JPH0785876B2 - Printed resin board cutting method - Google Patents

Description

The present invention relates to a method for cutting a printed resin substrate.

[Prior art] For the purpose of development of surface mounting technology and cost reduction, demand for HIC based on resin substrate has been increasing in recent years.

As with the ceramic substrate, this resin substrate is also divided (cut) from the master substrate to the module substrate in the steps after component mounting and before insertion into the lead frame and soldering. As a method of dividing (cutting), a high-speed rotary cutter, a shearing method, a cutting method using a mold, etc. are adopted.

[Problems to be Solved by the Invention] By the way, in the case of the above-mentioned high-speed rotating cutter, it is a method of cutting the substrate with a cutter that rotates at a high speed. Although it has a characteristic of dividing, it is versatile, but on the other hand, a large amount of cutting powder is generated at the time of cutting, the cutting surface is dirty, it is difficult to secure dimensional accuracy, and finally it is divided manually There is a protrusion, which affects the accuracy of external dimensions.

The above-mentioned shirring method is characterized by a cutting method by vertical movement of a cutter blade, while the cutting surface is formed well, but there is a large restriction on the range of component mounting, especially cutting after HIC mounting. Is considered impossible.

The cutting method by the above mold is at the stage of the master substrate,
The feature is that the module boards are molded in a shape in which they are connected in advance, and the joint part is punched out with a mold before insertion.High dimensional accuracy is obtained and the cut surface is good, but the cost of the mold is low. It is expensive, and the setup change is a mold change, which is not suitable for high-mix low-volume production.

As described above, the high-speed rotary cutter, the shearing method, and the cutting method using the mold all have advantages and disadvantages.

[Means for Solving the Problems] (1) A method for cutting a master resin substrate, which cuts a resin substrate by rotating upper and lower roller blades in a three-step operation orthogonal to the moving direction of the substrate. In the method, the blade angle of the first roller blade for cutting the resin substrate in the first step is set to 90 °,
The rotation groove of the roller blade is characterized in that a kerf is formed from the upper and lower sides to a depth of about 1/4 of the substrate thickness.

(2) The blade angle of the second roller blade that cuts the resin substrate in the second stage is set to 60 °, and the rotation of this roller blade causes the kerf to reach a depth of about 2/3 or more of the substrate thickness from the top and bottom. Is formed.

(3) The blade angle of the third roller blade for cutting the resin substrate in the third stage is set to 30 °, and the kerf of the substrate is cut from above and below by the rotation of this roller blade. .

[Operation] A cutting device that achieves the method for cutting a printed resin board according to the present invention includes a pusher, an opposed clamp that functions as an inlet transport unit, a three-step cutting roller blade that functions as a roller cutter unit, and a three-step cutting roller. Consists of a movable axis of the blade, a work stopper unit, an exit transfer unit, etc.When cutting a printed resin board with this device, one side end of the master board to be cut in the horizontal direction is clamped on one side of the entrance transfer unit. And pushes the pusher to move the master substrate until it abuts on a stopper attached to the arm of the work stopper unit.

When the master substrate comes into contact with the stopper attached to the arm, the other clamp of the inlet transport unit moves in one clamp direction, and the horizontal direction of the master substrate is bitten between the two clamps. The substrate is ready for cutting.

The roller cutter unit adopts a three-step cutting method using a first roller blade, a second roller blade, and a third roller blade, and is installed orthogonal to the moving direction of the master substrate. Further, the roller cutter unit faces the substrate and moves to enable three-stage cutting of the substrate.

First, as shown in FIG. 3A, the first roller blade holding a blade angle of 90 ° is cut from the top and bottom to a depth of about 1/4 of the master substrate thickness. (First-stage cutting.) Next, as shown in FIG. 3B, this master substrate is further deeply cut in the same groove by a second roller blade holding a blade edge angle of 60 °. (Second-stage cutting.) Finally, as shown in FIG. 3C, the master substrate is finally cut by a third roller blade holding a blade edge angle of 30 °. (Third-stage cutting.) That is, the master substrate naturally cuts into the substrate in the first-stage and second-stage cuts, and the cut-to-finish is performed in the third stage of finishing. The substrate is sent to the lower part of the exit transport unit by a lower scraping claw (not shown) attached to the exit transport unit, and is held in a state capable of coping with the next substrate cutting (three-step cut).

[Embodiment] FIG. 1 is a plan view of a cutting apparatus for carrying out the printed board cutting method of the present invention, and FIG. 2 is a front view thereof.

In the figure, 1 is a pusher, 2 is an opposed clamp that functions as an entrance transport unit, 3 is a roller cutter unit, and a three-stage cutting roller blade (free rotation) orthogonal to the moving direction of the substrate A is used to cut the first stage. Upper and lower first roller blades 4, upper and lower second roller blades 5 for second step cutting, and upper and lower third roller blades 6 for third step cutting.

The first roller blade 4 has a blade edge angle of 90 °.

The second roller blade 5 has a cutting edge angle of 60 °.

The third roller blade 6 has a blade edge angle of 30 °.

In the figure, 7 is a movable shaft of the roller cutter unit 3,
Reference numeral 8 denotes an exit transport unit, 9 denotes a work stopper unit, and 10 denotes a work stopper arm.

[Effects of the Invention] As described above, according to the present invention, a kerf is naturally formed in the substrate by the first and second stages of cutting, and the combined cutting is performed by the third stage of finishing. .

Therefore, since the blade rotates in contact with the substrate, the amount of chips generated is small.

Further, since the cutting is performed by the roller blade, the cutting can be performed even when the mounted components are mounted up to the front and back of the cutting portion.

Further, the cutting surface is good, and the cutting effect with high dimensional accuracy can be obtained.

Thus, the present invention is a high-precision cutting of the printed resin substrate,
This is a great invention that not only exhibits a useful effect as a method for cutting a printed resin board that can realize versatility but also contributes to the improvement of HIC assembly technology using resin as a board base in recent years.

[Brief description of drawings]

FIG. 1 is a front view of a cutting device for carrying out a method for cutting a printed resin board according to the present invention, FIG. 2 is a plan view of the same, and FIG. 3 (a) is an explanatory view showing a first-stage cut state. FIG. 3B is an explanatory diagram showing the second stage cut state, and FIG. 3C is an explanatory diagram showing the third stage cut state. A: Printed resin substrate 2 ... Entrance transport unit 3 ... Roller cutter unit 4 ... First roller blade 5 ... Second roller blade 6 ... Third roller blade

Claims (3)

[Claims] 1. A method for cutting a master resin substrate, which comprises cutting a resin substrate by rotating upper and lower roller blades in a three-step operation orthogonal to a moving direction of the substrate, in a first step. The blade angle of the first roller blade that cuts the resin substrate is set to 90 °.
A method for cutting a printed resin board, which comprises forming a kerf to a depth of about 4. 2. A second step of cutting a resin substrate in a second step
The blade edge angle of the roller blade is set to 60 °, and the kerf is formed from the upper and lower sides to a depth of about 2/3 or more of the substrate thickness by the rotation of the roller blade.
Method for cutting printed resin boards in. 3. A third step of cutting a resin substrate in a third step
2. The method for cutting a printed resin board according to claim 1, wherein the blade angle of the roller blade is set to 30 °, and the kerf of the board is cut from above and below by the rotation of the roller blade.