JPH0788466B2 - Polyphenylene ether heat-resistant resin composition - Google Patents
Polyphenylene ether heat-resistant resin compositionInfo
- Publication number
- JPH0788466B2 JPH0788466B2 JP61244698A JP24469886A JPH0788466B2 JP H0788466 B2 JPH0788466 B2 JP H0788466B2 JP 61244698 A JP61244698 A JP 61244698A JP 24469886 A JP24469886 A JP 24469886A JP H0788466 B2 JPH0788466 B2 JP H0788466B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- styrene
- weight
- polyphenylene ether
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920001955 polyphenylene ether Polymers 0.000 title claims description 24
- 239000011342 resin composition Substances 0.000 title claims description 19
- 229920006015 heat resistant resin Polymers 0.000 title claims description 7
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 41
- 229920005989 resin Polymers 0.000 claims description 28
- 239000011347 resin Substances 0.000 claims description 28
- -1 aromatic vinyl compound Chemical class 0.000 claims description 18
- 239000000203 mixture Substances 0.000 claims description 13
- 239000006078 metal deactivator Substances 0.000 claims description 10
- 150000001875 compounds Chemical class 0.000 claims description 6
- 229920001971 elastomer Polymers 0.000 claims description 5
- 229920002554 vinyl polymer Polymers 0.000 claims description 5
- 230000000379 polymerizing effect Effects 0.000 claims description 4
- 229920001577 copolymer Polymers 0.000 description 19
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 16
- 229920000642 polymer Polymers 0.000 description 16
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 13
- 229910052709 silver Inorganic materials 0.000 description 13
- 239000004332 silver Substances 0.000 description 13
- 238000000465 moulding Methods 0.000 description 12
- NXXYKOUNUYWIHA-UHFFFAOYSA-N 2,6-Dimethylphenol Chemical compound CC1=CC=CC(C)=C1O NXXYKOUNUYWIHA-UHFFFAOYSA-N 0.000 description 10
- 229920013636 polyphenyl ether polymer Polymers 0.000 description 9
- 239000003054 catalyst Substances 0.000 description 8
- QQOMQLYQAXGHSU-UHFFFAOYSA-N 2,3,6-Trimethylphenol Chemical compound CC1=CC=C(C)C(O)=C1C QQOMQLYQAXGHSU-UHFFFAOYSA-N 0.000 description 7
- 229920000578 graft copolymer Polymers 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 4
- 239000003963 antioxidant agent Substances 0.000 description 4
- 230000003078 antioxidant effect Effects 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 229920005669 high impact polystyrene Polymers 0.000 description 3
- 239000004797 high-impact polystyrene Substances 0.000 description 3
- 229920001519 homopolymer Polymers 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- QWBBPBRQALCEIZ-UHFFFAOYSA-N 2,3-dimethylphenol Chemical compound CC1=CC=CC(O)=C1C QWBBPBRQALCEIZ-UHFFFAOYSA-N 0.000 description 2
- 150000003923 2,5-pyrrolediones Chemical class 0.000 description 2
- METWAQRCMRWDAW-UHFFFAOYSA-N 2,6-diethylphenol Chemical compound CCC1=CC=CC(CC)=C1O METWAQRCMRWDAW-UHFFFAOYSA-N 0.000 description 2
- NAILKKRDWBJCNH-UHFFFAOYSA-N 2,6-dipropylphenol Chemical compound CCCC1=CC=CC(CCC)=C1O NAILKKRDWBJCNH-UHFFFAOYSA-N 0.000 description 2
- CIRRFAQIWQFQSS-UHFFFAOYSA-N 6-ethyl-o-cresol Chemical compound CCC1=CC=CC(C)=C1O CIRRFAQIWQFQSS-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 238000007334 copolymerization reaction Methods 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- QTMDXZNDVAMKGV-UHFFFAOYSA-L copper(ii) bromide Chemical compound [Cu+2].[Br-].[Br-] QTMDXZNDVAMKGV-UHFFFAOYSA-L 0.000 description 2
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 2
- 150000001993 dienes Chemical class 0.000 description 2
- 238000010556 emulsion polymerization method Methods 0.000 description 2
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- 125000002950 monocyclic group Chemical group 0.000 description 2
- 238000005691 oxidative coupling reaction Methods 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 230000003405 preventing effect Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 150000003512 tertiary amines Chemical class 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- OJOWICOBYCXEKR-KRXBUXKQSA-N (5e)-5-ethylidenebicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(=C/C)/CC1C=C2 OJOWICOBYCXEKR-KRXBUXKQSA-N 0.000 description 1
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- WCUDDVOHXLKLQN-UHFFFAOYSA-N 2,3,6-triethylphenol Chemical compound CCC1=CC=C(CC)C(CC)=C1O WCUDDVOHXLKLQN-UHFFFAOYSA-N 0.000 description 1
- SMTRUNQBPAVAIZ-UHFFFAOYSA-N 2,3,6-tripropylphenol Chemical compound CCCC1=CC=C(CCC)C(CCC)=C1O SMTRUNQBPAVAIZ-UHFFFAOYSA-N 0.000 description 1
- RLEWTHFVGOXXTN-UHFFFAOYSA-N 2,3-diethylphenol Chemical compound CCC1=CC=CC(O)=C1CC RLEWTHFVGOXXTN-UHFFFAOYSA-N 0.000 description 1
