JPH0645709B2 - Method for manufacturing heat resistant prepreg - Google Patents
Method for manufacturing heat resistant prepregInfo
- Publication number
- JPH0645709B2 JPH0645709B2 JP60159417A JP15941785A JPH0645709B2 JP H0645709 B2 JPH0645709 B2 JP H0645709B2 JP 60159417 A JP60159417 A JP 60159417A JP 15941785 A JP15941785 A JP 15941785A JP H0645709 B2 JPH0645709 B2 JP H0645709B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- resin
- resistant
- prepreg
- drying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 3
- 238000000034 method Methods 0.000 title description 3
- 238000001035 drying Methods 0.000 claims description 17
- 229920000642 polymer Polymers 0.000 claims description 14
- 229920006015 heat resistant resin Polymers 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 6
- 229920005989 resin Polymers 0.000 description 15
- 239000011347 resin Substances 0.000 description 15
- 239000003822 epoxy resin Substances 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- 239000000835 fiber Substances 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- 229910002804 graphite Inorganic materials 0.000 description 4
- 239000010439 graphite Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- -1 tape Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 239000004760 aramid Substances 0.000 description 2
- 229920003235 aromatic polyamide Polymers 0.000 description 2
- 239000004327 boric acid Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- OLLFKUHHDPMQFR-UHFFFAOYSA-N dihydroxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](O)(O)C1=CC=CC=C1 OLLFKUHHDPMQFR-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920002545 silicone oil Polymers 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229920000271 Kevlar® Polymers 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- XCLIHDJZGPCUBT-UHFFFAOYSA-N dimethylsilanediol Chemical compound C[Si](C)(O)O XCLIHDJZGPCUBT-UHFFFAOYSA-N 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 239000004761 kevlar Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003216 poly(methylphenylsiloxane) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
Landscapes
- Reinforced Plastic Materials (AREA)
- Organic Insulating Materials (AREA)
- Insulated Conductors (AREA)
- Insulating Bodies (AREA)
Description
【発明の詳細な説明】 （発明の技術分野） 本発明は、ガラス繊維、グラフアイト繊維等の含浸剤と
して、好適する耐熱性プリプレグに関する。TECHNICAL FIELD OF THE INVENTION The present invention relates to a heat-resistant prepreg suitable as an impregnating agent for glass fiber, graphite fiber and the like.
（発明の技術的背景） 近年、自動車や航空宇宙機器の構造部材にガラス、グラ
フアイト、ケブラー繊維（デュポン社製の商品名；ポリ
アミド繊維）にエポキシ樹脂等を含浸じたテープがよく
使われている。(Technical background of the invention) In recent years, tapes obtained by impregnating glass, graphite, Kevlar fiber (trade name manufactured by DuPont; polyamide fiber) with epoxy resin, etc. are often used for structural members of automobiles and aerospace equipment. There is.
このテープはエポキシ樹脂等の樹脂を繊維に含浸させて
用いることからプリプレグ(preimpregnated)テープとよばれ
ている。又このプリプレグテープはエポキシ樹脂等を含
浸するので強度が大きく、自己接着性並びに基体への接
着性が優れているので、加工し易く、取扱いが容易とい
う特徴を有している。This tape is called a preimpregnated tape because it is used by impregnating a fiber with a resin such as an epoxy resin. Further, since this prepreg tape is impregnated with an epoxy resin or the like, it has high strength and is excellent in self-adhesiveness and adhesiveness to a substrate, so that it is easy to process and easy to handle.
（背景技術の問題点） しかしながら、耐熱性については含浸させる繊維よりも
エポキシ樹脂等の含浸樹脂の耐熱性で耐熱温度が決まっ
てしまうというのが実状であった。(Problems of background art) However, regarding the heat resistance, the heat resistance temperature is determined by the heat resistance of the impregnated resin such as epoxy resin rather than the fiber to be impregnated.
具体的には、ガラス、グラフアイト、ケプラー繊維にエ
ポキシ樹脂を含浸させたプリプレグテープの耐熱温度は
１２０℃が限界であり、それ以上の温度になるとエポキ
シ樹脂の熱劣化に伴なう強度低下並びに接着力の低下が
生じ、使用不能であるという問題があった。Specifically, the heat resistance temperature of prepreg tape obtained by impregnating glass, graphite, and Kepler fibers with epoxy resin is 120 ° C., and at temperatures above this limit, strength deterioration due to thermal deterioration of epoxy resin and There is a problem in that the adhesive strength is reduced and it cannot be used.
（発明の目的） 本発明は、このような問題を解決するためになされたも
ので、高温長時間使用後においても接着性が低下するこ
とのない耐熱性プリプレグを提供することを目的とす
る。(Object of the Invention) The present invention has been made to solve such a problem, and an object of the present invention is to provide a heat-resistant prepreg in which the adhesiveness does not decrease even after use at high temperature for a long time.
