JPH0788431B2 - Heat resistant prepreg - Google Patents
Heat resistant prepregInfo
- Publication number
- JPH0788431B2 JPH0788431B2 JP16272486A JP16272486A JPH0788431B2 JP H0788431 B2 JPH0788431 B2 JP H0788431B2 JP 16272486 A JP16272486 A JP 16272486A JP 16272486 A JP16272486 A JP 16272486A JP H0788431 B2 JPH0788431 B2 JP H0788431B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- resistant
- heating
- resin
- prepreg
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000010438 heat treatment Methods 0.000 claims description 18
- 229920000642 polymer Polymers 0.000 claims description 16
- 238000001035 drying Methods 0.000 claims description 10
- 229920006015 heat resistant resin Polymers 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 5
- 238000010521 absorption reaction Methods 0.000 claims description 3
- 238000000862 absorption spectrum Methods 0.000 claims description 3
- 229920005989 resin Polymers 0.000 description 15
- 239000011347 resin Substances 0.000 description 15
- 239000003822 epoxy resin Substances 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- 239000000835 fiber Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- 229910002804 graphite Inorganic materials 0.000 description 4
- 239000010439 graphite Substances 0.000 description 4
- 229920003235 aromatic polyamide Polymers 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920002545 silicone oil Polymers 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 229920000271 Kevlar® Polymers 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 239000004760 aramid Substances 0.000 description 2
- 239000004327 boric acid Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- OLLFKUHHDPMQFR-UHFFFAOYSA-N dihydroxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](O)(O)C1=CC=CC=C1 OLLFKUHHDPMQFR-UHFFFAOYSA-N 0.000 description 2
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000004761 kevlar Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- -1 boric acid compound Chemical class 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- XCLIHDJZGPCUBT-UHFFFAOYSA-N dimethylsilanediol Chemical compound C[Si](C)(O)O XCLIHDJZGPCUBT-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003216 poly(methylphenylsiloxane) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Insulating Bodies (AREA)
- Reinforced Plastic Materials (AREA)
Description
【発明の詳細な説明】 （発明の技術分野） 本発明は、ガラス繊維、グラフアイトの繊維等の含浸剤
として、好適する耐熱性プリプレグに関する。TECHNICAL FIELD OF THE INVENTION The present invention relates to a heat-resistant prepreg suitable as an impregnating agent for glass fiber, graphite fiber and the like.
（発明の技術的背景） 近年、自動車や航空宇宙機器の構造部材にガラス、グラ
フアイト、ケブラー繊維（デユポン社製の商品名；ポリ
アラミド繊維）にエポキシ樹脂等を含浸したテープがよ
く使われている。(Technical background of the invention) In recent years, tapes obtained by impregnating glass, graphite, Kevlar fiber (trade name manufactured by Dyupon Co .; polyaramid fiber) with epoxy resin, etc. are often used for structural members of automobiles and aerospace equipment. .
このテープはエポキシ樹脂等の樹脂を繊維に含浸させて
用いることからプリプレグ（preimpregnated）テープと
よばれている。又このプリプレグテープはエポキシ樹脂
等を含浸するので強度が大きく、自己接着性並びに基体
への接着性が優れているので、加工し易く、取扱いが容
易という特徴を有している。This tape is called a preimpregnated tape because it is used by impregnating a fiber with a resin such as an epoxy resin. Further, since this prepreg tape is impregnated with an epoxy resin or the like, it has high strength and is excellent in self-adhesiveness and adhesiveness to a substrate, so that it is easy to process and easy to handle.
（背景技術の問題点） しかしながら、耐熱性については含浸させる繊維よりも
エポキシ樹脂等の含浸樹脂の耐熱性で耐熱温度が決まつ
てしまうというのが実状であつた。(Problems of background art) However, as for the heat resistance, the fact is that the heat resistance temperature is determined by the heat resistance of the impregnated resin such as epoxy resin rather than the fiber to be impregnated.
具体的には、ガラス、グラフアイト、ケブラー繊維にエ
ポキシ樹脂を含浸させたプリプレグテープの耐熱温度は
120℃が限界であり、それ以上の温度になるとエポキシ
樹脂の熱劣化に伴なう強度低下並びに接着力の低下が生
じ、使用不能であるという問題があつた。Specifically, the heat resistance temperature of prepreg tape made by impregnating glass, graphite, Kevlar fiber with epoxy resin is
The limit is 120 ° C, and when the temperature is higher than 120 ° C, there is a problem that the epoxy resin is deteriorated in strength and adhesive strength due to thermal deterioration and cannot be used.
