gas atmosphere having a low oxygen concentration with the core placed on the tip of the terminal portion.
【0005】[0005]
【実施例】図2〜図5を参照して、本発明による製造方
法の一実施例について説明する。まず、図2に断面で示
すように、コバルト、ニッケル、鉄の合金であるコバー
ル8aの両面に銅8bを被着した三層構造のクラッド材
からなる帯状の金属板8を用意する。コバール単体の熱
膨張係数は300°Cのときで54×10-7/°C前後
であるが、コバールの両面に銅を被着してクラッド材と
することによって熱膨張係数をガラスやフェライトに近
づけることができる。特に、銅、コバール、銅の三層の
厚みの比率を1:2:1としたときのクラッド材の熱膨
張係数は、例えば300°Cのときで約93×10-7/
°Cとなり、ガラスの95×10-7/°Cにきわめて近
似した値となる。このようなクラッド材からなる金属板
8を打ち抜いて、図3のように対向する端子部11、12を
長手方向に所定の間隔で設けたリードフレーム10を形成
する。EXAMPLE An example of the manufacturing method according to the present invention will be described with reference to FIGS. First, as shown in a cross section in FIG. 2, a strip-shaped metal plate 8 made of a clad material having a three-layer structure in which copper 8b is adhered on both surfaces of Kovar 8a which is an alloy of cobalt, nickel and iron is prepared. The coefficient of thermal expansion of Kovar alone is around 54 × 10 -7 / ° C at 300 ° C, but by applying copper to both sides of Kovar to form a clad material, the coefficient of thermal expansion can be changed to glass or ferrite. You can get closer. In particular, the coefficient of thermal expansion of the clad material when the thickness ratio of the three layers of copper, kovar, and copper is 1: 2: 1 is about 93 × 10 −7 / 300 ° C., for example.
The temperature becomes ° C, which is extremely close to the value of 95 × 10 -7 / ° C of glass. The metal plate 8 made of such a clad material is punched out to form the lead frame 10 in which the opposing terminal portions 11 and 12 are provided at predetermined intervals in the longitudinal direction as shown in FIG.
【0006】次に、結晶性ガラス粉末と水を混合して作
ったガラスペーストと、フェライト材料からなるドラム
形コア20を用意し、ガラスペーストを端子部11、12の先
端11a、12aまたはコア20の下面またはその両方に塗布
してから、コア20をリードフレーム10の対向する端子部
11、12の先端11a、12a上に図4のように載置する。そ
して、コア20付きのリードフレーム10を焼成炉に通し、
窒素またはヘリウムのような不活性ガスに酸素をわずか
に混合した雰囲気中でガラスペーストを焼成する。この
焼成処理によってガラスペーストの水分は蒸発し、溶け
たガラスによってコア20とリードフレーム10の端子部1
1、12はしっかり接合される。Next, a glass paste made by mixing crystalline glass powder and water and a drum-shaped core 20 made of a ferrite material are prepared, and the glass paste is applied to the tips 11a, 12a of the terminals 11, 12 or the core 20. On the bottom surface or both of the
The tips 11a and 12a are placed on the tips 11a and 12a as shown in FIG. Then, pass the lead frame 10 with the core 20 through a firing furnace,
The glass paste is fired in an atmosphere in which an inert gas such as nitrogen or helium is slightly mixed with oxygen. By this baking treatment, the water content of the glass paste evaporates, and the molten glass melts the core 20 and the terminal portion 1 of the lead frame 10.
1 and 12 are firmly joined.
【0007】この後、コア20に線材30を巻回し、その端
末31、32を端子部11、12に溶接または半田付けしてから
端子部11、12をリードフレーム10から切り離せば、端子
11、12がコバールの両面に銅を被着して三層構造となっ
たクラッド材で構成され、端子11、12とコア20とがガラ
スを介して接合された図5のような小型コイルが完成す
る。After this, the wire 30 is wound around the core 20, the ends 31 and 32 thereof are welded or soldered to the terminals 11 and 12, and then the terminals 11 and 12 are separated from the lead frame 10.