（発明の概要） すなわち本発明は、耐熱性基材にボロシロキサン重合体
を少なくとも１０重量％含む耐熱性樹脂を含浸させ、加
熱乾燥して形成する耐熱性プリプレグにおいて、加熱乾
燥の条件は、Ｘ軸が温度（℃），Ｙ軸が加熱乾燥時間
（時間）の座標平面において、Ａ（３００，０．２
５），Ｂ（２５０，０．５），Ｃ（２００，１．０），
Ｄ（２００，３．０），Ｅ（２５０，１．５），Ｆ（３
００，０．７５）の６つの点を頂点とする多角形により
囲まれる範囲内とすることを特徴とする耐熱性プリプレ
グに関する。(Summary of the Invention) That is, according to the present invention, in a heat-resistant prepreg formed by impregnating a heat-resistant base material with a heat-resistant resin containing at least 10% by weight of a borosiloxane polymer and heating and drying, the heat-drying condition is X. In the coordinate plane where the axis is temperature (° C) and the Y axis is heat drying time (hour), A (300, 0.2)
5), B (250, 0.5), C (200, 1.0),
D (200, 3.0), E (250, 1.5), F (3
00, 0.75) within a range surrounded by a polygon having six points as vertices.
ここで本発明における耐熱性基材としては、ガラス、グ
ラフアイト、カーボン、炭化ケイ素その他無機物の繊
維、不織布、テープ、ペーパー等耐熱性に優れたものを
用いることができる。Here, as the heat resistant substrate in the present invention, glass, graphite, carbon, silicon carbide or other inorganic fiber, non-woven fabric, tape, paper or the like having excellent heat resistance can be used.
又、本発明におけるボロシロキサン重合体としては、ケ
イ素、酸素、ホウ素を主要骨格とする高分子化合物は、
どれも用いることができる。しかしながら耐熱性等の点
から特に、ジメチルシリコンオイルやメチルフェニルシ
リコンオイルのようなシリコンオイルを溶媒とし、ジフ
ェニルジヒドロキシシランやジメチルジヒドロキシシラ
ンのようなヒドロキシシラン、およびホウ酸化合物を縮
重合させて得られた重合体を用いることが望ましい。Further, as the borosiloxane polymer in the present invention, a polymer compound having silicon, oxygen and boron as a main skeleton is
Any can be used. However, especially from the viewpoint of heat resistance, it is obtained by polycondensing a hydroxysilane such as diphenyldihydroxysilane or dimethyldihydroxysilane, and a boric acid compound using silicone oil such as dimethylsilicone oil or methylphenylsilicone oil as a solvent. It is desirable to use different polymers.
本発明における耐熱性樹脂としてはシリコーン樹脂、ポ
リイミド樹脂、ポリアミドイミド樹脂、ポリエーテルス
ルホン樹脂、ポリエーテルエーテルケトン樹脂、芳香族
ポリアミド樹脂（アラミド樹脂）、ポリアリレート樹
脂、ポリサルホン樹脂、ポリフェニレンスルフィド樹
脂、ポリフェニレンオキサイド樹脂およびポリカーボネ
ート樹脂等を用いることができる。As the heat-resistant resin in the present invention, silicone resin, polyimide resin, polyamideimide resin, polyethersulfone resin, polyetheretherketone resin, aromatic polyamide resin (aramid resin), polyarylate resin, polysulfone resin, polyphenylene sulfide resin, polyphenylene Oxide resin and polycarbonate resin can be used.
本発明において耐熱性樹脂に対するボロシロキサン重合
体の含有量を少なくとも１０重量％と限定したのは、１
０重量％未満ではボロシロキサン重合体の耐熱効果を充
分発揮できず、耐熱性に問題があるためである。In the present invention, the content of the borosiloxane polymer based on the heat resistant resin is limited to at least 10% by weight.
This is because if it is less than 0% by weight, the heat resistance effect of the borosiloxane polymer cannot be sufficiently exhibited, and there is a problem in heat resistance.
尚、ボロシロキサン樹脂を含む耐熱性樹脂には各種充填
剤および着色顔料等の併用も可能である。Incidentally, various fillers and color pigments can be used in combination with the heat resistant resin containing the borosiloxane resin.
又、本発明において、このような耐熱性基材にボロシロ
キサン重合体を含む耐熱性樹脂を含浸させたものの加熱
乾燥温度は２００〜３００℃が好ましく、その理由はボ
ロシロキサン重合体の加熱乾燥が不十分な場合も過度に
加熱乾燥した場合にも自己接着性および基体への接着性
が悪くなるためである。In the present invention, the heat-drying temperature of such a heat-resistant substrate impregnated with a heat-resistant resin containing a borosiloxane polymer is preferably 200 to 300 ° C., because the borosiloxane polymer is heat-dried. This is because the self-adhesiveness and the adhesiveness to the substrate are deteriorated both when it is insufficient and when it is excessively dried by heating.