（発明の目的） 本発明は、このような問題を解決するためになされたも
ので、高温長時間使用後においても接着性が低下するこ
とのない耐熱性プリプレグを提供することを目的とす
る。(Object of the Invention) The present invention has been made to solve such a problem, and an object of the present invention is to provide a heat-resistant prepreg in which the adhesiveness does not decrease even after use at high temperature for a long time.
（発明の概要） すなわち本発明の耐熱性プリプレグは、耐熱性基材にボ
ロシロキサン重合体を少なくとも10重量％含む耐熱性樹
脂を含浸させ、前記ボロシロキサン重合体における波長
700cm-1の赤外吸収スペクトルの吸収強度δ700が加熱前
後において、δ700（加熱後）／δ700（加熱前）≧0.2
となるように加熱乾燥し、前記ボロシロキサン重合体中
にケイ素−アルキル基あるいはケイ素−フエニル基の結
合を適正量分解させてなることを特徴としている。(Summary of the Invention) That is, the heat-resistant prepreg of the present invention is obtained by impregnating a heat-resistant substrate with a heat-resistant resin containing at least 10% by weight of a borosiloxane polymer,
The absorption intensity δ 700 of the infrared absorption spectrum at 700 cm -1 before and after heating is δ 700 (after heating) / δ 700 (before heating) ≧ 0.2
It is characterized in that it is dried by heating so that the appropriate amount of the bond of silicon-alkyl group or silicon-phenyl group is decomposed in the borosiloxane polymer.
ここで本発明における体熱性基材としては、ガラス、グ
ラフアイト、カーボン、炭化ケイ素その他無機物の繊
維、不織布、テープ、ペーパー等耐熱性に優れたものを
用いることができる。Here, as the body heat-resistant substrate in the present invention, those having excellent heat resistance such as glass, graphite, carbon, silicon carbide and other inorganic fiber, non-woven fabric, tape and paper can be used.
又、本発明におけるボロシロキサン重合体としては、ケ
イ素、酸素、ホウ素を主要骨格とする高分子化合物は、
どれも用いることができる。しかしながら耐熱性等の点
から特に、ジメチルシリコンオイルやメチルフエニルシ
リコンオイルのようなシリコンオイルを溶媒とし、ジフ
エニルジヒドロキシシランやジメチルジヒドロキシシラ
ンのようなヒドロキシシラン、およびホウ酸化合物を縮
重合させて得られた重合体を用いることが望ましい。Further, as the borosiloxane polymer in the present invention, a polymer compound having silicon, oxygen and boron as a main skeleton is
Any can be used. However, from the viewpoint of heat resistance, in particular, silicone oil such as dimethyl silicone oil or methylphenyl silicone oil is used as a solvent, and hydroxysilane such as diphenyldihydroxysilane or dimethyldihydroxysilane and a boric acid compound are polycondensed. It is desirable to use the obtained polymer.
本発明における耐熱性樹脂としてはシリコーン樹脂、ポ
リイミド樹脂、ポリアミドイミド樹脂、ポリエーテルス
ルホン樹脂、ポリエーテルエーテルケトン樹脂、芳香族
ポリアミド樹脂（アラミド樹脂）、ポリアリレート樹
脂、ポリサルホン樹脂、ポリフエニレンスルフイド樹
脂、ポリフエニレンオキサイド樹脂およびポリカーボネ
ート樹脂等を用いることができる。Examples of the heat resistant resin in the present invention include silicone resin, polyimide resin, polyamideimide resin, polyethersulfone resin, polyetheretherketone resin, aromatic polyamide resin (aramid resin), polyarylate resin, polysulfone resin, polyphenylene sulfide. Resins, polyphenylene oxide resins, polycarbonate resins and the like can be used.
本発明において耐熱性樹脂に対するボロシロキサン重合
体の含有量を少なくとも10重量％と限定したのは、10重
量％未満ではボロシロキサン重合体の耐熱効果を充分発
揮できず、耐熱性に問題があるためである。In the present invention, the content of the borosiloxane polymer with respect to the heat-resistant resin is limited to at least 10% by weight, because if it is less than 10% by weight, the heat-resistant effect of the borosiloxane polymer cannot be sufficiently exhibited and there is a problem in heat resistance. Is.