11 and 12 are made of a clad material having a three-layer structure in which both sides of Kovar are coated with copper, and a small coil as shown in FIG. 5 in which the terminals 11 and 12 and the core 20 are joined via glass is provided. Complete.
【0008】本発明においてはガラスペーストを不活性
ガスに少量の酸素を混合した雰囲気中で焼成するが、こ
の雰囲気中の酸素濃度は50ppm〜200ppmの範
囲の低いものにするのがよい。酸素濃度をこれ以上高く
すると、リードフレーム10の銅表面が酸化して端子部1
1、12の半田付け性が悪化する。一方、これよりも酸素
濃度を低くすると銅とガラスの表面における化学的な結
合が充分に行われず、リードフレーム10とガラスとの接
合強度が不足してしまう。また、ガラス成分を溶かして
充分な接合効果を得るためには、約600°Cの高温で
10分間程度焼成するのがよい。In the present invention, the glass paste is fired in an atmosphere in which a small amount of oxygen is mixed with an inert gas, and the oxygen concentration in this atmosphere is preferably as low as 50 ppm to 200 ppm. If the oxygen concentration is increased higher than this, the copper surface of the lead frame 10 will be oxidized and the terminal 1
Solderability of 1 and 12 deteriorates. On the other hand, if the oxygen concentration is lower than this, the chemical bond between the surfaces of the copper and the glass is not sufficiently performed, and the bonding strength between the lead frame 10 and the glass becomes insufficient. Further, in order to melt the glass component and obtain a sufficient bonding effect, it is preferable to bake at a high temperature of about 600 ° C. for about 10 minutes.
【0009】鉛硼素系の結晶性ガラス粉末と工業用純水
を混合したガラスペーストを用いて610°Cで10分
間焼成し、コア20の上鍔に真横方向から力を加えてコア
20がリードフレーム10から剥離する限界の力の値を測定
したところ、酸素を加えない窒素だけの雰囲気中で焼成
した場合は120グラムまでの接着強度しか得られなか
ったのに対し、酸素濃度が100ppmの窒素と酸素の
混合雰囲気中において焼成したものは300グラムの力
に耐える強度があることが確認された。なお、ガラスペ
ーストは、水の代わりにシンナー等の有機溶剤をガラス
粉末に混合することにより作ってもよい。ただし、この
場合は有機溶剤を気化させるための酸素が要るので焼成
時の酸素濃度を高めにしなければならないが、酸素濃度
を厳密に制御するのが難しいためリードフレーム10の表
面が酸化し易く、焼成後にリードフレーム10の洗浄が必
要になることがある。また、リードフレーム10の素材は
必ずしもコバールと銅のクラッド材に限られず、他の鉄
系合金と銅または銅系合金のクラッド材、あるいは従来
から端子に使用されている公知の金属を使用してよい。A glass paste prepared by mixing lead-boron-based crystalline glass powder and industrial pure water was fired at 610 ° C. for 10 minutes, and a force was applied to the upper brim of the core 20 in the lateral direction.
When the value of the limit force at which 20 peels from the lead frame 10 was measured, when it was fired in an atmosphere of nitrogen without addition of oxygen, only an adhesive strength of up to 120 g was obtained, whereas the oxygen concentration was It was confirmed that the product fired in a mixed atmosphere of 100 ppm of nitrogen and oxygen had a strength capable of withstanding a force of 300 g. The glass paste may be made by mixing an organic solvent such as thinner with glass powder instead of water. However, in this case, oxygen for vaporizing the organic solvent is required, so it is necessary to increase the oxygen concentration during firing, but since it is difficult to strictly control the oxygen concentration, the surface of the lead frame 10 is easily oxidized. The lead frame 10 may need to be cleaned after firing. Further, the material of the lead frame 10 is not necessarily limited to the Kovar and copper clad material, and other iron-based alloy and copper or a copper-based clad material, or a known metal conventionally used for terminals is used. Good.