即ち、これらの接着特性は、ボロシロキサン重合体が有
するケイ素−アルキル基又はケイ素−フェニル基の結合
が適正な量だけ分解することにより実現するものと考え
られ、本発明者等はバッチ式で実験を繰返した結果加熱
乾燥の条件が、図面に示すIIの範囲であれば充分な接着
特性が得られることを見出した（Ｉの範囲の条件では加
熱乾燥オーバ、IIIの範囲の条件では加熱乾燥不十
分）。That is, it is considered that these adhesive properties are realized by decomposing an appropriate amount of the bond of the silicon-alkyl group or the silicon-phenyl group possessed by the borosiloxane polymer, and the present inventors conducted an experiment in a batch system. As a result of repeating the above, it was found that sufficient adhesive properties can be obtained when the condition of heating and drying is in the range II shown in the drawing (heat drying is over in the condition of the range I, and heat drying is impossible in the condition of the range III. sufficient).
したがって、加熱乾燥にあたっては２００〜３００℃の
温度でかつ図面のIIの範囲にはいる適正な時間を選んで
加熱乾燥を行なうことにより、プリプレグとしての特性
に優れたものが得られる。しかしながら生産炉で連続的
に長尺物を乾燥する場合には当然炉の温度は一定でなく
或る分布をもっているから、単に炉の設定温度と時間を
図面のIIの範囲に設定すれば良いわけではなく、実質的
にプリプレグにかかる温度と加熱乾燥時間が、図面のII
の範囲となるように適宜、条件設定を行えば良い。Therefore, in heat-drying, by heating at a temperature of 200 to 300 ° C. and at an appropriate time within the range II in the drawing for heat-drying, a product having excellent characteristics as a prepreg can be obtained. However, when drying a long product continuously in a production furnace, the temperature of the furnace is not constant and naturally has a certain distribution, so it suffices to simply set the furnace temperature and time within the range II in the drawing. Not substantially the temperature and heat drying time of the prepreg are
The conditions may be appropriately set so that the range becomes.
尚、このような耐熱性基材に樹脂を含浸したものを加熱
乾燥して得られる本発明の耐熱性プリプレグにおいて
は、ボロシロキサン樹脂及び耐熱性樹脂をＮ−メチル−
２−ピロリドン、ジメチルアセトアミド、キシレン、エ
タノール等の汎用の溶剤で溶解したものを耐熱性基材に
含浸させた場合には取り扱いが容易となりかつ同様な効
果を発揮することができる。In the heat-resistant prepreg of the present invention obtained by heating and drying such a heat-resistant substrate impregnated with a resin, the borosiloxane resin and the heat-resistant resin are N-methyl-
When a heat-resistant base material is impregnated with a solution of a general-purpose solvent such as 2-pyrrolidone, dimethylacetamide, xylene, or ethanol, it is easy to handle and the same effect can be exhibited.
（発明の実施例） 以下本発明の実施例について記載する。(Examples of the Invention) Examples of the present invention will be described below.
実施例１〜３ 次の方法でボロシロキサン重合体を生成した。Examples 1 to 3 A borosiloxane polymer was produced by the following method.
すなわちジフェニルジヒドロキシシラン４３２ｇ、ホウ
酸８３ｇ、１０センチストークスのジメチルシリコンオ
イル２５５ｇをフラスコにいれ、窒素雰囲気中で室温か
ら４００℃まで徐々に加熱撹拌し、さらに４００℃で１
時間加熱撹拌して重縮合反応させた。That is, 432 g of diphenyldihydroxysilane, 83 g of boric acid, and 255 g of dimethyl silicone oil of 10 centistokes were placed in a flask, and the mixture was gradually heated and stirred in a nitrogen atmosphere from room temperature to 400 ° C.
The mixture was heated and stirred for a time to cause a polycondensation reaction.
こうして生成されたボロシロキサン重合体（キシレン５
０重量％溶液）と各種耐熱性樹脂を溶剤で溶解して溶液
としたものを次表に示す割合（樹脂の重量％）で混合し
た塗料をアルミナ系セラミックペーパーに含浸し次表に
示す条件で加熱乾燥した。また比較のために条件を図面
のIIの範囲外の条件で加熱乾燥した（比較例１，２，
３）。更に、ガラステープにエポキシ樹脂を含浸したも
のを比較例４とした。The borosiloxane polymer thus produced (xylene 5
0 wt% solution) and various heat resistant resins dissolved in a solvent to form a solution were mixed at a ratio (% by weight of resin) shown in the following table to impregnate alumina ceramic paper with the conditions shown in the following table. Heat dried. For comparison, the heat-drying was carried out under the condition outside the range II of the drawing (Comparative Examples 1, 2,
3). Further, Comparative Example 4 was prepared by impregnating a glass tape with an epoxy resin.