- HRQPPTDGMMGDKC-UHFFFAOYSA-N 2,3-dipropylphenol Chemical compound CCCC1=CC=CC(O)=C1CCC HRQPPTDGMMGDKC-UHFFFAOYSA-N 0.000 description 1
- HJPICRYOHOZPSA-UHFFFAOYSA-N 2,6-dimethyl-3-propylphenol Chemical compound CCCC1=CC=C(C)C(O)=C1C HJPICRYOHOZPSA-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 1
- OCKYMBMCPOAFLL-UHFFFAOYSA-N 2-ethyl-3-methylphenol Chemical compound CCC1=C(C)C=CC=C1O OCKYMBMCPOAFLL-UHFFFAOYSA-N 0.000 description 1
- XRSWLVYCXFHDDB-UHFFFAOYSA-N 2-ethyl-3-propylphenol Chemical compound CCCC1=CC=CC(O)=C1CC XRSWLVYCXFHDDB-UHFFFAOYSA-N 0.000 description 1
- AKZFZHNJLYDHKN-UHFFFAOYSA-N 2-ethyl-6-propylphenol Chemical compound CCCC1=CC=CC(CC)=C1O AKZFZHNJLYDHKN-UHFFFAOYSA-N 0.000 description 1
- XNCTZUPZTWUFNW-UHFFFAOYSA-N 2-methyl-3-propylphenol Chemical compound CCCC1=CC=CC(O)=C1C XNCTZUPZTWUFNW-UHFFFAOYSA-N 0.000 description 1
- PYSRRFNXTXNWCD-UHFFFAOYSA-N 3-(2-phenylethenyl)furan-2,5-dione Chemical compound O=C1OC(=O)C(C=CC=2C=CC=CC=2)=C1 PYSRRFNXTXNWCD-UHFFFAOYSA-N 0.000 description 1
- DRNBTKBRWOSYSD-UHFFFAOYSA-N 3-ethyl-2,6-dimethylphenol Chemical compound CCC1=CC=C(C)C(O)=C1C DRNBTKBRWOSYSD-UHFFFAOYSA-N 0.000 description 1
- IVFJPARIJHUGPZ-UHFFFAOYSA-N 3-ethyl-2-methylphenol Chemical compound CCC1=CC=CC(O)=C1C IVFJPARIJHUGPZ-UHFFFAOYSA-N 0.000 description 1
- JFAMOKKVRCODIC-UHFFFAOYSA-N 3-ethyl-2-propylphenol Chemical compound CCCC1=C(O)C=CC=C1CC JFAMOKKVRCODIC-UHFFFAOYSA-N 0.000 description 1
- FCUBUGPGVCEURB-UHFFFAOYSA-N 3-methyl-2-propylphenol Chemical compound CCCC1=C(C)C=CC=C1O FCUBUGPGVCEURB-UHFFFAOYSA-N 0.000 description 1
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical compound CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 description 1
- ZLPORNPZJNRGCO-UHFFFAOYSA-N 3-methylpyrrole-2,5-dione Chemical compound CC1=CC(=O)NC1=O ZLPORNPZJNRGCO-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- VSAWBBYYMBQKIK-UHFFFAOYSA-N 4-[[3,5-bis[(3,5-ditert-butyl-4-hydroxyphenyl)methyl]-2,4,6-trimethylphenyl]methyl]-2,6-ditert-butylphenol Chemical compound CC1=C(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C1CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 VSAWBBYYMBQKIK-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- XJXZDCCEALYMJL-UHFFFAOYSA-L C(O)CN.[Cl-].[Mn+2].[Cl-] Chemical compound C(O)CN.[Cl-].[Mn+2].[Cl-] XJXZDCCEALYMJL-UHFFFAOYSA-L 0.000 description 1
- GPDLYQNVRPKOHT-UHFFFAOYSA-M C1=CC=NC=C1.[OH-].Cl.[K+] Chemical compound C1=CC=NC=C1.[OH-].Cl.[K+] GPDLYQNVRPKOHT-UHFFFAOYSA-M 0.000 description 1
- 239000004709 Chlorinated polyethylene Substances 0.000 description 1
- 229910021590 Copper(II) bromide Inorganic materials 0.000 description 1
- 101000777220 Homo sapiens Ubiquitin carboxyl-terminal hydrolase 3 Proteins 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- KEQFTVQCIQJIQW-UHFFFAOYSA-N N-Phenyl-2-naphthylamine Chemical compound C=1C=C2C=CC=CC2=CC=1NC1=CC=CC=C1 KEQFTVQCIQJIQW-UHFFFAOYSA-N 0.000 description 1
- HDFGOPSGAURCEO-UHFFFAOYSA-N N-ethylmaleimide Chemical compound CCN1C(=O)C=CC1=O HDFGOPSGAURCEO-UHFFFAOYSA-N 0.000 description 1
- 229920001890 Novodur Polymers 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 229920007962 Styrene Methyl Methacrylate Polymers 0.000 description 1
- 229920000147 Styrene maleic anhydride Polymers 0.000 description 1
- 102100031287 Ubiquitin carboxyl-terminal hydrolase 3 Human genes 0.000 description 1
- YFTIRLAWDTWKKG-UHFFFAOYSA-K [Na+].[Cl-].[Mn+2].[Cl-].[Cl-] Chemical compound [Na+].[Cl-].[Mn+2].[Cl-].[Cl-] YFTIRLAWDTWKKG-UHFFFAOYSA-K 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 229920001893 acrylonitrile styrene Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 150000001868 cobalt Chemical class 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- ZESAGPFTHPLSMC-UHFFFAOYSA-L ethane-1,2-diamine manganese(2+) diacetate Chemical compound [Mn++].CC([O-])=O.CC([O-])=O.NCCN ZESAGPFTHPLSMC-UHFFFAOYSA-L 0.000 description 1
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 229920000126 latex Polymers 0.000 description 1
- 239000004816 latex Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 150000002696 manganese Chemical class 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 229940071125 manganese acetate Drugs 0.000 description 1
- UOGMEBQRZBEZQT-UHFFFAOYSA-L manganese(2+);diacetate Chemical compound [Mn+2].CC([O-])=O.CC([O-])=O UOGMEBQRZBEZQT-UHFFFAOYSA-L 0.000 description 1
- ADFPJHOAARPYLP-UHFFFAOYSA-N methyl 2-methylprop-2-enoate;styrene Chemical compound COC(=O)C(C)=C.C=CC1=CC=CC=C1 ADFPJHOAARPYLP-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-M phenolate Chemical compound [O-]C1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-M 0.000 description 1