尚、ボロシロキサン樹脂を含む耐熱性樹脂には各種充填
剤および着色顔料等の併用も可能である。Incidentally, various fillers and color pigments can be used in combination with the heat resistant resin containing the borosiloxane resin.
又、本発明において、このような耐熱性基材にボロシロ
キサン重合体を含む耐熱性樹脂を含浸させたものの加熱
乾燥温度は200〜300℃が好ましく、その理由はボロシロ
キサン重合体の加熱乾燥が不十分な場合も過度に加熱乾
燥した場合にも自己接着性および基体への接着性が悪く
なるためである。In the present invention, the heat-drying temperature of such a heat-resistant substrate impregnated with a heat-resistant resin containing a borosiloxane polymer is preferably 200 to 300 ° C. because the borosiloxane polymer is dried by heating. This is because the self-adhesiveness and the adhesiveness to the substrate are deteriorated both when it is insufficient and when it is excessively dried by heating.
したがつて加熱乾燥の際の温度条件は、ケイ素−アルキ
ル基あるいはケイ素−フエニル基の結合が適正量だけ分
解するように決定するのが好ましく、その条件は、ボロ
シロキサン重合体における波長700cm-1の の赤外吸収スペクトルの吸収強度δ700が加熱前後にお
いて、δ700（加熱後）／δ700（加熱前）≧0.2となる
範囲である。Therefore, it is preferable that the temperature condition during the heat drying is determined so that the bond of the silicon-alkyl group or the silicon-phenyl group is decomposed by an appropriate amount, and the condition is a wavelength of 700 cm -1 in the borosiloxane polymer. of The absorption intensity δ 700 of the infrared absorption spectrum of is in the range of δ 700 (after heating) / δ 700 (before heating) ≧ 0.2 before and after heating.
本発明者等がバッチ式で実験を繰返した結果では、図面
に示すIIの範囲であることを見出した（Ｉの範囲の条件
では加熱乾燥オーバ、IIIの範囲の条件では加熱乾燥不
充分）。As a result of repeated experiments by the inventors of the present invention in a batch system, it was found that the range was II as shown in the drawing (heat drying over under the condition of the range I, heat drying under the condition of the range III was insufficient).
したがつて、加熱乾燥にあたつては200〜300℃の温度で
かつ図面のIIの範囲にはいる適正な時間を選んで加熱乾
燥を行なうことにより、プリプレグとしての特性に優れ
たものが得られる。Therefore, when heating and drying, at a temperature of 200 to 300 ° C and by selecting an appropriate time within the range II of the drawing and performing heating and drying, a product with excellent characteristics as a prepreg is obtained. To be
尚、このような耐熱性基材の樹脂を含浸したものを加熱
乾燥して得られる本発明の耐熱性プリプレグにおいて
は、ボロシロキサン樹脂及び耐熱性樹脂をＮ−メチル−
２−ピロリドン、ジメチルアセトアミド、キシレン、エ
タノール等の汎用の溶剤で溶解したものを耐熱性基材に
含浸させた場合には取り扱いが容易となりかつ同様な効
果を発揮することができる。In the heat-resistant prepreg of the present invention obtained by heating and drying such a heat-resistant substrate impregnated with resin, the borosiloxane resin and the heat-resistant resin are N-methyl-
When a heat-resistant base material is impregnated with a solution of a general-purpose solvent such as 2-pyrrolidone, dimethylacetamide, xylene, or ethanol, it is easy to handle and the same effect can be exhibited.
（発明の実施例） 以下本発明の実施例について記載する。(Examples of the Invention) Examples of the present invention will be described below.
実施例１〜３ 次の方法でボロシロキサン重合体を生成した。Examples 1 to 3 A borosiloxane polymer was produced by the following method.
すなわちジフエニルジヒドロキシシラン432g、ホウ酸83
g、10センチストークスのジメチルシリコンオイル255g
をフラスコにいれ、窒素雰囲気中で室温から400℃まで
徐々に加熱撹拌し、さらに400℃で１時間加熱撹拌して
重縮合反応させた。That is, 432 g of diphenyldihydroxysilane, 83 boric acid
g, 10 cm Stokes dimethyl silicone oil 255 g
The mixture was placed in a flask and heated and stirred from room temperature to 400 ° C. gradually in a nitrogen atmosphere, and further heated and stirred at 400 ° C. for 1 hour to cause a polycondensation reaction.