得られたプリプレグの特性についての試験結果を次表に
併せて示す。The test results for the properties of the obtained prepreg are also shown in the following table.
この試験結果から耐熱性基材にポロシロキサン重合体を
含む耐熱性樹脂を含浸させたものを適正な条件下で加熱
乾燥してはじめて、プリプレグとして必要かつ充分な接
着性を有した耐熱性プリプレグが得られることがわか
る。 From this test result, heat-resistant base material impregnated with heat-resistant resin containing a polysiloxane polymer is heated and dried under appropriate conditions until a heat-resistant prepreg having necessary and sufficient adhesiveness as a prepreg is obtained. You can see that you can get it.
（発明の効果） 以下の実施例から明らかなように、本発明の耐熱性プリ
プレグは接着性に優れ、しかも高温使用後においても良
好な接着性を保持している。(Effects of the Invention) As is clear from the following examples, the heat-resistant prepreg of the present invention has excellent adhesiveness, and retains good adhesiveness even after use at high temperatures.
図面は、耐熱性基材にボロシロキサン重合体と耐熱性樹
脂を含浸したものの適正な加熱乾燥条件を示すグラフで
ある。The drawing is a graph showing appropriate heat drying conditions of a heat resistant substrate impregnated with a borosiloxane polymer and a heat resistant resin.
Claims (1)
くとも１０重量％含む耐熱性樹脂を含浸させ、加熱乾燥
して形成する耐熱性プリプレグにおいて、加熱乾燥の条
件は、Ｘ軸が温度（℃），Ｙ軸が加熱乾燥時間（時間）
の座標平面において、Ａ（３００，０．２５），Ｂ（２
５０，０．５），Ｃ（２００，１．０），Ｄ（２００，
３．０），Ｅ（２５０，１．５），Ｆ（３００，０．７
５）の６つの点を頂点とする多角形により囲まれる範囲
内とすることを特徴とする耐熱性プリプレグの製造方
法。1. A heat-resistant prepreg formed by impregnating a heat-resistant substrate with a heat-resistant resin containing at least 10% by weight of a borosiloxane polymer, and drying by heating, the conditions for heat drying are that the X axis is temperature (° C.). ), Y axis is heat drying time (hours)
On the coordinate plane of A (300, 0.25), B (2
50, 0.5), C (200, 1.0), D (200,
3.0), E (250, 1.5), F (300, 0.7)
5) A method for producing a heat-resistant prepreg, which is set within a range surrounded by a polygon having 6 points as vertices.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60159417A JPH0645709B2 (en) | 1985-07-19 | 1985-07-19 | Method for manufacturing heat resistant prepreg |
| GB8617440A GB2180857B (en) | 1985-07-19 | 1986-07-17 | Heat resistant prepreg and method for production thereof |
| CA000514118A CA1291378C (en) | 1985-07-19 | 1986-07-18 | Heat-resistant prepreg and method for production thereof |
| US06/886,794 US4735858A (en) | 1985-07-19 | 1986-07-18 | Heat-resistant prepreg and method for production thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60159417A JPH0645709B2 (en) | 1985-07-19 | 1985-07-19 | Method for manufacturing heat resistant prepreg |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6220534A JPS6220534A (en) | 1987-01-29 |
| JPH0645709B2 true JPH0645709B2 (en) | 1994-06-15 |
Family
ID=15693289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60159417A Expired - Lifetime JPH0645709B2 (en) | 1985-07-19 | 1985-07-19 | Method for manufacturing heat resistant prepreg |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0645709B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102252026A (en) * | 2011-07-14 | 2011-11-23 | 常州市武进长江滚针轴承有限公司 | Manufacturing method of engineering plastic bearing cage |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006120456A (en) * | 2004-10-21 | 2006-05-11 | Fujikura Ltd | Tape and fireproof wire |
| CN104016713B (en) * | 2014-05-20 | 2016-03-02 | 潘东海 | A kind of hydrogen chloride synthetic furnace graphite burning room high temperature resisting dipping treatment process |
| CN117431757A (en) * | 2022-07-15 | 2024-01-23 | 厦门中创环保科技股份有限公司 | A glass fiber filter material coating formula that can make the glass fiber filter material resistant to bending and its use method |
-
1985
- 1985-07-19 JP JP60159417A patent/JPH0645709B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102252026A (en) * | 2011-07-14 | 2011-11-23 | 常州市武进长江滚针轴承有限公司 | Manufacturing method of engineering plastic bearing cage |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6220534A (en) | 1987-01-29 |
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