- 229940031826 phenolate Drugs 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001485 poly(butyl acrylate) polymer Polymers 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002285 poly(styrene-co-acrylonitrile) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- AOJFQRQNPXYVLM-UHFFFAOYSA-N pyridin-1-ium;chloride Chemical compound [Cl-].C1=CC=[NH+]C=C1 AOJFQRQNPXYVLM-UHFFFAOYSA-N 0.000 description 1
- WQDUMFSSJAZKTM-UHFFFAOYSA-N sodium methoxide Substances [Na+].[O-]C WQDUMFSSJAZKTM-UHFFFAOYSA-N 0.000 description 1
- NESLWCLHZZISNB-UHFFFAOYSA-M sodium phenolate Chemical compound [Na+].[O-]C1=CC=CC=C1 NESLWCLHZZISNB-UHFFFAOYSA-M 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 238000010558 suspension polymerization method Methods 0.000 description 1
- ANRHNWWPFJCPAZ-UHFFFAOYSA-M thionine Chemical compound [Cl-].C1=CC(N)=CC2=[S+]C3=CC(N)=CC=C3N=C21 ANRHNWWPFJCPAZ-UHFFFAOYSA-M 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- ILWRPSCZWQJDMK-UHFFFAOYSA-N triethylazanium;chloride Chemical compound Cl.CCN(CC)CC ILWRPSCZWQJDMK-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Description
【発明の詳細な説明】 〈産業上の利用分野〉 本発明は、優れた熱安定性を有するポリフェニレンエー
テル系耐熱性樹脂組成物に関する。さらに詳しくは、高
温成形時に外観不良“シルバー”を生じないポリフェニ
レンエーテル系耐熱性樹脂組成物に関する。DETAILED DESCRIPTION OF THE INVENTION <Field of Industrial Application> The present invention relates to a polyphenylene ether-based heat resistant resin composition having excellent thermal stability. More specifically, it relates to a polyphenylene ether heat-resistant resin composition that does not cause a defective appearance "silver" during high temperature molding.
〈従来の技術〉 ポリフェニレンエーテル系樹脂は、耐熱性、耐衝撃性に
優れた樹脂であるが、それ単独では成形加工が困難であ
ることより、ポリフェニレンエーテル系樹脂とスチレン
系樹脂とからなる加工性の改善された樹脂組成物が多数
提案されており、すでに一部は実用化されている。(特
公昭43-17812、特公昭47-43174、特公昭51-28659、USP3
383435、USP4360618) ポリフェニレンエーテル系樹脂とスチレン系樹脂からな
る樹脂組成物は、一般には設定温度約290℃にて成形さ
れているが、近年プラスチック成形品の大型化ならびに
デザインの複雑化のため、より優れた加工性が求められ
ている。<Prior art> Polyphenylene ether resin is a resin with excellent heat resistance and impact resistance, but since it is difficult to mold by itself, it is a workability that consists of polyphenylene ether resin and styrene resin. Many improved resin compositions have been proposed, and some of them have already been put into practical use. (Japanese Patent Publication 43-17812, Japanese Publication 47-43174, Japanese Publication 51-28659, USP3
383435, USP4360618) A resin composition composed of a polyphenylene ether resin and a styrene resin is generally molded at a set temperature of about 290 ° C., but due to the increase in size of plastic molded products and the complicated design in recent years, more Excellent workability is required.
スチレン系樹脂の配合量を増加させれば加工性が向上す
るが、その反面耐熱性が著しく低下する。The workability is improved by increasing the blending amount of the styrene resin, but the heat resistance is remarkably lowered.
また、成形加工温度を上げると見掛けの加工性は向上す
るものの熱安定性が低下し、成形品表面にシルバースト
リーク(銀条痕)(以下、シルバーと記す。)を発生す
る。シルバー発生部分はその後の二次加工(塗装等)に
よっても消えることがなく、また成形温度を下げると加
工性が悪くなり金型内で充填不足といった問題を生じ
る。Further, when the molding processing temperature is raised, the apparent workability is improved, but the thermal stability is reduced, and silver streaks (hereinafter referred to as silver) are generated on the surface of the molded product. The silver generation portion does not disappear even after the secondary processing (painting, etc.), and if the molding temperature is lowered, the workability deteriorates and the problem of insufficient filling in the mold occurs.
一般的には、樹脂中に含まれる揮発成分が多いほどシル
バー発生の著しいことが知られており、成形前の乾燥条
件の強化といった手段が講じられている。しかしなが
ら、シルバー発生の原因は、成形前の樹脂中に含まれる
揮発成分のみでなく、他の不明原因も存在するため、乾
燥条件を強化してもシルバー発生を皆無にするまでには
至っていないのが実情である。また、一般的な酸化防止
剤の添加によっても改善されない。It is generally known that the more the volatile component contained in the resin, the more remarkable the generation of silver, and measures such as strengthening the drying conditions before molding are taken. However, the cause of silver generation is not only the volatile components contained in the resin before molding, but there are other unknown causes as well, so even if the drying conditions are strengthened, the occurrence of silver has not been completely eliminated. Is the reality. Further, it is not improved by the addition of a general antioxidant.
〈問題点を解決するための手段〉 本発明者らは、上述の問題点に鑑み鋭意研究した結果、
ポリフェニレンエーテル系樹脂とスチレン系樹脂とから
なる樹脂組成物に特定の化合物を少量配合することによ
り、高温成形時におけるシルバー発生を大幅に低下する
ことができ、より高温での成形が可能であるポリフェニ
レンエーテル系耐熱性樹脂組成物を見出し、本発明に到
達したものである。<Means for Solving Problems> The inventors of the present invention have conducted extensive studies in view of the above problems, and as a result,
By adding a small amount of a specific compound to a resin composition composed of a polyphenylene ether resin and a styrene resin, it is possible to significantly reduce silver generation during high temperature molding, and it is possible to mold at higher temperatures. The present invention has been accomplished by finding an ether heat-resistant resin composition.