こうして生成されたボロシロキサン重合体（キシレン50
重量％溶液）と各種耐熱性樹脂を溶剤で溶解して溶液と
したものを次表に示す割合（樹脂の重量％）で混合した
塗料を厚さ500μｍのアルミナ系のセラミックペーパー
に含浸し次表に示す条件で加熱乾燥した。また比較のた
めに条件を図面のIIの範囲外の条件で加熱乾燥した（比
較例1,2,3）。更に、ガラステープにエポキシ樹脂を含
浸したものを比較例４とした。The borosiloxane polymer thus produced (xylene 50
(% By weight solution) and various heat resistant resins dissolved in a solvent to form a solution and mixed at the ratio (% by weight of resin) shown in the table below to impregnate a 500 μm thick alumina ceramic paper with the following table. It was dried by heating under the conditions shown in. For comparison, heating and drying were performed under conditions outside the range II in the drawing (Comparative Examples 1, 2, and 3). Further, Comparative Example 4 was prepared by impregnating a glass tape with an epoxy resin.
得られたプリプレグの特性についての試験結果を次表に
併せて示す。The test results for the properties of the obtained prepreg are also shown in the following table.
この試験結果から耐熱性基材にボロシロキサン重合体を
含む耐熱性樹脂を含浸させたものを適正な条件下で加熱
乾燥してはじめて、プリプレグとして必要かつ充分な接
着性を有した耐熱性プリプレグが得られることがわか
る。 From this test result, the heat-resistant base material impregnated with the heat-resistant resin containing the borosiloxane polymer was heated and dried under appropriate conditions, and then the heat-resistant prepreg with necessary and sufficient adhesiveness as a prepreg was obtained. You can see that you can get it.
（発明の効果） 以上の実施例から明らかなように、本発明の耐熱性プリ
プレグは接着性に優れ、しかも高温使用後においても良
好な接着性を保持している。(Effects of the Invention) As is clear from the above examples, the heat-resistant prepreg of the present invention has excellent adhesiveness, and also retains good adhesiveness even after use at high temperatures.
図面は実験の結果求められた、耐熱性基材にボロシロキ
サン重合体を耐熱性樹脂を含浸したものの適正な加熱乾
燥条件を示すグラフである。The drawing is a graph showing the appropriate heat drying conditions of the heat-resistant base material impregnated with the heat-resistant resin in the heat-resistant base material, which was obtained as a result of the experiment.
Claims (1)
くとも10重量％含む耐熱性樹脂を含浸させ、前記ボロシ
ロキサン重合体における赤外吸収スペクトルの吸収強度
δ700が加熱前後において、δ700（加熱後）／δ
700（加熱前）≧0.2となるように加熱乾燥し、前記ボロ
シロキサン重合体中のケイ素−アルキル基あるいはケイ
素−フエニル基の結合を適正量分解させてなることを特
徴とする耐熱性プリプレグ。1. A heat-resistant base material is impregnated with a heat-resistant resin containing at least 10% by weight of a borosiloxane polymer, and the absorption intensity δ 700 of the infrared absorption spectrum of the borosiloxane polymer before and after heating is δ 700 ( After heating) / δ
A heat-resistant prepreg obtained by heating and drying so as to satisfy a condition of 700 (before heating) ≧ 0.2, and decomposing an appropriate amount of the bond of the silicon-alkyl group or the silicon-phenyl group in the borosiloxane polymer.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16272486A JPH0788431B2 (en) | 1986-07-10 | 1986-07-10 | Heat resistant prepreg |
| GB8617440A GB2180857B (en) | 1985-07-19 | 1986-07-17 | Heat resistant prepreg and method for production thereof |
| CA000514118A CA1291378C (en) | 1985-07-19 | 1986-07-18 | Heat-resistant prepreg and method for production thereof |
| US06/886,794 US4735858A (en) | 1985-07-19 | 1986-07-18 | Heat-resistant prepreg and method for production thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16272486A JPH0788431B2 (en) | 1986-07-10 | 1986-07-10 | Heat resistant prepreg |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6317939A JPS6317939A (en) | 1988-01-25 |
| JPH0788431B2 true JPH0788431B2 (en) | 1995-09-27 |
Family
ID=15760069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16272486A Expired - Lifetime JPH0788431B2 (en) | 1985-07-19 | 1986-07-10 | Heat resistant prepreg |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0788431B2 (en) |
-
1986
- 1986-07-10 JP JP16272486A patent/JPH0788431B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6317939A (en) | 1988-01-25 |
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