JPH0782976B2 - Electrode forming method for electronic parts - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Industrial Field of the Invention The present invention relates to an end surface of an electronic component 1 as shown in FIG.
1a or an electrode forming method of an electronic component for forming an electrode 2 on at least one of an end face 1a and two faces 1b and 1c connected to the end face 1a as shown in FIG.

2. Description of the Related Art Conventionally, such electrode formation is performed by a method using screen printing, and the following two methods are adopted as this method.

In the first method, as shown in FIG. 10, the electronic component 1 is erected in the cavity 11 formed in the plate 10 so that the upper part thereof projects, and the upper end surface 1a of the projecting electronic component 1 is screened from above. After printing and forming the electrodes, as shown in FIG. 11, insert the electronic component 1 into the cavity 13 formed in the plate 12 so that the electronic component 1 can be inserted in a state of being laid sideways as shown in FIG. , After screen-printing one surface 1b (or 1c) connected to the end surface 1a, re-insert the electronic component 1 into the cavity 13 so that the other surface 1c (or 1b) is the upper surface, and replace 1c (or 1b) The method is screen printing.

The second method is the holding member as shown in FIG.
Use 15 to place the electronic components 1 upright from both sides,
After the screen printing is performed on the end faces in the same manner as the first method, the two faces 1b and 1c are screen-printed one by one using the plate 12 described above. .

That is, the first method and the second method take different steps for screen printing the end surface 1a, but take the same steps for the two surfaces 1b, 1c.

However, in the case of the first method described above,
As shown in Fig. 14, the electrode paste 2 is attached to the upper edge of the cavity 11 during the screen printing of the end face, and the cavity 11 may be removed due to the clearance between the cavity 11 and the electronic component 1 put therein. If the electrode paste gets into the inside, the electronic parts may be soiled. Further, as shown in FIG. 10, since the electronic component 1 is projected from the upper edge of the cavity 11, the screen is pressed in the uneven state, and the screen is scratched or damaged.

On the other hand, in the case of the second method, since the electronic components 1 are closely arranged and the end faces are screen-printed, there is a possibility that the paste may enter between the electronic components 1 due to a capillary phenomenon and stain the electronic components. In order to prevent this, it is necessary to sandwich the spacer 14 such as paper between the electronic components 1 as shown in FIG. 15, which causes a problem that it takes time, and also in this case, the printing screen is the same as before. There will be scratches and scratches.

Further, both methods have the following similar drawbacks. That is, when the end face is screen-printed, if the corners of the electronic component 1 are dropped and the end face 1a is rounded as shown in FIG. 16,
The applied thickness of the printed electrode paste 2 differs between the central part and the end part in the thickness method and cannot be made uniform. Also, 2 connected to the end face
When screen-printing one side at a time, it is necessary to dry the part that was printed first and then turn it over and print.
Furthermore, the end face and the two faces connected to it are required to be printed separately, that is, in three times, so that productivity is poor, and as shown in FIG. 17, the end face 1a and the face 1b (or 1
There is a drawback that the electrode 2 formed in c) is misaligned.
This also occurs when the screen is warped or damaged as described above, and such warping or damage is also caused by a change with time accompanying the use of the screen.
Further, since the electrodes are exposed to the outside air, the solvent in the paste evaporates, causing various problems such as variations in coating thickness due to aging.

The present invention has been made to solve such a problem, and it is of course possible to prevent the electronic parts from being soiled, the screen from being scratched or damaged, and at least the end face and the two faces connected to the end face. An object of the present invention is to provide an electrode forming method for an electronic component, which can form electrodes on one side at the same time by one treatment, prevent positional deviation of the formed electrodes, and have no adverse effect on the electrode formation due to changes over time. And

Means for Solving the Problems In order to achieve the above object, according to the present invention, a method for forming a strip-shaped electrode on an end face of an electronic component or over at least one of the end face and two faces continuous with the end face. In, while arranging a slit plate in which a through slit having a width corresponding to the width of the electrode to be formed is located above the electrode paste bath, an electronic component is arranged on the slit plate so that the end face straddles the through slit. However, after that or before this, the electrode paste bath liquid level is raised to at least the end surface of the electronic component in a state where the electrode paste passes through the through slit, and at least the end surface of the electronic component or at least one of the end surface and the two surfaces continuous with this It is characterized in that the strip-shaped electrode paste is applied over one side.

Here, the electrode paste bath is stored in a container whose upper surface is closed by a slit plate, and the electrode paste bath liquid level is obtained by pressurizing the electrode paste from the container side or depressurizing the upper part of the slit plate. May be raised to at least the end surface of the electronic component and applied in a strip shape over at least one of the end surface of the electronic component or this end surface and two surfaces continuous with this end surface.