すなわち、本発明は、ポリフェニレンエーテル系樹脂
(以下、PPEと記す。)とスチレン系樹脂とからなる樹
脂組成物(A)100重量部に対し、特定の構造式で示さ
れる金属不活性化剤(B)0.001〜5.0重量部配合してな
ることを特徴とする高温成形時に外観不良“シルバー”
を生じないポリフェニレンエーテル系耐熱性樹脂組成物
を提供するものである。That is, the present invention relates to 100 parts by weight of a resin composition (A) composed of a polyphenylene ether resin (hereinafter referred to as PPE) and a styrene resin, and a metal deactivator represented by a specific structural formula ( B) Poor appearance "silver" during high temperature molding, characterized by containing 0.001 to 5.0 parts by weight
The present invention provides a polyphenylene ether-based heat-resistant resin composition that does not generate heat.
以下、本発明について詳細に説明する。Hereinafter, the present invention will be described in detail.
PPE 本発明において用いられるPPEとは、下記一般式で示さ
れる単環式フェノールの一種以上を酸化カップリング触
媒ならびに酸素または酸素含有ガスの存在下で酸化重合
して得られる重合体である。PPE The PPE used in the present invention is a polymer obtained by oxidatively polymerizing one or more monocyclic phenols represented by the following general formula in the presence of an oxidative coupling catalyst and oxygen or an oxygen-containing gas.
(式中、R1は炭素数1〜3の低級アルキル基、R2および
R3は水素原子または炭素数1〜3の低級アルキル基であ
る。) なお、PPEは上記一般式で示される単環式フェノールの
単独重合体であっても、また共重合体であってもよい。 (In the formula, R 1 is a lower alkyl group having 1 to 3 carbon atoms, R 2 and
R 3 is a hydrogen atom or a lower alkyl group having 1 to 3 carbon atoms. ) PPE may be a homopolymer or a copolymer of the monocyclic phenol represented by the above general formula.
上記一般式で示される単環式フェノールとしては、例え
ば2,6−ジメチルフェノール、2,6−ジエチルフェノー
ル、2,6−ジプロピルフェノール、2−メチル−6−エ
チルフェノール、2−メチル−6−プロピルフェノー
ル、2−エチル−6−プロピルフェノール、m−クレゾ
ール、2,3−ジメチルフェノール、2,3−ジエチルフェノ
ール、2,3−ジプロピルフェノール、2−メチル−3−
エチルフェノール、2−メチル−3−プロピルフェノー
ル、2−エチル−3−メチルフェノール、2−エチル−
3−プロピルフェノール、2−プロピル−3−メチルフ
ェノール、2−プロピル−3−エチルフェノール、2,3,
6−トリメチルフェノール、2,3,6−トリエチルフェノー
ル、2,3,6−トリプロピルフェノール、2,6−ジメチル−
3−エチルフェノール、2,6−ジメチル−3−プロピル
フェノール等が挙げられる。Examples of the monocyclic phenol represented by the above general formula include 2,6-dimethylphenol, 2,6-diethylphenol, 2,6-dipropylphenol, 2-methyl-6-ethylphenol and 2-methyl-6. -Propylphenol, 2-ethyl-6-propylphenol, m-cresol, 2,3-dimethylphenol, 2,3-diethylphenol, 2,3-dipropylphenol, 2-methyl-3-
Ethylphenol, 2-methyl-3-propylphenol, 2-ethyl-3-methylphenol, 2-ethyl-
3-propylphenol, 2-propyl-3-methylphenol, 2-propyl-3-ethylphenol, 2,3,
6-trimethylphenol, 2,3,6-triethylphenol, 2,3,6-tripropylphenol, 2,6-dimethyl-
3-ethylphenol, 2,6-dimethyl-3-propylphenol and the like can be mentioned.
フェノール化合物を酸化重合する際に用いられる酸化カ
ップリング触媒は、特に限定されるものではなく、重合
能を有するいかなる触媒でも使用し得る。例えば、その
代表的なものとしては、塩化第1銅−トリエチルアミ
ン、塩化第1銅−ピリジンなど第1銅塩と第3級アミン
類よりなる触媒、塩化第2銅−ピリジン−水酸化カリウ
ムなどの第2銅塩−アミン−アルカリ金属水酸化物より
なる触媒、塩化マンガン−エタノールアミン、酢酸マン
ガン−エチレンジアミンなどのマンガン塩類と第1級ア
ミン類よりなる触媒、塩化マンガン−ナトリウムメチラ
ート、塩化マンガン−ナトリウムフェノラートなどのマ
ンガン塩類とアルコラートあるいはフェノラートからな
る触媒、コバルト塩類と第3級アミン類との組合せより
なる触媒が挙げられる。The oxidative coupling catalyst used in the oxidative polymerization of the phenol compound is not particularly limited, and any catalyst having a polymerization ability can be used. For example, typical examples thereof include a cuprous chloride-triethylamine, a cuprous chloride-pyridine catalyst such as cupric chloride and a tertiary amine, and cupric chloride-pyridine-potassium hydroxide. Cupric salt-Amine-catalyst consisting of alkali metal hydroxide, manganese chloride-ethanolamine, manganese acetate such as manganese acetate-ethylenediamine and a catalyst consisting of primary amines, manganese chloride-sodium methylate, manganese chloride- Examples thereof include a catalyst composed of a manganese salt such as sodium phenolate and an alcoholate or a phenolate, and a catalyst composed of a combination of a cobalt salt and a tertiary amine.