【0010】[0010]
【発明の効果】本発明によれば、端子の半田付け性を損
なうことなく端子とガラスの接合強度を高めることがで
き、コアと端子が融点の高いガラスで接着され、プリン
ト基板に半田付けする際に端子がコアから剥がれるおそ
れがない小型コイルを得ることができる。According to the present invention, the bonding strength between the terminal and the glass can be enhanced without impairing the solderability of the terminal, and the core and the terminal are bonded with the glass having a high melting point and soldered to the printed circuit board. In this case, it is possible to obtain a small coil in which the terminals are not likely to come off from the core.
【0011】[0011]
【図1】 従来のコイルの斜視図FIG. 1 is a perspective view of a conventional coil.
【図2】 本発明の一実施例に係る金属板を拡大して示
す部分断面図FIG. 2 is a partial cross-sectional view showing an enlarged metal plate according to an embodiment of the present invention.
【図3】 同、リードフレームの平面図FIG. 3 is a plan view of the lead frame.
【図4】 組立工程の斜視図FIG. 4 is a perspective view of the assembly process.
【図5】 小型コイルの斜視図FIG. 5 is a perspective view of a small coil
【符号の説明】 10 リードフレーム 11 端子部 12 端子部 20 コア 30 線材[Explanation of reference symbols] 10 lead frame 11 terminal portion 12 terminal portion 20 core 30 wire rod
───────────────────────────────────────────────────── フロントページの続き (72)発明者 宇都宮 進 埼玉県入間郡鶴ヶ島町大字五味ヶ谷18番地 東光株式会社 埼玉事業所内 (56)参考文献 特開 昭58−87810(JP,A) ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Susumu Utsunomiya 18 Tsurugashima-cho, Iruma-gun, Saitama Omi Gomigaya Toko Co., Ltd. Saitama Plant (56) Reference JP-A-58-87810 (JP, A)
Claims (2)
付けした小型コイルの製造方法において、帯状の金属板
を打ち抜いて複数本の端子部を所定の間隔で設けたリー
ドフレームを形成し、結晶性ガラス粉末を主成分とする
ガラスペーストをリードフレームの端子部の先端または
コアの下面の少なくとも一方に塗布した後、コアを該端
子部の先端上に載置し、次いで該コア及びリードフレー
ムを低酸素濃度の不活性ガス雰囲気中で加熱してガラス
ペーストを焼成することを特徴とする小型コイルの製造
方法。1. A method of manufacturing a small coil, in which terminals are directly attached to a core made of a ferrite material, a strip-shaped metal plate is punched out to form a lead frame having a plurality of terminal portions provided at predetermined intervals, and crystallinity is provided. After applying a glass paste containing glass powder as a main component to at least one of the tip of the terminal portion of the lead frame or the lower surface of the core, the core is placed on the tip of the terminal portion, and then the core and the lead frame are lowered. A method for producing a small coil, which comprises heating a glass paste by heating in an atmosphere of an inert gas having an oxygen concentration.
ppm〜200ppmの範囲の酸素を混合したものであ
る請求項1の小型コイルの製造方法。2. A low-oxygen concentration inert gas is nitrogen.
The method for producing a small coil according to claim 1, wherein oxygen is mixed in the range of ppm to 200 ppm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3225166A JPH07123094B2 (en) | 1991-08-09 | 1991-08-09 | Small coil manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3225166A JPH07123094B2 (en) | 1991-08-09 | 1991-08-09 | Small coil manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0547581A JPH0547581A (en) | 1993-02-26 |
| JPH07123094B2 true JPH07123094B2 (en) | 1995-12-25 |
Family
ID=16824980
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3225166A Expired - Fee Related JPH07123094B2 (en) | 1991-08-09 | 1991-08-09 | Small coil manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07123094B2 (en) |
-
1991
- 1991-08-09 JP JP3225166A patent/JPH07123094B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0547581A (en) | 1993-02-26 |
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