Action In the present invention, the electrode paste bath liquid level is raised in a state where the electrode paste passes through the through slit, and at this time, the electronic component is placed on the slit plate with the end face on which the electrode is to be formed facing down. If it is, the electrode paste will be applied to the end surface,
When the liquid level is further raised, the electrode paste is applied to the end surface of the electronic component and the surface continuous with the end surface. That is, the rising height of the electrode paste liquid surface can be adjusted according to the shape of the electrode to be formed. At this time, when it is desired to form an electrode only on at least one of the two surfaces connected to the end surface, it is necessary to block the through slit portion on the electrode non-forming side of the slit plate portion with which the end surface of the electronic component is abutted. To do.

Further, if the electrode paste is stored in a container closed with a slit plate, the electrode paste will be in a substantially sealed state, and evaporation of a solvent or the like can be prevented. Then, when the paste in the container is pressurized or the upper part of the slit plate is depressurized in this state, the paste rises by a predetermined amount, whereby the electrode paste can be applied in a strip shape to a predetermined portion of the electronic component.

EXAMPLES The present invention will be specifically described below. FIG. 1 shows an electrode forming device which is convenient for use in the present invention. This device is provided with a slit plate 3 having through slits 3a formed therein with a predetermined width and interval according to the number and position of electrodes desired to be formed on an electronic component, the slit plate 3 placed on the slit plate 3, and an electrode paste inside. It has a container 4 in which the bath 2 is stored and a pressurizing means 5 provided on the side surface of the container 4, and when the pressing plate 5a provided in the pressurizing means 5 is pushed down to press the electrode paste 2, A part of the paste 2 is pushed out from the through slit 3a. The joint between the slit plate 3 and the container 4 is sealed so that the electrode paste 2 does not leak.

When predetermined preparations such as bringing the electrode paste bath 2 to a predetermined temperature are completed, first, as shown in FIG. 2, the electronic component 1 is held upright by a holding member or the like (not shown),
The end face 1a on which the electrode of the electronic component 1 is to be formed is the through slit 3a.
The electronic component 1 is placed on the slit plate 3 so as to straddle it.
At this time, there may be a gap between the slit plate 3 and the electronic component 1, or they may be in contact with each other.

Then, as shown in FIG. 3, the pressurizing means 5 is pressurized to
The liquid level of the electrode paste bath is raised while the electrode paste 2 passes through the through slits 3a, and the electrode paste 2 is raised on the slit plate 3 by a certain height. As a result, the electrode paste 2 contacts and is applied to the end surface 1a of the electronic component 1 and the two surfaces 1b and 1c connected to the end surface 1a.

Then, after returning the electrode paste 2 on the slit plate 3 into the container 4, the electronic component 1 is lifted as shown in FIG. Then, as shown in FIG.
A U-shaped strip-shaped electrode (solidified electrode paste) 2 is formed at the same time in one electrode forming process over three surfaces 1a and two surfaces 1b, 1c. The electronic component 1 may be lifted before returning the electrode paste 2 into the container 4.

Then, as shown in FIG. 6, the electrode paste 2 attached to the upper surface of the slit plate 3 is scraped off by a scraping tool 6 having a triangular prism shape, for example. This scraping is unnecessary when the electrode paste 2 is not attached to the upper surface of the slit plate 3.
After that, the above-mentioned electrode forming process is repeated for the next electronic component.

FIG. 7 shows another means for raising the liquid level of the electrode paste. That is, in the above-mentioned embodiment, the pressing means 5 is provided on the side surface side of the container 4 so that the electrode paste 2 is pushed out onto the slit plate 3. However, as shown in FIG. The tube 8 is placed in a vacuum case 7 or the like, and one end of the tube 8 is connected to the side surface of the container 4 so that the other end of the tube 8 is communicated. The pressure may be reduced and the electrode paste 2 may be sucked up onto the slit plate 3 (indicated by an outline arrow).

Further, as the slit plate 3, the one shown in FIG. 8 can be used instead of the one having the above-mentioned configuration. In this structure, the side plate 9 is attached around the slit plate 3 so that the upper end is higher than the upper surface of the slit plate 3. When such a slit plate 3 is used, it is submerged in the electrode paste bath 2 and the electrode paste 2 is raised at a constant height from the through slit 3a to form the electrode 2 on the electronic component 1.

Further, although not shown, an elastic sheet may be attached to the upper surface of the slit plate 3 to increase the adhesion between the slit plate 3 and the electronic component 1. When the adhesiveness is increased in this way, there is an advantage that it is possible to prevent the electrode paste attached to the electronic component 1 from spreading due to wetting at the time of application and to reduce the contamination of the slit plate 3.

Next, FIG. 18 shows another embodiment of the present invention. In the above-described embodiment, the U-shaped strip-shaped electrode 2 is formed over the three faces of the electronic component 1 which are the end face 1a and the two faces 1b, 1c, but in this embodiment, the electrode is formed only on the end face 1a of the electronic component 1. Forming 2. That is, when the liquid level of the electrode paste is raised through the through slits 3a, if the electrode paste 2 is held in a state of being substantially flush with the upper end of the through slits 3a as shown in FIG. As shown in the figure, the electrode paste 2 can be applied only to the end face 1a.