単環式フェノールの一種以上の重縮合により得られるポ
リフェニレンエーテルとしては、例えば、ポリ(2,6−
ジメチル−1,4−フェニレン)エーテル、ポリ(2,6−ジ
エチル−1,4−フェニレン)エーテル、ポリ(2,6−ジプ
ロピル1,4−フェニレン)エーテル、ポリ(2−メチル
−6−エチル−1,4−フェニレン)エーテル、ポリ(2
−メチル−6−プロピル−1,4−フェニレン)エーテ
ル、ポリ(2−エチル−6−プロピル−1,4−フェニレ
ン)エーテル、2,6−ジメチルフェノール/2,3,6−トリ
メチルフェノール共重合体、2,6−ジメチルフェノール/
2,3,6−トリエチルフェノール共重合体、2,6−ジエチル
フェノール/2,3,6−トリメチルフェノール共重合体、2,
6−ジプロピルフェノール/2,3,6−トリメチルフェノー
ル共重合体等が挙げられる。特に、ポリ(2,6−ジメチ
ル−1,4−フェニレン)エーテル、2,6−ジメチルフェノ
ール/2,3,6−トリメチルフェノール共重合体が好まし
い。Examples of the polyphenylene ether obtained by polycondensation of one or more monocyclic phenols include, for example, poly (2,6-
Dimethyl-1,4-phenylene) ether, poly (2,6-diethyl-1,4-phenylene) ether, poly (2,6-dipropyl-1,4-phenylene) ether, poly (2-methyl-6-ethyl) -1,4-phenylene) ether, poly (2
-Methyl-6-propyl-1,4-phenylene) ether, poly (2-ethyl-6-propyl-1,4-phenylene) ether, 2,6-dimethylphenol / 2,3,6-trimethylphenol copolymerization Combined, 2,6-dimethylphenol /
2,3,6-triethylphenol copolymer, 2,6-diethylphenol / 2,3,6-trimethylphenol copolymer, 2,
6-dipropylphenol / 2,3,6-trimethylphenol copolymer and the like can be mentioned. Particularly, poly (2,6-dimethyl-1,4-phenylene) ether and 2,6-dimethylphenol / 2,3,6-trimethylphenol copolymer are preferable.
スチレン系樹脂 本発明におけるスチレン系樹脂とは、スチレン、α−メ
チルスチレン、p−メチルスチレン、クロルスチレンな
どの芳香族ビニル化合物を必須成分とする重合体であ
り、芳香族ビニル化合物の単独重合体をはじめ、芳香族
ビニル化合物と他の共重合可能な化合物とからなる共重
合体、ゴム質重合体の存在下に芳香族ビニル化合物単独
又は他の共重合可能な化合物と共に重合してなるグラフ
ト重合体、さらにはそれらスチレン系重合体(単独重合
体、共重合体、グラフト重合体)の混合物をも意味する
ものである。Styrenic Resin The styrene resin in the present invention is a polymer containing an aromatic vinyl compound such as styrene, α-methylstyrene, p-methylstyrene, chlorostyrene as an essential component, and a homopolymer of an aromatic vinyl compound. , A copolymer of an aromatic vinyl compound and another copolymerizable compound, or a grafted polymer obtained by polymerizing the aromatic vinyl compound alone or together with another copolymerizable compound in the presence of a rubbery polymer. It also means a combination, and further a mixture of those styrene polymers (homopolymers, copolymers, graft polymers).
前述の共重合体又はグラフト重合体を構成する他の共重
合可能な化合物としては、アクリロニトリル、メタクリ
ロニトリルなどの不飽和ニトリル化合物(i)、メチル
(メタ)アクリレート、エチル(メタ)アクリレート、
ブチル(メタ)アクリレートなどの不飽和カルボン酸ア
ルキルエステル(ii)、アクリル酸、メタクリル酸、マ
レイン酸、マレイン酸無水物、シトラコン酸無水物など
の不飽和カルボン酸又は不飽和ジカルボン酸無水物(ii
i)、マレイミド、メチルマレイミド、エチルマレイミ
ド、N−フェニルマレイミド、O−クロル−N−フェニ
ルマレイミドなどのマレイミド化合物(iv)などがあげ
られる。Examples of the other copolymerizable compound constituting the above-mentioned copolymer or graft polymer include unsaturated nitrile compounds (i) such as acrylonitrile and methacrylonitrile, methyl (meth) acrylate, ethyl (meth) acrylate,
Unsaturated carboxylic acid alkyl ester such as butyl (meth) acrylate (ii), unsaturated carboxylic acid such as acrylic acid, methacrylic acid, maleic acid, maleic anhydride, citraconic anhydride or unsaturated dicarboxylic acid anhydride (ii
i), maleimide compounds (iv) such as maleimide, methylmaleimide, ethylmaleimide, N-phenylmaleimide, and O-chloro-N-phenylmaleimide.
共重合体として、より具体的には次の様な各種共重合体
があげられる。スチレン−アクリロニトリル共重合体、
α−メチルスチレン−アクリロニトリル共重合体、スチ
レン−メチルメタアクリレート共重合体、α−メチルス
チレン−アクリロニトリル−メチルメタアクリレート共
重合体、スチレン−無水マレイン酸共重合体、スチレン
−アクリロニトリル−無水マレイン酸共重合体、スチレ
ン−マレイミド共重合体、スチレン−N−フェニルマレ
イミド共重合体、スチレン−アクリロニトリル−N−フ
ェニルマレイミド共重合体。Specific examples of the copolymer include the following various copolymers. Styrene-acrylonitrile copolymer,
α-methylstyrene-acrylonitrile copolymer, styrene-methylmethacrylate copolymer, α-methylstyrene-acrylonitrile-methylmethacrylate copolymer, styrene-maleic anhydride copolymer, styrene-acrylonitrile-maleic anhydride copolymer Polymer, styrene-maleimide copolymer, styrene-N-phenylmaleimide copolymer, styrene-acrylonitrile-N-phenylmaleimide copolymer.
又、グラフト重合体を構成するゴム質重合体としては、
ポリブタジエン、スチレン−ブタジエン共重合体、アク
リロニトリル−ブタジエン共重合体等のジエン系重合体
(i)、エチレン−プロピレン共重合体、エチレン−プ
ロピレン−非共役ジエン(エチリデンノルボルネン、ジ
シクロペンタジエン等)共重合体等のエチレン−プロピ
レン系重合体(ii)、塩素化ポリエチレン(iii)、ポ
リブチルアクリレートに代表されるアクリル系ゴム(i
v)、エチレン−酢酸ビニル共重合体(v)などがあげ
られる。Further, as the rubbery polymer constituting the graft polymer,
Polybutadiene, styrene-butadiene copolymer, acrylonitrile-butadiene copolymer and other diene polymer (i), ethylene-propylene copolymer, ethylene-propylene-non-conjugated diene (ethylidene norbornene, dicyclopentadiene, etc.) copolymerization Acrylic rubber typified by ethylene-propylene polymer (ii) such as polymer, chlorinated polyethylene (iii), and polybutyl acrylate (i
v), ethylene-vinyl acetate copolymer (v) and the like.
グラフト重合体として、より具体的には次の様な各種グ
ラフト重合体があげられる。アクリロニトリル−ジエン
系ゴム−スチレン重合体、メチルメタアクリレート−ジ
エン系ゴム−スチレン重合体、アクリロニトリル−エチ
レン−プロピレン系ゴム−スチレン重合体、アクリロニ
トリル−アクリル系ゴム−スチレン重合体、アクリロニ
トリル−塩素化ポリエチレン−スチレン重合体、スチレ
ン−ジエン系ゴム−無水マレイン酸重合体。Specific examples of the graft polymer include the following various graft polymers. Acrylonitrile-diene rubber-styrene polymer, methylmethacrylate-diene rubber-styrene polymer, acrylonitrile-ethylene-propylene rubber-styrene polymer, acrylonitrile-acrylic rubber-styrene polymer, acrylonitrile-chlorinated polyethylene- Styrene polymer, styrene-diene rubber-maleic anhydride polymer.
なお、スチレン系樹脂は、乳化重合法、懸濁重合法、溶
液重合法、塊状重合法ならびにそれら重合法の組合せな
ど公知の方法により得ることができる。The styrene resin can be obtained by a known method such as an emulsion polymerization method, a suspension polymerization method, a solution polymerization method, a bulk polymerization method, or a combination of these polymerization methods.
樹脂組成物(A) 樹脂組成物(A)は、PPEとスチレン系樹脂とからな
り、その組成比率には何ら制限はない。ただし、耐熱性
と加工性のバランス面よりPPE10〜90重量%、スチレン
系樹脂90〜10重量%であることが特に好ましい。Resin composition (A) The resin composition (A) is composed of PPE and a styrene resin, and there is no limitation on the composition ratio thereof. However, from the viewpoint of the balance between heat resistance and processability, it is particularly preferable that PPE is 10 to 90% by weight and styrene resin is 90 to 10% by weight.
金属不活性化剤(B) 本発明において用いられる金属不活性化剤(B)とは、
以下の構造式〜にて示される化合物であり、1種ま
たは2種以上用いることができる。Metal deactivator (B) The metal deactivator (B) used in the present invention is
It is a compound represented by the following structural formulas 1 to 2 and may be used alone or in combination of two or more.
上記の構造式〜にて示される金属不活性化剤(B)
は、樹脂組成物(A)100重量部に対し、0.001〜5.0重
量部用いられる。0.001重量部未満では、高温成形時の
シルバー防止効果がなく、一方5.0重量部を超すとシル
バー防止効果はあるものの最終組成物の耐熱性、剛性な
どの低下をもたらすため好ましくない。特に好ましくは
0.05〜1.0重量部である。 Metal deactivators (B) represented by the above structural formulas
Is used in an amount of 0.001 to 5.0 parts by weight based on 100 parts by weight of the resin composition (A). If it is less than 0.001 part by weight, there is no silver preventing effect at the time of high-temperature molding, while if it exceeds 5.0 parts by weight, there is a silver preventing effect, but the heat resistance and rigidity of the final composition decrease, which is not preferable. Particularly preferably
0.05 to 1.0 parts by weight.
本発明のポリフェニレンエーテル系耐熱性樹脂組成物に
おいては、樹脂組成物(A)と金属不活性化剤(B)の
配合方法には何ら制限はなく、バンバリーミキサー、一
軸押出機、二軸押出機などの公知の混合・混練装置にて
行うことができる。In the polyphenylene ether heat-resistant resin composition of the present invention, there is no limitation on the compounding method of the resin composition (A) and the metal deactivator (B), and a Banbury mixer, a single screw extruder, a twin screw extruder. It can be performed by a known mixing / kneading device such as.
なお、混合・混練に際し、着色剤、無機充填剤、酸化防
止剤、可塑剤、帯電防止剤、紫外線吸収剤、難燃剤、発
泡剤、滑剤などの公知の添加剤を配合することも可能で
ある。In addition, it is possible to mix known additives such as a colorant, an inorganic filler, an antioxidant, a plasticizer, an antistatic agent, an ultraviolet absorber, a flame retardant, a foaming agent, and a lubricant when mixing and kneading. .
以下、実施例および比較例により本発明の樹脂組成物を
具体的に説明するが、以下の記載において部およびパー
セント(%)は、特別のことわりがない限り、重量基準
で表わされている。Hereinafter, the resin composition of the present invention will be specifically described with reference to Examples and Comparative Examples. In the following description, parts and percentages (%) are expressed on a weight basis unless otherwise specified.
また、実施例は例示的なものであって、本発明を限定す
るものではない。Further, the embodiments are merely illustrative and do not limit the present invention.