Further, when it is desired to form the electrode 2 only on at least one of the two surfaces 1b and 1c connected to the end surface 1a, the through slit on the electrode non-forming side of the slit plate portion with which the end surface 1a of the electronic component 1 is abutted. It is advisable to close the portion 3a or place the electronic component 1 on the slit plate 3 so that the end face 1a is located at the end of the through slit 3a.

It goes without saying that the liquid level raising means shown in FIG. 7 and the slit plate structure shown in FIG. 8 can also be used in this embodiment.

Further, in any of the above-described embodiments, the electronic component 1 is first placed on the slit plate 3 and the electrode paste 2 is subsequently raised in the through slit 3a. However, the electrode paste 2 is raised first. After that, the electronic component 1 may be placed on the slit plate 3 to form the electrode 2.

Furthermore, in all the examples, if a large number of electronic components 1 are arranged on the slit plate 3 to form electrodes,
Multi-processing is possible.

EFFECTS OF THE INVENTION In the case of the present invention as described in detail above, the electrode paste liquid level is raised in a state where the electrode paste passes through the through slits, and only the end face of the electronic component or the end face and the two faces connected thereto are Since it can be applied to at least one of the above, even if the electrode is formed on the end face and one face connected to it, a total of two faces, or even if the electrode is formed on the end face and two faces connected to this, a total of three faces, The electrodes can be formed at the same time by the treatment, and the productivity can be improved. Further, since the electrodes can be formed simultaneously on the two or three surfaces, it is possible to prevent the positional displacement of the electrodes as in the conventional case.

Furthermore, according to the present invention, the height of the electrode that is wrapped around the end face can be adjusted based on the height at which the electrode paste is raised, so that even if the corner of the end face is round, the electrode can be surely placed in the electrode formation portion. It can be formed, and since the formed electrode is applied, it has a uniform thickness.

In addition, when the electrode paste is stored in a container and a slit plate is placed on the container, the electrode paste is in a substantially sealed state and the solvent and the like do not evaporate, so that the change over time of the paste can be suppressed. It also has the effect of reducing variations caused by paste viscosity such as coating thickness.

Further, even if the electrode paste may adhere to the slit plate during paste application, it can be easily scraped off, and even if the paste remains on the inner surface of the through slit, there is no problem in forming the electrode. , Does not pollute electronic components.

Further, in the case of the present invention, since screen printing is not used, no cracks or scratches are generated on the screen, so that the electrode pitch, width, etc. are accurate. Further, by making the slit width small and increasing the viscosity of the paste, it becomes possible to form an electrode having a narrower width than that obtained by screen printing.

[Brief description of drawings]

FIG. 1 is a vertical sectional view showing an electrode forming apparatus which is convenient to use in the present invention, FIGS. 2, 3, and 4 are vertical sectional views showing an embodiment of the present invention, and FIG. FIG. 6 is a perspective view showing the formed electrode portion, FIG. 6 is a perspective view showing a state in which a scraping operation is being performed in accordance with the present invention, and FIGS. 7 and 8 are other embodiments of the present invention. 9A and 9B are sectional views and perspective views, FIG. 9A and FIG. 9B are perspective views for explaining the shape of an electrode formed in an electronic component, and FIGS. 10 and 11 are used for explaining a conventional electrode forming method. Perspective views, FIG. 12 and FIG. 13 are a longitudinal sectional view and a side view, which are also used for explaining the conventional electrode forming method.
FIGS. 14, 15, and 16 are side views used to explain problems with the conventional electrode forming method, and FIG. 17 is a perspective view used to explain problems with the conventional electrode forming method. 18 and 19 are views showing another embodiment of the present invention. 1 ... Electronic parts, 1a ... end face, 1b, 1c ... a face continuous with the end face 1a, 2 ... electrode (and electrode paste, electrode paste bath), 3 ... slit plate, 3a ... through slit, 4 ... …
Container, 5 ... Pressurizing means, 7 ... Vacuum case.

Claims (2)

[Claims] 1. A method of forming a strip-shaped electrode on an end surface of an electronic component or on at least one of the end surface and two surfaces continuous with the end surface, wherein a through slit having a width corresponding to a width of an electrode to be formed is provided. The formed slit plate is located above the electrode paste bath, and the electronic component is arranged on the slit plate so that the end surface straddles the through slit, and thereafter or prior to this, the electrode paste forms the through slit. The electrode paste bath liquid level is raised to at least the end surface of the electronic component in a passing state, and the electrode paste is applied in a strip shape across at least one of the end surface of the electronic component or this end surface and two surfaces continuous with this end surface. Electrode forming method for electronic parts. 2. The electrode paste bath is stored in a container whose upper surface is closed by a slit plate, and the electrode paste bath is pressurized from the container side or depressurized above the slit plate. 2. The electrode of an electronic component according to claim 1, wherein the liquid surface is raised to at least the end face of the electronic component, and is applied in a strip shape over at least one of the end face of the electronic component or this end face and two surfaces continuous with the end face. Forming method.