実施例 PPE 2,6−ジメチルフェノール、ジ−n−ブチルアミン、臭
化第2銅及びトルエンを用い、酸素を吹き込みながら30
℃で重合した後、脱触精製し、固有粘度(25℃、クロロ
ホルム)0.50dl/gのポリフェニレンエーテルを得た。Example PPE 2,6-Dimethylphenol, di-n-butylamine, cupric bromide and toluene were used, while oxygen was blown into them.
After polymerizing at ℃, purified by detouching, polyphenylene ether having an intrinsic viscosity of 0.50 dl / g (25 ℃, chloroform) was obtained.
スチレン系樹脂 (i)ポリスチレン(PS) 日本ポリスチレン社製ポリスチレン“エスブライト4" (ii)ハイインパクトポリスチレン(HIPS) 日本ポリスチレン社製ハイインパクトポリスチレン“エ
スブライト400" (iii)アクリロニトリル−スチレン共重合体(AS) アクリロニトリル27重量%、スチレン73重量%からな
り、かつ30℃、ジメチルホルムアミド溶液での固有粘度
0.62である市販の共重合体。Styrene-based resin (i) Polystyrene (PS) Polystyrene "Esbright 4" manufactured by Nippon Polystyrene Co., Ltd. (ii) High-impact polystyrene (HIPS) High-impact polystyrene manufactured by Japan Polystyrene Co., Ltd. "Esbright 400" (iii) Acrylonitrile-styrene copolymer (AS) Consists of 27% by weight of acrylonitrile and 73% by weight of styrene, and the intrinsic viscosity in dimethylformamide solution at 30 ℃
A commercial copolymer that is 0.62.
(iv)アクリロニトリル−ジエン系ゴム−スチレン重合
体(ABS) 公知の乳化重合法により、重量平均粒子径0.43μ、ゲル
含有率85重量%のポリブタジエンゴムラテックス(固型
分50重量%)100重量部、スチレン35重量部およびアク
リロニトリル15重量部をグラフト重合し、ゴム分約50重
量%の重合体を得た。(Iv) Acrylonitrile-diene rubber-styrene polymer (ABS) 100 parts by weight of polybutadiene rubber latex (solid content 50% by weight) having a weight average particle size of 0.43 µ and a gel content of 85% by a known emulsion polymerization method. Then, 35 parts by weight of styrene and 15 parts by weight of acrylonitrile were graft-polymerized to obtain a polymer having a rubber content of about 50% by weight.
(v)アクリロニトリル−エチレン−プロピレン系ゴム
−スチレン重合体(AES) 公知の溶液重合法により、プロピレン43重量%、ヨウ素
価13のエチレン−プロピレン−エチリデンノルボルネン
100重量部、スチレン400重量部およびアクリロニトリル
170重量部をグラフト重合し、ゴム分約15重量%の重合
体を得た。(V) Acrylonitrile-ethylene-propylene rubber-styrene polymer (AES) Ethylene-propylene-ethylidene norbornene having 43% by weight of propylene and an iodine value of 13 by a known solution polymerization method.
100 parts by weight, styrene 400 parts by weight and acrylonitrile
170 parts by weight was graft-polymerized to obtain a polymer having a rubber content of about 15% by weight.
金属不活性化剤(B−1〜B−8) 着色剤 住友化学工業社製フタロシアニンブルー“スミトーンシ
アニンブルーGH" 酸化防止剤 (i)日本チバガイギー社製n−オクタデシル−3−
(4′−ヒドロキシ−3′,5′−ジ−第三級ブチルフェ
ニル)プロピオネート“イルガノックス1076" (ii)日本チバガイギー社製1,3,5−トリメチル−2,4,6
−トリス−(3,5−ジt−ブチル−4−ヒドロキシベン
ジル)ベンゼン“イルガノックス1330" (iii)フェニルβ−ナフチルアミン PPE、スチレン系樹脂、金属不活性化剤、着色剤および
酸化防止剤をバンバリーミキサーにて一括混合した後、
押出機にて混練、造粒した。Metal deactivator (B-1 to B-8) Colorant Sumitomo Chemical Co., Ltd. Phthalocyanine Blue "Sumitone Cyanine Blue GH" Antioxidant (i) Nippon Ciba-Geigy n-Octadecyl-3-
(4'-Hydroxy-3 ', 5'-di-tert-butylphenyl) propionate "Irganox 1076" (ii) 1,3,5-trimethyl-2,4,6 manufactured by Ciba-Geigy Japan
-Tris- (3,5-di-t-butyl-4-hydroxybenzyl) benzene "Irganox 1330" (iii) Phenyl β-naphthylamine PPE, styrene resin, metal deactivator, colorant and antioxidant After batch mixing with a Banbury mixer,
The mixture was kneaded and granulated with an extruder.
得られたペレットを110℃で4時間乾燥した後、以下の
成形条件にて150mm×70mm×3mmの試験片を作成し、シル
バー発生の状態を肉眼で観察し、判定した。After drying the obtained pellets at 110 ° C. for 4 hours, a test piece of 150 mm × 70 mm × 3 mm was prepared under the following molding conditions, and the state of silver generation was visually observed and judged.
−判定基準− −成形条件− 日精樹脂社製3.5オンス射出成形機FS-75 樹脂温度:310℃(設定温度300℃) 滞留時間:5分、10分 背 圧:5kg/cm2 射出速度:8/10 スクリュー回転:100rpm 金型温度:80℃ 成形サイクル:8秒(射出)−15秒(冷 却)−5秒(取出し) 各組成物の組成および評価結果を表−1に示す。-Judgment criteria- -Molding conditions-3.5 ounce injection molding machine FS-75 manufactured by Nissei Plastic Co., Ltd. Resin temperature: 310 ° C (set temperature 300 ° C) Residence time: 5 minutes, 10 minutes Back pressure: 5kg / cm 2 Injection speed: 8/10 screw rotation : 100 rpm Mold temperature: 80 ° C Molding cycle: 8 seconds (injection) -15 seconds (cooling) -5 seconds (takeout) Table 1 shows the composition of each composition and the evaluation results.
また、各組成物より各種試験片を作成、評価し、金属不
活性化剤を配合しない組成物と金属不活性化剤を配合し
てなる本発明の組成物との加熱変形温度(1/4″、264PS
i、アニールなし)、加工性(250℃、30kg/cm2)および
ノッチ付アイゾット衝撃強度(1/4″、23℃)を比較、
両組成物に大差ないことが確認された。In addition, various test pieces were prepared from each composition, evaluated, and the heat distortion temperature (1/4) of the composition of the present invention containing the metal deactivator and the composition containing no metal deactivator. ″, 264PS
i, no annealing), workability (250 ℃, 30kg / cm 2 ) and notched Izod impact strength (1/4 ″, 23 ℃),
It was confirmed that there was no great difference between the two compositions.
〈発明の効果〉 本発明は、PPEとスチレン系樹脂とからなる樹脂組成物
本来の特長を犠牲にすることなく、高温成形を可能(シ
ルバーの発生ナシ)にしたものである。 <Effects of the Invention> The present invention enables high temperature molding (without silver generation) without sacrificing the original characteristics of the resin composition comprising PPE and a styrene resin.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭50−56383(JP,A) 特開 昭50−3086(JP,A) 特開 昭49−112868(JP,A) 特開 昭50−74653(JP,A) 特開 昭60−245667(JP,A) 特開 昭60−248773(JP,A) ─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP-A-50-56383 (JP, A) JP-A-50-3086 (JP, A) JP-A-49-112868 (JP, A) JP-A-50- 74653 (JP, A) JP 60-245667 (JP, A) JP 60-248773 (JP, A)
Claims (3)
系樹脂とからなる樹脂組成物(A)100重量部に対し、
以下の構造式〜に示される金属不活性化剤(B)0.
001〜5.0重量部配合してなることを特徴とするポリフェ
ニレンエーテル系耐熱性樹脂組成物。 1. A resin composition (A) comprising a polyphenylene ether resin and a styrene resin, relative to 100 parts by weight,
The metal deactivator (B) represented by the following structural formulas (B) 0.
A polyphenylene ether-based heat-resistant resin composition, characterized by containing 001 to 5.0 parts by weight.
テル系樹脂10〜90重量%とスチレン系樹脂90〜10重量%
とからなる組成物である特許請求の範囲第1項記載の組
成物。2. The resin composition (A) comprises 10 to 90% by weight of polyphenylene ether resin and 90 to 10% by weight of styrene resin.
The composition according to claim 1, which is a composition comprising
下、または非存在下、芳香族ビニル化合物と他の共重合
可能な化合物とを重合してなる樹脂である特許請求の範
囲第1項記載の組成物。3. The resin according to claim 1, wherein the styrene resin is a resin obtained by polymerizing an aromatic vinyl compound and another copolymerizable compound in the presence or absence of a rubbery polymer. The composition according to the item.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61244698A JPH0788466B2 (en) | 1986-10-14 | 1986-10-14 | Polyphenylene ether heat-resistant resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61244698A JPH0788466B2 (en) | 1986-10-14 | 1986-10-14 | Polyphenylene ether heat-resistant resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6397658A JPS6397658A (en) | 1988-04-28 |
| JPH0788466B2 true JPH0788466B2 (en) | 1995-09-27 |
Family
ID=17122601
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61244698A Expired - Lifetime JPH0788466B2 (en) | 1986-10-14 | 1986-10-14 | Polyphenylene ether heat-resistant resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0788466B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4766307B2 (en) * | 2005-05-31 | 2011-09-07 | 株式会社吉野工業所 | Container with cap |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49112868A (en) * | 1973-02-28 | 1974-10-28 | ||
| JPS5720354B2 (en) * | 1973-05-14 | 1982-04-28 | ||
| JPS5741516B2 (en) * | 1973-09-20 | 1982-09-03 | ||
| JPS5125265B2 (en) * | 1973-11-02 | 1976-07-29 | ||
| JPS59124950A (en) * | 1982-12-29 | 1984-07-19 | Mitsubishi Petrochem Co Ltd | Polyphenylene ether resin composition |
| JPS6044547A (en) * | 1983-08-20 | 1985-03-09 | Mitsubishi Petrochem Co Ltd | Polyphenylene ether composition with improved moldability |
| JPS60195158A (en) * | 1984-03-16 | 1985-10-03 | Toray Ind Inc | Polyarylene sulfide composition |
| JPS60250064A (en) * | 1984-05-25 | 1985-12-10 | Mitsubishi Petrochem Co Ltd | Polyphenylene ether composition with improved moldability |
| JPS60245667A (en) * | 1984-05-18 | 1985-12-05 | Mitsubishi Petrochem Co Ltd | Polyphenylene ether composition with improved moldability |
| JPS60250063A (en) * | 1984-05-25 | 1985-12-10 | Mitsubishi Petrochem Co Ltd | Polyphenylene ether composition with improved moldability |
| JPS60245666A (en) * | 1984-05-18 | 1985-12-05 | Mitsubishi Petrochem Co Ltd | Polyphenylene ether composition with improved moldability |
| JPS60248773A (en) * | 1984-05-24 | 1985-12-09 | Mitsubishi Petrochem Co Ltd | Polyphenylene ether composition having improved moldability |
| JPS60255847A (en) * | 1984-05-30 | 1985-12-17 | Mitsubishi Petrochem Co Ltd | Polyphenylene ether composition with improved moldability |
| JPS60255849A (en) * | 1984-05-30 | 1985-12-17 | Mitsubishi Petrochem Co Ltd | Polyphenylene ether composition with improved moldability |
| JPH0580943A (en) * | 1991-09-25 | 1993-04-02 | Nec Corp | Data readout system |
-
1986
- 1986-10-14 JP JP61244698A patent/JPH0788466B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6397658A (en) | 1988-04-28 |
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